Fuji Power MOSFET SuperFAP-G series Target Specification PRELIMINARY 2SK3674-01L,S,SJ (900V/2.0Ω/7A) T-PACK 1) Package L ・・・See Page 2/4 S ・・・See Page 3/4 SJ ・・・See Page 4/4 2) Absolute Maximum Ratings (Tc=25℃ unless otherwise specified) Items Drain-Source Voltage Continuous Drain Current Pulsed Drain Current Gate-Source Voltage Repetitive and Non-Repetitive Maximum Avalanche Current Non-Repetitive Maximum Avalanche Energy Maximum Drain-Source dV/dt Peak Diode recovery dV/dt This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Maximum Power Dissipation Operating and Storage Temperature range Symbols Ratings 900 ±7 ±28 ±30 Units V A A V IAR 7 A EAS 269.5 mJ VDS ID ID(pulse) VGS *1 kV/us kV/us *2 W W ℃ ℃ 20 5 225 1.67 150 -55 ∼ +150 dVDS/dt dV/dt PD ＠Ｔc=25℃ PD @Ta=25℃ Tch Tstg 3)Electrical Characteristics (Tch=25℃ unless otherwise specified) Items Symbols Test Conditions ID=250uA VGS=0V Drain-Source Breakdown Voltage BVDSS ID=250uA VDS=VGS VGS(th) Gate Threshold Voltage VDS=900V Tch=25℃ Zero Gate Voltage Drain Current IDSS VGS=0V Tch=125℃ VGS=±30V VDS=0V IGSS Gate-Source Leakage Current Drain-Source On-State Resistance RDS(on) Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate to Source Charge Gate to Drain (Miller) Charge Avalanche Capability Diode Forward On-Voltage Ciss Coss Crss Qg Qgs Qgd IAV VSD min. 900 3.0 ------- typ. ----------- max. --5.0 50 500 100 Units V V µA µA nA --- --- 2.0 Ω VDS=25V VGS=0V f=1MHz Vcc=450V ID=7A VGS=10V L=10.1mH Tch=25℃ IF=7A,VGS=0V,Tch=25℃ ------------7 --- 980 120 6 28 9 8 --1.0 --------------1.5 Test Conditions min. typ. max. 0.56 75.0 ID=3.5A VGS=10V pF nC A V 4) Thermal Characteristics Items Channel to Case Channel to Ambient Symbols Rth(ch-c) Rth(ch-a) *1 L=10.1mH,Vcc=90V *2 IF≤-ID,-di/dt=50A/µs,Vcc≤BVDSS,Tch≤150°C DATE NAME APPROVED Fuji Electric Co.,Ltd. CHECKED Sep.-10-'02 REVISIONS MA4LE DWG.NO. DRAWN Sep.-10-'02 MT5F12615 1/4 Units ℃/W ℃/W 1 DATE CHECKED REVISIONS MA4LE 2 1 NAME 2 DWG.NO. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. FUJI POWER MOS FET See Note: 1. Trademark Lot No. Type name PRE-SOLDER 3 CONNECTION 3 1 GATE 2 DRAIN 3 SOURCE JEDEC : TO-220AB Note: 1. Guaranteed mark of avalanche ruggedness. DIMENSIONS ARE IN MILLIMETERS. APPROVED DRAWN Fuji Electric Co.,Ltd. MT5F12615 2/4 FUJI POWER MOS FET OUT VIEW See Note: 1. 4 Trademark Fig. 1. Lot No. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Type name Fig. 1. CONNECTION Solder Plating 1 4 2 3 GATE DRAIN SOURCE Pre-Solder Notes Note: 1. Guaranteed mark of avalanche ruggedness. 1. ( ) : Reference dimensions. 2. The metal part is covered with the solder plating, part of cutting is without the solder plating. DIMENSIONS ARE IN MILLIMETERS. DATE NAME APPROVED Fuji Electric Co.,Ltd. CHECKED REVISIONS MA4LE DWG.NO. DRAWN MT5F12615 3/4 FUJI POWER MOS FET OUT VIEW See Note: 1. Trademark Fig. 1. Lot No. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Type name Fig. 1. CONNECTION 4 1 GATE 2 DRAIN 3 SOURCE Solder Plating Pre-Solder Notes Note: 1. Guaranteed mark of avalanche ruggedness. DATE NAME 1. ( ) : Reference dimensions. 2. The metal part is covered with the solder plating, part of cutting is without the solder plating. DIMENSIONS ARE IN MILLIMETERS. APPROVED Fuji Electric Co.,Ltd. CHECKED REVISIONS MA4LE DWG.NO. DRAWN MT5F12615 4/4