Spec. No. : C302N3-H Issued Date : 2003.04.14 Revised Date : Page No. : 1/4 CYStech Electronics Corp. Small Signal Schottky (double) diodes BAT54N3/BAT54AN3 BAT54CN3/BAT54SN3 Description Planar silicon Schottky barrier diodes encapsulated in a SOT-23 small plastic SMD package. Single diodes and double diodes with different pinning are available. Features •Very small conduction losses •Low forward voltage drop •Small plastic SMD package Applications •Ultra high-speed switching •Voltage clamping •Protection circuits •Blocking diodes Pinning Outline Pin 1 2 3 BAT54 A NC K Description BAT54A BAT54C K1 A1 K2 A2 A1,A2 K1,K2 3 3 3 1 SOT-23 BAT54S A1 K2 K1,A1 1 2 1 2 2 N.C. (1) BAT54 (2)BAT54A 2 1 Marking: 3 3 (3)BAT54C 1 2 (4)BAT54S Diode configuration and symbol BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 Type BAT54 N3 BAT54AN3 BAT54CN3 BAT54SN3 Marking Code L4 L42 L43 L44 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302N3-H Issued Date : 2003.04.14 Revised Date : Page No. : 2/4 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature Tstg ................................................................................................... -65~+150 °C Junction Temperature Tj .............................................................................................................. +125°C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Ptot (Note) ......................................................................... 230 mW • Maximum Voltages and Currents (Ta=25°C) Repetitive Peak Reverse Voltage VRRM .............................................................................................. 30 V Continuous Forward Current IF ................................................................................................... 200 mA Repetitive Peak Forward Current(tp≤1s,duty cycle≤0.5)………………………………………… 300mA Non-repetitive Peak Forward Current (tp<10ms, sinusoidal) IFSM ............................................... 600 mA Note:for double diodes, Ptot is the total power dissipation of both diodes. Characteristics (Ta=25°C) Characteristic Symbol Reverse Breakdown Voltage Forward Voltage (Note 1) Condition Min. Max. Unit VBR IR=100µA 30 - V VF(1) IF=0.1mA - 240 mV VF(2) IF=1mA - 320 mV VF(3) IF=10mA - 400 mV VF(4) IF=30mA - 500 mV VF(5) IF=100mA VR=25V,Tj=25℃ - 800 mV - 2 µA - 10 pF - 5 ns Reverse Leakage Current (Note 2) IR Diode Capacitance CD Reverse Recovery Time trr VR=1V, f=1MHz IF=IR=10mA RL=100Ω measured at IR=1mA Notes: 1.pulse test, tp=380µs,duty cycle<2%. 2.pulse test, tp=5ms,duty cycle<2%. BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302N3-H Issued Date : 2003.04.14 Revised Date : Page No. : 3/4 Characteristic Curves Forward Current & Forward Voltage Diode Capacitance & Reverse-Biased Voltage 100 250 Diode Capacitance-Cd (pF) Forward Current-I F (mA) 200 150 100 10 50 0 1 0 200 400 600 Forward Voltage-VF (mV) BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 800 1000 0.1 1 10 100 Reverse Biased Voltage-VR (V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302N3-H Issued Date : 2003.04.14 Revised Date : Page No. : 4/4 SOT-23 Dimension Diagram: A Marking: L 3 B L4_ L4X S 2 1 G V C D K H 3-Lead SOT-23 Plastic Surface Mounted Package. CYStek Package Code: N3 J • BAT54 N3: Single Diode (Marking Code L4) • BAT54AN3: Common Anode. (Marking Code L42) • BAT54CN3: Common Cathode. (Marking Code L43) • BAT54SN3: Series Connected. (Marking Code L44) *: Typical Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 DIM A B C D G H Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.85 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BAT54N3/BAT54AN3/BAT54CN3/BAT54SN3 CYStek Product Specification