CYSTEKEC DAN217N3

CYStech Electronics Corp.
Spec. No. : C303N3C
Issued Date : 2002.12.18
Revised Date :
. .
Page No. : 1/3
DAN217N3
HIGH-SPEED SWITCHING DIODE
Description
The DAN217N3 consists of two diodes in a plastic surface mount package. The diodes are
connected in series and the unit is designed for high-speed switching application in hybrid thick
and thin-film circuits.
Features
• Small SMD Package (SOT-23)
• Ultra-high Speed
• Low Forward Voltage
• Fast Reverse Recovery Time
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature............................................................................................ -65 ~ +150 °C
Junction Temperature .................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 250 mW
• Maximum Voltages and Currents (Ta=25°C)
Reverse Voltage .................................................................................................................. 70 V
Repetitive Reverse Voltage ................................................................................................. 70 V
Forward Current ............................................................................................................. 150 mA
Repetitive Forward Current ............................................................................................ 500 mA
Forward Surge Current (1ms)....................................................................................... 1000 mA
Characteristics (Ta=25°C)
Characteristic
Reverse Breakdown Voltage
Forward Voltage
Reverse Current
Total Capacitance
Reverse Recovery Time
DAN217N3
Symbol
V(BR)
VF(1)
VF(2)
VF(3)
VF(4)
IR
CT
Trr
Condition
IR=100uA
IF=1mA
IF=10mA
IF=50mA
IF=150mA
VR=70
VR=0, f=1MHz
IF=IR=10mA, RL=100Ω
measured at IR=1mA
Min
70
-
Max
715
855
1000
1250
2.5
1.5
Unit
V
mV
mV
mV
mV
uA
pF
-
6
nS
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C303N3C
Issued Date : 2002.12.18
Revised Date :
. .
Page No. : 2/3
Characteristics Curve
Forward Biased Voltage & Forward Current
Capacitance & Reverse-Biased Voltage
1
Capacitance-Cd (pF)
Current-IF (mA)
450
300
150
0.1
0
0
500
1000
1500
2000
0.1
1
10
100
Reverse Biased Voltage-VR (V)
Forward Biased Voltage-VF (mV)
Power Derating
300
PD(mW), Power Dissipation
250
200
150
100
50
0
0
20
40
60
80
100
120
140
160
o
Ta( C ), Ambient Temperature
DAN217N3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C303N3C
Issued Date : 2002.12.18
Revised Date :
. .
Page No. : 3/3
SOT-23 Dimension
Diagram :
A
L
Marking :
3
3
B
A7_
S
1
2
1
_ : hFE Rank Code
3-Lead SOT-23 Plastic Surface Mounted Package
CYStek Package Code : N3
G
V
2
C
Style : Pin 1.Anode 2.Cathode
3.Common Connection
D
K
H
J
*:Typical
Inches
Min.
Max.
0.1102 0.1204
0.0472 0.0630
0.0335 0.0512
0.0118 0.0197
0.0669 0.0910
0.0005 0.0040
DIM
A
B
C
D
G
H
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034 0.0070
0.0128 0.0266
0.0335 0.0453
0.0830 0.1083
0.0098 0.0256
Millimeters
Min.
Max.
0.85
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DAN217N3
CYStek Product Specification