CALMIRCO CSPEMI400

CSPEMI400
SIM Card EMI Filter Array with ESD Protection
Features
Product Description
•
CAMD's CSPEMI400 is an EMI filter array with ESD
protection, which integrates three pi filters (C-R-C) and
two additional channels of ESD protection. The
CSPEMI400 has component values of 20pF-47Ω20pF, and 20pF-100Ω-20pF. The parts include avalanche-type ESD diodes on every pin, which provide a
very high level of protection for sensitive electronic
components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter
ports safely dissipate ESD strikes of ±10kV, exceeding
the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method
3015) specification for Human Body Model (HBM)
ESD, the pins are protected for contact discharges at
greater than ±25kV.
•
•
•
•
•
•
Three channels of EMI filtering, each with ESD
protection
Two additional channels of ESD-only protection
±10kV ESD protection (IEC 61000-4-2, contact
discharge)
±25kV ESD protection (HBM)
Greater than 30dB of attenuation at 1GHz
10-bump, 1.960mm x 1.330mm footprint Chip
Scale Package (CSP)
Lead-free version available
Applications
•
•
•
SIM Card slot in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers
The ESD diodes on pins A4 and C4 ports are designed
and characterized to safely dissipate ESD strikes of
±10kV, well beyond the maximum requirement of the
IEC 61000-4-2 international standard.
This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CSPEMI400
is ideal for EMI filtering and protecting data lines from
ESD for the SIM card slot in mobile handsets.
The CSPEMI400 is available in a space-saving, lowprofile Chip Scale Package with optional lead-free finishing.
Electrical Schematic
R1
R2
A1
C1
C
A2
C2
C
C
C
GND
R1
A3
C3
C
A4
C4
C
C
C
R1=100Ω
R2=47Ω
B2,B4
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
CSPEMI400
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
A
A4
A2
Orientation
Marking
A1
A1
AG
B
A3
B2
C
C4
B1
C3
C2
C1
CSPEMI400
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
TYPE
PIN
DESCRIPTION
EMI
Filter
A1
EMI Filter with ESD Protection for RST Signal
C1
EMI Filter with ESD Protection for RST Signal
A2
EMI Filter with ESD Protection for CLK Signal
C2
EMI Filter with ESD Protection for CLK Signal
Device
Ground
B1
Device Ground
B2
Device Ground
EMI
Filter
A3
DAT EMI Filter with ESD Protection
C3
DAT EMI Filter with ESD Protection
ESD Channel
A4
ESD Proection Channel - VCC Supply
ESD Channel
C4
ESD Proection Channel
EMI
Filter
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Bumps
Package
Ordering Part
Number1
10
CSP
CSPEMI400
Part Marking
Ordering Part
Number1
Part Marking
AG
CSPEMI400G
AG
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
09/28/05
CSPEMI400
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
300
mW
RATING
UNITS
-40 to +85
°C
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R1
Resistance of R1
80
100
120
Ω
R2
Resistance of R2
38
47
56
Ω
C
Capacitance
VIN = 2.5VDC, 1MHz,
30mV ac
16
20
24
pF
Stand-off Voltage
I = 10μA
ILEAK
Diode Leakage Current
VBIAS = 3.3V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC
61000-4-2
Notes 2,4 and 5
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
fC1
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 100Ω, C = 20pF
77
MHz
fC2
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 47Ω, C = 20pF
85
MHz
VSTANDOFF
VCL
6.0
5.6
-1.5
6.8
-0.8
V
300
nA
9.0
-0.4
V
V
±25
kV
±10
kV
+12
-7
V
V
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: The parameters are guaranteed by design.
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
CSPEMI400
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. A1-C1 EMI Filter Performance
Figure 2. A2-C2 EMI Filter Performance
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
09/28/05
CSPEMI400
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. A3-C3 EMI Filter Performance
Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC)
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
CSPEMI400
Application Information
The CSPEMI400 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber identity module) card connector. SIM cards are
found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the
controller against possible ESD strikes that may occur
when the connector pins are exposed during direct con-
tact, or during insertion of the SIM card into the card slot.
The EMI filter suppresses all high-frequency noise, preventing the unwanted EMI signals from both entering and
exiting the main board. The signals that interface with the
SIM card are the Reset, the Clock and the bidirectional
data I/O, as shown in Figure 5.
CSPEMI400
Controller
with logic
level
translator
SIM Card Connector
100ohm
RST
47ohm
CLK
100ohm
I/O
Clock
Data I/O
VCC
VCC
supply
(5V,
3.3V or
1.8V)
Reset
5V/3V/1.8V
1uF
GND
GND
Note: One channel of the CSPEMI400 with a zener
diode is not shown on the diagram.
Figure 5. Typical Application Diagram for the SIM Card Interface
For best filter and ESD performance, both GND bumps
(B1, B2) of the CSPEMI400 should be directly connected to the Ground plane. A small capacitor of about
1μF is required next to the VCC pin of the SIM connector in order to improve stability of the SIM card supply
rail.
For information on the assembly of the CSPEMI400 to
the PCB (printed circuit board), please refer to the Chip
Scale Package (CSP) Application Note AP217, or contact factory at 800-325-4966 for technical support.
© 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
09/28/05
CSPEMI400
Application Information (cont’d)
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Eutectic Devices using Eutectic Solder Paste
240°C
Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 7. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 8. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
7
CSPEMI400
CSP Mechanical Specifications
Mechanical Package Diagrams
The CSPEMI400 is supplied in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP, see the California Micro
Devices CSP Package Information document.
BOTTOM VIEW
A1
Custom CSP
Bumps
10
Dim
Millimeters
C
B
A
Inches
Nom
Max
Nom
A1
1.915
1.960
2.005 0.0754 0.0772 0.0789
A2
1.285
1.330
1.375 0.0506 0.0524 0.0541
B1
0.495
0.500
0.505 0.0195 0.0197 0.0199
B2
0.245
0.250
0.255 0.0096 0.0098 0.0100
B3
0.430
0.435
0.440 0.0169 0.0171 0.0173
B4
0.430
0.435
0.440 0.0169 0.0171 0.0173
C1
0.180
0.230
0.280 0.0071 0.0091 0.0110
C2
0.180
0.230
0.280 0.0071
D1
0.562
0.606
0.650 0.0221 0.0239 0.0256
D2
0.356
0.381
0.406 0.0140 0.0150 0.0160
0.091
Max
1
2
3
4
C2
Min
# per tape and
reel
Min
A2
Package
B4
B3
B2
B1
PACKAGE DIMENSIONS
SIDE
VIEW
C1
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
D1
D2
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI400
Chip Scale Package
0.0110
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B 0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CSPEMI400
1.96 X 1.33 X 0.606
2.08 X 1.45 X 0.71
8mm
178mm (7")
3500
4mm
4mm
10 Pitches cumulative
tolerance on tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For tape feeder reference
only including draft.
Concentric around B.
Embossment
Center lines
of cavity
P1
User direction of feed
Figure 9. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
09/28/05