ETC CSD02060A

CSD02060–Silicon Carbide Schottky Diode
VRRM = 600V
Zero Recovery® Rectifier
IF(AVG)= 2A
Qc Features
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•
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•
= 7nC
Package
600-Volt Schottky Rectifier
Zero Reverse Recovery
Zero Forward Recovery
High-Frequency Operation
Temperature-Independent Switching Behavior
Extremely Fast Swtitching
Positive Temperature Coefficient on VF
TO-263-2
TO-220-2
Benefits
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•
•
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Replace Bipolar with Unipolar Rectifiers
Essentially No Switching Losses
Higher Efficiency
Reduction of Heat Sink Requirements
Parallel Devices Without Thermal Runaway
PIN 1
CASE
PIN 2
Applications
•
•
•
Switch Mode Power Supplies
Power Factor Correction
- Typical PFC Pout : 200W-400W
Motor Drives
- Typical Power : 0.50HP-1.0HP
Part Number
Package
Marking
CSD02060A
TO-220-2
CSD02060
CSD02060G
TO-263-2
CSD02060
Maximum Ratings
D02060 Rev.
Datasheet: CS
Symbol
Parameter
Value Unit
Test Conditions
VRRM
Repetitive Peak Reverse Voltage
600
V
VRSM
Surge Peak Reverse Voltage
600
V
VDC
DC Blocking Voltage
600
V
IF(AVG)
Average Forward Current
2
3.5
A
TC=150˚C, DC
TC=125˚C, DC
IF(PEAK)
Peak Forward Current
5
A
TC=125˚, TREP<1mS, Duty=0.5
IFRM
Repetitive Peak Forward Surge Current
10
A
TC=25˚C, tP=8.3ms, Half Sine Wave
IFSM
Non-Repetitive Peak Forward Surge Current
40
A
TC=25˚C, tP=10µs, Pulse
Ptot
Power Dissipation
43
14
W
TC=25˚C
TC=125˚C
-55 to
+175
˚C
TJ , Tstg
Operating Junction and Storage Temperature
Subject to change without notice.
www.cree.com/power
Note
Electrical Characteristics
Symbol
Parameter
Typ.
Max.
Unit
Test Conditions
VF
Forward Voltage
1.6
2.0
1.8
2.4
V
IR
Reverse Current
50
100
200
1000
μA
VR = 600V TJ=25°C
VR = 600V TJ=175°C
QC
Total Capacitive Charge
7
nC
VR = 600V, IF = 1A
di/dt = 500 A/μs
TJ = 25°C
C
Total Capacitance
120
20
15
pF
VR = 0V, TJ = 25°C, f = 1MHz
VR = 200V, TJ = 25˚C, f = 1MHz
VR = 400V, TJ = 25˚C, f = 1MHz
Note
IF = 2A TJ=25°C
IF = 2A TJ=175°C
Note:
1. This is a majority carrier diode, so there is no reverse recovery charge.
Thermal Characteristics
Symbol
Parameter
Typ.
Max.
Unit
RθJC
Thermal Resistance from Junction
to Case
4.7
°C/W
RθJA
Thermal Resistance from Junction
to Ambient
53
°C/W
Test Conditions
Note
Typical Performance
124
200
11
180
TJ = 25°C
10
TJ = 75°C
160
TJ = 125°C
TJ = 175°C
IR Reverse Current (µA)
IF Forward Current (A)
93
8
7
62
5
4
140
120
TJ = 25°C
TJ = 75°C
100
TJ = 125°C
TJ = 175°C
80
60
31
40
2
20
1
00
0.0
0
0.5
1.0
1.5
2.0
2.5
VF Forward Voltage (V)
Figure 1. Forward Characteristics
CSD02060 Rev. -
3.0
3.5
0
200
400
600
VR Reverse Voltage (V)
Figure 2. Reverse Characteristics
800
Typical Performance
250
100
20
186
200
80
5
14
C Capacitance (pF)
IF(AV) Forward Current (A)
IF(AVG) Forward Current (A)
16
124
10
3
8
62
150
60
100
40
50
20
4
1
2
00
25
25
50
50
75
75
100
100
125
125
150
150
175
175
00
200
200
1
TC Case Temperature (°C)
10
100
1000
VR Reverse Voltage (V)
Figure 3. Current Derating
Figure 4. Capacitance vs. Reverse Voltage
1.00E+01
Zth [°C/W]
1.00E+00
1.00E-01
1.00E-02
1.00E-03
1.00E-07
1.00E-06
1.00E-05
1.00E-04
1.00E-03
time [s]
Figure 5. Transient Thermal Impedance
CSD02060 Rev. -
1.00E-02
1.00E-01
1.00E+00
Package Dimensions
POS
Package TO-220-2
Inches
Max
Min
Max
A
.402
.408
10.211
10.364
B
.120
.124
3.048
3.150
C
.106
.110
2.692
2.794
D
.245
.251
6.223
6.375
E
.335
.345
8.509
8.763
F
.149
.153
3.784
3.886
G
.220
.240
5.588
6.096
H
.540
.550
13.716
13.970
J
.100 REF
K
PIN 1
CASE
PIN 2
Millimeters
Min
2.540 REF
.080
2.032
L
.050
.056
1.270
1.422
M
.032
.038
.813
.956
N
.197
.203
5.004
5.156
4.572
P
.170
.180
4.318
Q
.048
.052
1.219
1.321
R
.583
.593
14.808
15.062
S
6.5˚
8.5˚
6.5˚
8.5˚
T
6.5˚
8.5˚
6.5˚
8.5˚
U
6.5˚
8.5˚
6.5˚
8.5˚
V
.103
.107
2.616
2.718
W
.015
.021
.381
.533
X
2.0˚
4.0˚
2.0˚
4.0˚
Y
.396
.406
10.058
10.312
NOTE:
1.
Dimension L, M, W apply for Solder Dip Finish.
Package Dimensions
POS
Package TO-263-2
Inches
Max
Min
Max
A
.396
.406
10.058
10.312
B
.297
.303
7.544
7.696
C
.057
.063
1.448
1.600
D
.237
.243
6.015
6.167
E
.050
.070
1.270
1.778
F
.048
.052
1.219
1.321
G
PIN 1
CASE
PIN 2
CSD02060 Rev. -
Millimeters
Min
.100 TYP
2.540 TYP
H
.335
.345
8.509
8.763
J
.028
.032
.711
.813
K
2˚
4˚
2˚
4˚
L
.170
.180
4.318
4.572
M
.048
.052
1.219
1.321
N
.595
.615
15.113
15.621
P
0.00
0.10
0.00
.254
Q
R0.018
TYP
R0.022
TYP
R0.457
TYP
R0.559
TYP
R
.090
.110
2.286
2.794
S
.013
.017
.330
.432
T
6.5˚
8.5˚
6.5˚
8.5˚
U
.103
.107
2.616
2.718
V
R0.028
TYP
R0.032
TYP
R0.711
TYP
R0.813
TYP
W
—
5.0˚
—
5.0˚
Recommended Solder Pad Layout
TO-263-2
TO-220-2
Part Number
Package
Marking
CSD02060A
TO-220-2
CSD02060
CSD02060G
TO-263-2
CSD02060
This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body
nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited
to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical
equipment, aircraft navigation or communication or control systems, air traffic control systems, or weapons systems.
Copyright © 2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the
Cree logo, and Zero Recovery are registered trademarks of Cree, Inc.
CSD02060 Rev. -
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5451
www.cree.com/power