CLARE CPC1777J

CPC1777
i4-PAC™ DC Power Relay
Parameter
Blocking Voltage
Load Current, TA=25ºC
With 5°C/W Heat Sink
No Heat Sink
On-resistance
RθJC
Rating
600
Description
Units
VP
4.6
1.5
0.5
0.35
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of High Power Solid State Relays. As part of
this new family, the CPC1777 single pole normally
open (1-Form-A) DC Solid State Relay employs
optically coupled MOSFET technology to provide
2500Vrms of input to output isolation.
ADC
Ω
ºC/W
Features
•
•
•
•
•
•
•
•
•
•
100% Solid State
Compact i4-PAC Power Package
Low Thermal Resistance (0.35°C/W)
4.6ADC Load Current with 5°C/W Heat Sink
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
2500Vrms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
•
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (gas, oil, electric and water)
• Transportation Equipment
• Aerospace/Defense
The output is constructed with an efficient MOSFET
switch and photovoltaic die that uses Clare’s patented
OptoMOS architecture while the input GaAlAs
infrared LED provides the optically coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique i4-PAC package pioneered by IXYS
allows solid state relays to achieve the highest load
current and power ratings. This package features
an IXYS unique process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500Vrms isolation but also
very low thermal resistance (0.35°C/W).
Approvals
• UL recognized component: File # E69938
• Certified to UL 508
Ordering Information
Part Number
CPC1777J
Description
i4-PAC (25 per tube)
Switching Characteristics of
Normally Open (Form A) Devices
Pin Configuration
CONTROL
1
2
+
3
-
4
-
ILOAD
+
+
90%
10%+
TON
RoHS
2002/95/EC
TOFF
e3
DS-CPC1777-R02
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1
CPC1777
Absolute Maximum Ratings
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation
Isolation Voltage
Input to Output
Operational Temperature
Storage Temperature
Ratings
600
5
50
1
150
Units
VP
V
mA
A
mW
2500
-40 to +85
-40 to +125
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical absolute maximum ratings are at 25°C
Electrical Characteristics
Parameter
Output Characteristics
Load Current 1
Peak
Continuous
Continuous
Continuous
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current 3
Input Dropout Current
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance Input to Output
1
2
3
2
Conditions
TA=25°C
t ≤ 10ms
No Heat Sink
TC=25ºC
TC=99ºC
IL=1A, IF=10mA
VL=600V
IF=20mA, VL=10V
V=25V, f=1MHz
TA=25°C
IL=1.0A
IF=5mA
VR=5V
TA=25°C
-
Symbol
Min
Typ
Max
Units
AP
-
-
IL(99)
RON
ILEAK
-
0.35
-
20
1.5
15
2.0
0.5
1
TON
TOFF
COUT
-
8
0.15
3500
20
5
-
IF
IF
VF
IR
0.6
0.9
-
1.2
-
10
1.4
10
mA
mA
V
µA
CI/O
-
1
-
pF
IL
ADC
Ω
µA
ms
pF
Higher load currents possible with proper heat sinking.
Measurement taken within 1 second of on time.
For applications requiring high temperature operation (greater than 60oC) an LED drive current of 20mA is recommended.
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R02
CPC1777
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
Thermal Resistance (junction to ambient)
Junction Temperature (operation)
Conditions
Free air
-
Symbol
RθJC
RθJA
TJ
Min
-40
Typ
40
-
Max
0.35
100
Units
°C/W
°C/W
°C
Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal
interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate
junction-to-ambient thermal resistance of 12.5°C/W.
Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
RθCA =
(TJ - TA) IL(99)2
IL2
•
RθJC
- RθJC
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (Arms)
IL = Desired Operating Load Current (Arms), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
* Elevated junction temperature reduces semiconductor lifetime.
R02
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3
CPC1777
PERFORMANCE DATA*
CPC1777
Typical LED Forward Voltage Drop
(N = 50, TA = 25ºC, I L = 1ADC, I F = 10mA)
35
35
30
20
15
10
25
20
15
10
5
5
0
0
1.30
1.32
1.33
0.34
0.36
0.40
815
0.42
820
825
830
835
840
CPC1777
Typical Turn-On Time
(N=50, TA=25ºC, IL=1ADC, IF=10mA)
CPC1777
Typical Turn-Off Time
(N=50, TA=25ºC, IL=1ADC, IF=10mA)
CPC1777
Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
25
Device Count (N)
5
12
20
15
10
5
7.0
7.5
8.0
8.5
0.012
840
0.06
0.08
0.09
0.10
4
Free Air
0.11
0
20
40
60
Temperature (ºC)
0.010
0.008
0.006
0.004
0.002
60
80
830
825
820
815
100
10
8
6
4
2
810
805
-40
100
IF = 10mA
12
835
80
CPC1777
Typical Turn-On vs. Temperature
(IL=1ADC)
14
Turn-On (ms)
Blocking Voltage (VP)
845
40
5ºC/W
10ºC/W
CPC1777
Typical Blocking Voltage
vs. Temperature
0.014
20
6
Turn-Off (ms)
CPC1777
Typical Leakage vs. Temperature
at Maximum Rated Voltage
(Measured Across Pins 1 & 2)
0
8
0
0.04
9.0
Turn-On (ms)
-20
1ºC/W
10
2
0
6.5
-20
0
20
40
60
80
0
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
CPC1777
Typical Turn-Off vs. Temperature
(IL=1ADC)
CPC1777
Typical LED Forward Voltage Drop
vs. Temperature
CPC1777
Typical Turn-On vs. LED Forward Current
(IL=1ADC)
0.25
0.20
0.15
0.10
IF = 10mA
0.05
0
-20
0
20
40
60
Temperature (ºC)
80
100
1.8
1.6
1.4
IF = 50mA
IF = 20mA
IF = 10mA
1.2
1.0
0.8
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
Turn-On (ms)
0.30
LED Forward Voltage Drop (V)
Leakage (µA)
0.38
Blocking Voltage (VP)
0
Turn-Off (ms)
10
On-Resistance (Ω)
10
-40
15
LED Forward Voltage (V)
15
0.35
20
0
0.32
1.34
20
0
-40
25
5
Load Current (ADC)
25
1.31
Device Count (N)
Device Count (N)
Device Count (N)
25
CPC1777
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
35
30
30
Device Count (N)
CP1777
Typical On-Resistance Distribution
(N=50, TA=25ºC, IL=1ADC, IF=10mA)
18
16
14
12
10
8
6
4
2
1
0
0
5
10
15
20
25
30
35
40
45
LED Forward Current (mA)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R02
50
CPC1777
PERFORMANCE DATA*
1.8
0.16
1.6
0.15
1.4
0.14
0.13
0.12
0.11
0.10
CPC1777
Typical On-Resistance vs. Temperature
(IL=max rated)
1.2
1.0
0.8
0.6
0.4
0.2
0.09
0
0.08
0
5
10
15
20
25
30
35
40
45
-40
50
LED Forward Current (mA)
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
24
20
Load Current (A)
Load Current (A)
-20
20
18
16
14
12
10
8
6
4
2
0
CPC1777
Energy Rating Curve
(Free Air, No Heat Sink)
CPC1777
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=10mA)
2.5
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
-1.05
CPC1777
Typical IF for Switch Operation vs. Temperature
(IL=1ADC)
LED Current (mA)
0.17
On-Resistance (Ω)
Turn-Off (ms)
CPC1777
Typical Turn-Off vs. LED Forward Current
(IL=1ADC)
16
12
8
4
-0.70
-0.35
0
0.35
Load Voltage (V)
0.70
1.05
0
10µs 100µs 1ms 10ms 100ms
1s
10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R02
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5
CPC1777
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
RoHS
2002/95/EC
e3
MECHANICAL DIMENSIONS:
i4-PAC
0.190 MIN - 0.205 MAX
(4.83 MIN - 5.21 MAX)
0.046 MIN - 0.085 MAX
(1.17 MIN - 2.16 MAX)
0.770 MIN - 0.799 MAX
(19.56 MIN - 20.29 MAX)
0.210 MIN - 0.244 MAX
(5.33 MIN - 6.20 MAX)
0.065 MIN - 0.080 MAX
(1.65 MIN - 2.03 MAX)
0.660 MIN - 0.690 MAX
(16.76 MIN - 17.53 MAX)
ISOLATED HEAT SINK
0.100 MIN - 0.180 MAX
(2.54 MIN - 4.57 MAX)
0.819 MIN - 0.840 MAX
(20.80 MIN - 21.34 MAX)
0.590 MIN - 0.620 MAX
(14.99 MIN - 15.75 MAX)
0.083 MIN - 0.102 MAX
(2.11 MIN - 2.59 MAX)
0.780 MIN - 0.840 MAX
(19.81 MIN - 21.34 MAX)
0.300 BSC
(7.62 BSC)
0.150 BSC
(3.81 BSC)
0.020 MIN - 0.029 MAX
(0.51 MIN - 0.74 MAX)
0.058 MIN - 0.068 MAX
(1.47 MIN - 1.73 MAX)
0.102 MIN - 0.118 MAX
(2.59 MIN - 3.00 MAX)
0.045 MIN - 0.055 MAX
(1.14 MIN - 1.40 MAX)
NOTE: Bottom heatsink meets 2500Vrms isolation to the other pins.
Dimensions:
inches
(mm)
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1777-R02
©Copyright 2007, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
i4-PAC™ is a trademark of IXYS Corporation
All rights reserved. Printed in USA.
3/22/07