CLARE CPC1708

CPC1708
i4-PAC™ DC Power Relay
Parameters
Blocking Voltage
Ratings
60
Load Current, TA=25ºC
With 5°C/W Heat Sink
No Heat Sink
On-resistance
RθJC
Description
Units
VP
11.85
4
0.08
0.35
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new family
of High Power Solid State Relays. As part of this new
family, the CPC1708 1-Form-A DC Solid State Relay
employs optically coupled MOSFET technology to
provide 2500Vrms of input to output isolation.
ADC
Ω
ºC/W
Features
•
•
•
•
•
•
•
•
•
100% Solid State
Compact i4-PAC Power Package
Low Thermal Resistance (0.35°C/W)
11.85ADC Load Current with 5ºC/W Heat Sink
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Arc-Free With No Snubbing Circuits
2500Vrms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
•
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (gas, oil, electric and water)
• Transportation Equipment
• Aerospace/Defense
The output is constructed with an efficient MOSFET
switch and photovoltaic die that use Clare’s patented
OptoMOS architecture while the input GaAlAs
infrared LED provides the optically-coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique i4-PAC package pioneered by IXYS
allows solid state relays to achieve the highest load
current and power ratings. This package features
an IXYS unique process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500Vrms isolation but also
very low thermal resistance (0.35°C/W).
Approvals
• UL recognized component: File # E69938
• Certified to UL 508
Ordering Information
Part #
CPC1708J
Pin Configuration
Description
i4-PAC (25 per tube)
Switching Characteristics of
Normally Open (Form A) Devices
1
2
+
3
-
4
-
+
CONTROL
ILOAD
+
90%
10%+
TON
RoHS
2002/95/EC
TOFF
e3
DS-CPC1708-R01
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1
CPC1708
Absolute Maximum Ratings
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation
Isolation Voltage
Input to Output
Operational Temperature
Storage Temperature
Ratings
60
5
50
1
150
Units
VP
V
mA
A
mW
2500
-40 to +85
-40 to +125
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical absolute maximum ratings are at 25°C
Electrical Characteristics
Parameter
Output Characteristics
Load Current 1
Peak
Continuous
Continuous
Continuous
Conditions
TA=25°C
t ≤ 10ms
No Heat Sink
TC=25ºC
TC=99ºC
IL(99)
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current 3
Input Dropout Current
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance Input to Output
IL=1A, IF=10mA
VL=60V
IF=20mA, VL=10V
1
2
3
2
1MHz, V=25V
TA=25°C
IL=1.0A
IF=5mA
VR=5V
TA=25°C
-
Symbol
Typ
Max
Units
AP
-
-
30
4
24
5.35
RON
ILEAK
-
0.05
-
0.08
1
TON
TOFF
Cout
-
5
0.13
1250
20
5
-
ms
IF
IF
VF
IR
0.6
0.9
-
1.2
-
10
1.4
10
mA
mA
V
µA
CI/O
-
1
-
pF
IL
Min
ADC
Ω
µA
pF
Higher load currents possible with proper heatsinking.
Measurement taken within 1 second of on time.
For applications requiring high temperature operation (greater than 60oC) an LED drive current of 20mA is recommended.
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R01
CPC1708
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
Thermal Resistance (junction to ambient)
Junction Temperature
Conditions
Free air
-
Symbol
RθJC
RθJA
TJ
Min
-40
Typ
45
-
Max
0.35
100
Units
°C/W
°C/W
°C
Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal
interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate
junction-to-ambient thermal resistance of 12.5°C/W.
Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
RθCA =
(TJ - TA) IL(99)2
IL
2
•
RθJC
- RθJC
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (Arms)
IL = Desired Operating Load Current (Arms), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
* Elevated junction temperature reduces semiconductor lifetime.
R01
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3
CPC1708
PERFORMANCE DATA*
CPC1708
Typical LED Forward Voltage Drop
(N=50, TA=25ºC, IF=10mA)
35
35
30
20
15
10
25
20
15
10
5
5
0
0
1.30
1.31
1.32
1.33
30
Device Count (N)
25
0.045 0.050 0.055 0.060
On-Resistance (Ω)
6
15
5ºC/W
10ºC/W
5
0.116
0.124
0.132
0.140
0.148
0
20
14
180
12
175
Turn-On (ms)
Blocking Voltage (VP)
185
170
165
160
155
0.03
0.02
40
60
80
0
-40
100
0.16
80
100
8
I F = 20mA
6
4
-40
-20
0
I F = 20mA
I F = 10mA
1.2
1.0
0.8
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
Turn-On (ms)
1.6
I F = 50mA
80
100
80
100
0.10
0.08
I F = 20mA
0.06
12
11
10
9
8
7
6
5
4
3
2
1
0
I F = 10mA
-20
0
20
40
60
Temperature (ºC)
80
100
CPC1708
Typical Turn-Off vs. LED Forward Current
(IL=1ADC)
0.18
0.16
0.14
Turn-Off (ms)
1.8
1.4
20
40
60
Temperature (ºC)
CPC1708
Typical Turn-On vs. LED Forward Current
(IL=1ADC)
CPC1708
Typical LED Forward Voltage Drop
vs. Temperature
60
0.12
0.02
-40
60
40
0.14
I F = 10mA
10
0.04
40
20
CPC1708
Typical Turn-Off vs. Temperature
(IL=1ADC)
0
20
0
CPC1708
Typical Turn-On vs. Temperature
(IL=1ADC)
2
0
-20
Temperature (ºC)
Temperature (ºC)
LED Forward Voltage Drop (V)
0.04
145
-20
8.4
0.05
150
-40
7.3
Temperature (ºC)
Turn-Off (ms)
CPC1708
Blocking Voltage
vs. Temperature
6.2
0.01
Turn-Off (ms)
0
0.108
5.1
0.06
Free Air
0
4.0
0.07
20
10
2.9
CPC1708
Typical Leakage vs. Temperature
at Maximum Rated Voltage
(Measured Across Pins 1 & 2)
Leakage (µA)
Load Current (A)
Device Count (N)
12
10
Turn-On (ms)
1ºC/W
18
15
0.065
CPC1708
Typical Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
25
24
20
0
0.040
LED Forward Voltage (V)
30
25
5
1.34
CPC1708
Typical Turn-Off Time
(N=50, TA=25ºC, IL=1ADC, IF=20mA)
CPC1708
Typical Turn-On Time
(N=50, TA=25ºC, IL=1ADC, IF=20mA)
35
30
Device Count (N)
Device Count (N)
CPC1708
Typical On-Resistance Distribution
(N=50, TA=25ºC, IL=1ADC, IF=10mA)
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R01
CPC1708
0.09
0.08
I F = 10mA
0.05
0.04
0.03
0.02
Load Current (A)
0.06
4.0
3.0
2.0
1.0
0.01
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
I F = 10mA
0.06
0.05
0.04
0.03
0.02
0.0
0
0.05
0.10
0.15
0.20
0.25
0.30
Load Voltage (V)
CPC1708
Energy Rating Curve
(Free Air, No Heat Sink)
CPC1708
Typical On-Resistance vs. Temperature
(IL=max rated)
0.07
35
30
25
20
15
10
5
0.01
0.00
5.0
CPC1708
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=10mA)
0.07
0.08
On-Resistance (Ω)
CPC1708
Typical On-Resistance vs. Temperature
(IL=1ADC)
On-Resistance (Ω)
4.0
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.1
3.0
-40
CPC1708
Typical IF for Switch Operation
vs. Temperature
(IL=1ADC)
Load Current (A)
LED Current (mA)
PERFORMANCE DATA*
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0
10µs 100µs 1ms 10ms 100ms
1s
10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R01
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5
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
RoHS
2002/95/EC
e3
MECHANICAL DIMENSIONS:
i4-PAC
0.190 MIN - 0.205 MAX
(4.83 MIN - 5.21 MAX)
0.046 MIN - 0.085 MAX
(1.17 MIN - 2.16 MAX)
0.770 MIN - 0.799 MAX
(19.56 MIN - 20.29 MAX)
0.210 MIN - 0.244 MAX
(5.33 MIN - 6.20 MAX)
0.065 MIN - 0.080 MAX
(1.65 MIN - 2.03 MAX)
0.660 MIN - 0.690 MAX
(16.76 MIN - 17.53 MAX)
ISOLATED HEAT SINK
0.100 MIN - 0.180 MAX
(2.54 MIN - 4.57 MAX)
0.819 MIN - 0.840 MAX
(20.80 MIN - 21.34 MAX)
0.590 MIN - 0.620 MAX
(14.99 MIN - 15.75 MAX)
0.083 MIN - 0.102 MAX
(2.11 MIN - 2.59 MAX)
0.780 MIN - 0.840 MAX
(19.81 MIN - 21.34 MAX)
0.300 BSC
(7.62 BSC)
0.150 BSC
(3.81 BSC)
0.020 MIN - 0.029 MAX
(0.51 MIN - 0.74 MAX)
0.058 MIN - 0.068 MAX
(1.47 MIN - 1.73 MAX)
0.102 MIN - 0.118 MAX
(2.59 MIN - 3.00 MAX)
0.045 MIN - 0.055 MAX
(1.14 MIN - 1.40 MAX)
NOTE: Bottom heatsink meets 2500Vrms isolation to the other pins.
Dimensions:
inches
(mm)
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1708-R01
©Copyright 2007, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
i4-PAC™ is a trademark of IXYS Corporation
All rights reserved. Printed in USA.
3/20/07