TECHNICAL DATASHEET ABLEBOND® 84-1LMISR4 ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry. FEATURES • Excellent dispensability with minimal tailing and stringing • Box oven cure Typical Uncured Properties Filler Type ABLEBOND 84-1LMISR4 Test Description Silver Viscosity @ 25ºC 8000 cP Thixotropic Index 5.6 Work Life @ 25ºC 18 hours Storage Life @ -40ºC Brookfield CP51 @ 5 rpm ATM-0018 Viscosity @ 0.5/Viscosity @ 5 rpm ATM-0089 Physical worklife by % filler ATM-0067 1 year Cure Process Data Weight Loss on Cure ATM-0068 ABLEBOND 84-1LMISR4 5.3% Test Description 10 x 10 mm Si die on glass slide Recommended Cure Condition 1 hour @ 175ºC Alternate Cure Condition 3 - 5ºC / min ramp to 175ºC + 1 hour @ 175ºC (1) Test Method (1) Test Method ATM-0031 The ramp was observed to yield reduced bondline voiding and increased strength The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures. PHYSIOCHEMICAL PROPERTIES - Post Cure Ionics Chloride Sodium Potassium Water Extract Conductivity pH Weight Loss @ 300ºC ABLEBOND 84-1LMISR4 < 20 ppm < 10 ppm < 10 ppm 13 µmhos/cm 6 0.35% Test Description Test Method Teflon flask, 5 gm sample/20-40 mesh, 50 gm DI water, 100ºC for 24 hours ATM-0007 Conductometer ATM-0044 pH meter ATM-0002 Thermogravimetric analysis ATM-0073 The figures shown above are typical values only. If you need to write a specification, please request our current Standard Release Specification. 07/05 Page 1 of 3 84-1LMISR4 PHYSIOCHEMICAL PROPERTIES - Post Cure ABLEBOND 84-1LMISR4 Glass Transition Temperature Coefficient of Thermal Expansion Dynamic Tensile Modulus 120ºC TMA penetration mode Below Tg 40 ppm/ºC Above Tg 150 ppm/ºC 4400 MPa (640,000 psi) @ 25ºC 3900 MPa (570,000 psi) @ 150ºC 2000 MPa (290,000 psi) @ 250ºC 300 MPa (44,000 psi) THERMAL/ELECTRICAL PROPERTIES - Post Cure ABLEBOND 84-1LMISR4 Thermal Conductivity @ 121ºC MECHANICAL PROPERTIES Post Cure 2.5 W/mK 0.0001 ohm-cm Die Shear Strength (kgf/die) vs. Temperature Die Shear Strength (kgf/die) after 85ºC/85% RH exposure for 168 hours Chip Warpage (µm) @ 25ºC vs. Chip Size Chip Warpage (µm) vs. Post Cure Thermal Process(2) Test Description Test Description @200ºC @250ºC Substrate 2.9 1.7 Ag/Cu LF 11 2.6 1.4 Bare Cu LF 27 2.4 2.0 Pd/Ni/Cu LF @25ºC @200ºC Substrate 12 1.8 Ag/Cu LF 10 2.5 Bare Cu LF 23 1.8 Pd/Ni/Cu LF 3 x 3 mm (120 x 120 mil) Si die 3 x 3 mm (120 x 120 mil) Si die Chip Size Warpage 7.6 mm (300 x 300 mil) 19 µm 10.2 x 10.2 mm (400 x 400 mil) 32 µm 12.7 x 12.7 mm (500 x 500 mil) 51 µm Substrate Ag/Cu LF Bare Cu LF Post Cure 20 µm 22 µm + Wirebond 29 µm 30 µm + Post Mold Bake 28 µm 28 µm Page 2 of 3 Test Method ATM-0020 21 (4 hrs @ 175ºC) ATM-0093 4-point probe @25ºC (1 min @ 250ºC) ATM-0112 ATM-0017 2 x 2mm (80 x 80 mil) Si die on Ag/Cu leadframe 19 kgf/die ATM-0055 C-MATIC conductance tester ABLEBOND 84-1LMISR4 Die Shear Strength @ 25ºC Dynamic mechanical thermal analysis using < 0.5mm thick sample Dynamic vapor sorption after 85ºC/ 85% RH exposure 0.6% Test Method ATM-0058 TMA expansion mode @ -65ºC Moisture Absorption @ Saturation Volume Resistivity Test Description 0.38mm (5 mil) thick Si die on 0.2mm thick Ag/Cu LF 3 x 3 mm (120 x 120 mil) Si die Test Method ATM-0052 ATM-0052 ATM-0052 ATM-0059 ATM-0059 84-1LMISR4 APPLICATION GUIDELINES SHIPMENT This Ablestik product is packed and shipped in dry ice at –80ºC. Inside every dry ice shipment of Ablestik’s products is a small packet containing the ABLECUBE. This is a small blue cube which retains its shape at –40ºC. If the ABLECUBE is exposed to temperatures higher than –40ºC, the cube will melt. Please check the state of the ABLECUBE to ensure the integrity of the shipment. If the ABLECUBE has melted upon Receiving inspection, place the entire shipment in a –40ºC freezer and contact your Ablestik Customer Service or Sales Representative. UNPACKING Transfer the syringes from the dry ice to a –40ºC freezer without ANY delays. Freeze-thaw voids will form in the syringes if the syringes are repeatedly thawed and refrozen. STORAGE This Ablestik product must be stored at –40ºC. If stored at these conditions, ABLEBOND 84-1LMISR4 adhesive may be usable for up to one (1) year. Alternate storage conditions may be used as follows: Storage Temp Syringes Jars 0ºC to +5ºC 8 days 1 month* -15ºC to -10ºC 2 months 6 months” * Jar rolling required The shelf life of the material is only valid when the material has been stored at the correct storage condition. Incorrect storage conditions will degrade the performance of the material in both handling (e.g. dispensing) and final cured properties. ADHESIVE APPLICATION Thawed adhesive should be immediately placed on dispense equipment for use. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive. Adhesive must be completely used within the product’s recommended work life of 18 hours. Silver-resin separation may occur if the adhesive is left out at ambient beyond the recommended work life. Apply enough adhesive to achieve a 25-50 µm (1-2 mil) wet bondline thickness, dispensed with approximately 25% - 50% filleting on all sides of the die. Alternate dispense amounts may be used depending on the application requirements. Star or crossed shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern. Contact your Ablestik Technical Service Department for detailed recommendation on adhesive application, including dispensing. CURE This adhesive should be cured in conventional box oven per the recommended cure condition. Refer to the Cure Process Data section of the Technical Data Sheet for the recommended cure cycles. AVAILABILITY ABLEBOND® adhesives are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Ablestik Standard Package Data Set or contact your Customer Service Representative. THAWING Allow the container to reach room temperature before use. After removing from the freezer, set the syringes to stand vertically while thawing. Refer to the Syringe Thaw Time chart for the thaw time recommendation. DO NOT open the container before contents reach ambient temperature. Any moisture that collects on the thawed container should be removed prior to opening the container. DO NOT re-freeze. Once thawed to room temperature, the adhesive should not be re-frozen. CAUTION: This product may cause skin irritation in sensitive persons. Avoid skin contact. If contact does occur, wash area immediately with soap and water. Please refer to the Material Safety Data Sheet for more details. 20021 Susana Road, Rancho Dominguez, CA 90221 (310) 764-4600 Fax (310) 764-2545 Customer Service Fax (310) 764-1783 For a technical contact nearest you, visit www.ablestik.com The information given and the recommendations made herein are believed to be accurate but no guarantee of their accuracy is made. In every case we recommend that purchasers before using any product conduct their own tests to determine whether the product is suitable for their particular purposes under their own operating conditions. No representative of ours has any authority to waive or change the foregoing provisions but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs. Nothing contained herein shall be construed to imply the nonexistence of any relevant patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without the authority from the owner of this patent. These materials are not designed or manufactured for implantation in the human body. Approval from FDA for such use as part of any product to be implanted in the human body has NOT been sought nor received. We also expect purchasers to use our products in accordance with the guiding principles of the American Chemistry Council’s Responsible Care® program. Page 3 of 3