DEC B7502PFA

DIOTEC
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ABDC?E-F GHI JK-LM C?E CORP
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Data Sheet No. B75PF-1A
75 AMP PRESS FIT HIGH VOLTAGE DIODES
FEATURES
MECHANICAL SPECIFICATION
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 5% of Die Area)
_ 0.002”
0.052” +
HUGE ROUND DIE FOR ULTRA HIGH POWER &
HEAVY DUTY PERFORMANCE
1.02”
0.98”
PRESS FIT INTO HEAT SINK TO FURTHER ENHANCE
HEAT HANDLING CAPABILITY
LOW THERMAL
o STRESSo STRUCTURE - PASS
5 CYCLE (-55 C TO +150 C) THERMAL SHOCK TEST
0.173”
0.157”
0.505”/502”
OVER KNURL
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DT
B7504A
0452
0.250”
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ALL DIMENSIONS IN INCHES
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0.039”
0.031”
ROUND DIE
MECHANICAL DATA
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0.401”
0.385”
0.194”
0.184”
PROPRIETARY HIGH TEMPERATURE JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
T
N
LIA
P
OM
SC
70 Typ.
RoH
78 Places
Equally
Spaced
0.007”
0.005”
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
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