CM1442 LCD and Camera EMI Filter Array with ESD Protection Features Product Description • The CM1442 is a family of pi-style EMI filter arrays with ESD protection, which integrates six and eight filters (C-R-C) in Chip Scale Package form factor with 0.40mm pitch. The CM1442 has component values of 15pF-100Ω-15pF per channel. The CM1442 has a cutoff frequency of 120MHz and can be used in applications where the data rates are as high as 48Mbps. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC61000-42 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • • • Six and eight channels of EMI filtering with integrated ESD protection 0.4mm pitch, 15-bump, 2.360mm x 1.053mm footprint Chip Scale Package (CM1442-06) 0.4mm pitch, 20-bump, 3.160mm x 1.053mm footprint Chip Scale Package (CM1442-08) Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 30dB attenuation (typical) at 1 GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance OptiGuard™ coated for improved reliability at assembly Lead-free version available This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CM1442 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules The CM1442 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1442 is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space saving versus competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball. Electrical Schematic 100Ω FILTER+ESDn* (Pins A1-An) 15pF FILTER+ESDn* (Pins C1-Cn) 15pF GND (Pins B1-Bm where m = n/2) * See Package/Pinout Diagram for expanded pin information. 1 of 6 or 8 EMI/RFI + ESD Channels © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1442 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 C1 C2 C3 C4 C5 C6 A GND N426 B GND B1 Orientation Marking C GND B2 B3 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 A1 A2 A3 A4 A5 A6 A1 CM1442-06CS/CP 15 Bump CSP Package Orientation Marking (see note 2) 1 2 3 4 5 6 7 8 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 C1 C2 C3 C4 C5 C6 C7 A GND N428 B GND B1 Orientation Marking C GND B2 FILTER8 C8 GND B3 B4 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 A1 A2 A3 A4 A5 A6 A7 A8 A1 CM1442-08CS/CP Notes: 20 Bump CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME PIN(s) NAME A1 FILTER1 DESCRIPTION Filter + ESD Channel 1 C1 FILTER1 Filter + ESD Channel 1 DESCRIPTION A2 FILTER2 Filter + ESD Channel 2 C2 FILTER2 Filter + ESD Channel 2 A3 FILTER3 Filter + ESD Channel 3 C3 FILTER3 Filter + ESD Channel 3 A4 FILTER4 Filter + ESD Channel 4 C4 FILTER4 Filter + ESD Channel 4 A5 FILTER5 Filter + ESD Channel 5 C5 FILTER5 Filter + ESD Channel 5 A6 FILTER6 Filter + ESD Channel 6 C6 FILTER6 Filter + ESD Channel 6 A7 FILTER7 Filter + ESD Channel 7 C7 FILTER7 Filter + ESD Channel 7 A8 FILTER8 Filter + ESD Channel 8 C8 FILTER8 Filter + ESD Channel 8 B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 15 CSP CM1442-06CS N426 CM1442-06CP N426 20 CSP CM1442-08CS N428 CM1442-08CP N428 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1442 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R PARAMETER CONDITIONS Resistance MIN TYP MAX UNITS 80 100 120 Ω Total Channel Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC 24 30 36 pF C Capacitance C1 At 2.5VDC Reverse Bias, 1MHz, 30mVAC 12 15 18 pF VDIODE Standoff Voltage IDIODE=10μA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE= +3.3V 0.1 1 μA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 CTOTAL RDYN fC 5.6 -1.5 Notes 2, 3 and 4 ±30 kV ±15 kV Dynamic Resistance Positive Negative 2.3 0.9 Ω Ω 115 MHz R=100Ω, C=15pF Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω Note 1: Note 2: Note 3: Note 4: V TA=25°C unless otherwise specified. ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1442 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1442 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1442 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3) ) © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1442 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4, CM1442-08CS/CP Only) Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4, CM1442-08CS/CP Only ) © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1442 Performance Information (cont’d) Capacitance (Normalized) Typical Diode Capacitance vs. Input Voltage DC Voltage Figure 9. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25°C) © 2005 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1442 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Maximum Soldering Temperature for Eutectic Device using a Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 10. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 11. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 12. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9 CM1442 Mechanical Details CSP Mechanical Specifications CM1442 devices are supplied in custom Chip Scale Packages (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. CM1442-06 Mechanical Specifications The package dimensions for the CM1442-06 are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Package Custom CSP Bumps 15 C1 Millimeters Inches Nom B2 B1 C Max Min Max A1 2.315 2.360 2.405 0.911 A2 1.008 1.053 1.098 0.0397 0.0415 0.0432 B1 0.395 0.4000 0.405 0.0156 0.0157 0.0159 B2 0.195 0.2000 0.205 0.0076 0.0078 0.0080 B3 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 B4 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 C1 0.130 0.1800 0.230 0.0051 0.0071 0.0091 C2 0.130 0.1800 0.230 0.0051 0.0071 0.0091 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 B 0.0929 0.0947 A2 Nom C2 Min # per tape and reel OptiGuardTM Coating A1 B4 B3 Dim BOTTOM VIEW A 1 2 3 4 5 6 D1 D2 0.25 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1442-06 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1442-06 2.36 X 1.053 X 0.644 2.62 X 1.12 X 0.76 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 13. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1442 Mechanical Details (cont’d) CM1442-08 Mechanical Specifications The package dimensions for the CM1442-08 are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Custom CSP Bumps 15 C Inches Nom Max Min 3.115 3.160 3.205 Nom B Max A2 1.008 1.053 1.098 0.0397 0.0415 0.0432 B1 0.395 0.4000 0.405 0.0156 0.0157 0.0159 B2 0.195 0.2000 0.205 0.0076 0.0078 0.0080 B3 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 B4 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 C1 0.130 0.1800 0.230 0.0051 0.0071 0.0091 C2 0.130 0.1800 0.230 0.0051 0.0071 0.0091 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel A 0.1226 0.1244 0.1262 A2 A1 Millimeters Min B2 B1 C2 Dim A1 C1 B4 B3 Package OptiGuardTM Coating BOTTOM VIEW A 1 2 3 4 5 7 6 8 D1 D2 0.25 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1442-08 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1442-08 3.16 X 1.053 X 0.644 3.28 X 1.32 X 0.81 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 14. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11