No. STSE-CC5127A <Cat.No.051017> SPECIFICATIONS FOR NICHIA CHIP TYPE RED LED MODEL : NSSR100BT NICHIA CORPORATION -0- Nichia STSE-CC5127A <Cat.No.051017> 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature Symbol IF IFP VR PD Topr Tstg Tsld Absolute Maximum Rating 40 160 5 96 -30 ~ + 85 -40 ~ +100 Reflow Soldering : 260°C Hand Soldering : 350°C (Ta=25°C) Unit mA mA V mW °C °C for 10sec. for 3sec. IFP Conditions : Pulse Width < = 10msec. and Duty < = 1/10 (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Luminous Intensity Iv x Chromaticity Coordinate y - Condition IF=20[mA] VR= 5[V] IF=20[mA] IF=20[mA] IF=20[mA] Typ. (1.9) (180) 0.691 0.308 (Ta=25°C) Max. Unit 2.4 V 50 µA mcd - Min. 232 160 116 (Ta=25°C) Max. Unit 320 mcd 232 mcd 160 mcd Please refer to CIE 1931 chromaticity diagram. (3) Ranking Item Luminous Intensity Rank T Rank S Rank R Symbol Iv Iv Iv Condition IF=20[mA] IF=20[mA] IF=20[mA] Luminous Intensity Measurement allowance is ± 10%. Color Rank x y 0.67 0.27 (IF=20mA,Ta=25°C) Rank R 0.67 0.73 0.73 0.33 0.33 0.27 Color Coordinates Measurement allowance is ± 0.01. One delivery will include up to one color rank and three luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia. 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure’s page. -1- Nichia STSE-CC5127A <Cat.No.051017> 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure’s page. Material as follows ; Package : Encapsulating Resin : Electrodes : Ceramics Silicone Resin Au Plating 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. Please refer to figure’s page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; -U - Year ( 4 for 2004, 5 for 2005 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number U - Ranking by Color Coordinates - Ranking by Luminous Intensity -2- B for Nov. ) Nichia STSE-CC5127A <Cat.No.051017> 6.RELIABILITY (1) TEST ITEMS AND RESULTS Note 2 times Number of Damaged 0/100 0°C ~ 100°C 15sec. 15sec. -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle Ta=100°C 20 cycles 0/100 20 cycles 0/100 10 cycles 0/100 1000 hrs. 0/100 Ta=60°C, RH=90% 1000 hrs. 0/100 Ta=-40°C 1000 hrs. 0/100 Steady State Operating Life Ta=25°C, IF=40mA 1000 hrs. 0/100 Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature 60°C, RH=90%, IF=20mA 500 hrs. 0/100 Ta=-30°C, IF=20mA 1000 hrs. 0/100 Test Item Resistance to Soldering Heat (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) (2) CRITERIA FOR JUDGING DAMAGE Item Symbol Forward Voltage VF Reverse Current IR Luminous Intensity IV *) U.S.L. : Upper Standard Level Test Conditions Criteria for Judgement Min. Max. IF=20mA U.S.L.*) VR=5V U.S.L.*) IF=20mA L.S.L.**) 0.7 **) L.S.L. : Lower Standard Level -3- 1.1 2.0 Nichia STSE-CC5127A <Cat.No.051017> 7.CAUTIONS (1) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 ± 5°C · Nichia LED electrodes are gold plated. The gold surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · The operating current should be decided after considering the ambient maximum temperature of LED. -4- Nichia STSE-CC5127A <Cat.No.051017> (4) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200°C 120 ~ 150°C 120 sec. Max. 120 sec. Max. 240°C Max. 260°C Max. Hand Soldering Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) 10 sec. Max. 10 sec. Max. refer to refer to Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) After reflow soldering rapid cooling should be avoided. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. <1 : Lead Solder> <2 : Lead-free Solder> 2.5 ~ 5°C / sec. 2.5 ~ 5°C / sec. Pre-heating 120 ~ 150°C 60sec.Max. Above 200°C 1~ 5°C / sec. 240°C Max. 10sec. Max. 1~ 5°C / sec. Pre-heating 180 ~ 200°C 60sec.Max. Above 220°C 260°C Max. 10sec. Max. 120sec.Max. 120sec.Max. [Recommended soldering pad design] Use the following conditions shown in the figure. 2.2 1.5 4.4 (Unit : mm) · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. · The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. (5) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. -5- Nichia STSE-CC5127A <Cat.No.051017> (6) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. (7) Others · Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. · The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -6- Nichia STSE-CC5127A <Cat.No.051017> ICI Chromaticity Diagram 0.9 520 530 0.8 540 510 550 0.7 560 0.6 570 500 0.5 y 580 590 0.4 600 610 0.3 R 490 620 630 0.2 480 0.1 470 460 0 0 0.1 0.2 0.3 0.4 x ½ Color Coordinates Measurement allowance is ± 0.01. -7- 0.5 0.6 0.7 0.8 50 20 10 5 5.0 4.0 3.0 2.0 1.0 0 0 20 40 60 80 100 120 Forward Current IFP (mA) Ambient Temperature vs. Forward Voltage Ambient Temperature vs. Relative Luminosity 2.8 2.0 2.6 2.4 IFP=60mA IFP=20mA IFP=5mA 2.2 2.0 1.8 1.6 1.4 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Relative Luminosity (a.u.) -8- Forward Voltage VF (V) 1 1.4 1.6 1.8 2.0 2.2 2.4 2.6 Forward Voltage VF (V) Ta=25°C 6.0 IFP=20mA 1.0 0.5 0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Allowable Forward Current IFP (mA) Relative Luminosity (a.u.) Forward Current IFP (mA) Ta=25°C 300 200 160 Ta=25°C 100 50 40 20 10 1 5 10 20 50 100 Duty Ratio (%) Ambient Temperature vs. Allowable Forward Current Allowable Forward Current IF (mA) 7.0 200 100 Duty Ratio vs. Allowable Forward Current Forward Current vs. Relative Luminosity Forward Voltage vs. Forward Current 50 40 30 20 10 0 0 20 40 60 80 100 Ambient Temperature Ta (°C) NICHIA CORPORATION NSSR100B Title CHARACTERISTICS No. 050928545601 Nichia STSE-CC5127A <Cat.No.051017> Model Ambient Temperature vs. Chromaticity Coordinate (λD) y 0.32 0.31 -30°C(616nm) 0°C(618nm) 25°C(620nm) 50°C(622nm) 0.30 85°C(624nm) 0.29 0.67 0.68 0.69 0.70 0.71 0.72 626 624 IFP=20mA 622 620 618 616 614 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Ta=25°C IF=20mA 1.0 0.8 0.6 0.4 0.2 0 450 500 550 600 650 700 750 Wavelength λ (nm) Forward Current vs. Dominant Wavelength Dominant Wavelength λ D (nm) -9- Dominant Wavelength λ D (nm) x Ambient Temperature vs. Dominant Wavelength 1.2 Directivity Ta=25°C 624 622 620 618 616 614 0° 1.0 626 Relative Luminosity (a.u.) IFP=20mA 0.33 Relative Emission Intensity (a.u.) 0.34 Spectrum 1 5 10 20 50 100 Forward Current IFP (mA) 10° 20° Y 30° X X 40° Y 50° 60° 0.5 Ta=25°C IFP=20mA X-X Y-Y 0 90° 60° 30° Radiation Angle NICHIA CORPORATION 80° 0° 0.5 90° 1.0 NSSR100B Title CHARACTERISTICS No. 050928545611 Nichia STSE-CC5127A <Cat.No.051017> Model 70° 2+0.3 - 0.2 1.2 ± 0.15 1.7 1.3 Anode 1.6 2 3 A LED chip Cathode mark K Cathode 0.5 -10- ITEM MATERIALS PACKAGE ENCAPSULATING RESIN ELECTRODES Ceramics NICHIA CORPORATION Title No. Au Plating NSSR100B OUTLINE DIMENSIONS 050928545621 Unit mm 10/1 Scale Allow ±0.2 Nichia STSE-CC5127A <Cat.No.051017> Model Silicone Resin φ 1.5+0.1 -0 4±0.1 2±0.05 11.4±1 φ 180+0 -3 Reel part 1.75±0.1 Taping part 9±0.3 0.2±0.05 3.5±0.2 4±0.1 φ 1+0.25 -0 1 ±0.8 φ 60+1 -0 φ2 8±0.2 3.5±0.05 Cathode mark ±0.2 φ 13 2 MAX. Label XXXX LED 2.5 TYPE NSSx100BT LOT XXXXXX-U QTY pcs ±0.2 Reel End of tape No LEDs LEDs mounting part No LEDs -11Top cover tape Pull direction Embossed carrier tape Reel Lead Min.160mm (No LEDs is more than 40) Reel Lead Min.40mm (No LEDs) Reel Lead Min.400mm Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. Model NICHIA CORPORATION Title No. NSSx100BT TAPING DIMENSIONS 050311537871 Unit mm Scale Allow Nichia STSE-CC5127A <Cat.No.051017> 2,500pcs/Reel Nichia STSE-CC5127A <Cat.No.051017> The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label NICHIA Seal XXXX LED TYPE LOT QTY NSSx100xT xxxxxx-U PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture proof foil bag Moisture absorbent material The box is partitioned with the cardboard. Label NICHIA Nichia LED XXXX LED TYPE RANK QTY NSSx100xT U PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 2,500 MAX. Dimensions (mm) 291¯237¯120¯8t 259¯247¯243¯5t 444¯262¯259¯8t NICHIA CORPORATION -12- Reel/box 7reel MAX. 15reel MAX. 30reel MAX. Quantity/box (pcs) 17,500 MAX. 37,500 MAX. 75,000 MAX. Model NSSx100xT Title PACKING No. 050602541181