MICROSEMI 1N6663

1N6661 thru 1N6663
VOIDLESS-HERMETICALLY-SEALED
STANDARD RECOVERY GLASS
RECTIFIERS
SCOTTSDALE DIVISION
APPEARANCE
This “standard recovery” rectifier diode is military qualified to MIL-PRF-19500/587 and
is ideal for high-reliability applications where a failure cannot be tolerated. These
industry-recognized 500 mA rated rectifiers for working peak reverse voltages from 225
to 600 volts are hermetically sealed with void-less-glass construction using an internal
“Category I” metallurgical bond. The surface mount MELF package configurations are
also available by adding a “US” suffix (see separate data sheet for 1N6661US thru
1N6663US). Microsemi also offers numerous other rectifier products to meet higher
and lower current ratings with various recovery time speed requirements including fast
and ultrafast device types in both through-hole and surface mount packages.
DO-35
(Package C)
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
WWW . Microsemi .C OM
DESCRIPTION
APPLICATIONS / BENEFITS
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Popular JEDEC registered 1N6661 thru 1N6663 series
Voidless hermetically sealed glass package
Triple-Layer Passivation
Internal “Category I” Metallurgical bonds
Working Peak Reverse Voltage 225 to 600 Volts.
JAN, JANTX, and JANTXV available per MIL-PRF19500/587
• Surface mount equivalents also available in a square
end-cap MELF configuration with “US” suffix (also see
1N6661US thru 1N6663US)
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MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Junction & Storage Temperature: -65 C to +175 C
• Thermal Resistance: 160oC/W junction to lead at 3/8
inch (10 mm) lead length from body
• Average Rectified Forward Current (IO): 0.5 Amps @
TA = 25ºC and 0.150 Amps at 150ºC
• Forward Surge Current: 5 Amps @ 8.3 ms half-sine
• Solder Temperatures: 260ºC for 10 s (maximum)
o
Standard recovery 0.5 Amp rectifiers 225 to 600 V
Military and other high-reliability applications
General rectifier applications including bridges, halfbridges, catch diodes, etc.
Forward surge current capability
Extremely robust construction
Low thermal resistance in small DO-35 package
Inherently radiation hard as described in Microsemi
MicroNote 050
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CASE: Hermetically sealed void-less hard glass
with Tungsten slugs
TERMINATIONS: Axial leads are copper clad steel
with Tin/Lead (Sn/Pb) finish
MARKING: Body paint and part number, etc.
POLARITY: Cathode band
TAPE & REEL option: Standard per EIA-296
WEIGHT: 150 mg (approx)
See package dimensions on last page
ELECTRICAL CHARACTERISTICS
TYPE
225
400
600
MINIMUM
BREAKDOWN
VOLTAGE
VBR @ 100μA
VOLTS
270
480
720
AVERAGE
RECTIFIED
CURRENT
(NOTE 2)
IO
AMPS
o
o
25 C
150 C
0.5
0.5
0.5
0.15
0.15
0.15
MAXIMUM
FORWARD
VOLTAGE
VF @ 0.4 A
(PULSED)
VOLTS
1.0
1.0
1.0
MAXIMUM REVERSE
CURRENT
IR @ VRWM
μA
o
o
25 C
150 C
0.05
0.05
0.05
MAXIMUM
SURGE
CURRENT
(NOTE1)
IFSM
AMPS
300
300
300
5
5
5
NOTE 1: TA = 25oC, 10 surges of 8.3 ms @ 1 minute intervals
NOTE 2: Linearly derate at 2.8 mA/ºC between TA=25ºC and 150ºC and 6.0 mA/ºC between TA=150ºC and 175ºC
Copyright © 2008
1-03-2008
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
1N6661 - 1N6663
1N6661
1N6662
1N6663
WORKING
PEAK
REVERSE
VOLTAGE
VRWM
VOLTS
1N6661 thru 1N6663
SCOTTSDALE DIVISION
VBR
VRWM
VF
IR
SYMBOLS & DEFINITIONS
Definition
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range.
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and temperature.
GRAPHS
WWW . Microsemi .C OM
Symbol
VOIDLESS-HERMETICALLY-SEALED
STANDARD RECOVERY GLASS
RECTIFIERS
PACKAGE DIMENSIONS
1N6661 - 1N6663
Copyright © 2008
1-03-2008
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2