ETC MAS9122ASM3-T

DA9122.002
7 September, 2001
MAS9122
3 Outputs LDO Voltage Regulator IC
• Three Low Dropout Voltage
Regulators
• Very Low Noise: 25 µVrms
• High Ripple Rejection: 63 dB
• Very Low Crosstalk
• Low Ground Pin Current
• Regulator Enable/Disable
Control
DESCRIPTION
MAS9122 is a three output voltage regulator. It is
designed for three different output voltages, which
can be modified through a mask option. Regulators
operating mode is controlled by two enable/disable
pins. The circuit consists of a bandgap voltage
reference, an error amplifier, a current limit circuit
and a thermal protection circuit.
MAS9122 features very low ground pin current:
typically less than 1.5 µA sleep mode current and
typical 125 µA for one regulator in active mode.
Excellent noise and PSRR performance enables the
use of MAS9122 in high precision portable devices.
Low crosstalk between regulators provides an area
efficient solution compared to single regulators.
FEATURES
•
•
•
•
•
•
APPLICATION
•
Three Regulators at 135 mA, 70 mA and 50 mA
Output Options 2.70, 2.85 and 3.00 V, see
Ordering Information p. 12
Low Noise: 20 µVrms Typical and
30 µVrms Maximum for All Regulators over
Frequency Range 100 Hz…100 kHz
Fast Dynamic Response
Output Voltage Accuracy < ±2.0 %
MSOP-8 Package
•
•
•
•
Systems Requiring Stabilized Power in
Separate Blocks
Cordless Phones
Mobile Phones
Portable Systems
Battery Powered Systems
BLOCK DIAGRAM
VIN
ENA
&
LDO_A
135 mA
OUT A
&
LDO_B
70 mA
OUT B
&
LDO_C
50 mA
OUT C
ENBC
Temperature
Protection
ORgate
&
GND
Bandgap
Reference
VREF
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PIN CONFIGURATION
OUTA 1
OUTC 2
ENBC 3
ENA
8 OUTB
9122
AXWW
Top View
4
7 VIN
6 GND
5 VRF
Top Marking Information:
AX = voltage version, see p.12 Ordering information
WW = week
PIN DESCRIPTION
Pin Name
Pin
Type
OUTA
OUTC
ENBC
ENA
VREF
GND
VIN
OUTB
1
2
3
4
5
6
7
8
O
O
I
I
O
P
P
O
Function
135 mA Regulator Output
50 mA Regulator Output
Enable for Regulators B and C
Enable for Regulator A
Reference Voltage: Pin for Bypass Capacitor
Ground
Positive Supply Voltage
70 mA Regulator Output
G = Ground, I = Input, O = Output, P = Power
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ABSOLUTE MAXIMUM RATINGS
All Voltages with Respect to Ground
Parameter
Symbol
Supply Voltage
Voltage Range for All Pins
ESD Rating
Junction Temperature
Conditions
VIN
Min
Max
Unit
−0.3
−0.3
6
VIN + 0.3
2
175
V
V
kV
o
C
HBM
TJmax
(limited)
Storage Temperature
−55
TS
+150
o
C
Stresses beyond those listed may cause permanent damage to the device. The device may not operate under these conditions, but will not
be destroyed.
Parameter
Symbol
Conditions
Min
Max
Unit
Supply Voltage
VIN
VOUT(NOM) + 0.25
5.3
V
Operating Junction
Temperature
Operating Ambient
Temperature
TJ
−40
+125
°C
TA
−40
+85
°C
ELECTRICAL CHARACTERISTICS
TA = -40°C to +85°C, typical values at TA = +27°C, VIN = 4.5 V, IOUT = 1.0 mA, CIN = 1.0 µF, CL = 1.0 µF, CBYPASS = 10 nF,
VCTRL = 2.0 V, unless otherwise specified.
◆ Thermal Protection
Parameter
Threshold High
Threshold Low
Symbol
Conditions
TH
TL
Min
Typ
Max
130
150
170
o
160
o
120
140
Unit
C
C
The hysteresis of 10 oC prevents the device from turning on too soon after thermal shut-down.
◆ Control Pin Parameters
Parameter
Symbol
Input Voltage
ENA,
ENBC
ON-state
OFF-state
Conditions
Min
Typ
−0.3
Max
Unit
VIN + 0.3
V
2.0
0.3
If CTRL-pin is not connected, the particular regulator(s) is/are in OFF state (900 kΩ pull-down resistor to ground).
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◆ Current Parameters
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
LDO_A Continuous Output Current
IOUTA
0
135
mA
LDO_B Continuous Output Current
IOUTB
0
70
mA
LDO_C Continuous Output Current
IOUTC
0
50
mA
Short Circuit Current for LDO_A
ISHORTA
350
mA
Short Circuit Current for LDO_B
ISHORTB
265
mA
Short Circuit Current for LDO_C
ISHORTC
230
mA
Ground Pin Current
IGND(OFF)
Ground Pin Current
IGND(ONA)
Ground Pin Current
IGND(ONBC)
Ground Pin Current
IGND(ONABC)
2
IOUT = 0 A, VENA,ENBC < 0.3 V,
VIN= 3.6
IOUT = 0 A, VENA > 2 V,
VENBC < 0.3 V, VIN = 3.6
IOUT = 0 A, VENA < 0.3 V,
VENBC > 2 V, VIN = 3.6
IOUT = 0 A, VENA, ENBC > 2 V
VIN = 3.6
4
µA
125
µA
170
µA
245
µA
◆ Voltage Parameters
Parameter
Output Voltage:
Mask option for 2.85 V
LDO_A Dropout
Voltage
LDO_B Dropout
Voltage
LDO_C Dropout
Voltage
Symbol
Conditions
Min
Typ
Max
Unit
VOUTA
Max IOUT = 135 mA
2.85 – 3%
2.85
2.85 + 2%
V
VOUTA,B,C
2.85 – 2%
2.85
2.85 + 2%
V
VDROPB
Max IOUTA = 100 mA, Max IOUTB =
70 mA, Max IOUTC = 50 mA
IOUTA = 135 mA
IOUTA = 100 mA
IOUTB = 70 mA
VDROPC
IOUTC = 50 mA
VDROPA
220
180
165
mV
mV
150
mV
◆ External Capacitors
Parameter
Symbol
Output Capacitors for
all Regulators
Effective Series Resistance
Bypass Capacitor
COUTA,B,C
ESR
CBYPASS
Conditions
Min
Typ
0.8
0.01
1
0.1
10
Max
Unit
µF
2
Ω
nF
◆ Power Dissipation
Parameter
Symbol
Conditions
Junction to Case Thermal
Resistance
Junction to Ambient Thermal
Resistance
RJC
RJA
typical PC board mounting,
still air
Maximum Power Dissipation
Pd
any ambient temperature
Min
Pd MAX =
Typ
Max
Unit
39
°C/W
206
°C/W
TJ (MAX) − TA
R JA
mW
Note 1
Note 1: TJ(MAX) denotes maximum operating junction temperature (+125°C), TA ambient temperature, and RJA junction-to-ambient thermal
resistance (+206°C/W).
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◆ Load Regulation
Parameter
Symbol
Conditions
Load Regulation LDO_A
Min
0 mA < IOUT < 135 mA
0 mA < IOUT < 100 mA
0 mA < IOUT < 70 mA
0 mA < IOUT < 50 mA
Load Regulation LDO_B
Load Regulation LDO_C
Typ
Max
Unit
22
22
21
13
50
30
25
22
mV
mV
mV
Typ
Max
Unit
0.40
1.2
mV
Typ
Max
Unit
◆ Line Regulation
Parameter
Symbol
Line Regulation for all LDOs
Conditions
Min
IOUT = IMAX ,VIN from 5.3 V to 3.1 V
◆ PSRR
Parameter
Symbol
Conditions
PSRR for all LDOs
Min
IOUT = Max IOUT
VIN = 3.6 V
f = 1 kHz
f = 10 kHz
47
75
63
Symbol
Conditions
Min
Typ
Max
Unit
VNO
100 Hz < f < 100 kHz
25
30
µVrms
Symbol
Conditions
Typ
Max
Unit
dB
◆ Noise and Crosstalk
Parameter
Noise Voltage for all LDOs
◆ Dynamic Parameters
Parameter
Start-up Delay (from enabling
LDO_A to 90% * VOUT(NOM) ,
other LDOs at ON state)
(Note 2)
Overshoot
Settling Time
(from 90% * VOUT(NOM)A to max
±0.1% fluctuation)
Min
VENA from < 0.3 V to > 2.0 V,
VENBC > 2.0 V, IOUT = Max IOUT,
COUTA = 1 µF
25
µs
VENA from < 0.3 V to > 2.0 V,
VENBC > 2.0 V, IOUT = Max IOUT,
COUTA = 1 µF
VENA from < 0.3 V to > 2.0 V,
VENBC > 2.0 V, IOUT = Max IOUT,
COUTA = 1 µF, w/o CBYPASS
1
%
200
µs
Note 2: When all regulators are disabled the start-up delay is a function of a bypass capacitor. Typically 0.5 ms for 10 nF capacitor.
50%
TRL
overshoot
90%
VOUT
start-up delay
settling time
Figure 1. Definitions of
start-up delay, overshoot
and settling time.
5 (12)
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7 September, 2001
APPLICATION INFORMATION
VIN 3.1 V ... 5.3 V
VIN
1 uF
OUTA
OUTB
MAS9122
1 uF
VREF
ENA
1 uF
OUTC
ENBC
1 uF
10 nF
GND
See also table External Capacitors on p. 4.
FUNCTIONS
◆ Reference voltage
The device is supplied with 3.1 V to 5.3 V battery
under normal conditions. An internal bandgap
voltage reference is routed via 20 kOhm resistor to
an external pin, where a filter capacitor can be
connected in order to reduce noise level of all
regulators. The startup time of the reference
voltage is then determined by the value of the
bypass capacitor at pin VREF.
◆ Enable pins
Each regulator can be enabled/disabled by two
enable pins ENA and ENBC. Pin ENA controls
regulator LDO_A and pin ENBC controls both
regulator LDO_B and LDO_C. If both enable pins
are forced low, the whole circuit goes into power
saving sleep-mode. In the table below all functional
modes are presented.
◆ Regulators
The device contains three low dropout CMOS
regulators, with maximum output currents of 135
mA, 70 mA and 50 mA. Three different output
voltage options are available by mask option:
2.70 V, 2.85 V and 3.00 V.
◆ Logic Table for Enable Inputs
ENA
ENBC
LDO_A
LDO_B
LDO_C
VREF
1
1
ON
ON
ON
ON
1
0
ON
OFF
OFF
ON
0
1
OFF
ON
ON
ON
0
0
OFF
OFF
OFF
OFF
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TYPICAL PERFORMANCE
4.5
15
Vin(V)
10
4
5
3.5
0
-5
3
-10
Delta Vout (mV)
2.8535
2.853
2.8525
2.852
2.8515
2.851
2.8505
Vout (V) 2.85
2.8495
2.849
2.8485
-15
2.5
-20
2
0
10
20
30
0
50
100
Time (us)
150
200
250
300
-25
350
Time (us)
Figure 2. LDO_C line transient for 1 V change at supply voltage.
Figure 5. LDO_A load transient response to maximum output
current with 10 µs steps (IOUT max 100 mA).
NOTE: With 135 mA current the overshoot values and lengths
will grow by 30% compared to 100 mA current.
450
15
400
5
300
0
250
-5
200
-10
150
Delta Vout (mV)
Noise voltage (nV/sqrt(Hz))
10
350
-15
100
-20
50
0
100
0
1000
10000
50
100
100000
200
250
300
-25
350
Time (us)
Frequency (Hz)
Figure 3. Regulator output noise density.
150
Figure 6. LDO_B load transient response to maximum output
current with 10 µs steps.
2.86
15
2.855
2.85
2.845
2.84
-40
5
0
-5
-10
Delta Vout (mV)
Output voltage (V)
10
-15
-20
-20
0
20
40
60
80
Temperature
Figure 4. Regulator output voltage temperature dependency.
0
50
100
150
200
250
300
-25
350
Time (us)
Figure 7. LDO_C load transient response to maximum output
current with 10 µs steps.
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7 September, 2001
TYPICAL PERFORMANCE
25
2.86
Load regulation (mV)
ldo_a and ldo_b outputs (V)
2.88
20
2.84
2.82
LDO_A
LDO_B
LDO_C
15
2.80
2.78
10
2.76
2.74
5
2.72
0
-40
2.70
0
500
1000
1500
-20
0
20
Figure 8. LDO_A start-up, overshoot and cross-coupling
to LDO_B.
LDO_A
LDO_B
LDO_C
200
150
100
50
Short circuit current (mA)
Dropout voltage (mV)
360
340
LDO_A
320
300
280
260
LDO_B
240
LDO_C
220
200
-20
0
20
40
60
3
80
3.5
4
4.5
5
5.5
6
Supply voltage (V)
Temperature
Figure 9. Dropout voltage temperature
dependency with maximum output current.
Figure 12. Short circuit current variation vs. supply
voltage.
450
120
max. load
400
350
300
250
minload
Ground Pin Current (uA)
Ground Pin Current (uA)
80
Figure 11. Load regulation vs. temperature.
250
200
-40
60
Temperature
Time (100 us/Div)
0
-40
40
110
100
90
80
70
60
50
40
-20
0
20
40
60
80
Temperature
Figure 10. Total ground pin current vs. temperature.
0
20
40
60
80
100
Output current (mA)
Figure 13. LDO_A ground pin current vs. output current.
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DA9122.002
7 September, 2001
PACKAGE (MSOP-8) OUTLINE
Gage plane
F
E1 E
Land
Pattern
Recommendation
P
R
A
Q
L
A
R1
N
e
c
D
G
A2
c1
M
b1
(b)
A
A1
Section A - A
b
Symbol
Min
A
A1
A2
b
b1
c
c1
D
E
E1
e
F
G
L
(Terminal length for
soldering)
M
N
P
Q
R
R1
0
0.75
0.22
0.22
0.08
0.08
0.40
Nom
0.85
0.30
3.00 BSC
4.90 BSC
3.00 BSC
0.65 BSC
4.8
0.65
0.60
Max
Unit
1.10
0.15
0.95
0.38
0.33
0.23
0.18
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
0.80
0.41
1.02
0°
mm
mm
8°
0.25 BSC
0.07
0.07
mm
mm
mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
All measurement according to JEDEC standard MO-187.
9 (12)
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SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Reflow Temperature
Maximum Number of Reflow Cycles
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20 2*220°C
235°C
2
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
P1
T
DO
PO
P2
E
W
F
BO
A
AO
KO
D1
Section A-A
User Direction of Feed
Pin 1 Designator
Dimension
Min/Max
Unit
Ao
Bo
Do
D1
E
F
Ko
Po
P1
P2
T
W
5.00 ±0.10
3.20 ±0.10
1.50 +0.1/-0.0
1.50 min
1.75
5.50 ±0.05
1.45 ±0.10
4.0
8.0
±0.10
2.0
±0.05
0.3
±0.05
12.00 +0.30/-0.10
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
10 (12)
DA9122.002
7 September, 2001
REEL SPECIFICATIONS
W2
A
D
C
Tape Slot for Tape Start
N
B
W1
5000 Components on Each Reel
Reel Material: Conductive, Plastic Antistatic or Static Dissipative
Carrier Tape Material: Conductive
Cover Tape Material: Static Dissipative
Carrier Tape
Cover Tape
End
Start
Trailer
Dimension
A
B
C
D
N
W 1 (measured at hub)
W 2 (measured at hub)
Trailer
Leader
Weight
Leader
Components
Min
1.5
12.80
20.2
50
12.4
Max
Unit
330
mm
mm
mm
mm
mm
mm
mm
mm
mm
13.50
14.4
18.4
160
390,
of which minimum 160
mm of empty carrier tape
sealed with cover tape
1500
g
11 (12)
DA9122.002
7 September, 2001
ORDERING INFORMATION
Product Code
MAS9122ASM2-T
MAS9122ASM3-T
MAS9122ASM4-T
Product
Top Marking (ax)
Package
Comments
3 x 2.70 V LDO Voltage Regulator IC
3 x 2.85 V LDO Voltage Regulator IC
3 x 3.00 V LDO Voltage Regulator IC
A2
A3
A4
MSOP-8
MSOP-8
MSOP-8
Tape & Reel
Tape & Reel
Tape & Reel
For more voltage options contact Micro Analog Systems Oy.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O.Box 51
FIN-02771 Espoo, FINLAND
http://www.mas-oy.com
Tel. (09) 80 521
Tel. Int. +358 9 80 521
Telefax +358 9 805 3213
E-mail: [email protected]
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no
claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or
modification.
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