Data Sheet - Cree, Inc

CSD01060
VRRM = Silicon Carbide Schottky Diode
Zero R
Features
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•
•
•
•
•
•
IF (TC=135˚C) = 2 A
Rectifier
ecovery®
600 V
Qc = 3.3 nC
Package
600-Volt Schottky Rectifier
Zero Reverse Recovery Current
Zero Forward Recovery Voltage
High-Frequency Operation
Temperature-Independent Switching Behavior
Extremely Fast Switching
Positive Temperature Coefficient on VF
TO-252-2
TO-220-2
Benefits
•
•
•
•
•
PIN 1
Replace Bipolar with Unipolar Rectifiers
Essentially No Switching Losses
Higher Efficiency
Reduction of Rectifier Heat Sink
Parallel Devices Without Thermal Runaway
CASE
PIN 2
Applications
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•
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Switch Mode Power Supplies
Power Factor Correction
- Typical PFC Pout : 100W-200W
Motor Drives
- Typical Power : 0.25HP-0.5HP
Part Number
Package
Marking
CSD01060A
TO-220-2
CSD01060
CSD01060E
TO-252-2
CSD01060
Maximum Ratings (TC = 25 ˚C unless otherwise specified)
Symbol
Parameter
Unit
Test Conditions
VRRM
Repetitive Peak Reverse Voltage
600
V
VRSM
Surge Peak Reverse Voltage
600
V
VDC
DC Blocking Voltage
600
V
4
2
1
A
TC=25˚C
TC=135˚C
TC=158˚C
7
5.5
A
TC=25˚C, tP=10 ms, Half Sine Wave
TC=125˚C, tP=10 ms, Half Sine Wave
IF
Continuous Forward Current
IFRM
Repetitive Peak Forward Surge Current
IFSM
Non-Repetitive Peak Forward Surge Current
9
A
TC=25˚C, tP=1.5 ms, Half Sine Wave
IFSM
Non-Repetitive Peak Forward Surge Current
32
A
TC=25˚C, tP=10 µs, Pulse
Ptot
Power Dissipation
21.4
7.1
W
TC=25˚C
TC=125˚C
-55 to
+175
˚C
1
8.8
Nm
lbf-in
TJ , Tstg
Operating Junction and Storage Temperature
TO-220 Mounting Torque
1
Value
CSD01060 Rev. P
M3 Screw
6-32 Screw
Note
Electrical Characteristics
Symbol
Parameter
Typ.
Max.
Unit
Test Conditions
VF
Forward Voltage
1.6
2.0
1.8
2.4
V
IF = 1 A TJ=25°C
IF = 1 A TJ=175°C
IR
Reverse Current
20
40
100
500
μA
VR = 600 V TJ=25°C
VR = 600 V TJ=150°C
QC
Total Capacitive Charge
3.3
nC
VR = 600 V, IF = 1 A
di/dt = 500 A/μs
TJ = 25°C
C
Total Capacitance
80
11
8.5
pF
VR = 0 V, TJ = 25°C, f = 1 MHz
VR = 200 V, TJ = 25˚C, f = 1 MHz
VR = 400 V, TJ = 25˚C, f = 1 MHz
Note
Note:
1. This is a majority carrier diode, so there is no reverse recovery charge.
Thermal Characteristics
Symbol
Parameter
RθJC
Thermal Resistance from Junction to Case
RθJA
Thermal Resistance from Junction to Ambient
Typ.
Unit
7
°C/W
60
˚C/W
Typical Performance
2.0
IF Forward Current (A)
1.4
25°C
50°C
100°C
150°C
TTJ =
=25°C
200°C
40
40
40
J
TJ = 100°C
TJ = 200°C
IR Reverse Current (µA)
1.6
TJ =
TJ =
TJ =
TJ =
TJ 25 ° C
TJ = 25°C
TJ 100 ° C
TJ = 100°C
TJ 200 ° C
IR Reverse Current (μA)
IR Reverse Current (µA)
1.8
50
50
50
1.2
1.0
0.8
0.6
30
30
30
20
20
20
10
10
10
0.4
0.2
00
0.0
0.0
0.5
1.0
1.5
2.0
2.5
VF Forward Voltage (V)
Figure 1. Forward Characteristics
2
CSD01060 Rev. P
3.0
3.5
0
0
0
200
400
600
800
200
400
600
800
200
400
600
800
VR Reverse Voltage (V)
Voltage
(V)
VR Reverse
VR Reverse Voltage (V)
Figure 2. Reverse Characteristics
1000
1000
1000
Current Derating
Typical Performance
15.00
50
50
14
45
45
40
40
9.00
8
10%
30%
50%
70%
DC
6.00
6
Duty*
Duty*
Duty*
Duty*
4
3.00
35
35
C Capacitance (pF)
10
C Capacitance (pF)
Peak Forward
Forward Current
Current (A)
IF(PEAK) Peak
12.00
12
30
30
25
25
20
20
15
15
10
10
2
55
0.00
0
25
25
DC
50
50
70% Duty
75
100
125
150
75
100
125
150
TC Case Temperature (°C)
Case Temperature
* Frequency > 1KHz
50% Duty
30% Duty
175
175
00
200
200
11
10
10
100
100
1000
1000
VRVReverse
Voltage (V)
R Reverse Voltage (V)
10% Duty
Figure 3. Current Derating
Figure 4. Capacitance vs. Reverse Voltage
1.0E+01
Zth (°C/W)
1.0E+00
1.0E-01
1.0E-02
1.E-07
1.E-06
1.E-05
1.E-04
1.E-03
Tim e (s)
Figure 5. Transient Thermal Impedance
3
CSD01060 Rev. P
1.E-02
1.E-01
1.E+00
Typical Performance
30
30.000
Power Dissipation (W)
25
25.000
20.000
20
15.000
15
10.000
10
5.0005
0.0000
25
25
50
50
75
75
100
100
125
125
150
150
175
175
TC Case Temperature (°C)
Figure 6. Power Derating
Diode Model
Diode Model CSD01060
Vf T = VT + If*RT
VT= 0.94 + (Tj * -1.2*10-3)
RT= 0.015 + (Tj * 6.4*10-3)
Note: Tj = Diode Junction Temperature In Degrees Celsius
VT
4
CSD01060 Rev. P
RT
Package Dimensions
Package TO-220-2
Inches
POS
A
B
A
F
J
C
P
B
D
X
S
E
Y
1 2
G
T
Z
U
L
M
W
N
PIN 1
CASE
PIN 2
Max
.381
.410
9.677
10.414
E B
.235
5.969
.590 .255 .615
6.477
14.986
15.621
F C
D
G
E
H F
.102
.143
.337
1.105
.590
.500
.149
2.845
3.632
8.560
28.067
15.494
12.700
3.886
29.134
J G
1.127
L H
J
P N
.530
.025 .550
R 0.010
.045
.028
.036
.195
.045
.055
.165 .205
.195
13.462 13.970
.036
.635
R 0.254
.055
1.143
.711
.914
.205
4.953
1.143
1.397
.185
4.191
4.953
5.207
Q P
.170
.048
.180
4.318
.054
4.572
1.219
1.372
S Q
S
T
T
U U
.0483°
3°
3°
3°
3°3°
.054
1.371
3°
5°
3°
5°
3°
5°
6°
5°
6°1.219
3°
6°
3°
6° 3°
V V
.094
.100
.110
.110
2.54
2.388
2.794
2.794
W W
X
X
Y
Y
Z
.014
.014
3°
3°
.395
.385
.130
.130
.021 .025
.356
5°
3°
5.5°
.410
10.033
.410
.150
3.302
.150
.533
.356
5°
3°
10.414
9.779
3.810
3.302
.635
N
V
Min
D A
M
H
Max
.235
.255
5.969
Inc hes
M illim eters
.100
.120
2.540
M in
M ax
M in
M ax
.223 .410 .337
5.664
.395
10.033 10.414
CP OS
Q
Millimeters
Min
z
L
M
.112
2.591
.153
8.560
1.147
.610
14.986
.153 .550
3.785
R 1.147
0.197 28.626
.337
5°
5°
6.477
3.048
8.560
3.886
13.970
29.134 R 0.197
.914
1.397
5.207
4.699
6°
6°
5.5°
10.414
3.810
NOTE:
1. Dimension L, M, W apply for Solder Dip
Finish
Package Dimensions
POS
Package TO-252-2
*
Inches
Min
Max
Min
Max
A
.255
.265
6.477
6.731
B
.197
.205
5.004
5.207
C
.027
.033
.686
.838
D*
.270
.322
6.858
8.179
E
.178
.182
4.521
4.623
.889
F
.025
.035
.635
G
44˚
46˚
44˚
46˚
H
.382
.397
9.703
10.084
J
CASE
PIN 2
.090 TYP
2.286 TYP
K
6˚
8˚
6˚
8˚
L
.086
.094
2.184
2.388
M
.030
.034
.762
.864
N
.040
.044
1.016
1.118
P
.235
.245
5.969
6.223
Q
0.00
.004
0.00
.102
R
PIN 1
Millimeters
R0.01 TYP
S
.017
.023
.428
.588
T
.040
.044
1.016
1.118
U
.021
.027
.534
1.118
Note:
* Tab “D” may not be present
5
CSD01060 Rev. P
R0.31 TYP
Recommended Solder Pad Layout
.08
.26
TO-252-2
TO-220-2
Part Number
Package
Marking
CSD01060A
TO-220-2
CSD01060
CSD01060E
TO-252-2
CSD01060
Note: Recommended soldering profiles can be found in the applications note here:
http://www.cree.com/power_app_notes/soldering
Notes
• RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred
to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance
with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can
be obtained from your Cree representative or from the Product Documentation sections of www.cree.com.
• REACh Compliance
REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable
future,please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration.
REACh banned substance information (REACh Article 67) is also available upon request.
•
This product has not been designed or tested for use in, and is not intended for use in, applications implanted into
the human body nor in applications in which failure of the product could lead to death, personal injury or property
damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines,
cardiac defibrillators or similar emergency medical equipment, aircraft navigation or communication or control
systems, air traffic control systems, or weapons systems.
Copyright © 2013 Cree, Inc. All rights reserved.
The information in this document is subject to change without notice.
Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc.
6
CSD01060 Rev. P
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5451
www.cree.com/power