Noninverting Buffer / CMOS Logic Level Shifter with LSTTL–Compatible Inputs MC74VHC1GT50 The MC74VHC1GT50 is a single gate noninverting buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The device input is compatible with TTL–type input thresholds and the output has a full 5 V CMOS level output swing. The input protection circuitry on this device allows overvoltage tolerance on the input, allowing the device to be used as a logic–level translator from 3.0 V CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the high–voltage power supply. The MC74VHC1GT50 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the MC74VHC1GT50 to be used to interface 5 V circuits to 3 V circuits. The output structures also provide protection when V CC = 0 V. These input and output structures help prevent device destruction caused by supply voltage – input/output voltage mismatch, battery backup, hot insertion, etc. • High Speed: t PD = 3.5 ns (Typ) at V CC = 5 V • Low Power Dissipation: I CC = 2 mA (Max) at T A = 25°C • TTL–Compatible Inputs: V IL = 0.8 V; V IH = 2.0 V • CMOS–Compatible Outputs: V OH > 0.8 V CC ; V OL < 0.1 V CC @Load • Power Down Protection Provided on Inputs and Outputs • Balanced Propagation Delays • Pin and Function Compatible with Other Standard Logic Families • Chip Complexity: FETs = 104; Equivalent Gates = 26 MARKING DIAGRAMS 5 4 1 2 VLd 3 SC–70/SC–88A/SOT–353 DF SUFFIX CASE 419A Pin 1 d = Date Code 5 Figure 1. Pinout (Top View) 4 VLd 1 2 3 SOT–23/TSOP–5/SC–59 DT SUFFIX CASE 483 PIN ASSIGNMENT 1 2 3 4 5 NC IN A GND OUT Y V CC Figure 2. Logic Symbol Pin 1 d = Date Code FUNCTION TABLE Inputs A L H Output Y L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. VHT50–1/4 MC74VHC1GT50 MAXIMUM RATINGS Symbol V CC V IN V OUT Parameter Value Unit – 0.5 to + 7.0 V – 0.5 to +7.0 V V CC=0 – 0.5 to +7.0 V High or Low State –0.5 to V cc + 0.5 I IK Input Diode Current –20 mA I OK Output Diode Current V OUT < GND; V OUT > V CC +20 mA I OUT DC Output Current, per Pin + 25 mA I CC DC Supply Current, V CC and GND +50 mA PD Power dissipation in still air SC–88A, TSOP–5 200 mW θ JA Thermal resistance SC–88A, TSOP–5 333 °C/W TL Lead Temperature, 1 mm from Case for 10 s 260 °C TJ Junction Temperature Under Bias + 150 °C T stg Storage temperature –65 to +150 °C V ESD ESD Withstand Voltage Human Body Model (Note 2) >2000 V Machine Model (Note 3) > 200 Charged Device Model (Note 4) N/A I LATCH–UP Latch–Up Performance Above V CC and Below GND at 125°C (Note 5) ± 500 mA 1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22–A114–A 3. Tested to EIA/JESD22–A115–A 4. Tested to JESD22–C101–A 5. Tested to EIA/JESD78 DC Supply Voltage DC Input Voltage DC Output Voltage RECOMMENDED OPERATING CONDITIONS Symbol Parameter V CC DC Supply Voltage V IN V OUT DC Input Voltage DC Output Voltage TA t r ,t f Operating Temperature Range Input Rise and Fall Time V CC = 0 High Low State DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 NORMALIZED FAILURE RATE V CC = 3.3 ± 0.3 V V CC = 5.0 ± 0.5 V Min Max Unit 3.0 0.0 0.0 0.0 – 55 0 0 5.5 5.5 5.5 V CC + 125 100 20 V V V °C ns/V 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature VHT50–2/4 MC74VHC1GT50 DC ELECTRICAL CHARACTERISTICS V CC Symbol V IH Parameter Minimum High–Level Test Conditions Input Voltage V IL (V) Min Max Min Max Min 3.0 4.5 1.4 2.0 1.4 2.0 1.4 2.0 5.5 2.0 2.0 2.0 Max Unit V V Minimum High–Level V IN = V IH or V IL Output Voltage V IN = V IH or V IL I OH = – 50 µA Maximum Low–Level Output Voltage V IN = V IH or V IL 3.0 4.5 0.53 0.8 0.53 0.8 0.53 0.8 5.5 0.8 0.8 0.8 V V IN = V IH or V IL I OH = –4 mA V OL Typ T A < 85°C –55°C<TA<125°C Maximum Low–Level Input Voltage V OH T A = 25°C 3.0 4.5 2.9 4.4 3.0 4.5 2.9 4.4 2.9 4.4 3.0 2.58 2.48 2.34 I OH = –8 mA V IN = V IH or V IL 4.5 3.94 3.80 3.66 I OL = 50 µA 3.0 4.5 V 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 V IN = V IH or V IL I OL = 4 mA 3.0 0.36 0.44 0.52 4.5 0 to5.5 0.36 ±0.1 0.44 ±1.0 0.52 ±1.0 µA I IN Maximum Input I OL = 8 mA V IN = 5.5 V or GND I CC Leakage Current Maximum Quiescent V IN = V CC or GND 5.5 2.0 20 40 µA I CCT Supply Current Quiescent Supply Input: V IN = 3.4 V 5.5 1.35 1.50 1.65 mA I OPD Current Output Leakage V OUT = 5.5 V 0.0 0.5 5.0 10 µA Current AC ELECTRICAL CHARACTERISTICS C load = 50 pF, Input t r = t f = 3.0 ns T A = 25°C Symbol Parameter t PLH , Maximum t PHL C IN C PD Propagation Delay, Input A to Y Test Conditions V CC = 3.3± 0.3 V C L = 15 pF Typ 4.5 Max 10.0 C L = 50 pF 6.3 13.5 15.0 17.5 V CC = 5.0± 0.5 V C L = 15 pF C L = 50 pF 3.5 4.3 6.7 7.7 7.5 8.5 8.5 9.5 5 10 10 10 Maximum Input Capacitance Power Dissipation Capacitance (Note 6) Min T A < 85°C –55°C<TA<125°C Min Max 11.0 Typical @ 25°C, V CC = 5.0 V 12 Min Max Unit 13.0 ns pF pF 6. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD • V CC • f in + I CC . C PD is used to determine the no– load dynamic power consumption; P D = C PD • V CC 2 • f in + I CC • V CC . VHT50–3/4 MC74VHC1GT50 3.0V V OH Y V OL *Includes all probe and jig capacitance Figure 4. Switching Waveforms Figure 5. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Temp Order Number Circuit Device Range Technology Indicator Function Identifier Package Suffix Tape & Reel Suffix MC74VHC1GT50DFT1 MC 74 VHC1G T50 DF T1 MC74VHC1GT50DFT2 MC 74 VHC1G T50 DF T2 MC74VHC1GT50DFT4 MC 74 VHC1G T50 DF T4 MC74VHC1GT50DTT1 MC 74 VHC1G T50 DT T1 MC74VHC1GT50DTT3 MC 74 VHC1G T50 DT T3 Package Type (Name/SOT#/ Common Name) Tape and Reel Size SC–70/SC–88A/ SOT–353 SC–70/SC–88A/ SOT–353 SC–70/SC–88A/ SOT–353 SOT–23/TSOPS/ SC–59 SOT–23/TSOPS/ SC–59 178 mm (7 in) 3000 Unit 178 mm (7 in) 3000 Unit 330 mm (13 in) 10,000 Unit 178 mm (7 in) 3000 Unit 330 mm (13 in) 10,000 Unit VHT50–4/4