CYStech Electronics Corp. Spec. No. : C325S3 Issued Date : 2005.06.15 Revised Date : Page No. : 1/4 N-CHANNEL MOSFET MTN7002S3 Description •The MTN7002S3 is a N-channel enhancement-mode MOSFET. •Pb-free package Symbol Outline MTN7002S3 SOT-323 D G S G：Gate S：Source D：Drain Absolute Maximum Ratings (Ta=25°C) Parameter Drain-Source Voltage Drain-Gate Voltage (RGS=1MΩ) Gate-Source Voltage Continuous Drain Current (Ta=25°C) Continuous Drain Current (Ta=100°C) Pulsed Drain Current (Ta=25°C) Total Power Dissipation (Ta=25°C) Total Power Dissipation (Tc=25°C) Operating Junction Temperature Storage Temperature Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Lead Temperature, for 10 second Soldering Symbol BVDSS BVDGR VGS ID ID IDM PD Tj Tstg Rth,ja Rth,jc TL Limits 60 60 ±40 200 115 800 200 400 -55~+150 -55~+150 625 250 240 *1 *1 *2 Unit V V V mA mA mA mW °C °C °C/W °C/W °C Note : *1. The power dissipation of the package may result in a continuous drain current *2. Pulse Width ≤ 300µs, Duty cycle ≤2% MTN7002S3 CYStek Product Specification Spec. No. : C325S3 Issued Date : 2005.06.15 Revised Date : Page No. : 2/4 CYStech Electronics Corp. Electrical Characteristics (Ta=25°C) Symbol BVDSS VGS(th) IGSS/F IGSS/R IDSS ID(ON) Min. 60 1 500 80 - VDS(ON) RDS(ON) GFS Ciss Coss Crss Typ. - Max. 2.5 100 -100 1 0.375 3.75 7.5 7.5 50 25 5 Unit V V nA nA µA mA V V mS Test Conditions VGS=0, ID=10µA VDS=2.5V, ID=0.25mA VGS=+20V, VDS=0 VGS=-20V, VDS=0 VDS=60V, VGS=0 VDS>2VDS(ON), VGS=10V ID=50mA, VGS=5V ID=500mA, VGS=10V ID=50mA, VGS=5V ID=500mA, VGS=10V VDS>2VDS(ON), ID=200mA pF VDS=25V, VGS=0, f=1MHz Ω *Pulse Test : Pulse Width ≤380µs, Duty Cycle≤2% Characteristic Curves TYPICAL OUTPUT CHARACTERISICS TYTICAL TRANSFER CHARACTERISTIC 1.4 1.4 VGS=8V 1.2 1.0 DRAIN CURRENT---ID(A) DRAIN CURRENT---ID(A) 1.2 VGS=5V 0.8 VGS=4V 0.6 0.4 0.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0 1 2 3 4 5 6 7 DRAIN-SOURCE ---VDS(V) MTN7002S3 8 9 10 0 1 2 3 4 5 6 7 8 9 10 GAT E-SOURCE VOLT AGE---VGS(V) CYStek Product Specification Spec. No. : C325S3 Issued Date : 2005.06.15 Revised Date : Page No. : 3/4 CYStech Electronics Corp. STATIC DRAIN-SOURCE ON-STATE RESISTANCE VS GATE-SOURCE VOLTSAGE 10 3.5 9 VGS=5V 3.0 2.5 2.0 VGS=10V 1.5 1.0 0.5 RESISTANCE--- RDS(on)(ohm) 4.0 STATIC DRAIN-SOURCE ON-STATE STATIC DRAIN-SOURCE ON-STATE RESISTANCE--- RDS(on)(ohm) ST AT IC DRAIN-SOURCE ON-ST AT E RESIST ANCE vs DRAIN CURRENT 8 7 6 5 ID=115mA 4 ID=57.5m A 3 2 1 0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 0 1.2 DRAIN CURRENT ---ID(A) 10 15 20 GAT E-SOURCE VOLT AGE---VGS(V) REVERSE DRAIN CURRENT vs SOURCEDRAIN VOLTAGE FORWARD TRANSFER ADM ITTANCE vs DRAIN CURRENT 1.00 REVERSE DRAIN CURRENT---IDR(A) 1000 FORWARD TRANSFER ADMITTANCE--GFS(ms) 5 VGS=10V 100 10 1 0.001 0.01 0.1 Pulse d 0.10 VGS=10V 0.01 0.00 1 0.50 1.00 1.50 SOURCE-DRAIN VOLT AGE---VSD(V) DRAIN CURRENT ---ID(A) SWIT CHING VGS=0V CHARACT ERIST ICS Power Derating Curve 100 0.25 Power Dissipation---PD(W) SWITCHING TIMES---(ns) 1000 Tf T d(off) T d(on) 10 Tr 1 0.001 0.15 0.1 0.05 0 0.01 0.1 DRAIN CURRENT ---ID(A) MTN7002S3 0.2 1 0 50 100 150 200 Ambient Temperature---Ta(℃) CYStek Product Specification Spec. No. : C325S3 Issued Date : 2005.06.15 Revised Date : Page No. : 4/4 CYStech Electronics Corp. SOT-323 Dimension Marking: 3 A Q A1 1 C TE 702 Lp 2 detail Z bp e1 W B e E D A Z θ He 0 v A 3-Lead SOT-323 Plastic Surface Mounted Package CYStek Package Code: S3 2 mm 1 scale Style: Pin 1.Gate 2.Source 3.Drain *: Typical Inches Min. Max. 0.0315 0.0433 0.0000 0.0039 0.0118 0.0157 0.0039 0.0098 0.0709 0.0866 0.0453 0.0531 0.0512 - DIM A A1 bp C D E e Millimeters Min. Max. 0.80 1.10 0.00 0.10 0.30 0.40 0.10 0.25 1.80 2.20 1.15 1.35 1.3 - Inches DIM Min. Max. e1 0.0256 He 0.0787 0.0886 Lp 0.0059 0.0177 Q 0.0051 0.0091 v 0.0079 w 0.0079 θ Millimeters Min. Max. 0.65 2.00 2.25 0.15 0.45 0.13 0.23 0.2 0.2 10° 0° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTN7002S3 CYStek Product Specification