HANBIT HDD16M72D9RPW-13A

HANBit
HDD16M72D9RPW
DDR SDRAM Module 128Mbyte (16Mx72bit), based on 16Mx8, 4Banks
4K Ref., 184Pin-DIMM with PLL & Register
Part No. HDD16M72D9RPW
GENERAL DESCRIPTION
The HDD16M72D9RPW is a 64M x 72 bit Double Data Rate(DDR) Synchronous Dynamic RAM high-density memory
module. The module consists of nine CMOS 16M x 8 bit with 4banks DDR SDRAMs in 66pin TSOP-II 400mil packages and
2K EEPROM in 8-pin TSSOP package on a 184-pin glass-epoxy. Four 0.1uF decoupling capacitors are mounted on the
printed circuit board in parallel for each DDR SDRAM. The HDD16M72D9RPW is a DIMM(Dual in line Memory
Module) .Synchronous design allows precise cycle control with the use of system clock. Data I/O transactions are possible
on both edges of DQS. Range of operating frequencies, programmable latencies and burst lengths allows the same device
to be useful for a variety of high bandwidth, high performance memory system applications. All module components may be
powered from a single 2.5V DC power supply and all inputs and outputs are SSTL_2 compatible.
FEATURES
• Part Identification
HDD16M72D9RPW – 10A
: 100MHz (CL=2)
HDD16M72D9RPW – 13A
: 133MHz (CL=2)
HDD16M72D9RPW – 13B
: 133MHz (CL=2.5)
• Power supply : VDD: 2.5V ± 0.2V, VDDQ: 2.5V ± 0.2V
• Double-data-rate architecture; two data transfers per clock cycle
• Bidirectional data strobe(DQS)
• Differential clock inputs(CK and CK)
• DLL aligns DQ and DQS transition with CK transition
• Programmable Read latency 2, 2.5 (clock)
• Programmable Burst length (2, 4, 8)
• Programmable Burst type (sequential & interleave)
• Edge aligned data output, center aligned data input
• Auto & Self refresh, 15.6us refresh interval (4K/64ms refresh)
• Serial presence detect with EEPROM
• PCB : Height 1200 mil, double sided component
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HDD16M72D9RPW
PIN ASSIGNMENT
PIN
Front
PIN
Back
PIN
Frontl
PIN
Back
PIN
Front
PIN
Back
1
VREF
32
A5
62
VDDQ
93
VSS
124
VSS
154
/RAS
2
DQ0
33
DQ24
63
/WE
94
DQ4
125
A6
155
DQ45
3
VSS
34
VSS
64
DQ41
95
DQ5
126
DQ28
156
VDDQ
4
DQ1
35
DQ25
65
/CAS
96
VDDQ
127
DQ29
157
/CS0
5
DQS0
36
DQS3
66
VSS
97
DM0
128
VDDQ
158
/CS1
6
DQ2
37
A4
67
DQS5
98
129
DM3
159
DM5
7
VDD
38
VDD
68
DQ42
99
DQ7
130
A3
160
VSS
8
DQ3
39
DQ26
69
DQ43
100
VSS
131
DQ30
161
DQ46
DQ6
9
NC
40
DQ27
70
VDD
101
NC
132
VSS
162
DQ47
10
/RESET
41
A2
71
* /CS2
102
NC
133
DQ31
163
* /CS3
11
VSS
42
VSS
72
DQ48
103
*A13
134
CB4
164
VDDQ
12
DQ8
43
A1
73
DQ49
104
VDDQ
135
CB5
165
DQ52
13
DQ9
44
CB0
74
VSS
105
DQ12
136
VDDQ
166
DQ53
14
DQS1
45
CB1
75
* CK2
106
DQ13
137
CK0
167
NC
15
VDDQ
46
VDD
76
* /CK2
107
DM1
138
/CK0
168
VDD
16
* CK1
47
DQS8
77
VDDQ
108
VDD
139
VSS
169
DM6
17
* /CK1
48
A0
78
DQS6
109
DQ14
140
DM8
170
DQ54
18
VSS
49
CB2
79
DQ50
110
DQ15
141
A10
171
DQ55
19
DQ10
50
VSS
80
DQ51
111
CKE1
142
CB6
172
VDDQ
20
DQ11
51
CB3
81
VSS
112
VDDQ
143
VDDQ
173
NC
21
CKE0
52
BA1
82
VDDID
113
* BA2
144
CB7
174
DQ60
22
VDDQ
83
DQ56
114
DQ20
175
DQ61
23
DQ16
53
KEY
DQ32
84
DQ57
115
*A12
145
KEY
VSS
176
VSS
24
DQ17
54
VDDQ
85
VDD
116
VSS
146
DQ36
177
DM7
25
DQS2
55
DQ33
86
DQS7
117
DQ21
147
DQ37
178
DQ62
26
VSS
56
DQS4
87
DQ58
118
A11
148
VDD
179
DQ63
27
A9
57
DQ34
88
DQ59
119
DM2
149
DM4
180
VDDQ
28
DQ18
58
VSS
89
VSS
120
VDD
150
DQ38
181
SA0
29
A7
59
BA0
90
NC
121
DQ22
151
DQ39
182
SA1
30
VDDQ
60
DQ35
91
SDA
122
A8
152
VSS
183
SA2
31
DQ19
61
DQ40
92
SCL
123
DQ23
153
DQ44
184
VDDSPD
*These pins should be NC in the system which does not support SPD
PIN
PIN DESCRIPTION
PIN
PIN DESCRIPTION
A0~A11
Address input
VDD
Power supply(2.5V)
Power supply for DQs(2.5V)
BA0~BA1
Bank Select Address
VDDQ
DQ0~DQ63
Data input/output
VREF
Power supply for reference
CB0~CB7
Check bit(Data input/output)
VSPD
Serial EEPROM Power supply(3.3)
DQS0~DQS7
Data Strobe input/output
VSS
Ground
DM0~DM7
Data-in Mask
SA0~SA2
Address in EEPROM
CK0~CK2,/CK0~/CK2
Clock input
SDA
Serial data I/O
CKE0
Clock enable input
SCL
Serial clock
/CS0
Chip Select input
WP
Write protection
/RAS
Row Address strobe
VDDIN
VDD identification flag
/CAS
Column Address strobe
NC
No connection
/RESET
Reset Enable
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HDD16M72D9RPW
FUNCTIONAL BLOCK DIAGRAM
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HDD16M72D9RPW
PIN FUNCTION DESCRIPTION
Pin
CK, /CK
Name
Clock
Input Function
CK and /CK are differential clock inputs. All address and control input signals are
sampled on the positive edge of CK and negative edge of CK. Output (read) data
is referenced to both edges of CK. Internal clock signals are derived from CK/CK.
CKE HIGH activates, and CKE LOW deactivates internal clock signals, and
device input buffers and output drivers. Deactivating the clock provides
PRECHARGE
POWER-DOWN and SELF REFRESH operation (all banks idle), or ACTIVE
CKE
Clock Enable
POWER-DOWN(row ACTIVE in any bank). CKE is synchronous for all functions
except for disabling outputs, which is achieved asynchronously. Input buffers,
excluding CK, CK and CKE are disabled during power-down and self refresh
modes, providing low standby power. CKE will recognizean LVCMOS LOW level
prior to VREF being stable on power-up.
/CS enables(registered LOW) and disables(registered HIGH) the command
decoder.
/CS
Chip Select
All commands are masked when /CS is registered HIGH. /CS provides for external
bank selection on systems with multiple banks. /CS is considered part of the
command code.
Row/column addresses are multiplexed on the same pins.
A0 ~ A12
Address
BA0 ~ BA1
Bank select address
/RAS
Row address strobe
/CAS
Columnaddress strobe
/WE
Write enable
DQS0 ~ 7
Data Strobe
Row address : RA0 ~ RA12, Column address : CA0 ~ CA9
BA0 and BA1 define to which bank an ACTIVE, READ, WRITE or PRE-CHARGE
command is being applied.
Latches row addresses on the positive going edge of the CLK with /RAS low.
Enables row access & precharge.
Latches column addresses on the positive going edge of the CLK with /CAS low.
Enables column access.
Enables write operation and row precharge.
Latches data in starting from /CAS, /WE active.
Output with read data, input with write data. Edge-aligned with read data, centered in write data. Used to capture write data.
DM is an input mask signal for write data. Input data is masked when DM is
sampled HIGH along with that input data during a WRITE access. DM is sampled
DM0~7
Input Data Mask
on both edges of DQS. DM pins include dummy loading internally, to matches the
DQ and DQS load-ing.
DQ0 ~ 63
Data input/output
Data inputs/outputs are multiplexed on the same pins.
WP pin is connected to Vcc.
WP
Write Protection
When WP is “high”, EEPROM Programming will be inhibited and the entire
memory will be write-protected.
VDDQ
Supply
DQ Power Supply : +2.5V ± 0.2V.
VDD
Supply
Power Supply : +2.5V ± 0.2V (device specific).
VSS
Supply
DQ Ground.
VREF
Supply
SSTL_2 reference voltage.
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HDD16M72D9RPW
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATING
UNTE
VIN, VOUT
-0.5 ~ 3.6
V
Voltage on VDD supply relative to Vss
VDD
-1.0 ~ 3.6
V
Voltage on VDDQ supply relative to Vss
VDDQ
-0.5 ~ 3.6
V
Storage temperature
TSTG
-55 ~ +150
°C
PD
8.0
W
Short circuit current
IOS
50
Notes: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
mA
Voltage on any pin relative to Vss
Power dissipation
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
POWER & DC OPERATING CONDITIONS
(Recommended operating conditions (Voltage referenced to Vss = 0V, TA = 0 to 70°C) )
PARAMETER
Supply Voltage
I/O Supply Voltage
SYMBOL
MIN
MAX
UNIT
VDD
2.3
2.7
V
VDDQ
2.3
2.7
V
NOTE
I/O Reference Voltage
VREF
VDDQ/2-50mV
VDDQ/2+50mV
V
1
I/O Termination Voltage(system)
VTT
VREF – 0.04
VREF + 0.04
V
2
Input High Voltage
VIH (DC)
VREF + 0.15
VREF + 0.3
V
Input Low Voltage
VIL (DC)
-0.3
VREF - 0.15
V
Input Voltage Level, CK and /CK inputs
VIN (DC)
-0.3
VDDQ + 0.3
V
Input Differential Voltage, CK and /CK inputs
VID (DC)
0.3
VDDQ + 0.6
V
Input leakage current
I LI
-2
2
uA
Output leakage current
I OZ
-5
5
uA
Output High current (VOUT = 1.95V)
I OH
-16.8
mA
Output Low current (VOUT = 0.35V)
I OL
16.8
mA
Output High Current(Half strengh driver)
IOH
-9
mA
Output High Current(Half strengh driver)
IOL
9
mA
3
Notes
1. Includes ± 25mV margin for DC offset on VREF, and a combined total of ± 50mV margin for all AC noise and DC offset on VREF,
bandwidth limited to 20MHz. The DRAM must accommodate DRAM current spikes on VREF and internal DRAM noise coupled
TO VREF, both of which may result in VREF noise. VREF should be de-coupled with an inductance of £ 3nH.
2. VTT is not applied directly to the device. V TT is a system supply for signal termination resistors, is expected to be set equal to
VREF, and must track variations in the DC level of VREF
3. VID is the magnitude of the difference between the input level on CK and the input level on CK.
4. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in
simulation. The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ.
5. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the dc level of the same.
6. These charactericteristics obey the SSTL-2 class II standards.
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HDD16M72D9RPW
INPUT/OUTPUT Capacitance
(VDD = 2.5V, VDDQ = 2.5V, TA = 25° C, F = 1MHZ)
DESCRIPTION
SYMBOL
MIN
MAX
UNITS
Input Capacitance(A0 ~ A12, BA0 ~ BA1,RAS,CAS, WE )
CIN1
49
57
pF
Input Capacitance(CKE0)
CIN2
42
50
pF
Input Capacitance( CS0)
CIN3
42
50
pF
Input Capacitance( CLK0, CLK1,CLK2 )
CIN4
22
25
pF
COUT1
6
8
pF
CIN5
6
8
pF
Data & DQS input/output Capacitance(DQ0~DQ63)
Input Capacitance(DM0~DM8)
AC Operating Conditions
PARAMETER/ Condition
STMBOL
MIN
Input High (Logic 1) Voltage, DQ, DQS and DM signals
VIH (AC)
VREF + 0.31
Input Low (Logic 0) Voltage, DQ, DQS and DM signals.
VIL (AC)
Input Differential Voltage, CK and CK inputs
VID (AC)
Input Crossing Point Voltage, CK and CK inputs
VIX (AC)
MAX
UNIT
NOTE
3
VREF - 0.31
V
3
0.7
VDDQ+0.6
V
1
0.5*VDDQ-0.2
0.5*VDDQ+0.2
V
2
Note 1. VID is the magnitude of the difference between the input level on CK and the input on CK.
2. The value of V IX is expected to equal 0.5* VDDQ of the transmitting device and must track variations in the DC level of the same.
3. These parameters should be tested at the pim on actual components and may be checked at either the pin or the pad in simulation.
the AC and DC input specificatims are refation to a VREF envelope that has been bandwidth limited 20MHz.
AC Operating TEST Conditions
PARAMETER
VALUE
UNIT
Input reference voltage for Clock
0.5 * VDDQ
V
Input signal maximum peak swing
1.5
V
Input signal minimum slew rate
0.5
V/ns
Input Levels(VIH/VIL)
VREF+0.31/VREF-0.31
V
Input timing measurement reference level
VREF
V
Output timing measurement reference level
VTT
V
Output load condition
See Load Circuit
V
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HDD16M72D9RPW
AC Timming Parameters & Specifications (These AC charicteristics were tested on the Component)
PARAMETER
DDR200
DDR266A
DDR266B
-10A
-13A
-13B
SYMBOL
MIN
MAX
MIN
MAX
MIN
UNIT
NOTE
MAX
Row cycle time
tRC
70
65
65
ns
1
Refresh row cycle time
tRFC
80
75
75
ns
1,2
Row active time
tRAS
48
ns
1,2
/RAS to /CAS delay
tRCD
20
20
20
ns
3
Row precharge time
tRP
20
20
20
ns
3
Row active to Row active delay
tRRD
15
15
15
ns
3
Write recovery time
tWR
2
2
2
tCK
3
Last data in to Read command
tCDLR
1
1
1
tCK
2
Col. address to Col. address delay
tCCD
1
1
1
tCK
Clock cycle time
CL=2.0
CL=2.5
tCK
120K
10
45
120K
45
120K
12
7.5
12
10
12
ns
12
7.5
12
7.5
12
ns
Clock high level width
tCH
0.45
0.55
0.45
0.55
0.45
0.55
tCK
Clock low level width
tCL
0.45
0.55
0.45
0.55
0.45
0.55
tCK
DQS-out access time from CK/CK
tDQSCK
-0.8
+0.8
-0.75
+0.75
-0.75
+0.75
ns
Output data access time from CK/CK
tAC
-0.8
+0.8
-0.75
+0.75
-0.75
+0.75
ns
Data strobe edge to ouput data edge
tDQSQ
-
+0.6
-
+0.5
-
+0.5
ns
Read Preamble
tRPRE
0.9
1.1
0.9
1.1
0.9
1.1
tCK
Read Postamble
tRPST
0.4
0.6
0.4
0.6
0.4
0.6
tCK
Data out high impedence time from CK-/CK
tHZQ
-0.8
+0.8
-0.75
+0.75
-0.75
+0.75
ns
CK to valid DQS-in
tDQSS
0.75
1.25
0.75
1.25
0.75
1.25
tCK
DQS-in setup time
tWPRES
0
0
0
ns
DQS-in hold time
tWPREH
0.25
0.25
0.25
tCK
DQS-in falling edge to CK rising-setup time
tDSS
0.2
0.2
0.2
tCK
DQS-in falling edge to CK rising hold time
tDSH
0.2
0.2
0.2
tCK
DQS-in high level width
tDQSH
0.35
0.35
0.35
tCK
DQS-in low level width
tDQSL
0.35
0.35
0.35
tCK
DQS-in cycle time
tDSC
0.9
Address and Control Input setup time
tIS
1.1
0.9
0.9
ns
Address and Control Input hold time
tIH
1.1
0.9
0.9
ns
1.1
0.9
1.1
0.9
1.1
Mode register set cycle time
tMRD
16
15
15
ns
tDS
0.6
0.5
0.5
ns
DQ & DM hold time to DQS
tDH
0.6
0.5
0.5
ns
DQ & DM input pulse width
tDIPW
2
1.75
1.75
ns
Power down exit time
tPDEX
10
10
10
ns
Exit self refresh to write command
tXSW
116
95
Exit self refresh to bank active command
tXSA
80
75
75
ns
Exit self refresh to read command
tXSR
200
200
200
Cycle
ns
Refresh interval time
tREF
15.6
15.6
15.6
us
Output DQS valid window
tQH
0.35
0.35
0.35
tCK
DQS write postamble time
tWPST
0.25
0.25
0.25
tCK
7
3
tCK
DQ & DM setup time to DQS
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Notes :
-
1.
Maximum burst refresh cycle : 8
2.
The specific requirement is that DQS be valid(High or Low) on or before this CK edge. The case shown(DQS going from High_Z
to logic Low) applies when no writes were previously in progress on the bus. If a previous write was in progress, DQS could be
High at this time, depending on tDQSS.
3.
The maximum limit for this parameter is not a device limit. The device will operate with a great value for this parameter, but
system performance (bus turnaround) will degrade accordingly.
4.
A write command can be applied with tRCD satisfied after this command.
5.
For registered DIMMs, tCL and tCH are ≥ 45% of the period including both the half period jitter (tJIT(HP) ) of the PLL and the half
jitter due to crosstalk (tJIT(crosstalk) ) on the DIMM.
6.
Input Setup/Hold Slew Rate Derating
(V/ns)
(ps)
(ps)
0.5
0
0
0.4
+50
+50
I/O Setup/Hold Slew Rate Derating
Input Setup/Hold Slew Rate
Δ tIS
Δ tIH
(V/ns)
(ps)
(ps)
0.5
0
0
0.4
+75
+75
I/O Setup/Hold Plateau Derating
I/O Input Level
Δ tDS
Δ tDH
(mV)
(ps)
(ps)
± 280
+50
+50
This derating table is used to increase tDS/tDH in the case where the input level is flat below VREF ± 310mV for a duration of up to 2ns.
9.
-
Δ tIH
0.3
+150
+150
This derating table is used to increase tDS/tDH in the case where the I/O slew rate is below 0.5V/ns. I/O setup/hold slew rate based on
the lesser of AC-AC slew rate and DC-DC slew rate.
8.
-
Δ tIS
0.3
+100
+100
This derating table is used to increase tDS/tDH in the case where the input slew rate is below 0.5V/ns. Input setup/hold slew rate based
on the lesser of AC-AC slew rate and DC-DC slew rate.
7.
-
Input Setup/Hold Slew Rate
I/O Delta Rise/Fall Rate(1/slew-rate) Derating
Delta Rise/Fall Rate
Δ tDS
Δ tDH
(ns/V)
(ps)
(ps)
0
0
0
±0.25
+50
+50
±0.5
+100
+100
This derating table is used to increase tDS/tDH in the case where the DQ and DQS slew rates differ. The Delta Rise/Fall Rate is
calated as 1/SlewRate1-1/SlewRate2. For example, if slew rate 1 = 5V/ns and slew rate 2 =.4V/ns then the Delta Rise/Fall Rate =0/5ns/V. Input S/H slew rate based on larger of AC-AC delta rise/fall rate and DC-DC delta rise/fall rate.
10. This parameter is fir system simulation purpose. It is guranteed by design.
11. For each of the terms, if not already an integer, round to the next highest integer. tCK is actual to the system clock cycle time.
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COMMAND TRUTH TABLE (V=Valid, X=Don’t Care, H=Logic High, L=Logic Low)
COMMAND
CK
E
n-1
CKE
n
/CS
/RAS
/CAS
/WE
DM
BA
0,1
A10/
AP
A11
A9~A0
NOTE
Register
Extended MRS
H
X
L
L
L
L
X
OP code
1,2
Register
Mode register set
H
X
L
L
L
L
X
OP code
1,2
L
L
L
H
X
X
L
H
H
H
X
X
Auto refresh
Refresh
Entry
Self
refresh
Exit
Bank active & Row Addr.
Read &
column
address
Write &
column
address
H
H
L
L
H
H
X
X
X
H
X
L
L
H
H
X
V
H
X
L
H
L
H
X
V
Auto precharge
disable
Auto precharge
Auto precharge
disable
Auto precharge
H
H
X
L
H
L
enable
Burst Stop
H
Bank selection
Precharge
All banks
Clock suspend or
active power down
Precharge power
down mode
H
X
X
Entry
H
L
Exit
L
H
Entry
Exit
X
H
L
DM
H
No operation command
H
L
H
L
H
H
L
L
L
H
L
H
X
X
X
L
V
V
V
X
X
X
X
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
X
X
H
X
X
X
L
H
H
H
3
Column
(A0 ~ A9)
4
L
Column
4
H
(A0 ~ A9)
Address
X
V
L
X
H
X
X
5
X
X
X
X
X
V
X
X
X
1.
OP Code : Operand Code. A0 ~ A12 & BA0 ~ BA1 : Program keys. (@EMRS/MRS)
2.
EMRS/ MRS can be issued only at all banks precharge state.
A new command can be issued 2 clock cycles after EMRS or MRS.
3.
Auto refresh functions are same as the CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by "Auto".
Auto/self refresh can be issued only at all banks precharge state.
4.
BA0 ~ BA1 : Bank select addresses.
If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected.
If BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank B is selected.
If BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank C is selected.
If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected.
5.
If A10/AP is "High" at row precharge, BA0 and BA1 are ignored and all banks are selected.
6.
During burst write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after the end of burst.
7.
Burst stop command is valid at every burst length.
8.
DM sampled at the rising and falling edges of the DQS and Data-in are masked at the both edges (Write DM latency is 0).
9.
This combination is not defined for any function, which means "No Operation(NOP)" in DDR SDRAM.
9
4,6
7
Note :
URL : www.hbe.co.kr
REV 1.0 (November.2002)
4
H
X
X
3
Address
V
L
3
Row address
L
eable
3
HANBit Electronics Co.,Ltd.
8
HANBit
HDD16M72D9RPW
PACKAGE DIMENSIONS
Unit : mm
< Front –Side >
133.35 ± 0.20
30.48± 0.20
< Rear –Side >
133.35 ± 0.20
30.48± 0.20
ORDERING INFORMATION
Part Number
Density
Org.
HDD16M72D9RPW-10A
128MByte
16M x 72
HDD16M72D9RPW-13A
128MByte
16M x 72
Package
184PIN
DIMM
184PIN
Ref.
Vcc
MODE
MAX.frq
4K
2.5V
DDR
100MHz/CL2
4K
2.5V
DDR
133MHz/CL2
4K
2.5V
DDR
133MHz/CL2.5
DIMM
HDD16M72D9RPW-13B
128MByte
16M x 72
184PIN
DIMM
URL : www.hbe.co.kr
REV 1.0 (November.2002)
10
HANBit Electronics Co.,Ltd.