Pb Free Plating Product ISSUED DATE :2005/01/25 REVISED DATE :2005/12/12B GU40N03 BVDSS RDS(ON) ID N-CHANNEL ENHANCEMENT MODE POWER MOSFET 30V 17m 40A Description The GU40N03 provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-263 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage application such as DC/DC converters and high efficiency switching circuit. Features *Dynamic dv/dt Rating *Simple Drive Requirement *Repetitive Avalanche Rated *Fast Switching Package Dimensions REF. A b L4 c L3 L1 E Millimeter REF. Min. Max. 4.40 4.80 c2 0.76 1.00 b2 0.00 0.30 B D 0.36 0.5 e 1.50 REF. L 2.29 2.79 9.80 10.4 L2 Millimeter Min. Max. 1.25 1.45 1.17 1.47 8.6 9.0 2.54 REF. 14.6 15.8 0˚ 8˚ 1.27 REF. Absolute Maximum Ratings Parameter Symbol Ratings Unit Drain-Source Voltage VDS 30 V Gate-Source Voltage VGS ±20 V Continuous Drain Current, VGS@10V ID @TC=25 40 A Continuous Drain Current, VGS@10V ID @TC=100 30 A 169 A 50 W Pulsed Drain Current 1 IDM Total Power Dissipation PD @TC=25 Linear Derating Factor 0.4 Operating Junction and Storage Temperature Range Tj, Tstg -55 ~ +150 Symbol Value W/ Thermal Data Parameter Unit Thermal Resistance Junction-case Max. Rthj-c 2.5 /W Thermal Resistance Junction-ambient Max. Rthj-a 62 /W GU40N03 Page: 1/5 ISSUED DATE :2005/01/25 REVISED DATE :2005/12/12B Electrical Characteristics (Tj = 25 Parameter unless otherwise specified) Symbol Min. Typ. Max. Unit Drain-Source Breakdown Voltage BVDSS 30 - - V Breakdown Voltage Temperature Coefficient BVDSS / Tj - 0.037 - Gate Threshold Voltage VGS(th) 1.0 - 3.0 V VDS=VGS, ID=250uA gfs - 26 - S VDS=10V, ID=20A IGSS - - ±100 nA VGS= ±20V - - 25 uA VDS=30V, VGS=0 - - 250 uA VDS=24V, VGS=0 - 14 17 - 22 24 Forward Transconductance Gate-Source Leakage Current Drain-Source Leakage Current(Tj=25 ) Drain-Source Leakage Current(Tj=150 ) Static Drain-Source On-Resistance IDSS RDS(ON) V/ m Test Conditions VGS=0, ID=250uA Reference to 25 , ID=1mA VGS=10V, ID=20A VGS=4.5V, ID=16A Total Gate Charge2 Qg - 17 - Gate-Source Charge Qgs - 3 - Gate-Drain (“Miller”) Change Qgd - 10 - Td(on) - 7.2 - Tr - 60 - Td(off) - 22.5 - Tf - 10 - Input Capacitance Ciss - 800 - Output Capacitance Coss - 380 - Reverse Transfer Capacitance Crss - 133 - Symbol Min. Typ. Max. Unit VSD - - 1.3 V IS=40A, VGS=0V, Tj=25 IS - - 40 A VD=VG=0V, VS=1.3V ISM - - 169 A Turn-on Delay Time2 Rise Time Turn-off Delay Time Fall Time nC ID=20A VDS=24V VGS=5V ns VDS=15V ID=20A VGS=10V RG=3.3 RD=0.75 pF VGS=0V VDS=25V f=1.0MHz Source-Drain Diode Parameter 2 Forward On Voltage Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) 1 Test Conditions Notes: 1. Pulse width limited by safe operating area. 2. Pulse width 300us, duty cycle 2%. GU40N03 Page: 2/5 ISSUED DATE :2005/01/25 REVISED DATE :2005/12/12B Characteristics Curve Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Maximum Drain Current v.s. Case Temperature Fig 6. Type Power Dissipation GU40N03 Page: 3/5 ISSUED DATE :2005/01/25 REVISED DATE :2005/12/12B Fig 7. Maximum Safe Operating Area Fig 9. Gate Charge Characteristics Fig 11. Forward Characteristics of Reverse Diode GU40N03 Fig 8. Effective Transient Thermal Impedance Fig 10. Typical Capacitance Characteristics Fig 12. Gate Threshold Voltage v.s. Junction Temperature Page: 4/5 ISSUED DATE :2005/01/25 REVISED DATE :2005/12/12B Fig 13. Switching Time Circuit Fig 14. Switching Time Waveform Fig 15. Gate Charge Circuit Fig 16. Gate Charge Waveform Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM. GTM reserves the right to make changes to its products without notice. GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems. GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Taiwan: No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C. TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785 China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165 GU40N03 Page: 5/5