KODENSHI KK33153

TECHNICAL DATA
SINGLE IGBT GATE DRIVER
KK33153
The KK33153 is specifically designed as an IGBT driver for high power applications that include ac induction motor control, brushless dc motor control and uninterruptable power supplies. Although designed for
driving discrete and module IGBTs, this device offers a cost effective solution for driving power MOSFETs
and Bipolar Transistors. Device protection features include the choice of desaturation or overcurrent sensing
and undervoltage detection. These devices are available in dual-inline and surface mount packages and include the following features:
FEATURES
• High Current Output Stage: 1.0 A Source/2.0 A Sink
• Protection Circuits for Both Conventional and Sense IGBTs
• Programmable Fault Blanking Time
• Protection against Overcurrent and Short Circuit
• Undervoltage Lockout Optimized for IGBT's
• Negative Gate Drive Capability
• Cost Effectively Drives Power MOSFETs and Bipolar Transistors
BLOCK SCHEME
1
KK33153
ABSOLUTE MAXIMUM RATINGS
Rating
Power Supply Voltage
VCC to VEE
Kelvin Ground to VEE (Note 1 )
Logic Input
Current Sense Input
Blanking/Desaturation Input
Gate Drive Output
Source Current
Sink Current
Diode Clamp Current
Fault Output
Source Current
Sink Curent
Power Dissipation and Thermal Characteristics
D Suffix SO-8 Package, Case 751
Maximum Power Dissipation @ TA = 5O°C Thermal
Resistance, Junction-to-Air
P Suffix DIP-8 Package, Case 626
Maximum Power Dissipation @ TA = 5O°C Thermal
Resistance, Junction-to-Air
Symbol
Operating Junction Temperature
Operating Ambient Temperature
Storage Temperature Range
VCC-VEE
KGnd - VEE
Vin
VS
VBD
IO
IFO
Value
Unit
V
20
20
VEE-O,3 to VCC V
-0.3 to Vcc
V
-0.3 to Vcc
V
A
1.0
2.0
1.0
mA
25
10
PD
RθJA
0.56
180
W
°C/W
PD
RθJA
1.0
100
W
°C/W
TJ
TA
Tstg
+150
-40 to +105
-65 to +150
°C
°C
°C
2
KK33153
ELECTRICAL CHARACTERISTICS
(Vcc=15V, VEE=0V, Kelvin Gnd connected to VEE. For typical values TA=25°C, for min/max values TA is the operating ambient
temperature range that applies (Note 2), unless otherwise noted.)
Characteristic
Input Threshold Voltage ]
High State (Logic 1 )
Low State (Logic 0)
Input Current
High State (VIH = 3.0 V)
Low State (Vii. = 1.2 V)
Symbol
LOGIC INPUT
Min
Typ
Max
Unit
V
VIH
VIL
1.2
2.70
2.30
3.2
-
-
130
50
500
100
12
-
2.0
13.9
100
2.5
200
12
0.2
13.3
1.0
-
µA
IIH
IIL
DRIVE OUTPUT
Output Voltage
Low State (Isink = 1.0 A)
High State (Isource = 500 mA)
Output Pull-Down Resistor
V
VOL
VOH
RPD
kΩ
FAULT OUTPUT
Output voltage
Low Slate (Isink = 5.0 mA)
High State (Isource = 20 mA)
V
VFL
VFH
SWITCHING CHARACTERISTICS
Propagation Delay (50% Input to 50% Output CL = 1.0 nF)
Logic Input to Drive Output Rise
tPLH(in/out) tPHL Logic Input to Drive Output Fall
(in/out)
Drive Output Rise Time (10% to 90%) CL = 1.0 nF
tr
Drive Output Fall Time (90% to 10%) CL= 1.0 nF
tf
Propagation Delay
tp(OC)
Current Sense Input to Drive Output
Fault Blanking/Desaturation Input to Drive Output
tp(FLT)
UVLO
Startup Voltage
VSS Start
11.3
Disable Voltage
VSS dis
10.4
COMPARATORS
Overcurrent Threshold Voltage (Vpin8 > 7,0 V)
VSOC
50
Short Circuit Threshold Voltage (Vpine8> 7,0 V)
VSSC
100
Fault Blanking/Desaturation Threshold (Vpin1 > 100 mV)
Vth(FLT)
6.0
Current Sense Input Current (Vsi = 0 V)
ISI
FAULT BLANKING/DESATURATION INPUT
Current Source (Vpjn8 = 0 V, Vpin4 = 0 V)
Ichg
-200
Discharge Current (Vpin8 = 15 V, Vpin4 = 5.0 V)
Idschg
1.0
TOTAL DEVICE
ICC
Power Supply Current
Standby (Vpin 4 = VCC, Output Open)
Operating (CL= 1.0 nF, f= 20 kHz)
ns
80
120
17
17
300
300
55
55
0.3
0.3
1.0
1.0
12
11
12.6
11.7
V
V
65
130
6.5
-1.4
80
160
7.0
-10
mV
mV
V
mA
-270
2.5
-300
-
mA
mA
7.2
7.9
14
20
ns
ns
µs
mA
NOTES: 1. Kelvin Ground must always be between VEE and VCC.
2.Low duty cycle pulse techniques are used during test to maintain the junction temperature as close to ambient as possible.
Tlow = -40°C lor KK33153
Thigh = +105°Clor KK33153
3
KK33153
N SUFFIX PLASTIC DIP
(MS – 001BA)
A
Dimension, mm
5
8
B
1
4
MIN
MAX
A
8.51
10.16
B
6.1
7.11
5.33
C
L
F
Symbol
C
D
0.36
0.56
F
1.14
1.78
-T- SEATING
PLANE
N
G
K
D
0.25 (0.010) M
M
H
J
T
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
G
2.54
H
7.62
J
0°
10°
K
2.92
3.81
L
7.62
8.26
M
0.2
0.36
N
0.38
4