THYRISTOR MODULE PHT2508 250A / 800V OUTLINE DRAWING FEATURES * Isolated Base * Single Thyristor Module * High Surge Capability * UL Recognized, File No. E187184 TYPICAL APPLICATIONS * Rectified For General Use Maximum Ratings Parameter Repetitive Peak Off-State Voltage Non Repetitive Peak Off-State Voltage Repetitive Peak Reverse Voltage Non Repetitive Peak Reverse Voltage Approx Net Weight:250g Symbol IO(AV) RMS On-State Current IT(RMS) I Squared t 800 900 800 900 Conditions Average Rectified Output Current ITSM I2t Critical Rate of Turned-On Current di/dt Peak Gate Power Average Gate Power Peak Gate Current Peak Gate Voltage Peak Gate Reverse Voltage Operating JunctionTemperature Range Storage Temperature Range Isoration Voltage Case mounting Mounting torque Terminals PGM PG(AV) IGM VGM VRGM Tjw Tstg Viso Ftor Unit PHT2508 VDRM VDSM VRRM VRSM Parameter Surge On-State Current Grade 50Hz Half Sine Wave condition Tc=65°C 50 Hz Half Sine Wave, 1Pulse Non-Repetitive 2msec to 10msec VD=2/3VDRM, ITM=2 IO, Tj=125°C IG=300mA, diG/dt=0.2A/µs • V V Max Rated Value Unit 250 A 390 A 4000 A 80000 A2s 100 A/µs 5 W 1 W 2 A 10 V 5 V -40 to +125 °C -40 to +125 °C Base Plate to Terminals, AC1min 2000 V M5 Screw 2.4 to 2.8 N•m M5 Screw 2.4 to 2.8 Electrical • Thermal Characteristics Symbol Test Conditions Peak Off-State Current Peak Reverse Current Peak Forward Voltage IDM IRM VTM Gate Current to Trigger IGT Gate Voltage to Trigger VGT Gate Non-Trigger Voltage Critical Rate of Rise of Off-State Voltage VGD VDM= VDRM, Tj= 125°C VRM= VRRM, Tj= 125°C ITM= 800A, Tj=25°C Tj=-40°C VD=6V,IT=1A Tj=25°C Tj=125°C Tj=-40°C VD=6V,IT=1A Tj=25°C Tj=125°C VD=2/3VDRM Tj=125°C Maximum Value. Min. Typ. Max. 80 80 1.38 300 150 80 5 3 2 0.25 dv/dt VD=2/3VDRM Tj=125°C 500 tq ITM=IO,VD=2/3VDRM dv/dt=20V/µs, VR=100V -di/dt=20A/µs, Tj=125°C Characteristics Turn-Off Time Turn-On Time Delay Time Rise Time Latching Current Holding Current Thermal Resistance tgt td tr IL IH Rth(j-c) VD=2/3VDRM Tj=125°C IG=300mA, diG/dt=0.2A/µs Tj=25°C Tj=25°C Junction to Case Base Plate to Heat Sink Rth(c-f) with Thermal Compound Unit mA mA V mA V V V/µs 200 µs 6 2 4 150 100 µs µs µs mA 0.18 0.1 °C/W PHT2508 OUTLINE DRAWING (Dimensions in mm)