HT46R74D-1 Dual Slope A/D Type MCU with LCD Technical Document · Tools Information · FAQs · Application Note Features · Operating voltage: · Integrated RC or crystal oscillator fSYS = 4MHz: 2.2V~5.5V fSYS = 8MHz: 3.3V~5.5V · Power-down and wake-up functions reduce power consumption · 10 bidirectional I/O lines and two ADC inputs · Internal 3.3V Voltage regulator and charge pump · Two external interrupts inputs shared with I/O lines · Embedded voltage reference generator - 1.5V · One 8-bit and one 18-bit programmable timer/event · 6-level subroutine nesting counter with overflow interrupt and pre-scaler · Bit manipulation instruction · LCD driver with 15´4, 16´3 or 16´2 segments · 15-bit table read instruction · 4K´15 program memory with partial lock function · Up to 0.5ms instruction cycle with 8MHz system clock · 96´8 data memory RAM at VDD=5V · Single differential input channel dual slope Analog to · 63 powerful instructions Digital Converter with Operational Amplifier. · All instructions in 1 or 2 machine cycles · Watchdog Timer with regulator power · Low voltage reset/detector function · Buzzer output · 56-pin SSOP package · External 32768Hz RTC oscillator General Description converter, LCD display, HALT and wake-up functions, watchdog timer, as well as low cost, enhance the versatility of these devices to suit for a wide range of AD with LCD application possibilities such as sensor signal processing, scales, consumer products, subsystem controllers, etc. The HT46R74D-1 is an 8-bit high performance, RISC architecture microcontroller device specifically designed for A/D with LCD applications that interface directly to analog signals, such as those from sensors. The advantages of low power consumption, I/O flexibility, timer functions, oscillator options, Dual slope A/D Rev. 1.30 1 June 7, 2007 HT46R74D-1 Block Diagram In te rru p t C ir c u it P ro g ra m R O M P ro g ra m C o u n te r IN T C M M P U T im in g G e n e r a tio n P B C V D D S S h ifte r P A C P o rt A P A D S C 1 H A L T R e g u la to r P A 5 /T M R 1 fS Y S /4 X 3 2 7 6 8 H z M U Y S /4 R T C X O S C O S C 3 O S C 4 W D T O S C P B 0 ~ P B 1 P A P A P A P A P A P A P A P A 2 0 /B Z 1 /B Z 3 /P 4 /T 5 /T 6 /IN 7 /IN F D M R 0 M R 1 T 0 T 1 L V D /L V R L C D M e m o ry C h a rg e P u m p E N /D IS Y S A C C L C D D r iv e r 1 -C h a n n e l D u a l- S lo p e C o n v e rte r w ith O P V O C H P V O R E G P o rt B P B B P O S R E V D V S U fS P A 4 /T M R 0 W D T S T A T U S A L U O S C 2 M W D T P r e s c a le r M U X In s tr u c tio n D e c o d e r X fS D a ta M e m o ry X U P F D 0 T M R 1 C T M R 1 P F D 1 In s tr u c tio n R e g is te r P r e s c a le r M T M R 0 C T M R 0 S T A C K C O M 0 ~ C O M 2 C O M 3 /S E G 1 5 S E G 0 ~ S E G 1 4 D O P D O P D O P D C H D S R D S R D S C C A P C R A N A O O P Pin Assignment P A 2 1 5 6 P A 1 /B Z P A 3 /P F D 2 5 5 P A 0 /B Z P A 4 /T M R 0 3 5 4 R E S P A 5 /T M R 1 4 5 3 O S C 1 P A 6 /IN T 0 5 5 2 O S C 2 P A 7 /IN T 1 6 5 1 O S C 4 V S S 7 5 0 O S C 3 V D D 8 4 9 S E G 0 A V D D 9 4 8 S E G 1 V O B G P 1 0 4 7 S E G 2 C H P C 2 1 1 4 6 S E G 3 C H P C 1 1 2 4 5 S E G 4 V O C H P 1 3 4 4 S E G 5 V O R E G 1 4 4 3 S E G 6 A V S S 1 5 4 2 S E G 7 D O P A P 1 6 4 1 S E G 8 D O P A N 1 7 4 0 S E G 9 D O P A O 1 8 3 9 S E G 1 0 D C H O P 1 9 3 8 S E G 1 1 D S R R 2 0 3 7 S E G 1 2 D S R C 2 1 3 6 S E G 1 3 D S C C 2 2 3 5 S E G 1 4 P B 0 2 3 3 4 S E G 1 5 /C O M 3 P B 1 2 4 3 3 C O M 2 V L C D 2 5 3 2 C O M 1 V M A X 2 6 3 1 C O M 0 V 1 2 7 3 0 C 2 V 2 2 8 2 9 C 1 H T 4 6 R 7 4 D -1 5 6 S S O P -A Rev. 1.30 2 June 7, 2007 HT46R74D-1 Pin Description Pin Name I/O Options Description PA0/BZ PA1/BZ PA2 PA3/PFD PA4/TMR0 PA5/TMR1 PA6/INT0 PA7/INT1 I/O Wake-up Pull-high Buzzer PFD Bidirectional 8-bit input/output port. Each individual pin on this port can be configured as a wake-up input by a configuration option. Software instructions determine if the pin is a CMOS output or Schmitt trigger input. Configuration options determine which pins on this port have pull-high resistors. The BZ/BZ, PFD, TMR0/TMR1, INT0/INT1 are pin-shared with PA0/1, PA3, PA4/5, and PA6/7, respectively. PB0~PB1 I/O Pull-high Bidirectional 2-bit input/output port. Software instructions determine if the pin is a CMOS output or Schmitt trigger input. Configuration options determine which pins on this port have pull-high resistors. VLCD ¾ ¾ LCD power supply VMAX ¾ ¾ IC maximum voltage. Connect to VDD, VLCD or V1 V1, V2, C1, C2 ¾ ¾ LCD voltage pump COM0~COM2 COM3/SEG15 O SEG0~SEG14 O Segment Output VOBGP AO ¾ Band gap voltage output pin. (for internal use) VOREG O ¾ Regulator output - 3.3V VOCHP O ¾ Charge pump output - requires external capacitor CHPC1 ¾ ¾ Charge pump capacitor, positive CHPC2 ¾ ¾ Charge pump capacitor, negative DOPAN, DOPAP, DOPAO, DCHOP AI/AO ¾ Dual Slope converter pre-stage OPA related pins. DOPAN is the OPA Negative input pin, DOPAP is the OPA Positive input pin, DOPAO is the OPA output pin and DCHOP is the OPA Chopper pins. DSRR, DSRC, DSCC AI/AO ¾ Dual slope AD converter main function RC circuit. DSRR is the input or reference signal, DSRC is the Integrator negative input, and DSCC is the comparator negative input. OSC1 OSC2 I O OSC1, OSC2 are connected to an external RC network or crystal for the Crystal or RC internal system clock. The OSC2 pin can be used to monitor the system clock at 1/4 frequency. OSC3 OSC4 I O RTC or OSC3, OSC4 are connected to a 32768Hz crystal to form a real time System Clock clock for timing purposes or to form a system clock. RES I ¾ Schmitt trigger reset input, active low VDD ¾ ¾ Positive power supply VSS ¾ ¾ Negative power supply, ground AVDD ¾ ¾ Analog positive power supply AVSS ¾ ¾ Analog negative power supply, ground Rev. 1.30 COM0~COM3 are the LCD common outputs. A configuration option se1/2, 1/3 or 1/4 lects the LCD duty-cycle. When either 1/3 or 1/2 duty is selected, the Duty COM3/SEG15 pin will be configured as SEG15. LCD driver outputs for the LCD panel segments. 3 June 7, 2007 HT46R74D-1 Absolute Maximum Ratings Supply Voltage ...........................VSS-0.3V to VSS+6.0V Storage Temperature ............................-50°C to 125°C Input Voltage..............................VSS-0.3V to VDD+0.3V IOL Total ..............................................................150mA Total Power Dissipation .....................................500mW Operating Temperature...........................-40°C to 85°C IOH Total............................................................-100mA Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. D.C. Characteristics Symbol VDD Parameter Operating Voltage Ta=25°C Test Conditions Conditions VDD Min. Typ. Max. Unit ¾ 5.5 V ¾ fSYS=4MHz 2.2 ¾ fSYS=8MHz 3.3 ¾ 5.5 V ¾ 0.6 1.6 mA ¾ 2 4 mA ¾ 0.8 1.5 mA ¾ 2.5 4 mA 3V No load, fSYS=4MHz Analog block off IDD1 Operating Current (Crystal OSC) IDD2 Operating Current (RC OSC) IDD3 Operating Current (RC OSC) 5V No load, fSYS=8MHz Analog block off ¾ 4 8 mA IDD4 Operating Current (Crystal OSC) 5V No load, fSYS=8MHz Analog block off ¾ 4 8 mA IDD5 ¾ 0.3 0.6 mA Operating Current (RTC OSC) ¾ 0.6 1 mA ¾ 3 5 mA ¾ ¾ 1 mA ¾ ¾ 2 mA ¾ 2.5 5 mA ¾ 10 20 mA ¾ 2 5 mA ¾ 6 10 mA ¾ 17 30 mA ¾ 34 60 mA ¾ 13 25 mA ¾ 28 50 mA ¾ 14 25 mA ¾ 26 50 mA ¾ 10 20 mA ¾ 19 40 mA 5V 3V 5V 3V 5V IDD6 Operating Current (ADC On) ISTB1 Standby Current (*fS=fSYS/4) ISTB2 Standby Current (*fS=RTC OSC) ISTB3 Standby Current (*fS=WDT OSC) ISTB4 Standby Current (*fS=RTC OSC) ISTB5 ISTB6 ISTB7 Rev. 1.30 Standby Current (*fS=RTC OSC) Standby Current (*fS=WDT OSC) Standby Current (*fS=WDT OSC) 5V 3V 5V 3V 5V 3V 5V 3V 5V 3V 5V 3V 5V 3V 5V No load, fSYS=4MHz Analog block off No load, fSYS=32768Hz VREGO=3.3V, fSYS=4MHz ADC on, ADCCLK=125kHz (all other analog devices off) No load, system HALT, Analog block off, LCD off No load, system HALT, Analog block off, LCD off No load, system HALT, Analog block off, LCD off No load, system HALT, Analog block off, LCD on 1/2 bias, VLCD=VDD (Low bias current option) No load, system HALT, Analog block off, LCD on 1/3 bias, VLCD=VDD (Low bias current option) No load, system HALT, Analog block off, LCD on 1/2 bias, VLCD=VDD No load, system HALT, Analog block off, LCD on 1 3 bias, VLCD=VDD 4 June 7, 2007 HT46R74D-1 Symbol Parameter Test Conditions VDD Conditions Min. Typ. Max. Unit VIL1 Input Low Voltage for I/O Ports, TMR and INT ¾ ¾ 0 ¾ 0.3VDD V VIH1 Input High Voltage for I/O Ports, TMR and INT ¾ ¾ 0.7VDD ¾ VDD V VIL2 Input Low Voltage (RES) ¾ ¾ 0 ¾ 0.4VDD V VIH2 Input High Voltage (RES) ¾ ¾ 0.9VDD ¾ VDD V VLCD LCD Highest Voltage ¾ ¾ 0 ¾ VDD V VLVR1 Low Voltage Reset 1 ¾ LVR option= 2.2V 2.1 2.2 2.3 V VLVR2 Low Voltage Reset 2 ¾ LVR option= 3.3V 3.15 3.3 3.45 V VLVD1 Low Voltage Detector 1 ¾ LVR option= 2.2V, LVD option= LVR+0.2 2.25 2.4 2.55 V VLVD2 Low Voltage Detector 2 ¾ LVR option=3.3V LVD option= LVR+0.2 3.45 3.6 3.75 V IOL1 I/O Port Segment Logic Output Sink Current 3V 4 8 ¾ mA 10 20 ¾ mA IOH1 I/O Port Segment Logic Output Source Current -2 -4 ¾ mA -5 -10 ¾ mA IOL2 LCD Common and Segment Current 210 420 ¾ mA IOH2 LCD Common and Segment Current RPH Pull-high Resistance of I/O Ports and INT 5V 3V 5V 3V 5V 3V 5V VOL=0.1VDD VOH=0.9VDD VOL=0.1VDD VOH=0.9VDD 350 700 ¾ mA -80 -160 ¾ mA -180 -360 ¾ mA 3V ¾ 20 60 100 kW 5V ¾ 10 30 50 kW Charge pump on 2.2 ¾ 3.6 V Charge pump off 3.7 ¾ 5.5 V Charge Pump and Regulator VCHPI Input Voltage VREGO Output Voltage VREGDP1 ¾ ¾ No load 3 3.3 3.6 V ¾ VDD=3.7V~5.5V Charge pump off Current£10mA ¾ 100 ¾ mV ¾ VDD=2.4V~3.6V Charge pump on Current£6mA ¾ 100 ¾ mV Regulator Output Voltage Drop (Compare with No Load) VREGDP2 Dual Slope AD, Amplifier and Band Gap VRFGO Reference Generator Output ¾ @3.3V 1.45 1.5 1.55 V VRFGTC Reference Generator Temperature Coefficient ¾ @3.3V ¾ 50 ¾ Ppm/C VADOFF Input Offset Range ¾ ¾ 500 800 mV VICMR Common Mode Input Range ¾ ¾ Amplifier, no load 0.2 ¾ VREGO-1 V ¾ Integrator, no load 1 ¾ VREGO-0.2 V A.C. Characteristics Rev. 1.30 Ta=25°C 5 June 7, 2007 HT46R74D-1 Test Conditions Symbol Parameter System Clock (RC OSC) fSYS System Clock (Crystal OSC) fINRC Unit 400 ¾ 4000 kHz ¾ 2.2V~5.5V 400 ¾ 4000 kHz ¾ 3.3V~5.5V 400 ¾ 8000 kHz ¾ 12 ¾ kHz ¾ 15 ¾ kHz 0 ¾ 4000 kHz 3V tWDTOSC Watchdog Oscillator Period Max. 2.2V~5.5V ¾ Internal RC OSC Timer I/P Frequency (TMR0/TMR1) Typ. ¾ 5V fTIMER Min. Conditions VDD ¾ 2.2V~5.5V 3V ¾ 45 90 180 ms 5V ¾ 32 65 130 ms tRES External Reset Low Pulse Width ¾ ¾ 1 ¾ ¾ ms tSST System Start-up Timer Period ¾ Power-up or wake-up from HALT ¾ 1024 ¾ tSYS tLVR Low Voltage Width to Reset ¾ ¾ 0.25 1 2 ms tINT Interrupt Pulse Width ¾ ¾ 1 ¾ ¾ ms Note: tSYS= 1/fSYS Rev. 1.30 6 June 7, 2007 HT46R74D-1 Functional Description After accessing a program memory word to fetch an instruction code, the value of the PC is incremented by 1. The PC then points to the memory word containing the next instruction code. Execution Flow The system clock is derived from either a crystal or an external RC oscillator. It is internally divided into four non-overlapping clocks. One instruction cycle consists of four system clock cycles. When executing a jump instruction, conditional skip execution, loading the PCL register, a subroutine call, an initial reset, an internal interrupt, an external interrupt, or returning from a subroutine, the PC manipulates the program transfer by loading the address corresponding to each instruction. Instruction fetching and execution are pipelined in such a way that a fetch takes one instruction cycle while decoding and execution takes the next instruction cycle. The pipelining scheme makes it possible for each instruction to be effectively executed in a cycle. If an instruction changes the value of the program counter, two cycles are required to complete the instruction. The conditional skip is activated by instructions. Once the condition is met, the next instruction, fetched during the current instruction execution, is discarded and a dummy cycle replaces it to get a proper instruction, otherwise the program proceeds with the next instruction. Program Counter - PC The program counter is 12 bits wide and controls the sequence in which the instructions stored in the program ROM are executed. The contents of the PC can specify a maximum of 4096 addresses. S y s te m O S C 2 (R C C lo c k T 1 T 2 T 3 T 4 T 1 The lower byte of the Program Counter, PCL, is a readable and writeable register. Moving data into the PCL register performs a short jump. The destination must be within 256 locations. T 2 T 3 T 4 T 1 T 2 T 3 T 4 o n ly ) P C P C P C + 1 F e tc h IN S T (P C ) E x e c u te IN S T (P C -1 ) P C + 2 F e tc h IN S T (P C + 1 ) E x e c u te IN S T (P C ) F e tc h IN S T (P C + 2 ) E x e c u te IN S T (P C + 1 ) Execution Flow Mode Program Counter *11 *10 *9 *8 *7 *6 *5 *4 *3 *2 *1 *0 Initial Reset 0 0 0 0 0 0 0 0 0 0 0 0 External Interrupt 0 0 0 0 0 0 0 0 0 0 1 0 0 External Interrupt 1 0 0 0 0 0 0 0 0 1 0 0 0 Timer/Event Counter 0 Overflow 0 0 0 0 0 0 0 0 1 1 0 0 Timer/Event Counter 1 Overflow 0 0 0 0 0 0 0 1 0 0 0 0 ADC Interrupt 0 0 0 0 0 0 0 1 0 1 0 0 RTC Interrupt 0 0 0 0 0 0 0 1 1 0 0 0 Skip Program Counter+2 Loading PCL *11 *10 *9 *8 @7 @6 @5 @4 @3 @2 @1 @0 Jump, Call Branch #11 #10 #9 #8 #7 #6 #5 #4 #3 #2 #1 #0 Return from Subroutine S11 S10 S9 S8 S7 S6 S5 S4 S3 S2 S1 S0 Program Counter Note: *11~*0: Program counter bits #11~#0: Instruction code bits Rev. 1.30 S11~S0: Stack register bits @7~@0: PCL bits 7 June 7, 2007 HT46R74D-1 · Location 00CH When a control transfer takes place, an additional dummy cycle is required. Location 00CH is reserved for the Timer/Event Counter 0 interrupt service program. If a timer interrupt results from a Timer/Event Counter 0 overflow, and if the interrupt is enabled and the stack is not full, the program begins execution at location 00CH. Program Memory - ROM The program memory is used to store the program instructions which are to be executed. It also contains data, table, and interrupt entries, and is organized with a structure of 4096´15 bits which are addressed by the program counter and table pointer. · Location 010H Location 010H is reserved for the Timer/Event Counter 1 interrupt service program. If a timer interrupt results from a Timer/Event Counter 1 overflow, and if the interrupt is enabled and the stack is not full, the program begins execution at location 010H. Certain locations in the ROM are reserved for special usage: · Location 000H · Location 014H Location 000H is reserved for program initialization. After a chip reset, the program always begins execution at this location. Location 014H is reserved for the ADC interrupt service program. If an ADC interrupt occurs, and the interrupt is enabled, and the stack is not full, the program begins execution at location 014H. · Location 004H · Location 018H Location 004H is reserved for the INT0 external interrupt service program. If the INT0 input pin is activated, and the interrupt is enabled, and the stack is not full, the program begins execution at location 004H. Location 018H is reserved for the real time clock interrupt service program. If a real time clock interrupt occurs, and the interrupt is enabled, and the stack is not full, the program begins execution at location 018H. · Location 008H Location 008H is reserved for the INT1 external interrupt service program. If the INT1 input pin is activated, and the interrupt is enabled, and the stack is not full, the program begins execution at location 008H. 0 0 0 H E x te r n a l In te r r u p t 0 S u b r o u tin e 0 0 8 H 0 1 0 H Any location in the Program Memory can be used as a look-up table. The instructions ²TABRDC [m]² (the current page, 1 page=256 words) and ²TABRDL [m]² (the last page) transfer the contents of the lower-order byte to the specified data memory, and the contents of the higher-order byte to the TBLH register, which is the Table high order byte register. Only the destination of the lower-order byte in the table is well-defined; the other bits of the table word are all transferred to the lower portion of TBLH. The TBLH register is read only, and the table pointer, TBLP, is a read/write register, and is used to indicate the table location. Before accessing the table, the location should be placed into the TBLP register. All the table related instructions require 2 cycles to complete their operation. These areas may function as normal ROM depending upon the user¢s requirements. D e v ic e In itia liz a tio n P r o g r a m 0 0 4 H 0 0 C H · Table location E x te r n a l In te r r u p t 1 S u b r o u tin e T im e r /E v e n t C o u n te r 0 In te r r u p t S u b r o u tin e T im e r /E v e n t C o u n te r 1 In te r r u p t S u b r o u tin e 0 1 4 H A D C In te rru p t 0 1 8 H P ro g ra m M e m o ry R T C In te rru p t n 0 0 H L o o k - u p ta b le ( 2 5 6 w o r d s ) Stack Register - STACK n F F H The stack register is a special part of the memory used to save the contents of the program counter. The stack is organized into 6 levels and is neither part of the data nor part of the program, and is neither readable nor writeable. Its activated level is indexed by a stack pointer, SP, and is neither readable nor writeable. At the L o o k - u p ta b le ( 2 5 6 w o r d s ) F F F H 1 5 b its N o te : n ra n g e s fro m 0 to 1 F Program Memory Table Location Instruction(s) *11 *10 *9 *8 *7 *6 *5 *4 *3 *2 *1 *0 TABRDC [m] P11 P10 P9 P8 @7 @6 @5 @4 @3 @2 @1 @0 TABRDL [m] 1 1 1 1 @7 @6 @5 @4 @3 @2 @1 @0 Table Location Note: *11~*0: Table location bits @7~@0: Table pointer bits Rev. 1.30 P11~P8: Current program counter bits 8 June 7, 2007 HT46R74D-1 In d ir e c t A d d r e s s in g R e g is te r 0 start of a subroutine call or an interrupt acknowledgment, the contents of the program counter is pushed onto the stack. At the end of the subroutine or interrupt routine, indicated by a return instruction, RET or RETI, the contents of the program counter is restored to its previous value from the stack. After a chip reset, the SP will point to the top of the stack. 0 0 H If the stack is full and a non-masked interrupt takes place, the interrupt request flag is recorded but the acknowledgment is still inhibited. Once the SP is decremented, using a RET or RETI instruction, the interrupt is serviced. This feature prevents a stack overflow, allowing the programmer to use the structure easily. Likewise, if the stack is full, and a ²CALL² is subsequently executed, a stack overflow occurs and the first entry is lost as only the most recent 6 return addresses are stored. 0 8 H T B L H 0 9 H R T C C 0 A H S T A T U S 0 B H IN T C 0 0 1 H M P 0 0 2 H In d ir e c t A d d r e s s in g R e g is te r 1 0 3 H M P 1 0 4 H B P 0 5 H A C C 0 6 H P C L 0 7 H T B L P 0 C H 0 D H T M R 0 0 E H T M R 0 C 0 F H T M R 1 H 1 0 H T M R 1 L 1 1 H T M R 1 C 1 2 H P A Data Memory - RAM 1 3 H P A C 1 4 H P B Bank 0 of the data memory has a capacity of 123´8 bits, and is divided into two functional groups, namely the special function registers, which have a 27´8 bit capacity and the general purpose data memory which have a 96´8 bit capacity. Most locations are readable/writable, although some are read only. The special function register are overlapped in all banks. 1 5 H P B C 1 6 H T M R 1 H H 1 7 H H A L T C Any unused locations before 20H will return a zero result if read. The general purpose data memory, addressed from 20H to 7FH , is used for data and control information under instruction commands. All of the data memory areas can handle arithmetic, logic, increment, decrement and rotate operations directly. Except for some dedicated bits, each bit in the data memory can be set and reset by the ²SET [m].i² and ²CLR [m].i² instructions. They are also indirectly accessible through the memory pointer registers, MP0 and MP1. A D C R 1 9 H R e s e rv e d 1 A H A D C D 1 B H E A D C R 1 C H W D T C 1 D H W D T D 1 E H IN T C 1 1 F H C H P R C 2 0 H 7 F H G e n e ra l P u rp o s e D a ta M e m o ry (9 6 B y te s ) : U n u s e d R e a d a s "0 0 " RAM Mapping registers, MP0 and MP1, are both 7-bit registers and are used to access the Data Memory in combination with the indirect addressing registers. MP0 can only be used with the data memory, while MP1 can be used with both the data memory and the LCD display memory. Bank 1 contains the LCD Data Memory locations. After first setting up the Bank Pointer, BP, to the value of ²01H² to access Bank 1, this bank must then be accessed indirectly using Memory Pointer MP1. With BP set to a value of ²01H², using MP1 to indirectly read or write to the data memory areas with addresses from 40H~4FH will result in operations to Bank 1. Directly addressing the Data Memory will always result in Bank 0 being accessed irrespective of the value of BP. Accumulator - ACC The accumulator, ACC, is related to the ALU operations. It is mapped to location 05H of the RAM and is capable of operating with immediate data. The data movement between two data memory locations must pass through the ACC. Indirect Addressing Register Locations 00H and 02H are indirect addressing registers that are not physically implemented. Any read/write operations on [00H] and [02H] accesses the RAM locations pointed to by MP0 and MP1 respectively. Reading locations 00H or 02H indirectly returns the result 00H. Writing to them indirectly leads to no operation. The function of data movement between two indirect addressing registers is not supported. The memory pointer Rev. 1.30 1 8 H S p e c ia l P u r p o s e D a ta M e m o ry Arithmetic and Logic Unit - ALU This circuit performs 8-bit arithmetic and logic operations and provides the following functions: · Arithmetic operations (ADD, ADC, SUB, SBC, DAA) · Logic operations (AND, OR, XOR, CPL) · Rotation (RL, RR, RLC, RRC) · Increment and Decrement (INC, DEC) 9 June 7, 2007 HT46R74D-1 · Branch decision (SZ, SNZ, SIZ, SDZ etc.) request flag will be recorded. If a certain interrupt requires servicing within the service routine, the EMI bit and the corresponding bit of INTC0 or INTC1 may be set in order to permit interrupt nesting to take place. Once the stack is full, the interrupt request will not be acknowledged, even if the related interrupt is enabled, until the Stack Pointer is decremented. If immediate service is desired, the stack should be prevented from becoming full. The ALU not only saves the results of a data operation but also changes the status register. Status Register - STATUS The status register is 8 bits wide and contains, a carry flag (C), an auxiliary carry flag (AC), a zero flag (Z), an overflow flag (OV), a power down flag (PDF), and a watchdog time-out flag (TO). It also records the status information and controls the operation sequence. All interrupts will provide a wake-up function. As an interrupt is serviced, a control transfer occurs by pushing the contents of the program counter onto the stack followed by a branch to a subroutine at the specified location in the Program Memory. Only the contents of the program counter is pushed onto the stack. If the contents of the accumulator or of the status register is altered by the interrupt service program which corrupts the desired control sequence, the contents should be saved in advance. Except for the TO and PDF flags, the status register bits can be altered by instructions similar to other registers. Data written into the status register does not alter the TO or PDF flags. Operations related to the status register, however, may yield different results from those intended. The TO and PDF flags can only be changed by a Watchdog Timer overflow, a device power-up, or clearing the Watchdog Timer and executing the ²HALT² instruction. The Z, OV, AC, and C flags reflect the status of the latest operations. External interrupts are triggered by an edge transition on pin INT0 or INT1. A configuration option determines the type of edge transition, high to low, low to high, or both low to high and high to low. Their related interrupt request flags are EIF0; bit 4 of INTC0, and EIF1; bit 5 of INTC0, must also be set. After the interrupt is enabled, if the stack is not full and the external interrupt is active, a subroutine call to location 04H or 08H occurs. The interrupt request flag, EIF0 or EIF1, and EMI bits will be cleared to disable other maskable interrupts. On entering the interrupt sequence or executing a subroutine call, the status register will not be automatically pushed onto the stack. If the contents of the status register is important, and if the subroutine is likely to corrupt the status register, the programmer should take precautions and save it properly. Interrupts The device provides two external interrupts, two internal timer/event counter interrupts and the ADC interrupt. The interrupt control register INTC0, and interrupt control register INTC1, both contain the interrupt control bits that are used to set the enable/ disable status and interrupt request flags. The internal Timer/Event Counter 0 interrupt is generated when the Timer/Event Counter 0 interrupt request flag is set, which is bit T0F; bit 6 of INTC0. This occurs when the timer overflows. After the interrupt is enabled, if the stack is not full, and the T0F bit is set, a subroutine call to location 0CH occurs. The related interrupt request flag, T0F, will be reset, and the EMI bit will be cleared to disable other maskable interrupts. The interrupt for Timer/Event Counter 1 operates in a similar Once an interrupt subroutine is serviced, other interrupts are all blocked, by clearing the EMI bit. This prevents further interrupt nesting. Other interrupt requests may take place during this interval, but only the interrupt Bit No. Label Function 0 C C is set if an operation results in a carry during an addition operation or if a borrow does not take place during a subtraction operation; otherwise C is cleared. C is also affected by a rotate through carry instruction. 1 AC AC is set if an operation results in a carry out of the low nibbles in addition or no borrow from the high nibble into the low nibble in subtraction; otherwise AC is cleared. 2 Z 3 OV OV is set if an operation results in a carry into the highest-order bit but not a carry out of the highest-order bit, or vice versa; otherwise OV is cleared. 4 PDF PDF is cleared by either a system power-up or executing the ²CLR WDT² instruction. PDF is set by executing the ²HALT² instruction. 5 TO TO is cleared by a system power-up or executing the ²CLR WDT² or ²HALT² instruction. TO is set by a WDT time-out. 6~7 ¾ Unused bit, read as ²0² Z is set if the result of an arithmetic or logic operation is zero; otherwise Z is cleared. Status (0AH) Register Rev. 1.30 10 June 7, 2007 HT46R74D-1 manner but its related interrupt request flag is T1F, which is bit 4 of INTC1, and its subroutine call location is 10H. Interrupts occurring in the interval between the rising edges of two consecutive T2 pulses are serviced on the latter of the two T2 pulses if the corresponding interrupts are enabled. In the case of simultaneous requests, the priorities in the following table apply. These can be masked by resetting the EMI bit. The A/D converter interrupt is generated when the A/D converter interrupt request flag, ADF; bit 5 of INTC1 is set. This occurs when an A/D conversion process has completed. After the interrupt is enabled, if the stack is not full, and the ADF bit is set, a subroutine call to location 14H occurs. The related interrupt request flag, ADF, is reset and the EMI bit is cleared to disable further maskable interrupts. Priority Vector External interrupt 0 Interrupt Source 1 04H External interrupt 1 2 08H Timer/Event Counter 0 overflow 3 0CH Timer/Event Counter 1 overflow 4 10H ADC interrupt 5 14H Real time clock interrupt 6 18H The real time clock interrupt is generated when the real time clock interrupt request flag, RTF; bit 6 of INTC1, is set. After the interrupt is enabled, if the stack is not full, and the RTF bit is set, a subroutine call to location 18H occurs. The related interrupt request flag, RTF, is reset and the EMI bit is cleared to disable further maskable interrupts. Once an interrupt request flag has been set, it remains in the INTC1 or INTC0 register until the interrupt is serviced or cleared by a software instruction. During the execution of an interrupt subroutine, other maskable interrupt acknowledgments are all held until the ²RETI² instruction is executed or the EMI bit and the related interrupt control bit are set both to 1 (if the stack is not full). To return from the interrupt subroutine, a ²RET² or ²RETI² instruction may be invoked. A RETI instruction sets the EMI bit and enables an interrupt service, but a RET instruction does not. It is recommended that a program should not use the ²CALL subroutine² within the interrupt subroutine. This is because interrupts often occur in an unpredictable manner or require to be serviced immediately in some applications. During that period, if only one stack is left, and enabling the interrupts is not well controlled, executing a ²call² in the interrupt subroutine may damage the original control sequence. Bit No. Label Function 0 EMI Control the master (global) interrupt (1=enabled; 0=disabled) 1 EEI0 Control the external interrupt 0 (1=enabled; 0=disabled) 2 EEI1 Control the external interrupt 1 (1=enabled; 0=disabled) 3 ET0I Control the Timer/Event Counter 0 interrupt (1=enabled; 0=disabled) 4 EIF0 External interrupt 0 request flag (1=active; 0=inactive) 5 EIF1 External interrupt 1 request flag (1=active; 0=inactive) 6 T0F Internal Timer/Event Counter 0 request flag (1=active; 0=inactive) 7 ¾ For test mode used only. Must be written as ²0²; otherwise may result in unpredictable operation. INTC0 (0BH) Register Bit No. Label Function 0 ET1I Control the Timer/Event Counter 1 interrupt (1=enabled; 0=disabled) 1 EADI Control the ADC interrupt (1=enabled; 0:disabled) 2 ERTI Control the real time clock interrupt (1=enabled; 0:disabled) 3, 7 ¾ 4 T1F Internal Timer/Event Counter 1 request flag (1=active; 0=inactive) 5 ADF ADC request flag (1=active; 0=inactive) 6 RTF Real time clock request flag (1=active; 0=inactive) Unused bit, read as ²0² INTC1 (1EH) Register Rev. 1.30 11 June 7, 2007 HT46R74D-1 Oscillator Configuration when the system enters the power down mode, the system clock stops, the WDT oscillator keeps running with a period of approximately 65ms at 5V. The WDT oscillator can be disabled by a configuration option to conserve power. The device provides three oscillator circuits for system clocks, i.e., RC oscillator, crystal oscillator and a 32768Hz crystal oscillator, determined by configuration options. The Power-down mode stops the system oscillator, (RC and crystal oscillator only) and ignores external signals in order to conserve power. The 32768Hz crystal oscillator will continue running even when in the Power-down mode. If the 32768Hz crystal oscillator is selected as the system oscillator, the system oscillator is not stopped; but instruction execution is stopped. Since the 32768Hz oscillator is also designed for timing purposes, the internal timing (RTC, time base, WDT) operation keeps running even if the system enters the Power-down mode. Watchdog Timer - WDT The WDT clock is sourced from either its dedicated internal RC oscillator or from the instruction clock which is the system clock/4. The WDT is provided to prevent software malfunctions or a sequence from jumping to an unknown location with unpredictable results. The watchdog timer can be disabled by a configuration option. If the watchdog timer is disabled, the WDT timer will have the same operation as if it were enabled except that the timeout signal will not generate a device reset. So when the watchdog timer is disabled, the WDT timer counter can still be read out and can still be cleared. This function is used to permit the application program to access the WDT frequency to obtain the temperature coefficient for analog component adjustment. The WDT oscillator needs to be disabled/enabled using its registers, (WDTC :WDTOSC), to minimise power consumption. Of the three oscillators, if the RC oscillator is used, an external resistor between OSC1 and VSS is required, whose resistance should range from 30kW to 750kW. The system clock, divided by 4, is available on OSC2 with a pull-high resistor added, which can be used to synchronise external logic. The RC oscillator provides the most cost effective solution, however, the frequency of the oscillation may vary with VDD, temperature, and the device itself due to process variations. It is therefore, not suitable for timing sensitive operations where accurate oscillator frequency is desired. There are 2 registers related to the WDT function, WDTC and WDTD. The WDTC register controls the WDT oscillator enable/disable function and the WDT power source. The WDTD register is the WDT counter readout register. If the crystal oscillator is selected, a crystal across OSC1 and OSC2 is needed to provide the feedback and phase shift required for the oscillator. No other external components are required. A resonator may be connected between OSC1 and OSC2 to replace the crystal and to obtain a frequency reference, but two external capacitors connected between OSC1, OSC2 and ground are required. The WDTPWR bits can be used to choose the WDT power source, the default source is VOCHP. The main purpose of the regulator is to be used for the WDT Temperature-coefficient adjustment. In this case, the application program should enable the regulator before switching to the regulator source. The WDTOSC bits can be used to enable or disable the WDT OSC (12kHz). If the application does not use the WDT OSC, then it needs to disable it in order to reduce power consumption. Another oscillator circuit is supplied for the real time clock. For this oscillator only a 32.768kHz crystal oscillator can be used, and should be connected between pins OSC3 and OSC4. If the internal RC oscillator, which has a nominal period of 65ms, is selected, it is first divided by a value which ranges from 212~215 the exact value of which is determined by a configuration option, to obtain the actual WDT time-out period. The minimum period of the WDT time-out period is about 300ms~600ms. This time-out period may vary with temperature, VDD and process The RTC oscillator circuit can be forced to start up quickly by setting the ²QOSC² bit, which is bit 4 in the RTCC register. It is recommended to turn on the quick oscillating function when power is first applied, and then turn it off after 2 seconds. The WDT oscillator is a free running on-chip RC oscillator, and no external components are required. Although V D D 4 7 0 p F C 1 O S C 1 O S C 1 R O S C O S C 3 C 2 R 1 O S C 2 C r y s ta l O s c illa to r fS Y S /4 N M O S o p e n d r a in O S C 2 R C O s c illa to r O S C 4 3 2 7 6 8 H z C r y s ta l/R T C O s c illa to r System Oscillator Rev. 1.30 12 June 7, 2007 HT46R74D-1 V O C H P V O R E G W D T O S C E n a b le W D T P W R W D T O S C C L R W D T 1 F la g C L R W D T 2 F la g 1 /2 In s tr u c tio n s W D T O S C fS Y S /4 C o n tro l L o g ic W D T S o u rc e C o n fig u r a tio n O p tio n fS C L R 1 1 6 - B it C o u n te r b 0 b 1 5 W D T D iv is io n C o n fig u r a tio n O p tio n b 4 ~ b 1 1 fS 1 /2 1 3 ~ fS 1 /2 W D T E N /D IS W D T T im e - o u t 1 6 D a ta B u s Watchdog Timer variations. By using the related WDT configuration option, longer time-out periods can be .implemented. If the WDT time-out is selected to be 215, the maximum time-out period is divided by 215~216which will give a time-out period of about 2.3s~4.7s. only the PC and SP are reset to zero. There are three methods to clear the contents of the WDT, an external low level on RES, a software instruction or a ²HALT² instruction. There are two types of software instructions; the single ²CLR WDT² instruction, or the pair of instructions ¾ ²CLR WDT1² and ²CLR WDT2². The WDT clock source may also come from the instruction clock, in which case the WDT will operate in the same manner except that in the Power Down mode the WDT will stop counting and lose its protecting purpose. In this situation the device can only be restarted by external logic. If the device operates in a noisy environment, using the on-chip RC oscillator is strongly recommended, since the HALT instruction will stop the system clock. Of these two types of instruction, only one type of instruction can be active at a time depending on the configuration option ¾ ²CLR WDT² times selection option. If the ²CLR WDT² is selected (i.e., CLR WDT times equal one), any execution of the ²CLR WDT² instruction clears the WDT. If the ²CLR WDT1² and ²CLR WDT2² option is chosen (i.e., CLR WDT times equal two), these two instructions have to be executed to clear the WDT, otherwise the WDT may reset the device due to a time-out. Under normal operation, a WDT overflow initialises a device reset and sets the status bit ²TO². In the HALT or IDLE mode, the overflow initialises a ²warm reset², and Bit No. Label Function 0~1 WDT Power source selection. 01: WDT power comes from VOCHP WDTPWR0~ 10: WDT power comes from the regulator WDTPWR1 00/11: WDT power comes from VOCHP strongly recommend use to use 01 for VOCHP prevent the noise to let the WDT lose the power 2~3 WDTOSC0~ WDTOSC1 4~7 ¾ The WDT oscillator enable/disable (WDTOSC1:0)= 01: WDT OSC disable10: WDT OSC enable 00/11: WDT OSC enable strongly recommend use to use 10 for WDT OSC enable Reserved WDTC (1CH) Register Note: WDTOSC registers initial value will be set to enable (1,0), if both ²WDT option enable² and ²WDT clock option set to WDT², otherwise, it will be set to disable (0,1) Bit No. Label 0~7 WDTD0~ WDTD7 Function The WDT counter data value. This register is read only. It¢s used for temperature adjusting. WDTD (1DH) Register The WDT clock (fS1) is further divided by an internal counter to give longer watchdog time-outs., In this device, the division ratio can be varied by selecting different configuration options to give 213 to 216 division ration range. Rev. 1.30 13 June 7, 2007 HT46R74D-1 fS Multi-function Timer The device provides a multi-function timer for the RTC, LCD and buzzer functions but with different time-out periods. The multi-function timer consists of an 8-stage divider and a 7-bit prescaler, with the clock source coming from the WDT OSC, the RTC OSC or the instruction clock which is the system clock divided by 4. The multi-function timer also provides a selectable frequency signal, which ranges from fS/22 to fS/28, for the LCD driver circuits, and a selectable frequency signal, ranging from fS/22 to fS/29, for the buzzer output using configuration options. It is recommended to select a frequency as close as possible to 4kHz signal for the LCD driver circuits to ensure a proper display. fS Y S /4 W D T O S C R T C O S C fS S o u rc e C o n fig u r a tio n O p tio n fs D iv id e r R T C R e g is te r The real time clock, RTC, is operated in the same manner as the time base in that it is used to supply a regular internal interrupt. Its time-out period ranges from fS/28 to fS/215 by software programming . Writing data to RT2, RT1 and RT0, which are bits 2, 1, 0 of the RTCC register, provides various time-out periods. If an RTC time-out occurs, the related interrupt request flag, RTF; bit 6 of INTC1, is set. But if the interrupt is enabled, and if the stack is not full, a subroutine call to location 18H occurs. RTC Clock Divided Factor 8 0 0 0 2 * 0 0 1 2 9* 0 1 0 210* 0 1 1 211* 1 0 0 212 1 0 1 213 1 1 0 214 1 1 1 215 f S /2 8 ~ f S /2 1 5 R T C In te rru p t The buzzer is driven by the internal clock source, fS, which then passes through a divider, the division ratio of which is selected by configuration options to provide a range of buzzer frequencies from fS/22 to fS/29. Real Time Clock - RTC RT0 8 to 1 M u x . The Buzzer function provides a means of producing a variable frequency output, suitable for applications such as Piezo-buzzer driving or other external circuits that require a precise frequency generator. The BZ and BZ pins form a complimentary pair, and are pin-shared with I/O pins, PA0 and PA1. A configuration option is used to select from one of three buzzer options. The first option is for both pins PA0 and PA1 to be used as normal I/Os, the second option is for both pins to be configured as BZ and BZ buzzer pins, the third option selects only the PA0 pin to be used as a BZ buzzer pin with the PA1 pin retaining its normal I/O pin function. Note that the BZ pin is the inverse of the BZ pin which together generate a differential output which can supply more power to connected interfaces such as buzzers. For the Charge Pump and the ADC chopper , the clock is independent of the multi-function timer. The clock always sourced from the system clock (RC or Crystal). RT1 R T 2 R T 1 R T 0 Buzzer Output L C D D r iv e r ( fS /2 2 ~ fS /2 8 ) B u z z e r (fS /2 2~ fS /2 9) R T C (fS /2 2~ fS /2 15) RT2 P r e s c a le r Real Time Clock P r e s c a le r L C D /B u z z e r C o n fig u r a tio n O p tio n D iv id e r The clock source that generates fS, which in turn controls the buzzer frequency, can originate from two different sources, the Int.RCOSC (Internal RC oscillator) or the System oscillator/4, the choice of which is determined by the fS clock source configuration option. Note that the buzzer frequency is controlled by configuration options, which select both the source clock for the internal clock fS and the internal division ratio. There are no internal registers associated with the buzzer frequency. If the configuration options have selected both pins PA0 and PA1 to function as a BZ and BZ complementary pair of buzzer outputs, then for correct buzzer operation it is essential that both pins must be setup as outputs by setting bits PAC0 and PAC1 of the PAC port control register to zero. The PA0 data bit in the PA data register must also be set high to enable the buzzer outputs, if set low, both pins PA0 and PA1 will remain low. In this way the single bit PA0 of the PA register can be used as an on/off control for both the BZ and BZ buzzer pin outputs. Note that the PA1 data bit in the PA register has no control over the BZ buzzer pin PA1. Note: * not recommended for use Rev. 1.30 14 June 7, 2007 HT46R74D-1 If the configuration options have selected that only the PA0 pin is to function as a BZ buzzer pin, then the PA1 pin can be used as a normal I/O pin. For the PA0 pin to function as a BZ buzzer pin, PA0 must be setup as an output by setting bit PAC0 of the PAC port control register to zero. The PA0 data bit in the PA data register must also be set high to enable the buzzer output, if set low pin PA0 will remain low. In this way the PA0 bit can be used as an on/off control for the BZ buzzer pin PA0. If the PAC0 bit of the PAC port control register is set high, then pin PA0 can still be used as an input even though the configuration option has configured it as a BZ buzzer output. pin to function as an input, then this will override the configuration option selection and force the pin to always behave as an input pin. This arrangement enables the pin to be used as both a buzzer pin and as an input pin, so regardless of the configuration option chosen; the actual function of the pin can be changed dynamically by the application program by programming the appropriate port control register bit. Note:The above drawing shows the situation where both pins PA0 and PA1 are selected by a configuration option to be BZ and BZ buzzer pin outputs. The Port Control Register of both pins must have already been setup as outputs. The data setup on pin PA1 has no effect on the buzzer outputs. Note that no matter what configuration option is chosen for the buzzer, if the port control register has setup the PAC Register PAC.0 PAC Register PAC.1 PA data Register PA.0 PA data Register PA.1 0 0 0 X PA0=0, PA1=0 0 0 1 X PA0=BZ, PA1=BZ 0 1 0 X PA0=0, PA1=Input 0 1 1 X PA0=BZ, PA1=Input 1 0 0 X PA0=Input, PA1=0 1 1 X X PA0=Input, PA1=Input Output Function PA0/PA1 Pin Function Control In te r n a l C lo c k S o u r c e P A 0 D a ta B Z O u tp u t a t P A 0 P A 1 D a ta B Z O u tp u t a t P A 1 Buzzer Output Pin Control Rev. 1.30 15 June 7, 2007 HT46R74D-1 Power Down Operation - HALT The Power-down mode is initialised by a ²HALT² instruction and results in the following. · The system oscillator turns off but the WDT oscillator keeps running if the WDT oscillator or the real time clock is selected. · The contents of the Data Memory and the registers re- main unchanged. · The WDT is cleared and starts recounting if the WDT clock is sourced from the WDT oscillator or the real time clock oscillator. · All I/O ports maintain their original status. · The PDF flag is set but the TO flag is cleared. · The LCD driver keeps running if the WDT OSC or RTC OSC is selected. The system leaves the HALT or IDLE mode by means of an external reset, an interrupt, an external falling edge signal on port A, or by a WDT overflow. An external reset causes a device initialisation, while a WDT overflow performs a ²warm reset². After examining the TO and PDF flags, the reason for the device reset can be determined. The PDF flag is cleared by a system power-up or by executing the ²CLR WDT² instruction, and is set by executing the ²HALT² instruction. The TO flag is set if a WDT time-out occurs, and causes a wake-up that only resets the program counter and the SP, and leaves the others in their original state. A port A wake-up and interrupt methods can be considered as a continuation of normal execution. Each pin of port A can be independently selected to wake-up the device using configuration options. After awakening from an I/O port stimulus, the program will resume execution at the next instruction. However, if awakening from an interrupt, two sequences may occur. If the related interrupt is disabled or the interrupt is enabled but the stack is full, the program will resume execution at the next instruction. But if the interrupt is enabled, and the stack is not full, a regular interrupt response takes place. When an interrupt request flag is set before entering the Power-down mode, the system cannot be awakened using that interrupt. If a wake-up events occur, it takes 1024 tSYS (system clock periods) to resume normal operation. In other words, a dummy period is inserted after the wake-up. If the wake-up results from an interrupt acknowledgment, the actual interrupt subroutine execution is delayed by more than one cycle. However, if the wake-up results in the next instruction execution, the execution will be performed immediately after the dummy period is finished. To minimise power consumption, all the I/O pins should be carefully managed before entering the Power-down mode. When a HALT instruction is executed, the CPU will stop running, and the related OSC and peripheral clocks will be set by the HALTC register. The HALTC register will only take effect when the system clock (fSYS) is set to OSC. Note: HALTC has no effect if the 32K oscillator is set as the system clock. Bit No. Label Function 0 LCDON Specifies the LCD condition in the Power-down mode 1: LCD module remains on ( if OSCON=1) and ignores the configuration option setting 0: LCD condition decided by the LCD_ON configuration option 1~6 ¾ 7 OSCON Unused bit, read as ²0² System clock oscillator On/off during Power-down mode setting. 0: Oscillator stops running. All related peripherals will lose their clock and stop functioning. (Register bit 0 will be ignored) 1: Oscillator keeps running. (All peripheral keep running, except for the special setting of Bit 0) HALTC (17H) Register Rev. 1.30 16 June 7, 2007 HT46R74D-1 V Reset 0 .0 1 m F * There are three ways in which a reset may occur. · RES is reset during a normal operation 1 0 0 k W · RES is reset during Power-down R E S · WDT time-out is reset during normal operation 1 0 k W The WDT time-out during a HALT or IDLE differs from other reset conditions, as it performs a ²warm reset² that resets only the program counter and SP and leaves the other circuits in their original state. Some registers remain unaffected during any other reset conditions. Most registers are reset to their initial conditions once the reset conditions are met. By examining the PDF and TO flags, the program can distinguish between different reset types. TO PDF 0 0 RES reset during power-up u u RES reset during normal operation 0 1 RES Wake-up HALT 1 u WDT time-out during normal operation 1 1 WDT Wake-up HALT D D 0 .1 m F * Reset Circuit Note: ²*² Make the length of the wiring, which is connected to the RES pin as short as possible, to avoid noise interference. RESET Conditions V D D R E S tS S T S S T T im e - o u t C h ip R e s e t Reset Timing Chart Note: ²u² stands for unchanged To guarantee that the system oscillator has started and has stabilised, the SST (System Start-up Timer) provides an extra-delay of 1024 system clock pulses when the system awakes from the Power-down mode or during power-up. When awakening from the Power-down mode or during a system power-up, the SST delay is added. 000H Interrupt Disabled Prescaler, Divider Cleared WDT Cleared. After master reset, WDT starts counting Timer/Event Counter Off Input/output Ports Input mode Stack Pointer Points to the top of the stack Rev. 1.30 W a rm R e s e t W D T E x te rn a l R E S O S C 1 The functional unit chip reset status is shown below. Program Counter H A L T S S T 1 0 - b it R ip p le C o u n te r S y s te m C o ld R e s e t R e s e t Reset Configuration 17 June 7, 2007 HT46R74D-1 The register states are summarised below: Register Reset (Power On) WDT Time-out RES Reset (Normal Operation) (Normal Operation) RES Reset (HALT) WDT Time-out (HALT)* MP0 -xxx xxxx -uuu uuuu -uuu uuuu -uuu uuuu -uuu uuuu MP1 -xxx xxxx -uuu uuuu -uuu uuuu -uuu uuuu -uuu uuuu ---- ---0 ---- ---0 ---- ---0 ---- ---0 ---- ---u xxxx xxxx uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu 0000H 0000H 0000H 0000H 0000H xxxx xxxx uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu BP ACC Program Counter TBLP TBLH --xx xxxx --uu uuuu --uu uuuu --uu uuuu --uu uuuu RTCC --00 0111 --00 0111 --00 0111 --00 0111 --uu uuuu STATUS --00 xxxx --1u uuuu --uu uuuu --01 uuuu --11 uuuu INTC0 -000 0000 -000 0000 -000 0000 -000 0000 -uuu uuuu TMR0 xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx uuuu uuuu TMR0C 00-0 1000 00-0 1000 00-0 1000 00-0 1000 uu-u uuuu ---- --xx ---- --uu ---- --uu ---- --uu ---- --uu TMR1H xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx uuuu uuuu TMR1L xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx uuuu uuuu TMR1C 0000 1--0 0000 1--0 0000 1--0 0000 1--0 uuuu u--0 PA 1111 1111 1111 1111 1111 1111 1111 1111 uuuu uuuu PAC 1111 1111 1111 1111 1111 1111 1111 1111 uuuu uuuu PB ---- 1111 ---- 1111 ---- 1111 ---- 1111 ---- uuuu PBC ---- 1111 ---- 1111 ---- 1111 ---- 1111 ---- uuuu 0000 x000 0000 x000 0000 x000 0000 x000 0000 x000 TMR1HH ADCR ADCD ---- -111 ---- -111 ---- -111 ---- -111 ---- -uuu WDTC ---- ss01 ---- ss01 ---- ss01 ---- ss01 ---- uuuu WDTD 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 INTC1 -000 -000 -000 -000 -000 -000 -000 -000 -uuu -uuu CHPRC 0000 0000 0000 0000 0000 0000 0000 0000 uuuu uuuu HALTC 0--- ---0 0--- ---0 0--- ---0 0--- ---0 u--- ---u EADCR 0000 0000 0000 0000 0000 0000 0000 0000 uuuu uuuu Note: ²*² stands for warm reset ²u² stands for unchanged ²x² stands for unknown ²s² for special case, it depends on the option table (please see the WDT chapter for the detail) Rev. 1.30 18 June 7, 2007 HT46R74D-1 TMR1HH to the destination and latch the TMR1H and TMR1L counters to the lower-order byte buffers, respectively. Reading the TMR1H and TMR1L registers will read the contents of the lower-order byte buffers. TMR1C is the Timer/ Event Counter 1 control register, which defines the operating mode, counting enable or disable and an active edge. Timer/Event Counter Two timer/event counters are integrated within the microcontroller. The Timer/Event Counter 0 contains a 8-bit programmable count-up counter whose clock may come from an external source or an internal clock source. The internal clock source comes from fSYS. The Timer/Event Counter 1 contains a 18-bit programmable count-up counter whose clock may come from an external source or an internal clock source. The internal clock source comes from fSYS/4 or 32768Hz selected by configuration option. The external clock input allows external events to be counted, time intervals or pulse widths to be measured, or to generate an accurate time base. The T0M0, T0M1 (TMR0C) and T1M0, T1M1 (TMR1C) bits define the operation mode. The event count mode is used to count external events, which means that the clock source comes from an external pin, TMR0 or TMR1. The timer mode functions as a normal timer with the clock source coming from the internally selected clock source. Finally, the pulse width measurement mode can be used to measure a high or low level duration of an external signal on pin TMR0 or TMR1. This measurement uses the internally selected clock source. There are two registers related to the Timer/Event Counter 0, TMR0 and TMR0C. Two physical registers are mapped to the TMR0 location. Writing to TMR0 places the start value into the Timer/Event Counter 0 register while reading TMR0 reads directly the contents of the Timer/Event Counter 0. TMR0C is a timer/event counter control register, which defines some options. There are four registers related to Timer/Event Counter 1, TMR1HH, TMR1H, TMR1L and TMR1C. Writing to TMR1L and TMR1H will only put the required data into two internal lower-order byte buffers, each of which is 8-bits. Writing to TMR1HH will transfer the specified data and the contents of the lower-order byte buffers into the TMR1HH, TMR1H and TMR1L registers respectively. The Timer/Event Counter 1 preload register is changed by each write to the TRM1HH register operation. Reading TMR1HH will latch the contents of fS To enable a counting operation, the Timer ON bit, (T0ON: bit 4 of TMR0C; T1ON: 4 bit of TMR1C) should be set to 1. In the pulse width measurement mode, the T0ON/T1ON bit is automatically cleared after the measurement cycle is completed. But in the other two modes, the T0ON/T1ON bits can only be reset using instructions. The Timer/Event Counter 0/1 overflow is one of the wake-up sources. The timers and can also be used as the source clock for the PFD (Programmable Frequency Divider) output on PA3. This function is selected by a configuration option. Only one Timer/Event Counter clock source (PFD0 or PFD1) can be used as the PFD clock source, chosen by a configuration option. 8 - s ta g e P r e s c a le r Y S f IN 8 -1 M U X T 0 P S C 2 ~ T 0 P S C 0 D a ta B u s T T 0 M 1 T 0 M 0 T M R 0 R e lo a d 8 - b it T im e r /E v e n t C o u n te r P r e lo a d R e g is te r T 0 E P u ls e W id th M e a s u re m e n t M o d e C o n tro l T 0 M 1 T 0 M 0 T 0 O N 8 - b it T im e r /E v e n t C o u n te r (T M R 0 ) O v e r flo w to In te rru p t T Q P F D 0 P A 3 D a ta C T R L Timer/Event Counter 0 D a ta B u s fS Y S /4 3 2 7 6 8 H z T 1 S M U f IN L o w B y te B u ffe r T X T 1 M 1 T 1 M 0 T M R 1 1 8 - B it P r e lo a d R e g is te r T 1 E T 1 M 1 T 1 M 0 T 1 O N P u ls e W id th M e a s u re m e n t M o d e C o n tro l H ig h B y te L o w R e lo a d O v e r flo w B y te 1 8 - B it T im e r /E v e n t C o u n te r T Q to In te rru p t P F D 1 P A 3 D a ta C T R L Timer/Event Counter 1 Rev. 1.30 19 June 7, 2007 HT46R74D-1 Bit No. 0 1 2 Label T0PSC0 T0PSC1 T0PSC2 3 T0E 4 T0ON 5 ¾ 6 7 T0M0 T0M1 Function To define the prescaler stages. T0PSC2, T0PSC1, T0PSC0= 000: fINT=fSYS 001: fINT=fSYS/2 010: fINT=fSYS/4 011: fINT=fSYS/8 100: fINT=fSYS/16 101: fINT=fSYS/32 110: fINT=fSYS/64 111: fINT=fSYS/128 Defines the timer/event counter TMR0 pin active edge: In the Event Counter Mode - T0M1,T0M0 = 0,1: 1:count on falling edge; 0:count on rising edge In the Pulse Width measurement mode - T0M1,T0M0 = 1,1 1: start counting on rising edge, stop on falling edge; 0: start counting on falling edge, stop on rising edge Enable/disable timer counting - 0=disabled; 1=enabled Unused bit, read as ²0² Operation Mode Definition bits T0M1, T0M0: 01= Event count mode - External clock 10= Timer mode - Internal clock 11= Pulse Width measurement mode - External clock 00= Unused TMR0C (0EH) Register Bit No. Label 0 T132KON 1~2 ¾ 3 T1E 4 T1ON 5 T1S 6 7 T1M0 T1M1 Function Defines if the 32768 Oscillator is running or not. (See Note) 0: 32768 Oscillator off if no other peripherals are using it 1: 32768 Oscillator starts to run or keeps running. Unused bit, read as ²0² Defines the timer/event counter TMR1 active edge: In the Event Counter Mode - T1M1,T1M0=0,1: 1:count on falling edge; 0:count on rising edge In the Pulse Width measurement mode - T1M1,T1M0=1,1: 1: start counting on rising edge, stop on falling edge; 0: start counting on falling edge, stop on rising edge Enable/disable timer counting - 0=disabled; 1=enabled Defines the TMR1 internal clock source - 0=fSYS/4; 1=32768Hz Operation Mode Definition bits T1M1, T1M0: 01= Event count mode - External clock 10= Timer mode - Internal clock 11= Pulse Width measurement mode - External clock 00= Unused TMR1C (11H) Register Note: The 32768Hz oscillator enable will be logical OR function of the T132KON bit and any configuration option that chooses the 32768Hz oscillator. That is, the 32768Hz OSC will be enabled if any related function enables it, and will be turned off if no function enables it. Rev. 1.30 20 June 7, 2007 HT46R74D-1 After a device reset, these input/output lines will default to inputs and remain at a high level or in a floating state, depending upon the pull-high configuration options. Each bit of these input/output latches can be set or cleared by a ²SET [m].i² and ²CLR [m].i² (m=12H or 14H) instruction. If PA3 is selected to be a PFD output, there are two types of selections. One is to use PFD0 as the PFD output, the other is to use PFD1 as the PFD output. PFD0 and PFD1 are the timer overflow signals of the Timer/Event Counter 0 and Timer/Event Counter 1 respectively. No matter what the operation mode is, writing a 0 to ET0I or ET1I disables the related interrupt service. When the PFD function is selected, executing a ²SET [PA].3² instruction will enable the PFD output while executing a ²CLR [PA].3² instruction will disable the PFD output. Some instructions first input data and then follow the output operations. For example, ²SET [m].i², ²CLR [m].i², ²CPL [m]², ²CPLA [m]² read the entire port states into the CPU, execute the defined operations (bit-operation), and then write the results back to the latches or the accumulator. In the case of timer/event counter OFF condition, writing data to the timer/event counter preload register also reloads that data to the timer/event counter. But if the timer/event counter is running, data written to the timer/event counter will be loaded only to the timer/event counter preload register. The timer/event counter still continues its operation until an overflow occurs. Each line of port A has the capability of waking-up the device. Each I/O port has a pull-high option. Once a pull-high option is selected, the I/O port has a pull-high resistor connected. Take note that a non-pull-high I/O port setup as an input mode will be in a floating condition. When the timer/event counter is read, the clock will be blocked to avoid errors, which may result in a counting error, and should be taken into account by the programmer. It is strongly recommended to load a desired value into the TMR0/TMR1 register first, before turning on the related timer/event counter, for proper operation since the initial value of TMR0/TMR1 is unknown. After this procedure, the timer/event function can be operated normally. Pins PA0, PA1, PA3, PA4, PA5, PA6 and PA7 are pin-shared with BZ, BZ, PFD, TMR0, TMR1, INT0 and INT1 pins respectively. PA0 and PA1 are pin-shared with BZ and BZ signal, respectively. If the BZ/BZ configuration option is selected, the output signals in the output mode of PA0/PA1 will be the buzzer signal. The input mode always retains its original function. Once the BZ/BZ configuration option is selected, the buzzer output signals are controlled by the PA0 data register. Bit0~bit2 of TMR0C can be used to define the pre-scaling stages of the timer/event counter internal clock. The overflow signal of timer/event counter can be used to generate the PFD signal. The PA0/PA1 I/O function is shown below. PA0 I/O I I O O O O O O O O Input/Output Ports PA1 I/O I O I There are 10 bidirectional input/output lines in the microcontroller, labeled as PA and PB, which are mapped to the data memory of [12H] and [14H] respectively. All of these I/O ports can be used for input and output operations. For input operation, these ports are non-latching, that is, the inputs must be ready at the T2 rising edge of instruction ²MOV A,[m]² (m=12H or 14H). For output operations, all the data is latched and remains unchanged until the output latch is rewritten. PA0 Mode X X C B B C B B B B PA1 Mode X C X X X C C C B B PA0 Data X X D 0 PA1 Data X D X X X D1 D D X X PA0 Pad Status I I D 0 B D0 0 0 B PA1 Pad Status I D I I D1 D D 0 B I I O O O O O 1 D0 0 1 B 0 1 Note: ²I² input; ²O² output ²D, D0, D1² Data ²B² buzzer option, BZ or BZ ²X² don¢t care ²C² CMOS output Each I/O line has its own control register, known as PAC and PBC, to control the input/output configuration. With this control register, either CMOS outputs or Schmitt trigger inputs with or without pull-high resistor structures can be reconfigured dynamically under software control. To function as an input, the corresponding latch of the control register must be written with a ²1². The input source also depends on the control register. If the control register bit is ²1², the input will read the pad state. To function as an output the the control register bit should be set to ²0². The latter is possible in the ²read-modify-write² instruction. Rev. 1.30 I It is recommended that if there are unused or not bonded out I/O lines then they should be setup as output pins using software instructions to avoid consuming power. If setup as inputs and left floating this may result in unnecessary increased power consumption. 21 June 7, 2007 HT46R74D-1 V C o n tr o l B it Q D D a ta B u s W r ite C o n tr o l R e g is te r P U Q C K S C h ip R e s e t R e a d C o n tr o l R e g is te r P A P A P A P A P A P A P A P A P B D a ta B it Q D W r ite D a ta R e g is te r C K S Q M P A 0 /P A 1 B Z /B Z M R e a d D a ta R e g is te r S y s te m D D U U 0 /B Z 1 /B Z 2 3 /P 4 /T 5 /T 6 /IN 7 /IN 0 ~ P F D M R 0 M R 1 T 0 T 1 B 1 X E N X W a k e -u p ( P A o n ly ) O P 0 ~ O P 7 T M R 0 fo r P A 4 o n ly T M R 1 fo r P A 5 o n ly IN T fo r P A 6 o n ly Input/Output Ports Additionally, the device also includes a band gap voltage generator for the 1.5V low temperature sensitive reference voltage. This reference voltage is used as the zero adjustment and for a single end type reference voltage. Charge Pump and Voltage Regulator A charge pump and voltage regulator are integrated within the device. The charge pump can be enabled/disabled by the application program. The charge pump uses VDD as its input, and has the function of doubling the VDD voltage, therefore the charge pump output voltage will be VDD´2. The regulator can generate a stable voltage of 3.3V for the ADC and also can provide an external bridge sensor excitation voltage or supply a reference voltage for other applications. The user needs to ensure that the charge pump output voltage is greater than 3.6V to ensure that the regulator is capable of generating the required 3.3V voltage output. C H P C 2 C H P C 1 R e g u la to r R E F B a n d G a p E n h a n c e I V O B G P F IL B G (S F 0 : O 1 : O P Q S T R b its ) ff (s h o rt) n C F IL RFIL is about 100kW and the recommend value for CFIL is 10mF. V O R E G V O C H P R Note: The VOBGP signal is an internal signal only and only the recommend CFIL should be connected. V D D C h a rg e P u m p ( V o lta g e D o u b le r ) fS D iv id e r C H P C K D C H P E N V D D V D D x 2 R e g u la to r (3 .3 V ) 3 .3 V There is a single register associated with this module named CHPRC. The CHPRC is the Charge Pump/Regulator Control register, which controls the charge pump on/off function, the regulator on/off functions as well as setting the clock divider value to generate the clock for the charge pump. A D C R E G C E N The CHPCKD4~CHPCKD0 bits are used to set the clock divider to generate the desired clock frequency for proper charge pump operation. The actual frequency is determined by the following formula. Actual Charge Pump Clock= (fSYS/16)/(CHPCKD +1). Rev. 1.30 22 June 7, 2007 HT46R74D-1 Bit No. Label 0 REGCEN 1 CHPEN 2 3~7 BGPQST Function Enable/disable Regulator/Charge-Pump module. (1=enable; 0=disable) Charge Pump Enable/disable setting. (1=enable; 0=disable) Note: this bit will be ignored if the REGCEN bit is disabled Bandgap quick start-up function 0: R short, quick start up 1: R connected, normal RC filter mode Each time REGCEN changes from 0 to 1, that is when the regulator turns on, this bit should be set to 0 and then set to 1 to ensure a quick start up. The minimum time to keep the bit low should be about 2ms. CHPCKD0~ Charge pump clock divider. These 5 bits form a clock divider with a division ratio range of 1 CHPCKD4 to 32. Charge Pump clock = (fSYS/16) / (CHPCKD+1) CHPRC (1FH) Register REGCEN CHPEN Charge Pump VOCHP Regulator Pin VOREG Pin OPA ADC Description Complete module is disabled, OPA/ADC will have no Power 0 X OFF VDD OFF Hi-Impedance Disable 1 0 OFF VDD ON 3.3V Active Used when VDD is greater than 3.6V 1 1 ON 2´VDD ON 3.3V Active Use whefor VDD is less than 3.6V (VDD=2.2V~3.6V) ADC - Dual Slope The suggested charge pump clock frequency is 20kHz. The application needs to set the correct value to get the desired clock frequency. For a 4MHz application, the CHPCKD bits should be set to the decimal value 11, and for a 2MHz application, the bits should be set to 5. A Dual Slope A/D converter is implemented within the microcontroller. The dual slope module includes an Operational Amplifier and a buffer for the amplification of differential signals and an Integrator and comparator for the main dual slope AD converter. The REGCEN bit in the CHPRC register is the Regulator/Charge-pump module enable/disable control bit. If this bit is disabled, then the regulator will be disabled and the charge pump will be also be disabled to save power. When REGCEN = 0, the module will enter the Power Down Mode ignoring the CHPEN setting. The ADC and OPA will also be disabled to reduce power. There are 3 special function registers related to the ADC function known as ADCR, ADCD and EADCR. The ADCR register is the A/D control register, which controls the ADC block power on/off, the chopper clock on/off, the charge/discharge control and is also used to read out the comparator output status. The ADCD register is the A/D Chopper clock divider register, which defines the chopper clock to the ADC module. The EADCR register is the enhanced A/D control register, which defines the Auto Mode Dual Slope ADC function. If REGCEN is set to ²1², the regulator will be enabled. If the CHPEN bit is enabled, the charge pump will be active and will use VDD as its input to generate the double voltage output. This double voltage will then be used as the input voltage for the regulator. If CHPEN is set to ²0², the charge pump is disabled and the charge pump output will be equal to the charge pump input, VDD. The ADPWREN bit in the ADCR register, is used to control the ADC module on/off function. The ADCCKEN bit in the ADCR register is used to control the chopper clock on/off function. When the ADCCKEN bit is set to ²1² it will enable the Chopper clock, with the clock frequency defined by the ADCD registers. The ADC module includes the OPA, buffer, integrator and comparator, however the Bandgap voltage generator is independent of this module. It will be automatically enabled when the It is necessary to carefully manage the VDD voltage. If the voltage is less than 3.6V, then CHPEN should be set to 1 to enable the charge pump, otherwise CHPEN should be set to zero. If the Charge pump is disabled and VDD is less than 3.6V then the output voltage of the regulator will not be guaranteed. Rev. 1.30 23 June 7, 2007 HT46R74D-1 V D S O P W R C o n tro l V O R E G R v f1 V D O P A P - D O P A N R v f2 M V + + U - A m p lifie r A D P W R E N IN T X C M P + B u ffe r + - In te g ra to r R A D C M P O C o m p a ra to r A D D IS C H 0 A D D IS C H 1 O n C h ip D O P A O O ff C h ip D C H O P D S R R D S R C D S C C Note: The VINT, VCMP signals can come from different R groups which are selected by software registers. 1 0 0 k W 2 5 k W D O P A O V O R E G C h o p p e r A m p lifie r V A B r id g e S e n s o r D C H O P B u ffe r D O P A N V B 2 7 n F D O P A P N o te : A ll " R " a n d " C " v a lu e s h e r e a r e fo r r e fe r e n c e o n ly O ff C h ip O n C h ip The amplifier and buffer combination, form a differential input pre-amplifier which amplifies the sensor input signal. regulator is enabled, and also be disabled when the regulator is disabled. The application program should enable the related power to permit them to function and disable them when idle to conserve power. The charge/discharge control bits, ADDISCH1~ ADDISCH0, are used to control the Dual slope circuit charging and discharging behavior. The ADCMPO bit is read only for the comparator output, while the ADINTM bits can set the ADCMPO trigger mode for interrupt generation. The combination of the Integrator, the comparator, the resistor Rds, between DSRR and DSRC and the capacitor Cds, between DSRC and DSCC form the main body of the Dual slope ADC. The Integrator integrates the output voltage increase or decrease and is controlled by the ²Switch Circuit² - refer to the block diagram. The charge and discharge curves are illustrated by the following. The following descriptions are based on the fact that ADRR0=0 C o m p a ra to r 4 /6 V D S O 1 /6 V D S O + The ²comparator² will switch the state from high to low when VC, which is the DSCC pin voltage,drops to less than 1/6 VDSO. A D C M P O - In general applications, the application program will switch the ADC to the charging mode for a fixed time called Ti, which is the integrating time. It will then switch to the dis-charging mode and wait for Vc to drop to less than 1/6VDSO. At this point the comparator will change In te g r a to r D S R R V D S C C D S R C V A R D S Rev. 1.30 C C D S 24 June 7, 2007 HT46R74D-1 In user applications, it is required to choose the correct value of RDS and CDS to determine the Ti value, to allow the V C value to operate between 5/6VDSO and 1/6VDSO. Vfull cannot be greater than 5/6VDSO and Vzero cannot be less than 1/6VDSO state and store the time taken, Tc, which is the de-integrating time. The following formula 1 can then be used to calculate the input voltage VA. formula 1: VA= (1/3)´VDSO´(2-Tc/Ti). (Based on ADRR0=0) V C V fu ll V V z e ro 1 /6 V D S O T i T c (z e ro ) T c T c ( fu ll) In te g r a te tim e Bit No. 0 1~2 3 4~5 D e - In te g r a te tim e Label Function Dual slope block (including input OP) power on/off switch. ADPWREN 0: disable Power 1: Power source comes from the regulator. Defines the ADC discharge/charge. 00: reserved ADDISCH0~ 01: charging - Integrator input connect to buffer output ADDISCH1 10: discharging - Integrator input connect to VDSO) 11: reserved ADCMPO Dual Slope ADC - last stage comparator output. Read only bit, write data instructions will be ignored. During the discharging state, when the integrator output is less than the reference voltage, the ADCMPO will change from high to low. ADC integrator interrupt mode definition. These two bits define the ADCMPO data interrupt trigger mode: ADINTM0~ 00: no interrupt 01: rising edge ADINTM1 10: falling edge 11: both edge 6 ADCCKEN 7 ADRR0 ADC OP chopper clock source on/off switch. 0: disable 1: enable (clock value is defined by ADCD register) ADC resistor selection 0: (VINT, VCMP)= (4/6 VOREG, 1/6 VOREG) 1: (VINT, VCMP)= (4.4/6 VOREG, 1/6 VOREG) ADCR (18H) Register Rev. 1.30 25 June 7, 2007 HT46R74D-1 Bit No. Label Function 0 1 2 ADCD0 ADCD1 ADCD2 Defines the chopper clock. ADCCKEN should be enabled. The suggested clock value should be around 10kHz. The chopper clock definitions are: 0: clock= (fSYS/32)/1 1: clock= (fSYS/32)/2 2: clock= (fSYS/32)/4 3: clock= (fSYS/32)/8 4: clock= (fSYS/32)/16 5: clock= (fSYS/32)/32 6: clock= (fSYS/32)/64 7: clock= (fSYS/32)/128 3~7 ¾ Reserved ADCD (1AH) Register Bit No. Label Function 0~1 ¾ 2 CHGTS Select the ADC CHARGE state timer 0: timer 0 1: timer1 3 DISTS Select the ADC discharge state timer 0: timer 0 1: timer 1 Unused bit, read as ²0² 4 CHGCMP Select if the charge timer (note 1) will auto-start by the ADCMPO result or not. ASTEN should be enabled. 0: immediately auto start timer counting (note 3) when charging begins 1: Wait for the ADCMPO rising edge to auto start timer counting (note 3) when charging begins 5 ASTEN Dual slope auto start enable. When this function is enabled, the charging timer (note 1) will auto start (note 3) when the user sets ADDISCH to the charging mode. The start method is determined by CHGCMP. 0: disable 1: enable this auto function ADISEN Dual slope auto discharge enable. When this function enable and ADISCH is set to the charging mode and the charging timer (note 1)) run overflow, the charging timer will auto stop (note 3) and ADDISCH will be auto set to the discharging mode (note 4) and the discharging timer (note 2) will auto start counting (note 3). 0: disable 1: enable this auto function AENDEN Dual slope Auto End Enable. When this function is enabled and ADDISCH is set to the discharge mode and detects the ADCMPO falling edge, the discharging timer will auto stop (note 2). 0: disable 1: enable this auto function 6 7 Note: 1: charge timer means the timer0 or timer 1 that select in the CHGTS registers. 2: discharge timer means the timer0 or timer 1 that select in the DISTS registers. 3: timer auto start only set the TxS to 1, and auto stop only set the TxON to 0 4: auto set the discharge mode only set the ADISCH1/0 to 1/0. EADCR (1BH) Register Rev. 1.30 26 June 7, 2007 HT46R74D-1 LCD Display Memory The LCD clock source frequency should be chosen to be as close as possible to 4kHz. The device provides an area of embedded data memory for the LCD display. This area is located at 40H to 4FH in Bank 1 of the Data Memory. The bank pointer BP, enables either the General Purpose Data Memory or LCD Memory to be chosen. When BP is set to ²1², any data written into location range 40H~4FH will affect the LCD display. When the BP is cleared to ²0², any data written into 40H~4FH will access the general purpose data memory. The LCD display memory can be read and written to only indirectly using MP1. When data is written into the display data area, it is automatically read by the LCD driver which then generates the corresponding LCD driving signals. To turn the display on or off, a ²1² or a ²0² is written to the corresponding bit of the display memory, respectively. The figure illustrates the mapping between the display memory and LCD pattern for the device. Note that the LCD frequency is controlled by configuration options, which select the internal division ratio. 4 0 H C O M 4 1 H 4 2 H 4 3 H 4 D H 4 E H 4 F H B it 0 0 1 1 2 2 3 3 0 S E G M E N T 1 2 3 1 3 1 4 1 5 Display Memory LCD Driver Output The output number of the device LCD driver can be 16´2, 16´3 or 15´4 by configuration option (i.e., 1/2 duty, 1/3 duty or 1/4 duty). The bias type LCD driver can be ²R² type or ²C² type. If the ²R² bias type is selected, no external capacitor is required. If the ²C² bias type is The LCD clock frequency is determined by configuration options, and has a division ratio range of fs/22~fs/28. D u r in g a R e s e t P u ls e C O M 0 ,C O M 1 ,C O M 2 A ll L C D d r iv e r o u tp u ts N o r m a l O p e r a tio n M o d e * * * C O M 0 C O M 1 C O M 2 * L C D s e g m e n ts O N C O M 0 ,1 , 2 s id e s a r e u n lig h te d O n ly L C D s e g m e n ts O N C O M 0 s id e a r e lig h te d O n ly L C D s e g m e n ts O N C O M 1 s id e a r e lig h te d O n ly L C D s e g m e n ts O N C O M 2 s id e a r e lig h te d L C D s e g m e n ts O N C O M 0 ,1 s id e s a r e lig h te d L C D s e g m e n ts O N C O M 0 , 2 s id e s a r e lig h te d L C D s e g m e n ts O N C O M 1 , 2 s id e s a r e lig h te d L C D s e g m e n ts O N C O M 0 ,1 , 2 s id e s a r e lig h te d H A L T M o d e V L 1 /2 V S V L 1 /2 V S C D V L 1 /2 V S V L 1 /2 V S V L 1 /2 V S V L 1 /2 V S V L 1 /2 V S V L 1 /2 V S V L 1 /2 V S V L 1 /2 V S V L 1 /2 V S V L 1 /2 V S V L 1 /2 V S C D V L 1 /2 V S V L 1 /2 V S C O M 0 , C O M 1 , C O M 2 A ll lc d d r iv e r o u tp u ts N o te : " * " O m it th e C O M 2 s ig n a l, if th e 1 /2 d u ty L C D V L C D S C D V L C D S S V L C D C D V L C D S C D S C D S C D S V L C D V L C D V L C D C D S C D S C D S C D S C D S C D S V L C D V L C D V L C D V L C D V L C D V L C D C D S V L C D C D S V L C D is u s e d . LCD Driver Output (1/3 Duty, 1/2 Duty, R Type) Rev. 1.30 27 June 7, 2007 HT46R74D-1 V A V B V C C O M 0 V S S V A V B V C C O M 1 V S S V A V B V C C O M 2 V S S V A V B C O M 3 V C V S S V A V B V C L C D s e g m e n ts O N C O M 2 s id e lig h te d V S S N o te : 1 /4 d u ty , 1 /3 b ia s , R ty p e : " V A " V L C D , " V B " 2 /3 V L C D , " V C " 1 /3 V L C D LCD Driver Output (1/4 Duty) selected, a capacitor mounted between C1 and C2 pins is needed. The LCD driver bias voltage can be 1/2 bias or 1/3 bias by option. If 1/2 bias is selected, a capacitor mounted between V2 pin and ground is required. If 1/3 bias is selected, two capacitors are needed for V1 and V2 pins. Refer to application diagram. LCD Type R Type LCD Bias Type 1/2 bias 1/3 bias C Type 1/2 bias If VDD>VLCD, then VMAX connect to VDD, else VMAX connect to VLCD VMAX 1/3 bias 3 If VDD> VLCD, then VMAX connect to VDD, 2 else VMAX connect to V1 LCD Segment pins used as Logic Outputs The SEG0~SEG7 pins also can be setup for use logic outputs using configuration options. Once an LCD segment is selected for use as a logic output, the content of bit 0 of the related segment address in the LCD RAM will appear on the segment. SEG0~SEG7 are bits that can be individually optioned as logical outputs. V Rev. 1.30 M A X V L C D , V 1 , V 2 , C 1 , C 2 C O M 0 ~ C O C O M 3 /S E G S E G 0 ~ S E G , M 2 , 1 5 , 1 4 28 June 7, 2007 HT46R74D-1 Low Voltage Reset/Detector Functions When the LVD function configuration option is set to the enable state, the LVD voltage option will decide the detecting voltage. When the LVD configuration option is set to LVR+0.2, the actual LVD voltage depends upon the LVR options and will detect the VDD voltage. When LVD option is set to Regulator+ 0.2, the actual LVD voltage will detect the regulator input voltage. There is a low voltage detector, LVD, and a low voltage r e s e t c i r c u i t , LV R , i m p l e m e n t e d w i t h i n t h e microcontroller. These two functions can be enabled/disabled via configuration options. Once the LVD option is enabled, the user can use the RTCC.3 bit to enable/disable the LVD circuit and read the LVD detector status from the RTCC.5 bit. Otherwise the LVD function is disabled. The RTCC register definitions are listed below. Bit No. Label Function 0~2 RT0~RT2 3 LVDC LVD enable/disable (1/0) 4 QOSC 32768Hz OSC quick start-up function 0/1: quick/slow start 5 LVDO LVD detect output (1/0) 1: low voltage detect, read only 6~7 ¾ 8 to 1 multiplexer control inputs to select the real clock prescaler output Unused bit, read as ²0² RTCC (09H) Register The LVR includes the following specifications: The LVR has the same effect or function as the external RES signal which performs a device reset. When in the Power Down Mode, both the LVR and LVD are disabled. · The low voltage, which is specified as 0.9V~VLVR, has The microcontroller provides a low voltage reset circuit in order to monitor the supply voltage of the device. If the supply voltage of the device is within the range 0.9V~VLVR, such as what might happen when changing a battery, the LVR will automatically reset the device internally. · The LVR has an ²OR² function with the external RES V to remain within this range for a period of time greater than 1ms. If the low voltage state does not exceed 1ms, the LVR will ignore it will not perform a reset function. signal to perform a device reset. D D 5 .5 V V L V R L V R D e te c t V o lta g e 0 .9 V 0 V R e s e t S ig n a l N o r m a l O p e r a tio n R e s e t *1 R e s e t *2 Low Voltage Reset Note: *1: To make sure that the system oscillator has stabilised, the SST provides an extra delay of 1024 system clock pulses before entering normal operation. *2: Since a low voltage state has to be maintained in its original state for over 1ms, therefore after the 1ms delay, the device enters the reset mode. Rev. 1.30 29 June 7, 2007 HT46R74D-1 Options The following shows the options in the device. All these options should be defined in order to ensure a proper functioning system. Options OSC type selection. There are two types selection: Crystal OSC or RC OSC System clock selection: OSC or RTC fS clock source. There are three types of selections: fSYS/4, WDT or RTC WDT clock source selection. There are various types of selections: system clock/4, WDT or RTC WDT enable/disable selection. The WDT function can be enabled or disabled by this configuration option. WDT time-out period selection. There are four types of selection: WDT clock source divided by 216/fS, 215/fS, 214/fS or 213/fS CLR WDT times selection. This option selects the instruction method of clearing the WDT. ²One time² means that the ²CLR WDT² instruction can clear the WDT. ²Two times² means only if both the ²CLR WDT1² and ²CLR WDT2² instructions have been executed, can the WDT be cleared. Buzzer output frequency selection. There are eight types of frequency signals for the buzzer output: fS/22~fS/29. ²fS² Wake-up selection. This option defines the wake-up capability. A falling edge on each external pin on PA has the capability to wake-up the device from a Power Down condition. Bit option. Pull-high selection. Selects pull-high resistors when the I/O in in the input mode. Bit options. I/O pins shared with other function selections. PA0/BZ, PA1/BZ: PA0 and PA1 can be setup as I/O pins or buzzer outputs. PA3 can be setup as an I/O pin or as a PFD output. PFD clock source selection: Timer/Event Counter 0 or Timer/Event Counter 1 LCD common selection. There are three types of selections: 2 commons (1/2 duty), 3 commons (1/3 duty) or 4 commons (1/4 duty). LCD bias selection. This option is to determine what kind of bias is selected, 1/2 bias or 1/3 bias. LCD segment logic output This option is to determine if pins SEG0~SEG7 are to be setup as logic outputs or setup as segment outputs - bit option LCD driver clock frequency selection. There are a range of frequency signals for the LCD driver circuits: fS/22~fS/28 LCD ON/OFF when in Power Down Mode selection LVR selection. LVR enable or disable option LVD selection. LVD enable or disable option LVR voltage selection: 2.2V or 3.3V LVD voltage selection: LVR+0.2 or regulator+0.2 INT trigger edge selection: disable; high to low; low to high; low to high or high to low Partial-lock selection: Page0~3, Page4~6, Page7. Rev. 1.30 30 June 7, 2007 HT46R74D-1 Application Circuits V D D 0 .0 1 m F * V D D 1 0 0 k W R E S 0 .1 m F 1 0 k W 0 .1 m F * V S S S e e r ig h t s id e C O M 0 ~ C O M 2 C O M 3 /S E G 1 5 S E G 0 ~ S E G 1 4 V L C D O S C 1 O S C C ir c u it L C D P o w e r S u p p ly V M A X O S C 2 3 2 7 6 8 H z L C D P a n e l C 1 O S C 3 0 .1 m F C 2 V 1 O S C 4 0 .1 m F V R E G S e n s o r V 2 D O P A P 0 .1 m F D O P A N 2 5 k W P A 0 /B Z D O P A O V P A 1 /B Z D C H O P D S R R 3 0 0 k W 4 7 m F V R E G 1 0 m F V O B G P 1 0 m F 1 0 m F P A 2 D S C C V S S P A 6 /IN T 0 V O C H P R P A 4 /T M R 0 P A 5 /T M R 1 V O R E G 4 7 m F 4 7 0 p F P A 3 /P F D D S R C D D O S C O S C 1 fS C 1 R 1 P B 0 ~ P B 1 /4 O S C 2 O S C 1 C 2 P A 7 /IN T 1 Y S C H P C 1 C ry s ta l S y s te m F o r th e v a lu e s , s e e ta b le b e lo w O s c illa to r O S C 2 O S C 1 V O B G P R C S y s te m O s c illa to r 3 0 k W < R O S C < 7 5 0 k W O S C 2 3 2 O s O S u n 7 6 8 H z C ry s ta l S y s te m c illa to r C 1 a n d O S C 2 le ft c o n n e c te d C H P C 2 H T 4 6 R 7 4 D -1 O S C C ir c u it The following table shows the C1, C2 and R1 values corresponding to the different crystal values. For reference only. Crystal or Resonator C1, C2 R1 4MHz Crystal 0pF 10kW 4MHz Resonator 10pF 12kW 3.58MHz Crystal 0pF 10kW 3.58MHz Resonator 25pF 10kW 2MHz Crystal & Resonator 25pF 10kW 1MHz Crystal 35pF 27kW 480kHz Resonator 300pF 9.1kW 455kHz Resonator 300pF 10kW 429kHz Resonator 300pF 10kW The function of the resistor R1 is to ensure that the oscillator will switch off should low voltage conditions occur. Such a low voltage, as mentioned here, is one which is less than the lowest value of the MCU operating voltage. Note however that if the LVR is enabled then R1 can be removed. Note: The resistance and capacitance for the reset circuit should be designed in such a way as to ensure that the VDD is stable and remains within a valid operating voltage range before bringing RES high. ²*² Make the length of the wiring, which is connected to the RES pin as short as possible, to avoid noise interference. Rev. 1.30 31 June 7, 2007 HT46R74D-1 Instruction Set Summary Description Instruction Cycle Flag Affected Add data memory to ACC Add ACC to data memory Add immediate data to ACC Add data memory to ACC with carry Add ACC to data memory with carry Subtract immediate data from ACC Subtract data memory from ACC Subtract data memory from ACC with result in data memory Subtract data memory from ACC with carry Subtract data memory from ACC with carry and result in data memory Decimal adjust ACC for addition with result in data memory 1 1(1) 1 1 1(1) 1 1 1(1) 1 1(1) 1(1) Z,C,AC,OV Z,C,AC,OV Z,C,AC,OV Z,C,AC,OV Z,C,AC,OV Z,C,AC,OV Z,C,AC,OV Z,C,AC,OV Z,C,AC,OV Z,C,AC,OV C 1 1 1 1(1) 1(1) 1(1) 1 1 1 1(1) 1 Z Z Z Z Z Z Z Z Z Z Z Increment data memory with result in ACC Increment data memory Decrement data memory with result in ACC Decrement data memory 1 1(1) 1 1(1) Z Z Z Z Rotate data memory right with result in ACC Rotate data memory right Rotate data memory right through carry with result in ACC Rotate data memory right through carry Rotate data memory left with result in ACC Rotate data memory left Rotate data memory left through carry with result in ACC Rotate data memory left through carry 1 1(1) 1 1(1) 1 1(1) 1 1(1) None None C C None None C C Move data memory to ACC Move ACC to data memory Move immediate data to ACC 1 1(1) 1 None None None Clear bit of data memory Set bit of data memory 1(1) 1(1) None None Mnemonic Arithmetic ADD A,[m] ADDM A,[m] ADD A,x ADC A,[m] ADCM A,[m] SUB A,x SUB A,[m] SUBM A,[m] SBC A,[m] SBCM A,[m] DAA [m] Logic Operation AND A,[m] OR A,[m] XOR A,[m] ANDM A,[m] ORM A,[m] XORM A,[m] AND A,x OR A,x XOR A,x CPL [m] CPLA [m] AND data memory to ACC OR data memory to ACC Exclusive-OR data memory to ACC AND ACC to data memory OR ACC to data memory Exclusive-OR ACC to data memory AND immediate data to ACC OR immediate data to ACC Exclusive-OR immediate data to ACC Complement data memory Complement data memory with result in ACC Increment & Decrement INCA [m] INC [m] DECA [m] DEC [m] Rotate RRA [m] RR [m] RRCA [m] RRC [m] RLA [m] RL [m] RLCA [m] RLC [m] Data Move MOV A,[m] MOV [m],A MOV A,x Bit Operation CLR [m].i SET [m].i Rev. 1.30 32 June 7, 2007 HT46R74D-1 Instruction Cycle Flag Affected Jump unconditionally Skip if data memory is zero Skip if data memory is zero with data movement to ACC Skip if bit i of data memory is zero Skip if bit i of data memory is not zero Skip if increment data memory is zero Skip if decrement data memory is zero Skip if increment data memory is zero with result in ACC Skip if decrement data memory is zero with result in ACC Subroutine call Return from subroutine Return from subroutine and load immediate data to ACC Return from interrupt 2 1(2) 1(2) 1(2) 1(2) 1(3) 1(3) 1(2) 1(2) 2 2 2 2 None None None None None None None None None None None None None Read ROM code (current page) to data memory and TBLH Read ROM code (last page) to data memory and TBLH 2(1) 2(1) None None No operation Clear data memory Set data memory Clear Watchdog Timer Pre-clear Watchdog Timer Pre-clear Watchdog Timer Swap nibbles of data memory Swap nibbles of data memory with result in ACC Enter Power Down Mode 1 1(1) 1(1) 1 1 1 1(1) 1 1 None None None TO,PDF TO(4),PDF(4) TO(4),PDF(4) None None TO,PDF Mnemonic Description Branch JMP addr SZ [m] SZA [m] SZ [m].i SNZ [m].i SIZ [m] SDZ [m] SIZA [m] SDZA [m] CALL addr RET RET A,x RETI Table Read TABRDC [m] TABRDL [m] Miscellaneous NOP CLR [m] SET [m] CLR WDT CLR WDT1 CLR WDT2 SWAP [m] SWAPA [m] HALT Note: x: Immediate data m: Data memory address A: Accumulator i: 0~7 number of bits addr: Program memory address Ö: Flag is affected -: Flag is not affected (1) : If a loading to the PCL register occurs, the execution cycle of instructions will be delayed for one more cycle (four system clocks). (2) : If a skipping to the next instruction occurs, the execution cycle of instructions will be delayed for one more cycle (four system clocks). Otherwise the original instruction cycle is unchanged. (3) (1) : (4) and (2) : The flags may be affected by the execution status. If the Watchdog Timer is cleared by executing the ²CLR WDT1² or ²CLR WDT2² instruction, the TO and PDF are cleared. Otherwise the TO and PDF flags remain unchanged. Rev. 1.30 33 June 7, 2007 HT46R74D-1 Instruction Definition ADC A,[m] Add data memory and carry to the accumulator Description The contents of the specified data memory, accumulator and the carry flag are added simultaneously, leaving the result in the accumulator. Operation ACC ¬ ACC+[m]+C Affected flag(s) TO PDF OV Z AC C ¾ ¾ Ö Ö Ö Ö ADCM A,[m] Add the accumulator and carry to data memory Description The contents of the specified data memory, accumulator and the carry flag are added simultaneously, leaving the result in the specified data memory. Operation [m] ¬ ACC+[m]+C Affected flag(s) TO PDF OV Z AC C ¾ ¾ Ö Ö Ö Ö ADD A,[m] Add data memory to the accumulator Description The contents of the specified data memory and the accumulator are added. The result is stored in the accumulator. Operation ACC ¬ ACC+[m] Affected flag(s) TO PDF OV Z AC C ¾ ¾ Ö Ö Ö Ö ADD A,x Add immediate data to the accumulator Description The contents of the accumulator and the specified data are added, leaving the result in the accumulator. Operation ACC ¬ ACC+x Affected flag(s) TO PDF OV Z AC C ¾ ¾ Ö Ö Ö Ö ADDM A,[m] Add the accumulator to the data memory Description The contents of the specified data memory and the accumulator are added. The result is stored in the data memory. Operation [m] ¬ ACC+[m] Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ Ö Ö Ö Ö 34 June 7, 2007 HT46R74D-1 AND A,[m] Logical AND accumulator with data memory Description Data in the accumulator and the specified data memory perform a bitwise logical_AND operation. The result is stored in the accumulator. Operation ACC ¬ ACC ²AND² [m] Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ AND A,x Logical AND immediate data to the accumulator Description Data in the accumulator and the specified data perform a bitwise logical_AND operation. The result is stored in the accumulator. Operation ACC ¬ ACC ²AND² x Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ ANDM A,[m] Logical AND data memory with the accumulator Description Data in the specified data memory and the accumulator perform a bitwise logical_AND operation. The result is stored in the data memory. Operation [m] ¬ ACC ²AND² [m] Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ CALL addr Subroutine call Description The instruction unconditionally calls a subroutine located at the indicated address. The program counter increments once to obtain the address of the next instruction, and pushes this onto the stack. The indicated address is then loaded. Program execution continues with the instruction at this address. Operation Stack ¬ Program Counter+1 Program Counter ¬ addr Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ CLR [m] Clear data memory Description The contents of the specified data memory are cleared to 0. Operation [m] ¬ 00H Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ 35 June 7, 2007 HT46R74D-1 CLR [m].i Clear bit of data memory Description The bit i of the specified data memory is cleared to 0. Operation [m].i ¬ 0 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ CLR WDT Clear Watchdog Timer Description The WDT is cleared (clears the WDT). The power down bit (PDF) and time-out bit (TO) are cleared. Operation WDT ¬ 00H PDF and TO ¬ 0 Affected flag(s) TO PDF OV Z AC C 0 0 ¾ ¾ ¾ ¾ CLR WDT1 Preclear Watchdog Timer Description Together with CLR WDT2, clears the WDT. PDF and TO are also cleared. Only execution of this instruction without the other preclear instruction just sets the indicated flag which implies this instruction has been executed and the TO and PDF flags remain unchanged. Operation WDT ¬ 00H* PDF and TO ¬ 0* Affected flag(s) TO PDF OV Z AC C 0* 0* ¾ ¾ ¾ ¾ CLR WDT2 Preclear Watchdog Timer Description Together with CLR WDT1, clears the WDT. PDF and TO are also cleared. Only execution of this instruction without the other preclear instruction, sets the indicated flag which implies this instruction has been executed and the TO and PDF flags remain unchanged. Operation WDT ¬ 00H* PDF and TO ¬ 0* Affected flag(s) TO PDF OV Z AC C 0* 0* ¾ ¾ ¾ ¾ CPL [m] Complement data memory Description Each bit of the specified data memory is logically complemented (1¢s complement). Bits which previously contained a 1 are changed to 0 and vice-versa. Operation [m] ¬ [m] Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ 36 June 7, 2007 HT46R74D-1 CPLA [m] Complement data memory and place result in the accumulator Description Each bit of the specified data memory is logically complemented (1¢s complement). Bits which previously contained a 1 are changed to 0 and vice-versa. The complemented result is stored in the accumulator and the contents of the data memory remain unchanged. Operation ACC ¬ [m] Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ DAA [m] Decimal-Adjust accumulator for addition Description The accumulator value is adjusted to the BCD (Binary Coded Decimal) code. The accumulator is divided into two nibbles. Each nibble is adjusted to the BCD code and an internal carry (AC1) will be done if the low nibble of the accumulator is greater than 9. The BCD adjustment is done by adding 6 to the original value if the original value is greater than 9 or a carry (AC or C) is set; otherwise the original value remains unchanged. The result is stored in the data memory and only the carry flag (C) may be affected. Operation If ACC.3~ACC.0 >9 or AC=1 then [m].3~[m].0 ¬ (ACC.3~ACC.0)+6, AC1=AC else [m].3~[m].0 ¬ (ACC.3~ACC.0), AC1=0 and If ACC.7~ACC.4+AC1 >9 or C=1 then [m].7~[m].4 ¬ ACC.7~ACC.4+6+AC1,C=1 else [m].7~[m].4 ¬ ACC.7~ACC.4+AC1,C=C Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ Ö DEC [m] Decrement data memory Description Data in the specified data memory is decremented by 1. Operation [m] ¬ [m]-1 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ DECA [m] Decrement data memory and place result in the accumulator Description Data in the specified data memory is decremented by 1, leaving the result in the accumulator. The contents of the data memory remain unchanged. Operation ACC ¬ [m]-1 Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ 37 June 7, 2007 HT46R74D-1 HALT Enter Power Down Mode Description This instruction stops program execution and turns off the system clock. The contents of the RAM and registers are retained. The WDT and prescaler are cleared. The power down bit (PDF) is set and the WDT time-out bit (TO) is cleared. Operation Program Counter ¬ Program Counter+1 PDF ¬ 1 TO ¬ 0 Affected flag(s) TO PDF OV Z AC C 0 1 ¾ ¾ ¾ ¾ INC [m] Increment data memory Description Data in the specified data memory is incremented by 1 Operation [m] ¬ [m]+1 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ INCA [m] Increment data memory and place result in the accumulator Description Data in the specified data memory is incremented by 1, leaving the result in the accumulator. The contents of the data memory remain unchanged. Operation ACC ¬ [m]+1 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ JMP addr Directly jump Description The program counter are replaced with the directly-specified address unconditionally, and control is passed to this destination. Operation Program Counter ¬addr Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ MOV A,[m] Move data memory to the accumulator Description The contents of the specified data memory are copied to the accumulator. Operation ACC ¬ [m] Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ 38 June 7, 2007 HT46R74D-1 MOV A,x Move immediate data to the accumulator Description The 8-bit data specified by the code is loaded into the accumulator. Operation ACC ¬ x Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ MOV [m],A Move the accumulator to data memory Description The contents of the accumulator are copied to the specified data memory (one of the data memories). Operation [m] ¬ACC Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ NOP No operation Description No operation is performed. Execution continues with the next instruction. Operation Program Counter ¬ Program Counter+1 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ OR A,[m] Logical OR accumulator with data memory Description Data in the accumulator and the specified data memory (one of the data memories) perform a bitwise logical_OR operation. The result is stored in the accumulator. Operation ACC ¬ ACC ²OR² [m] Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ OR A,x Logical OR immediate data to the accumulator Description Data in the accumulator and the specified data perform a bitwise logical_OR operation. The result is stored in the accumulator. Operation ACC ¬ ACC ²OR² x Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ ORM A,[m] Logical OR data memory with the accumulator Description Data in the data memory (one of the data memories) and the accumulator perform a bitwise logical_OR operation. The result is stored in the data memory. Operation [m] ¬ACC ²OR² [m] Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ 39 June 7, 2007 HT46R74D-1 RET Return from subroutine Description The program counter is restored from the stack. This is a 2-cycle instruction. Operation Program Counter ¬ Stack Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ RET A,x Return and place immediate data in the accumulator Description The program counter is restored from the stack and the accumulator loaded with the specified 8-bit immediate data. Operation Program Counter ¬ Stack ACC ¬ x Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ RETI Return from interrupt Description The program counter is restored from the stack, and interrupts are enabled by setting the EMI bit. EMI is the enable master (global) interrupt bit. Operation Program Counter ¬ Stack EMI ¬ 1 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ RL [m] Rotate data memory left Description The contents of the specified data memory are rotated 1 bit left with bit 7 rotated into bit 0. Operation [m].(i+1) ¬ [m].i; [m].i:bit i of the data memory (i=0~6) [m].0 ¬ [m].7 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ RLA [m] Rotate data memory left and place result in the accumulator Description Data in the specified data memory is rotated 1 bit left with bit 7 rotated into bit 0, leaving the rotated result in the accumulator. The contents of the data memory remain unchanged. Operation ACC.(i+1) ¬ [m].i; [m].i:bit i of the data memory (i=0~6) ACC.0 ¬ [m].7 Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ 40 June 7, 2007 HT46R74D-1 RLC [m] Rotate data memory left through carry Description The contents of the specified data memory and the carry flag are rotated 1 bit left. Bit 7 replaces the carry bit; the original carry flag is rotated into the bit 0 position. Operation [m].(i+1) ¬ [m].i; [m].i:bit i of the data memory (i=0~6) [m].0 ¬ C C ¬ [m].7 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ Ö RLCA [m] Rotate left through carry and place result in the accumulator Description Data in the specified data memory and the carry flag are rotated 1 bit left. Bit 7 replaces the carry bit and the original carry flag is rotated into bit 0 position. The rotated result is stored in the accumulator but the contents of the data memory remain unchanged. Operation ACC.(i+1) ¬ [m].i; [m].i:bit i of the data memory (i=0~6) ACC.0 ¬ C C ¬ [m].7 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ Ö RR [m] Rotate data memory right Description The contents of the specified data memory are rotated 1 bit right with bit 0 rotated to bit 7. Operation [m].i ¬ [m].(i+1); [m].i:bit i of the data memory (i=0~6) [m].7 ¬ [m].0 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ RRA [m] Rotate right and place result in the accumulator Description Data in the specified data memory is rotated 1 bit right with bit 0 rotated into bit 7, leaving the rotated result in the accumulator. The contents of the data memory remain unchanged. Operation ACC.(i) ¬ [m].(i+1); [m].i:bit i of the data memory (i=0~6) ACC.7 ¬ [m].0 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ RRC [m] Rotate data memory right through carry Description The contents of the specified data memory and the carry flag are together rotated 1 bit right. Bit 0 replaces the carry bit; the original carry flag is rotated into the bit 7 position. Operation [m].i ¬ [m].(i+1); [m].i:bit i of the data memory (i=0~6) [m].7 ¬ C C ¬ [m].0 Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ Ö 41 June 7, 2007 HT46R74D-1 RRCA [m] Rotate right through carry and place result in the accumulator Description Data of the specified data memory and the carry flag are rotated 1 bit right. Bit 0 replaces the carry bit and the original carry flag is rotated into the bit 7 position. The rotated result is stored in the accumulator. The contents of the data memory remain unchanged. Operation ACC.i ¬ [m].(i+1); [m].i:bit i of the data memory (i=0~6) ACC.7 ¬ C C ¬ [m].0 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ Ö SBC A,[m] Subtract data memory and carry from the accumulator Description The contents of the specified data memory and the complement of the carry flag are subtracted from the accumulator, leaving the result in the accumulator. Operation ACC ¬ ACC+[m]+C Affected flag(s) TO PDF OV Z AC C ¾ ¾ Ö Ö Ö Ö SBCM A,[m] Subtract data memory and carry from the accumulator Description The contents of the specified data memory and the complement of the carry flag are subtracted from the accumulator, leaving the result in the data memory. Operation [m] ¬ ACC+[m]+C Affected flag(s) TO PDF OV Z AC C ¾ ¾ Ö Ö Ö Ö SDZ [m] Skip if decrement data memory is 0 Description The contents of the specified data memory are decremented by 1. If the result is 0, the next instruction is skipped. If the result is 0, the following instruction, fetched during the current instruction execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle). Operation Skip if ([m]-1)=0, [m] ¬ ([m]-1) Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ SDZA [m] Decrement data memory and place result in ACC, skip if 0 Description The contents of the specified data memory are decremented by 1. If the result is 0, the next instruction is skipped. The result is stored in the accumulator but the data memory remains unchanged. If the result is 0, the following instruction, fetched during the current instruction execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle). Operation Skip if ([m]-1)=0, ACC ¬ ([m]-1) Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ 42 June 7, 2007 HT46R74D-1 SET [m] Set data memory Description Each bit of the specified data memory is set to 1. Operation [m] ¬ FFH Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ SET [m]. i Set bit of data memory Description Bit i of the specified data memory is set to 1. Operation [m].i ¬ 1 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ SIZ [m] Skip if increment data memory is 0 Description The contents of the specified data memory are incremented by 1. If the result is 0, the following instruction, fetched during the current instruction execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle). Operation Skip if ([m]+1)=0, [m] ¬ ([m]+1) Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ SIZA [m] Increment data memory and place result in ACC, skip if 0 Description The contents of the specified data memory are incremented by 1. If the result is 0, the next instruction is skipped and the result is stored in the accumulator. The data memory remains unchanged. If the result is 0, the following instruction, fetched during the current instruction execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle). Operation Skip if ([m]+1)=0, ACC ¬ ([m]+1) Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ SNZ [m].i Skip if bit i of the data memory is not 0 Description If bit i of the specified data memory is not 0, the next instruction is skipped. If bit i of the data memory is not 0, the following instruction, fetched during the current instruction execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle). Operation Skip if [m].i¹0 Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ 43 June 7, 2007 HT46R74D-1 SUB A,[m] Subtract data memory from the accumulator Description The specified data memory is subtracted from the contents of the accumulator, leaving the result in the accumulator. Operation ACC ¬ ACC+[m]+1 Affected flag(s) TO PDF OV Z AC C ¾ ¾ Ö Ö Ö Ö SUBM A,[m] Subtract data memory from the accumulator Description The specified data memory is subtracted from the contents of the accumulator, leaving the result in the data memory. Operation [m] ¬ ACC+[m]+1 Affected flag(s) TO PDF OV Z AC C ¾ ¾ Ö Ö Ö Ö SUB A,x Subtract immediate data from the accumulator Description The immediate data specified by the code is subtracted from the contents of the accumulator, leaving the result in the accumulator. Operation ACC ¬ ACC+x+1 Affected flag(s) TO PDF OV Z AC C ¾ ¾ Ö Ö Ö Ö SWAP [m] Swap nibbles within the data memory Description The low-order and high-order nibbles of the specified data memory (1 of the data memories) are interchanged. Operation [m].3~[m].0 « [m].7~[m].4 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ SWAPA [m] Swap data memory and place result in the accumulator Description The low-order and high-order nibbles of the specified data memory are interchanged, writing the result to the accumulator. The contents of the data memory remain unchanged. Operation ACC.3~ACC.0 ¬ [m].7~[m].4 ACC.7~ACC.4 ¬ [m].3~[m].0 Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ 44 June 7, 2007 HT46R74D-1 SZ [m] Skip if data memory is 0 Description If the contents of the specified data memory are 0, the following instruction, fetched during the current instruction execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle). Operation Skip if [m]=0 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ SZA [m] Move data memory to ACC, skip if 0 Description The contents of the specified data memory are copied to the accumulator. If the contents is 0, the following instruction, fetched during the current instruction execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle). Operation Skip if [m]=0 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ SZ [m].i Skip if bit i of the data memory is 0 Description If bit i of the specified data memory is 0, the following instruction, fetched during the current instruction execution, is discarded and a dummy cycle is replaced to get the proper instruction (2 cycles). Otherwise proceed with the next instruction (1 cycle). Operation Skip if [m].i=0 Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ TABRDC [m] Move the ROM code (current page) to TBLH and data memory Description The low byte of ROM code (current page) addressed by the table pointer (TBLP) is moved to the specified data memory and the high byte transferred to TBLH directly. Operation [m] ¬ ROM code (low byte) TBLH ¬ ROM code (high byte) Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ TABRDL [m] Move the ROM code (last page) to TBLH and data memory Description The low byte of ROM code (last page) addressed by the table pointer (TBLP) is moved to the data memory and the high byte transferred to TBLH directly. Operation [m] ¬ ROM code (low byte) TBLH ¬ ROM code (high byte) Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ ¾ ¾ ¾ 45 June 7, 2007 HT46R74D-1 XOR A,[m] Logical XOR accumulator with data memory Description Data in the accumulator and the indicated data memory perform a bitwise logical Exclusive_OR operation and the result is stored in the accumulator. Operation ACC ¬ ACC ²XOR² [m] Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ XORM A,[m] Logical XOR data memory with the accumulator Description Data in the indicated data memory and the accumulator perform a bitwise logical Exclusive_OR operation. The result is stored in the data memory. The 0 flag is affected. Operation [m] ¬ ACC ²XOR² [m] Affected flag(s) TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ XOR A,x Logical XOR immediate data to the accumulator Description Data in the accumulator and the specified data perform a bitwise logical Exclusive_OR operation. The result is stored in the accumulator. The 0 flag is affected. Operation ACC ¬ ACC ²XOR² x Affected flag(s) Rev. 1.30 TO PDF OV Z AC C ¾ ¾ ¾ Ö ¾ ¾ 46 June 7, 2007 HT46R74D-1 Package Information 56-pin SSOP (300mil) Outline Dimensions 2 9 5 6 B A 2 8 1 C C ' G H D Symbol Rev. 1.30 a F E Dimensions in mil Min. Nom. Max. A 395 ¾ 420 B 291 ¾ 299 C 8 ¾ 12 C¢ 720 ¾ 730 D 89 ¾ 99 E ¾ 25 ¾ F 4 ¾ 10 G 25 ¾ 35 H 4 ¾ 12 a 0° ¾ 8° 47 June 7, 2007 HT46R74D-1 Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 86-21-6485-5560 Fax: 86-21-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 5/F, Unit A, Productivity Building, Cross of Science M 3rd Road and Gaoxin M 2nd Road, Science Park, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 86-10-6641-0030, 86-10-6641-7751, 86-10-6641-7752 Fax: 86-10-6641-0125 Holtek Semiconductor Inc. (Chengdu Sales Office) 709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016 Tel: 86-28-6653-6590 Fax: 86-28-6653-6591 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538 Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright Ó 2007 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.30 48 June 7, 2007