MTN2N70FP

CYStech Electronics Corp.
N-Channel Enhancement Mode Power MOSFET
MTN2N70FP
Spec. No. : C722FP
Issued Date : 2011.06.09
Revised Date :
Page No. : 1/10
BVDSS : 700V
RDS(ON) : 5.8Ω (typ.)
ID : 1.8A
Description
The MTN2N70FP is a N-channel enhancement-mode MOSFET, providing the designer with the best
combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness.
The TO-220FP package is universally preferred for all commercial-industrial applications
Features
• Low On Resistance
• Simple Drive Requirement
• Fast Switching Characteristic
• Insulating package, front/back side insulating voltage=2500V(AC)
• RoHS compliant package
Applications
• Adapter
• Switching Mode Power Supply
Symbol
Outline
MTN2N70FP
TO-220FP
G：Gate
D：Drain
S：Source
MTN2N70FP
G D S
CYStek Product Specification
Spec. No. : C722FP
Issued Date : 2011.06.09
Revised Date :
Page No. : 2/10
CYStech Electronics Corp.
Absolute Maximum Ratings (TC=25°C)
Parameter
Symbol
Limits
Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Continuous Drain Current @TC=100°C
Pulsed Drain Current @ VGS=10V
(Note 1)
Single Pulse Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
Maximum Temperature for Soldering @ Lead at 0.125 in(0.318mm)
from case for 10 seconds
Total Power Dissipation (TC=25℃)
Linear Derating Factor
Operating Junction and Storage Temperature
VDS
VGS
ID
ID
IDM
EAS
IAR
EAR
dv/dt
700
±30
1.8*
1.08*
7.2*
8.8
1.8
2.3
4.5
V
V
A
A
A
mJ
A
mJ
V/ns
TL
300
°C
PD
23
0.18
-55~+150
W
W/°C
°C
Tj, Tstg
*Drain current limited by maximum junction temperature
Note : 1.Repetitive rating; pulse width limited by maximum junction temperature.
2. IAS=1.8A, VDD=50V, L=5mH, RG=25Ω, starting TJ=+25℃.
3. ISD≤1.8A, dI/dt≤100A/μs, VDD≤BVDSS, starting TJ=+25℃.
Thermal Data
Parameter
Thermal Resistance, Junction-to-case, max
Thermal Resistance, Junction-to-ambient, max
MTN2N70FP
Symbol
Rth,j-c
Rth,j-a
Value
5.5
62.5
Unit
°C/W
°C/W
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C722FP
Issued Date : 2011.06.09
Revised Date :
Page No. : 3/10
Characteristics (Tj=25°C, unless otherwise specified)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
700
2.0
-
0.65
1.2
5.8
4.0
±100
1
10
7
V
V/°C
V
S
nA
Ω
VGS=0, ID=250μA, Tj=25℃
Reference to 25°C, ID=250μA
VDS = VGS, ID=250μA
VDS =15V, ID=0.9A
VGS=±30
VDS =650V, VGS =0
VDS =520V, VGS =0, Tj=125°C
VGS =10V, ID=0.9A
6.6
1.4
2.6
9
25
24
28
320
42
6
8
28
60
58
66
-
nC
ID=1.8A, VDS=520V, VGS=10V
ns
VDS=325V, ID=1.8A, VGS=10V,
RG=25Ω
pF
VGS=0V, VDS=25V, f=1MHz
230
1
1.8
7.2
1.5
-
Static
BVDSS
∆BVDSS/∆Tj
VGS(th)
*GFS
IGSS
IDSS
*RDS(ON)
Dynamic
*Qg
*Qgs
*Qgd
*td(ON)
*tr
*td(OFF)
*tf
Ciss
Coss
Crss
Source-Drain Diode
*IS
*ISM
*VSD
*trr
*Qrr
-
μA
A
V
ns
μC
IS=1.8A, VGS=0V
VGS=0, IF=1.8A, dI/dt=100A/μs
*Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%
Ordering Information
Device
MTN2N70FP
MTN2N70FP
Package
TO-220FP
(RoHS compliant)
Shipping
50 pcs/tube, 20 tubes/box, 4 boxes / carton
CYStek Product Specification
Spec. No. : C722FP
Issued Date : 2011.06.09
Revised Date :
Page No. : 4/10
CYStech Electronics Corp.
Typical Characteristics
Static Drain-Source On-resistance vs Ambient Temperature
Typical Output Characteristics
15
3
15V
10V
9V
7V
2
Static Drain-Source On-state
Resistance-RDS(on)(Ω)
Drain Current - ID(A)
4
6V
5.5V
1
13
11
9
7
ID=0.9A,
VGS=10V
5
5V
VGS=4.5V
0
0
10
20
30
40
Drain-Source Voltage -VDS(V)
50
3
-100
60
150
2
15
Ta=25°C
VDS=10V
VGS=10V
Drain Current-ID(on)(A)
Static Drain-Source On-State
Resistance-RDS(on)(Ω)
0
50
100
Ambient Temperature-Ta(°C)
Drain Current vs Gate-Source Voltage
Static Drain-Source On-State resistance vs Drain Current
10
1.5
1
0.5
0
5
0.1
1
Drain Current-ID(A)
0
10
5
10
15
Gate-Source Voltage-VGS(V)
20
Forward Drain Current vs Source-Drain Voltage
Static Drain-Source On-State Resistance vs Gate-Source
Voltage
100
20
Ta=25°C
VGS=0V
Forward Current-IF(A)
Static Drain-Source On-State
Resistance-RDS(ON)(Ω)
-50
15
10
ID=0.9A
10
Ta=150°C
1
Ta=25°C
0.1
5
0
MTN2N70FP
2
4
6
8
10
Gate-Source Voltage-VGS(V)
12
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Source Drain Voltage -VSD(V)
CYStek Product Specification
Spec. No. : C722FP
Issued Date : 2011.06.09
Revised Date :
Page No. : 5/10
CYStech Electronics Corp.
Typical Characteristics(Cont.)
Brekdown Voltage vs Ambient Temperature
Capacitance vs Reverse Voltage
1000
Drain-Source Breakdown Voltage
BVDSS(V)
850
Capacitance-(pF)
Ciss
100
Coss
10
Crss
800
750
700
650
ID=250μA,
VGS=0V
f=1MHz
1
0
5
10
15
20
25
Drain-to-Source Voltage-VDS(V)
600
-100
30
0
50
100
150
200
Ambient Temperature-Tj(°C)
Gate Charge Characteristics
Maximum Safe Operating Area
10
12
10μs
100μs
1ms
10ms
1
100ms
Operation in this area is
limited by RDS(ON)
0.1
VDS=130V
Gate-Source Voltage---VGS(V)
Drain Current --- ID(A)
-50
DC
10
VDS=325V
8
VDS=520V
6
4
2
ID=1.8A
0
0.01
1
10
100
Drain-Source Voltage -VDS(V)
1000
0
2
4
6
8
Total Gate Charge---Qg(nC)
Maximum Drain Current vs Case Temperature
Maximum Drain Current---ID(A)
2.5
2
1.5
1
0.5
0
25
50
75
100
125
150
175
Case Temperature---TC(°C)
MTN2N70FP
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C722FP
Issued Date : 2011.06.09
Revised Date :
Page No. : 6/10
Typical Characteristics(Cont.)
Transient Thermal Response Curves
10
ZθJC(t), Thermal Response
D=0.5
0.2
1
0.1
1.ZθJC(t)=5.5 °C/W max.
2.Duty Factor, D=t1/t2
3.TJM-TC=PDM*ZθJC(t)
0.05
0.02
0.1
0.01
Single Pulse
0.01
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
t1, Square Wave Pulse Duration(s)
MTN2N70FP
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C722FP
Issued Date : 2011.06.09
Revised Date :
Page No. : 7/10
Test Circuit and Waveforms
MTN2N70FP
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C722FP
Issued Date : 2011.06.09
Revised Date :
Page No. : 8/10
Test Circuit and Waveforms(Cont.)
MTN2N70FP
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C722FP
Issued Date : 2011.06.09
Revised Date :
Page No. : 9/10
TO-220FP (C Forming) Dimension
Marking:
Device Name
Date Code
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
Style: Pin 1.Gate 2.Drain 3.Source
*Typical
Inches
Min.
Max.
0.169
0.185
0.051 REF
0.110
0.126
0.098
0.114
0.020
0.030
0.043
0.053
0.059
0.069
0.020
0.030
0.392
0.408
DIM
A
A1
A2
A3
b
b1
b2
c
D
Millimeters
Min.
Max.
4.300
4.700
1.300 REF
2.800
3.200
2.500
2.900
0.500
0.750
1.100
1.350
1.500
1.750
0.500
0.750
9.960
10.360
DIM
E
e
F
Φ
h
L
L1
L2
Inches
Min.
Max.
0.583
0.598
0.100*
0.106 REF
0.138 REF
0.000
0.012
1.102
1.118
0.067
0.075
0.075
0.083
Millimeters
Min.
Max.
14.800
15.200
2.540*
2.700 REF
3.500 REF
0.000
0.300
28.000
28.400
1.700
1.900
1.900
2.100
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
MTN2N70FP
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C722FP
Issued Date : 2011.06.09
Revised Date :
Page No. : 10/10
TO-220FP (S Forming) Dimension
Marking:
Device Name
Date Code
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
Style: Pin 1.Gate 2.Drain 3.Source
*Typical
Inches
Min.
Max.
0.171
0.183
0.051 REF
0.112
0.124
0.102
0.110
0.020
0.030
0.031
0.041
0.047 REF
0.020
0.030
0.396
0.404
0.583
0.598
0.100 *
0.106 REF
DIM
A
A1
A2
A3
b
b1
b2
c
D
E
e
F
Millimeters
Min.
Max.
4.35
4.65
1.300 REF
2.85
3.15
2.60
2.80
0.50
0.75
0.80
1.05
1.20 REF
0.500
0.750
10.06
10.26
14.80
15.20
2.54*
2.70 REF
DIM
G
H
H1
H2
J
K
L
L1
L2
M
N
Inches
Min.
Max.
0.246
0.258
0.138 REF
0.055 REF
0.256
0.272
0.031 REF
0.020
1.102
1.118
0.043
0.051
0.036
0.043
0.067 REF
0.012 REF
Millimeters
Min.
Max.
6.25
6.55
3.50 REF
1.40 REF
6.50
6.90
0.80 REF
0.50 REF
28.00
28.40
1.10
1.30
0.92
1.08
1.70 REF
0.30 REF
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTN2N70FP
CYStek Product Specification