No. STSE-CG5125A <Cat.No.051019> SPECIFICATIONS FOR NICHIA GREEN LED MODEL : NSPGR70ASS NICHIA CORPORATION -0- Nichia STSE-CG5125A <Cat.No.051019> 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature Symbol IF IFP VR PD Topr Tstg Tsld Absolute Maximum Rating 35 100 5 147 -30 ~ + 85 -40 ~ +100 265°C for 5sec. (Ta=25°C) Unit mA mA V mW °C °C IFP Conditions : Pulse Width < = 10msec. and Duty < = 1/10 (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Luminous Flux φV x Chromaticity Coordinate y - Condition IF=30[mA] VR= 5[V] IF=30[mA] IF=30[mA] IF=30[mA] Typ. (3.7) (4.0) 0.17 0.70 (Ta=25°C) Max. Unit 4.2 V 50 µA lm - Min. 4.8 3.4 2.4 (Ta=25°C) Max. Unit 6.8 lm 4.8 lm 3.4 lm Please refer to CIE 1931 chromaticity diagram. (3) Ranking Item Luminous Flux Rank Rc Rank Rb Rank Ra Symbol φV φV φV Condition IF=30[mA] IF=30[mA] IF=30[mA] Luminous Flux Measurement allowance is ± 10%. Color Ranks x y 0.14 0.64 Rank G 0.14 0.22 0.74 0.74 x y 0.22 0.64 0.21 0.65 (IF=30mA,Ta=25°C) Rank H 0.21 0.28 0.28 0.73 0.73 0.65 Color Coordinates Measurement allowance is ± 0.01. One delivery will include up to two color ranks and three luminous flux ranks of the products. The quantity-ratio of the ranks is decided by Nichia. -1- Nichia STSE-CG5125A <Cat.No.051019> 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure’s page. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure’s page. Material as follows ; Resin(Mold) : Leadframe : Epoxy Resin (over Silicone Resin + Diffused) Ag plating Copper Alloy 4.PACKAGING · The LEDs are packed in cardboard boxes after packaging in stick. Please refer to figure’s page. The label on the packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; -U - Year ( 4 for 2004, 5 for 2005 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number U - Ranking by Color Coordinates - Ranking by Luminous Flux -2- B for Nov. ) Nichia STSE-CG5125A <Cat.No.051019> 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Standard Test Method Test Conditions Note Number of Damaged 1 time 0/50 1 time over 95% 0/50 Resistance to Soldering Heat JEITA ED-4701 300 302 Tsld=260 ± 5°C, 5sec. 1.6mm from the base of the stopper (Pre treatment 30°C,70%,168hrs.) Solderability JEITA ED-4701 300 303 Tsld=235 ± 5°C, (using flux) Thermal Shock JEITA ED-4701 300 307 0°C ~ 100°C 15sec. 15sec. 100 cycles 0/50 Temperature Cycle JEITA ED-4701 100 105 -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 100 cycles 0/50 Moisture Resistance Cyclic JEITA ED-4701 200 203 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle 10 cycles 0/50 Terminal Strength (bending test) JEITA ED-4701 400 401 Load 5N (0.5kgf) 0° ~ 90° ~ 0° bend 2 times No noticeable damage 0/50 Terminal Strength (pull test) JEITA ED-4701 400 401 Load 10N (1kgf) 10 ± 1 sec. No noticeable damage 0/50 High Temperature Storage JEITA ED-4701 200 201 Ta=100°C 1000hrs. 0/50 Temperature Humidity Storage JEITA ED-4701 100 103 Ta=60°C, RH=90% 1000hrs. 0/50 Low Temperature Storage JEITA ED-4701 200 202 Ta=-40°C 1000hrs. 0/50 Steady State Operating Life Condition 1 Ta=25°C, IF=35mA 1000hrs. 0/50 Steady State Operating Life Condition 2 Ta=35°C, IF=30mA 1000hrs. 0/50 Steady State Operating Life of High Humidity Heat 60°C, RH=90%, IF=20mA 500hrs. 0/50 Steady State Operating Life of Low Temperature Ta=-30°C, IF=30mA 1000hrs. 0/50 5sec. (2) CRITERIA FOR JUDGING DAMAGE Criteria for Judgement Item Symbol Test Conditions Min. Max. Forward Voltage VF IF=30mA U.S.L.*) 1.1 Reverse Current IR VR=5V U.S.L.*) 2.0 Luminous Flux IF=30mA L.S.L.**) 0.7 φV *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level -3- Nichia STSE-CG5125A <Cat.No.051019> 7.CAUTIONS (1) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 85°C · Nichia LED leadframes are silver plated copper alloy. The silver surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible. · Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. (2) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) -4- Nichia STSE-CG5125A <Cat.No.051019> (3) Soldering Conditions · Nichia LED leadframes are silver plated copper alloy. This substance has a low thermal coefficient (easily conducts heat). Careful attention should be paid during soldering. · Solder the LED no closer than 1.6mm from the base of the stopper. · The mechanical stress by clinching will cause degradation of the reliability on the LEDs. It is important to minimize the mechanical stress on the LEDs. It should be confirmed beforehand that it will not cause any problem when using it. · Recommended soldering conditions Pre-Heat Pre-Heat Time Solder Bath Temperature Dipping Time Dipping Position Dip Soldering 120°C Max. 60 seconds Max. 260°C Max. Temperature Soldering Time Position Soldering 350°C Max. 3 seconds Max. No closer than 1.6 mm from the base of the stopper. 5 seconds Max. No lower than 1.6 mm from the base of the stopper. · Do not apply any stress to the lead particularly when heated. · The LEDs must not be repositioned after soldering. · After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. · Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused from warping of the PC board or from the clinching and cutting of the leadframes. When it is absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility for any problems. Direct soldering should only be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will occur. Nichia’s LEDs should not be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin. · When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. · Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. (4) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · The operating current should be decided after considering the ambient maximum temperature of LEDs. (5) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. -5- Nichia STSE-CG5125A <Cat.No.051019> (6) Safety Guideline for Human Eyes · In 1993, the International Electric Committee (IEC) issued a standard concerning laser product safety (IEC 825-1). Since then, this standard has been applied for diffused light sources (LEDs) as well as lasers. In 1998 IEC 60825-1 Edition 1.1 evaluated the magnitude of the light source. In 2001 IEC 60825-1 Amendment 2 converted the laser class into 7 classes for end products. Components are excluded from this system. Products which contain visible LEDs are now classified as class 1. Products containing UV LEDs are class 1M. Products containing LEDs can be classified as class 2 in cases where viewing angles are narrow, optical manipulation intensifies the light, and/or the energy emitted is high. For these systems it is recommended to avoid long term exposure. It is also recommended to follow the IEC regulations regarding safety and labeling of products. (7) Others · Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -6- Nichia STSE-CG5125A <Cat.No.051019> ICI Chromaticity Diagram 0.9 520 530 0.8 540 510 0.7 G H 550 560 0.6 570 500 0.5 y 580 590 0.4 600 0.3 610 620 630 490 0.2 480 0.1 470 460 0 0 0.1 0.2 0.3 0.4 x ½ Color Coordinates Measurement allowance is ± 0.01. -7- 0.5 0.6 0.7 0.8 10 5 3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V) Ta=25°C 2.5 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 Forward Current IFP (mA) Ambient Temperature vs. Forward Voltage Ambient Temperature vs. Relative Luminous Flux 5.4 2.0 -8- 5.0 IFP=30mA 4.6 4.2 3.8 3.4 3.0 2.6 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) IFP=30mA 1.0 0.5 0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Allowable Forward Current IFP (mA) 20 3.0 200 Ta=25°C 100 50 30 20 10 1 5 10 20 50 100 Duty Ratio (%) Ambient Temperature vs. Allowable Forward Current Allowable Forward Current IF (mA) Ta=25°C 50 1 2.5 Forward Voltage VF (V) Relative Luminous Flux (a.u.) 100 Relative Luminous Flux (a.u.) Forward Current IFP (mA) 200 Duty Ratio vs. Allowable Forward Current Forward Current vs. Relative Luminous Flux Forward Voltage vs. Forward Current 50 40 30 20 10 9 0 0 20 40 60 80 100 Ambient Temperature Ta (°C) NICHIA CORPORATION NSPGR70AS Title CHARACTERISTICS No. 051005544971 Nichia STSE-CG5125A <Cat.No.051019> Model Forward Current vs. Chromaticity Coordinate (λD) 30mA 5mA (525nm) (535nm) 0.70 y 50mA (520nm) 0.65 1mA (541nm) 100mA(514nm) 0.60 0.55 0.05 0.10 0.15 0.20 0.25 0.30 555 Ta=25°C 545 535 525 515 505 495 1 5 10 20 50 100 Forward Current IFP (mA) Ta=25°C IF=30mA 1.0 0.8 0.6 0.4 0.2 0 400 450 500 550 600 650 700 Wavelength λ (nm) Ambient Temperature vs. Dominant Wavelength Dominant Wavelength λ D (nm) -9- Dominant Wavelength λ D (nm) x Forward Current vs. Dominant Wavelength 1.2 Directivity 1.0 531 529 IFP=30mA Relative Illuminance (a.u.) Ta=25°C 0.75 Relative Emission Intensity (a.u.) 0.80 Spectrum 527 525 523 521 519 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) 0° Ta=25°C IFP=30mA 10° 20° 30° 40° 50° 60° 0.5 70° 80° 0 90° 60° 30° Radiation Angle NICHIA CORPORATION 0.5 90° 1.0 NSPGR70AS Title CHARACTERISTICS No. 051005544981 Nichia STSE-CG5125A <Cat.No.051019> Model 0° Internal Circuit 3 2 3 A 7.5 ± 0.5 4.4 2 0.5 K 4 1 (C 1.25) 1 Pin Mark R 0.69 0.76 ± 0.1 1 1.55 K 4 5.08 7.62 ± 0.5 A 7.62 ± 0.5 φ3 (5°) 1.4MAX. 0.4 ± 0.1 0.4 2.5 ± 0.5 -10- 0.4 1.1 Stopper 0.5 5.08 ± 0.3 ITEM LEAD FRAME Remark: Please note that the bare copper alloy showing at the cut end of the lead frame may be corroded under certain conditions. LEDs have some sharp edges and points, particularly lead frames. Please handle with care so as to avoid injuries. Model NICHIA CORPORATION Title No. NSPGR70AS OUTLINE DIMENSIONS 051005544991 Unit mm 5/1 Scale Allow ±0.2 Nichia STSE-CG5125A <Cat.No.051019> RESIN MATERIALS Epoxy Resin (over Silicone Resin + Diffused) Ag Plating Copper Alloy Cross Sectional image of stick 5.85 9 11.8 5.4 ½1 t = 0.6 ± 0.1mm ½2 Warp : 1mm Max. 3 9.6 -11- Whole image of stick 485 ± 1 Cap NICHIA >PC< CAUTION TO ELECTROSTATIC DAMAGE 静電気に注意 A 60pcs / stick K NICHIA CORPORATION NSPxR70xSS Title STICK DIMENSIONS No. 050725436072 Unit mm Scale Allow ±0.2 Nichia STSE-CG5125A <Cat.No.051019> Model Nichia STSE-CG5125A <Cat.No.051019> The stick and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Moisture absorbent material Moisture proof foil bag Stick Label NICHIA XXXX LED TYPE LOT QTY Seel NSPxR70xSS xxxxxx-U PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Label NICHIA XXXX LED TYPE RANK QTY NSPxR70xSS U PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Empty space in the box is filled with cushion material. Packing unit Moisture proof foil bag Cardboard box Cardboard box M Cardboard box 1/2L Cardboard box L Stick/bag 10 stick Max. Quantity/bag (pcs) 600 MAX. Dimensions (mm) 590¯277¯120¯4t 613¯298¯268¯7t 613¯298¯518¯7t Stick/box 100 stick MAX. 200 stick MAX. 400 stick MAX. Model NICHIA CORPORATION -12- Quantity/box (pcs) 6,000 MAX. 12,000 MAX. 24,000 MAX. NSPxR70xSS Title PACKING No. 050725436082