Pb Free Plating Product ISSUED DATE :2005/06/24 REVISED DATE : GE630 BVDSS RDS(ON) ID N-CHANNEL ENHANCEMENT MODE POWER MOSFET 200V 400m 9A Description The GE630 provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 is universally preferred for all commercial-industrial applications at power dissipation level to approximately 50 watts. The through-hole version is available for low-profile applications. Features *Dynamic dv/dt Rating *Repetitive Avalanche Rated *Simple Drive Requirement *Fast Switching Package Dimensions REF. A b c D E L4 L5 Millimeter Min. Max. 4.40 4.80 0.76 1.00 0.36 0.50 8.60 9.00 9.80 10.4 14.7 15.3 6.20 6.60 REF. c1 b1 L e L1 Ø A1 Millimeter Min. Max. 1.25 1.45 1.17 1.47 13.25 14.25 2.54 REF. 2.60 2.89 3.71 3.96 2.60 2.80 Absolute Maximum Ratings Parameter Symbol Ratings Unit Drain-Source Voltage VDS 200 V Gate-Source Voltage VGS 30 V Continuous Drain Current, VGS@10V ID @TC=25 9 A Continuous Drain Current, VGS@10V ID @TC=100 5.7 A 36 A 74 W Pulsed Drain Current 1 IDM PD @TC=25 Total Power Dissipation Linear Derating Factor Single Pulse Avalanche Energy 0.59 2 W/ EAS 240 mJ Avalanche Current IAR 9 A Repetitive Avalanche Energy EAR 7 mJ Tj, Tstg -55 ~ +150 Symbol Value Operating Junction and Storage Temperature Range Thermal Data Parameter Unit Thermal Resistance Junction-case Max. Rthj-c 1.7 /W Thermal Resistance Junction-ambient Max. Rthj-a 62 /W GE630 Page: 1/5 ISSUED DATE :2005/06/24 REVISED DATE : Electrical Characteristics(Tj = 25 Parameter Unless otherwise specified) Symbol Min. Typ. Max. Unit Drain-Source Breakdown Voltage BVDSS 200 - - V Breakdown Voltage Temperature Coefficient BVDSS / Tj - 0.248 - Gate Threshold Voltage VGS(th) 2.0 - 4.0 V VDS=VGS, ID=250uA gfs - 40 - S VDS=10V, ID=5A IGSS - - 100 nA VGS= - - 10 uA VDS=200V, VGS=0 - - 100 uA VDS=160V, VGS=0 RDS(ON) - - 400 Total Gate Charge Qg - 25 - Gate-Source Charge Qgs - 3.6 - Gate-Drain (“Miller”) Change Qgd - 14 - Td(on) - 8 - Tr - 26 - Td(off) - 34 - Tf - 22 - Ciss - 515 - Output Capacitance Coss - 90 - Reverse Transfer Capacitance Crss - 40 - Symbol Min. Typ. Max. Unit VSD - - 1.3 V IS=9A, VGS=0V, Tj=25 IS - - 9 A VD=VG=0V, VS=1.3V ISM - - 36 A Forward Transconductance Gate-Source Leakage Current Drain-Source Leakage Current(Tj=25 ) Drain-Source Leakage Current(Tj=150 ) Static Drain-Source On-Resistance 3 3 Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance IDSS V/ Test Conditions VGS=0, ID=1mA Reference to 25 , ID=1mA 30V m VGS=10V, ID=5A nC ID=9A VDS=160V VGS=10V ns VDS=100V ID=9A VGS=10V RG=10 RD=11 pF VGS=0V VDS=25V f=1.0MHz Source-Drain Diode Parameter 3 Forward On Voltage Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) 1 Test Conditions Notes: 1. Pulse width limited by safe operating area. 2. Staring Tj=25 , VDD=50V, L=4.5mH, RG=25 , IAS=9A. 3. Pulse width 300us, duty cycle 2%. GE630 Page: 2/5 ISSUED DATE :2005/06/24 REVISED DATE : Characteristics Curve Fig 1. Typical Output Characteristics GE630 Fig 2. Typical Output Characteristics Fig 3. Normalized BVDSS v.s. Junction Temperature Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Maximum Drain Current v.s. Case Temperature Fig 6. Type Power Dissipation Page: 3/5 ISSUED DATE :2005/06/24 REVISED DATE : Fig 7. Maximum Safe Operating Area Fig 9. Gate Charge Characteristics Fig 11. Forward Characteristics of Reverse Diode GE630 Fig 8. Effective Transient Thermal Impedance Fig 10. Typical Capacitance Characteristics Fig 12. Gate Threshold Voltage v.s. Junction Temperature Page: 4/5 ISSUED DATE :2005/06/24 REVISED DATE : Fig 13. Switching Time Circuit Fig 14. Switching Time Waveform Fig 15. Gate Charge Circuit Fig 16. Gate Charge Waveform Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM. GTM reserves the right to make changes to its products without notice. GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems. GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Taiwan: No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C. TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785 China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165 GE630 Page: 5/5