SM8150A PMIC with White LED Driver 1. OVERVIEW The SM8150A is a charge pump type white LED driver, with 2-system programmable LDOs (Low Dropout Regulator), and step-down DC/DC converter power management IC. The white LED driver provides constantcurrent drive for 1 to 6 backlight white LED connected in parallel and 1 torch/strobe white LED. The charge pump automatically selects between ×1 mode, ×1.5 boost mode, and ×2 boost mode in response to battery voltage, LED drive current, and VFLED (LED forward bias voltage drop) conditions in order to extend battery drive life. The SM8150A operating mode settings are accessed using an I2C*1 interface, allowing LED drive current, LDO voltage, output ON/OFF, and other settings to be controlled from a microcontroller. *1. I2C-BUS is a registered trademark of NXP B. V. 2. FEATURES ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Optimum specifications for clamshell cellular phone with camera • LCD backlight: Main-4ch/Sub-2ch (max 25mA/ch) • Camera flash: 1ch (max 300mA) Power saving design by automatic mode selection of charge pump • Power at ×1.5 mode is reduced by 25% from ×2 mode • Power at ×1 mode is reduced by 50% from ×2 mode, 33% from ×1.5 mode I2C interface best match for cellular phone chipset Selecting current value (torch/strobe) of flash LED by SBN pin Shutdown synchronized to microcontroller supply by VEN pin 1 system of step-down DC/DC converter built-in • Output: 1.2 to 3.0V@ max 500mA 2 systems of programmable LDO built-in • Output: 1.5/1.8/2.5/2.6/2.8/3.0/3.1/3.3V@ max 300mA Various protection circuits built-in • Startup soft start circuit built-in • Overtemperature thermal shutdown (TSD) circuit built-in • Supply undervoltage lockout (UVLO) circuit built-in Supply voltage range (VIN1 to VIN3): 2.7 to 4.6V Logic operating voltage range (VEN) : 1.8 to 4.6V White LED Driver • Charge-pump frequency: 1.0MHz (typ) • Charge-pump maximum output current: 450mA • Backlight LED current: 25 ± 1.5mA/ch (max) • Backlight LED relative accuracy: ± 3% • Flash LED current: 300 ± 20mA (max) DC/DC converter • DC/DC converter output voltage: 1.2 to 3.0V (typ) • DC/DC converter output current: 500mA (max) • DC/DC converter operating frequency: 2.0MHz (typ) • DC/DC converter voltage accuracy: ± 2% LDO • LDO output voltage: 1.5 to 3.3V (VIN = 3.6V) • LDO output current: 300mA (max) • LDO dropout voltage: 0.1V (typ) • LDO voltage accuracy: ± 2% Package: 28-pin QFN 3. TYPICAL APPLICATION CIRCUIT 1µF 1µF 3.6V C1P C1M C2P C2M VIN1 2.2µF VOUT 4.7µF PGND1 VIN2 DIN1 2.2µF PGND2 DIN2 VIN3 DIN3 2.2µF DIN4 DIN5 DIN6 SM8150A Logic supply VEN DIN7 0.1µF I2 C LDOUT1 SCL LDO1 output 2.2µF SDA LDOUT2 LDO2 output 2.2µF Strobe SBN ON/OFF 100kΩ FB 8pF 200kΩ LX VREF 0.1µF 2.2µH GND1 2.2µF GND2 DCOUT (1.8V) 4. APPLICATIONS ■ ■ Cellular phone Mobile equipment 5. ORDERING INFORMATION Device Package SM8150AB 28-pin QFN SEIKO NPC CORPORATION —1 SM8150A 6. PINOUT LDOUT1 VIN3 LDOUT2 FB PGND2 LX VIN2 (Top view) VREF GND2 DIN7 DIN6 DIN5 GND1 DIN4 21 22 15 14 28 8 7 DIN3 DIN2 DIN1 VOUT C1P C2P C2M 1 SDA SCL SBN VEN VIN1 C1M PGND1 7. PIN DESCRIPTION Number Name I/O 1 DIN3 O LED drive current control output 3 (group A)*1 Description 2 DIN2 O LED drive current control output 2 (group A)*1 3 DIN1 O LED drive current control output 1 (group A)*1 4 VOUT O LED drive voltage output 5 C1P – Charge pump boost capacitor connection 6 C2P – Charge pump boost capacitor connection 7 C2M – Charge pump boost capacitor connection 8 PGND1 – Ground (charge pump) 9 C1M – Charge pump boost capacitor connection 10 VIN1 – Supply input (charge pump) 11 VEN – Supply input (logic)*2 12 SBN I Torch/strobe selecting voltage input (strobe when LOW)*3 13 SCL I I2C interface clock input*3 14 SDA I/O I2C interface data input*3 15 VIN2 – Supply input (DC/DC converter) 16 LX O DC/DC converter coil switching output*4 17 PGND2 – Ground (DC/DC converter) 18 FB I DC/DC converter feedback input 19 LDOUT2 O LDO output 2*4 20 VIN3 – Supply input (logic and LDOs) 21 LDOUT1 O LDO output 1*4 22 VREF O Bypass capacitor connection 23 GND2 – Ground 24 DIN7 O LED drive current control output 7 (high-current LED)*1 25 DIN6 O LED drive current control output 6 (group B)*1 26 DIN5 O LED drive current control output 5 (group B)*1 27 GND1 – Ground 28 DIN4 O LED drive current control output 4 (group A)*1 *1. Connect to ground when no LED is connected. *2. Connect to a supply with ≥ 1.8mA drive current capability. If pull-up resistors Rup are connected to SCL, SDA, and SBN, the current consumption increases by the amount flowing through the pull-up resistances only. The current component for each of the 3 pins is given by Iup [mA] = VEN [V] / Rup [kΩ]. *3. Pull-up or pull-down resistances are not built-in. *4. Leave open circuit when not used (do not connect to ground). SEIKO NPC CORPORATION —2 SM8150A 8. BLOCK DIAGRAM VIN1 C1M C1P VIN3 C2M C2P VIN2 VOUT Charge pump 1/ 1.5/ 2 DIN1 GND2 I2 C interface & Control logic VREF Thermal shutdown UVLO SDA SBN GND1 VREF DIN3 DIN4 DIN5 DIN6 Torch/ Strobe SCL OSC Group A VEN Group B Current control & Current detect DIN2 Synchronous step-down DC/DC converter DIN7 LX FB Programmable LDO LDOUT1 Programmable LDO LDOUT2 PGND1 DCOUT PGND2 SEIKO NPC CORPORATION —3 SM8150A 9. ABSOLUTE MAXIMUM RATINGS GND = PGND = 0V Parameter Pins Symbol Rating Unit VIN1 to 3 VIN −0.3 to 5.5 V VEN VEN −0.3 to 5.5 V SBN, SCL, SDA VDATA –0.3 to VEN + 0.3 V All other input pins VINPUT –0.3 to VIN + 0.3 V SDA VOUT_ACK –0.3 to VEN + 0.3 V VOUT VOUT_CP 5.5 V All other output pins VOUTPUT –0.3 to VIN + 0.3 V VOUT IOUT_CP 600 mA LX IOUT_LX 1.2 A LDOUT1 to 2 IOUT_LDO 1 A Supply voltage Logic operating voltage Input voltage Output voltage Output current Power dissipation = 90°C /W)*1 W TJMAX +125 °C TSTG −55 to +125 °C 1.1 (θJ PD − Junction temperature Storage temperature *1. When the SM8150A is mounted on a 40 × 60 × 1.6mm 2-layer board whose wiring pattern ratio is 130%. Note. The device may suffer breakdown if any one of these parameter ratings is exceeded. The thermal resistance θJ required for the operating environment is determined by the relationship with power dissipation and operating temperature given below. ■ Maximum junction temperature: TJMAX = 125 [°C] Operating temperature: Ta [°C] Thermal resistance: θJ [°C/W] PD = (TJMAX − Ta) θJ 2 1.5 PD [W] ■ ■ θJ = 90°C/W 1 0.5 0 0 25 50 75 85 Ta [°C] SM8150A power dissipation SEIKO NPC CORPORATION —4 SM8150A 10. RECOMMENDED OPERATING CONDITIONS VIN1 = VIN2 = VIN3, GND = PGND = 0V Rating Parameter Pin Supply voltage*1 Symbol VIN1 to 3 Logic operating voltage Input voltage Conditions Unit min typ max VIN_×1 ×1 mode, IOUT = 0mA 2.7 3.6 4.6 V VIN_×1.5 ×1.5 mode, IOUT = 150mA 3.0 3.6 4.6 V VIN_×2 ×2 mode, IOUT = 450mA 3.3 3.6 4.6 V VEN VEN 1.8 2.8 4.6 V SBN, SCL, SDA VDATA 0 − VEN V Strobe time*2 DIN7 Torch LED current*2 tSTROBE ILED7 ≥ 150mA − − 250 ms ILED7 tTORCH > 250ms − − 150 mA −30 25 +85 °C − Operating temperature Ta *1. Supply voltage and IOUT (LED) When the white LED drive current is increased, the required supply voltage also increases. The supply is automatically switched in charge pump boost mode, and cannot be manually selected. The forward-bias voltage drop VF of the LED is assumed to be ≤ 3.5V. 500 IOUT (LED) [mA] 400 300 200 100 0 2.5 3 3.5 4 4.5 5 VIN [V] IOUT (LED) vs. VIN *2. Torch and Strobe Pin DIN7 is provided for connection to a high-current white LED. Two types of light modulation (dimming) data are available, switched by the SBN input voltage. When SBN is HIGH, torch mode is selected. When SBN is LOW, strobe mode is selected. The recommended operating condition is high current with short ON times in strobe mode, and low current with longer ON times in torch mode. In strobe mode (SBN = LOW), high-current supply is the main priority and, therefore, the current consumption is not optimized (see “Torch/Strobe Selecting”). I2C data settings DIN7 − Enable 1 DIN7 − Disable 1 1 1 1 1 * * * * 1 0 * * SBN Torch Strobe Dimming Recommended operating conditions H ON OFF Torch ILED7 < 150mA L OFF ON Strobe Operating time < 250ms H OFF OFF − − L OFF OFF − − * * SEIKO NPC CORPORATION —5 SM8150A 11. ELECTRICAL CHARACTERISTICS 11-1. Common Blocks VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25°C unless otherwise noted. Rating Parameter Pin Standby current 1 VIN Standby current 2 Current consumption*1 Symbol Condition VIN UVLO operating voltage – TSD hysteresis H-level input voltage 1 max VEN = 0V, input/outputs no load – 0.01 1 µA ISTB2 VEN ≥ 1.8V, input/outputs no load – 0.1 1 µA IEN1 SCL = SDA = SBN = VEN – 0.1 1 µA IEN2 SBN = VEN = 2.8V SCL, SDA: f = 400kHz tr = tf = 300ns signal amplitude = VEN × 90% – 0.1 0.5 mA IEN3 SBN = VEN = 4.6V SCL, SDA: f = 400kHz tr = tf = 300ns signal amplitude = VEN × 90% – 0.6 1.8 mA tPOR Design value – – 1 ms VUVLO TSD operating temperature typ ISTB1 VEN Power-ON reset time*2 Unit min 2.0 2.45 2.65 V TSD VIN falling Design value – 170 – °C TSDHYS Design value – 20 – °C VIH1 VEN ≥ 2.3V 1.8 – – V VIL1 VEN ≥ 2.3V – – 0.6 V VIH2 VEN < 2.3V 1.5 – – V VIL2 VEN < 2.3V – – 0.3 V H-level input current IIH VIH = VEN – – 1.0 µA L-level input current IIL VIL = GND –1.0 – – µA L-level input voltage 1 H-level input voltage 2 L-level input voltage 2 SBN, SCL, SDA *1. Excluding the current that flows to external circuit such as pull-up resistors. IEN A Rup Rup VEN 0.1µF Rup SCL SDA SBN *2. The time between when power is applied and the device enters standby mode. Reference Data Standby current 2 [µA] 0.5 0.4 0.3 0.2 0.1 0 2.7 3 3.3 3.6 3.9 4.2 4.5 VIN [V] Standby current (VEN = 1.8V) SEIKO NPC CORPORATION —6 SM8150A 11-2. White LED Driver VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25°C unless otherwise noted. Rating Parameter Pin Current consumption*1 Symbol VIN Output voltage*2 VOUT Output current Charge pump frequency C1M Soft start time*3 DIN1 to 7 LED drive pin leakage current LED current (max) 1 DIN1 to 6 LED current relative accuracy LED current (max) 2 DIN7 Condition Unit min typ max IDRV_×1 ×1 mode, no load – 0.3 1 mA IDRV_×1.5 ×1.5 mode, no load – 4 8 mA IDRV_×2 ×2 mode, no load – 5 10 mA VOUT_CP Boost ON, no load 4.6 4.9 5.2 V IOUT_CP Boost ON – – 450 mA fOSC 0.85 1.0 1.15 MHz tSS – 1 3 ms ILEAK1 to 7 Standby mode, DIN1 to 7 = VIN – 0.01 1.0 µA ILED1 to 6 ×1 mode, ILED1 to 6 max setting 23.5 25.0 26.5 mA ∆ILED ×1 mode, ILED1 to 6 max setting –3.0 – +3.0 % ILED7 ×2 mode, ILED7 max setting 280 300 320 mA *1. LDOUT1 to 2 and the DC/DC converter is disabled. *2. Over voltage protection threshold. *3. The time from when one of the DIN1 to 7 outputs is enabled until the LED turns ON. Charge Pump Operating Mode Switching The SM8150A switches between 3 charge pump operating modes; ×1 mode (VIN through mode), ×1.5 mode (×1.5 charge pump boost), and ×2 mode (×2 charge pump boost), reducing the total power dissipation. These selecting occurs automatically in internal circuits, and cannot be controlled by external signals. If the LED current drops below the setting value while operating in ×1 or ×1.5 mode, each LED drive circuit detects the undercurrent and the operating mode is automatically selected ×1 → ×1.5, ×1.5 → ×2. This occurs even if only one LED undercurrent condition is detected among the 7-channel LED drive circuits, thus it is recommended that LED has small VF variation to optimize the total efficiency. In ×1.5 or ×2 mode operating, the SM8150A generates "a mode reset signal" internally once every 1 second. This signal forces to select the mode ×1.5 → ×1, ×2 → ×1.5. Reference Data 7 100 5 80 ×2 Efficiency [%] IDRV [mA] 6 4 3 ×1.5 2 ×1 1 0 2.7 3 3.3 3.6 3.9 4.2 VIN [V] Current consumption (No load) 60 40 20 4.5 0 3.0 3.3 3.6 3.9 4.2 4.5 VIN [V] Efficiency (DIN1 to 6: 25mA, DIN7: 155mA) SEIKO NPC CORPORATION —7 SM8150A 11-3. I2C Interface VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25°C unless otherwise noted. Rating Parameter Pin SCL clock frequency Symbol SCL SCL hold time Condition Unit fSCL SCL, SDA SCL L-level pulsewidth I2C start condition tHD;STA tLOW SCL SCL H-level pulsewidth tHIGH I2C start condition min typ max − − 400 kHz 0.6 − − µs 1.3 − − µs 0.6 − − µs 0.6 − − µs SCL setup time tSU;STA SDA data hold time tHD;DAT 0.05 − 0.9 µs SDA data setup time tSU;DAT 100 − − ns tr − − 300 ns − − 300 ns 0.6 − − µs Rise time SCL, SDA Fall time tf SCL setup time I2C stop condition tSU;STO Bus free time tBUF 1.3 − − µs Capacitive load for each bus line Cb − − 400 pF SDA tf tLOW tBUF tr tr tSU;DAT tf tHD;STA SCL tHD;DAT tHD;STA tHIGH tSU;STA S tSU;STO Sr P Note. S: START condition, Sr: repeated START condition, P: STOP condition After a START condition, the slave address should be sent, and a data transfer should be terminated by a STOP condition. 1st byte: Slave address Start 2nd byte: Control data SDA Nth byte: Control data ACK M3 M2 D2 D1 9 1 2 7 8 ACK Stop M3 M2 D2 D1 ACK 1 2 7 8 9 SCL 1 2 7 8 9 SEIKO NPC CORPORATION —8 SM8150A 11-4. DC/DC Converter VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25°C unless otherwise noted. Rating Parameter Pin Symbol Condition Unit min typ max Current consumption*1 VIN IDD No load, switching stopped – 0.5 1.2 mA Soft start time*2 LX tSS DCOUT = 1.8V – 1 – ms DCOUT VDCO 1.2 – 3.0 V FB VFB 0.588 0.6 0.612 V DCOUT IDCO – – 500 mA fOSC 1.7 2.0 2.3 MHz Output voltage range*3 FB pin voltage LX pin output current Switching frequency Supply-side switch ON resistance LX GND-side switch ON resistance LX pin leakage current Line regulation DCOUT Load regulation Overcurrent protection circuit operating current LX IDCO = 1mA RONP ILX = 50mA – 0.5 1.0 Ω RONN ILX = 50mA – 0.4 0.8 Ω –1.0 – 1.0 µA ILEAKLX Standby mode, LX = 1/2VIN ∆VOUT1 2.7 ≤ VIN ≤ 4.6V, IDCO = 1mA – 10 – mV ∆VOUT2 1mA ≤ IDCO ≤ 300mA – 60 – mV ILIMITLX Supply-side switch 0.8 1.2 1.7 A *1. DIN1 to 7 and LDOUT1 to 2 outputs are disabled. *2. The time from when the DC/DC converter is enabled until the output is stabilized. *3. The DCOUT output voltage is determined by the external resistors R1 and R2, as given by the following equation. The SM8150A DC/DC converter controls the output such that the FB pin voltage remains at 0.6V. The DCOUT voltage is given for values of R1 and R2 in the table on the right, where R1 is a fixed 200kΩ resistance. DCOUT = Example 0.6 × (R1 + R2) R2 FB SM8150 8pF DCOUT DCOUT [V] R1 [kΩ] R2 [kΩ] 1.200 200 200 1.502 200 133 1.800 200 100 2.505 200 63 2.600 200 60 2.802 200 54.5 3.000 200 50 LX 2.2µH 2.2µF R1 0.6V R2 SEIKO NPC CORPORATION —9 SM8150A 100 1 80 0.8 IDD [mA] Efficiency [%] Reference Data 60 40 0.6 0.4 0.2 20 0 2.7 0 1 10 100 1000 3 3.3 IDCO [mA] Efficiency − Load current 1.90 1.85 IDCO = 300mA VDCO [V] VDCO [V] 1.85 1.80 1.70 2.7 3.9 4.2 4.5 Current consumption (No load, switching stopped) 1.90 1.75 3.6 VIN [V] 1.80 1.75 IDCO = 1mA 1.70 3.0 3.3 3.6 3.9 4.2 VIN [V] 4.5 0 100 200 300 400 500 IDCO [mA] Line regulation Load regulation IDCO = 300mA IDCO = 500mA SEIKO NPC CORPORATION —10 SM8150A 11-5. LDO VIN =3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25°C unless otherwise noted. Rating Parameter Pin Symbol Current consumption*1 Condition Unit min typ max IDD_LDO No load – 0.35 0.8 mA GND pin current IGND_LDO ILDO = 50mA, IGND_LDO = IDD_LDO − ILDO – 0.35 1.2 mA Soft start time*2 tSS_LDO ILDO = 1mA – 1 – ms Output voltage VLDO Output current ILDO VIN Dropout voltage VDROP LDOUT1 to 2 ∆VOUT1 Line Regulation ∆VOUT2 Load Regulation Overcurrent protection circuit operating current ILDO = 1mA, VLDO ≤ VIN – 0.3V See “Output voltage table”. – – 300 mA ILDO = 100mA – 0.1 0.2 V ILDO = 200mA – 0.2 0.4 V ILDO = 300mA – 0.3 0.6 V 3.6V ≤ VIN ≤ 4.6V, VLDO (setting) = 3V, ILDO = 30mA – 20 60 mV VLDO (setting) = 3V, 5mA ≤ ILDO ≤ 100mA – 10 30 mV VLDO (setting) = 3V, 5mA ≤ ILDO ≤ 200mA – 20 60 mV 350 650 950 mA VIN = 3V, VLDO (setting) = 3.3V IOS *1. DIN1 to 7 and the DC/DC converter is disabled. *2. The time taken from when either of LDOUT1 to 2 is enabled until the output is stabilized. Output voltage table Setting min typ max unit 1.5 1.470 1.5 1.530 V 1.8 1.764 1.8 1.836 V 2.5 2.450 2.5 2.550 V 2.6 2.548 2.6 2.652 V 2.8 2.744 2.8 2.856 V 3.0 2.940 3.0 3.060 V 3.1 3.038 3.1 3.162 V 3.3 3.234 3.3 3.366 V SEIKO NPC CORPORATION —11 SM8150A Reference Data 0 -10 PSRR [dB] Output noise [µV/ √ Hz] 10.00 1.00 0.10 -20 -30 -40 -50 -60 0.01 10 100 1000 10000 10 100000 100 1000 Output noise VIN3: 2.2µF VREF: 0.1µF LDOUT: 2.2µF Ripple rejection VIN = 3.6V VLDO = 1.8V ILDO = 10mA VIN3: 0µF, 500mVp-p VREF: 0.1µF LDOUT: 2.2µF Step response 1 ∆VLDO [mV] ∆VLDO [mV] VLDO = 2.8V -10 -20 VLDO = 1.8V -30 -40 0 50 VIN = 3.6V VLDO = 1.8V ILDO = 10mA Step response 2 10 0 10000 100000 1000000 f [Hz] f [Hz] 100 150 200 250 300 15 10 5 0 -5 -10 -15 -20 -25 -30 -35 2.7 ILDO [mA] VLDO = 1.8V VLDO = 2.8V 3 3.3 3.6 3.9 4.2 4.5 VIN [V] Load regulation Line regulation 0 1 IGND_LDO [mA] ∆VLDO [mV] -50 -100 -150 -200 -250 -300 -350 0 100 200 300 ILDO [mA] Dropout voltage (VLDO = 2.8V) 0.8 0.6 0.4 0.2 0 0 100 200 ILDO [mA] 300 GND pin current (VLDO = 1.8V) SEIKO NPC CORPORATION —12 SM8150A 12. FUNCTIONAL DESCRIPTION 12-1. Startup Method The SM8150A enters standby mode when the VIN supply is applied. After the VEN supply is applied, standby mode is released and operation commences when any one of the DIN1 to 4, DIN5 to 6, DIN7, LDOUT1, LDOUT2 outputs or the DC/DC converter is enabled. 12-2. Standby Mode In standby mode, all SM8150A circuit operation stops, reducing the current consumption. After the VIN supply is applied, the built-in power-ON reset circuit initializes the registers to their default values (see table 1) and the device enters standby mode. Also, when the VEN supply is turned OFF (0V), the registers are initialized to their default values and the device enters standby mode. However, when all the outputs are disabled (enable settings 1 and 2), the register values are stored and the device enters standby mode. 12-3. I2C Interface The individual SM8150A settings are set using an I2C interface. The SM8150A has a fixed 8-bit address (slave address) and the device must be addressed before inputting each data setting. The set data has an MSB first 8bit data structure. The first 3 bits select the register, and the next 5 bits are the write data. Each register is writeonly, and cannot be read. Transfer speed is in fast mode (400kbit/s). 12-3-1. Basic cycle SDA SCL Start condition Stop condition I2C start/stop condition Steps (1) to (4) represent the basic data input cycle. (1) Start condition (2) 1st byte (slave address input) (3) 2nd byte to nth byte (settings data input) (4) Stop condition Data transfer begins with the start condition, which is when the SDA input voltage changes from HIGH to LOW while the SCL input voltage is HIGH. Similarly, data transfer ends with the stop condition, which is when the SDA input voltage changes from LOW to HIGH while the SCL input voltage is HIGH. Immediately after each byte (8 bits) in steps (2) and (3), 1 clock cycle is used as an ACK (Acknowledge) cycle. The SM8150A acknowledges that it has recognized the slave address in the first byte by taking the SDA line LOWlevel output while the ACK clock cycle is HIGH. No signal is output if the slave address is not recognized. The second to nth bytes are always acknowledged by a LOW-level output bit, regardless of the received data content. The second and successive bytes are received and the corresponding setting is updated until the stop condition is input to the device. SEIKO NPC CORPORATION —13 SM8150A 12-3-2. 1st byte: slave address A6 A5 A4 A3 A2 A1 A0 R/W 0 0 0 1 0 0 1 0 12-3-3. 2nd byte to nth byte: data settings Data settings summary Mode select Function Set data M3 M2 M1 D5 D4 D3 D2 D1 MSB Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 LSB Main group LED dimmer setting (DIN1 to 4) 0 0 0 Sub-group LED dimmer setting (DIN5 to 6) 0 0 1 Torch LED dimmer setting (DIN7) 0 1 0 Strobe LED dimmer setting (DIN7) 0 1 1 LDO1 output voltage setting 1 0 0 0*1 0*1 LDO2 output voltage setting 1 0 1 0*1 0*1 Enable setting 2*2 (DC/DC converter) 1 1 0 Buck Enable 0*1 0*1 0*1 0*1 Enable setting 1*2 (DIN1 to 7, LDO1 to 2) 1 1 1 DIN1 to 4 Enable DIN5 to 6 Enable DIN7 Enable LDO1 Enable LDO2 Enable 32-step dimming control (see table 2) 8-step voltage settings (see table 3) *1. Setting used by NPC for testing. Always input 0 for normal operation. *2. Enable settings are 1 for enabled, 0 for disabled. 12-3-4. Data input precautions The VIN supply is applied first, and data input should commence after an interval of ≥ 1ms has elapsed after the VEN supply is applied. VIN VEN 1ms ACK Start 0 0 0 1 0 0 1 0 SDA Slave address The LDO set voltage is changed using the following procedure. First, a) set to disabled, next b) change the voltage setting, and then c) set to enabled. The gap between steps a) and c) should be ≥ 0.3ms. Example ACK 0 0 0 1 0 0 1 0 Start Slave address ACK ACK ACK 1 1 1 * * * 0 * 1 0 0 0 0 1 1 1 1 1 1 * * * 1 * LDO1 disable LDO1 set (3.1V) LDO1 enable Stop 0.3ms SEIKO NPC CORPORATION —14 SM8150A 12-4. Torch/Strobe Selecting The DIN7 pin LED drive current, when DIN7 is enabled, can be switched by the input voltage on the SBN pin. When SBN is HIGH, torch LED dimming is selected. When SBN is LOW, strobe LED dimming is selected. The SM8150A automatically switches the charge pump operating mode (×1, ×1.5, ×2 boost mode) to optimize the power consumption. However, when SBN is LOW the degree of boost is selected in the direction of increased boost only. That is, selecting in order of ×1 → ×1.5 → ×2 boost only, ×2 → ×1.5 → ×1 selecting does not occur. 12-5. Thermal Shutdown Circuit (TSD) If for whatever reason the chip temperature reaches approximately 170°C, the overtemperature protection thermal shutdown (TSD) circuit operates, stopping all output. Turn on occurs the IC cools by approximately 150°C. 12-6. Undervoltage Lockout Circuit (UVLO) If the VIN supply voltage falls below 2.45V, the supply undervoltage lockout (UVLO) circuit operates, initializing the registers to their default values and putting the device in standby mode. In this case, all data settings must be re-input. 12-7. Register Settings Table Table 1. Default settings (all disabled) Mode select Mode Set data M3 M2 M1 D5 D4 D3 D2 D1 MSB Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 LSB Main group LED dimmer setting (DIN1 to 4) 0 0 0 0 0 0 0 0 Sub-group LED dimmer setting (DIN5 to 6) 0 0 1 0 0 0 0 0 Torch LED dimmer setting (DIN7) 0 1 0 0 0 0 0 0 Strobe LED dimmer setting (DIN7) 0 1 1 0 0 0 0 0 LDO1 output voltage setting 1 0 0 0 0 0 0 0 LDO2 output voltage setting 1 0 1 0 0 0 0 0 Enable setting 2 (DC/DC converter) 1 1 0 0 0 0 0 0 Enable setting 1 (DIN1 to 7, LDO1 to 2) 1 1 1 0 0 0 0 0 SEIKO NPC CORPORATION —15 SM8150A Table 2. LED drive current settings (not guaranteed values) D5 D4 D3 D2 D1 Data 3 Data 4 Data 5 Data 6 LSB DIN1 to 4 DIN5 to 6 DIN7 (Torch) DIN7 (Strobe) Unit 0 0 0 0 0 0 0 0 0 mA 0 0 0 0 1 0.8 0.8 9.7 9.7 mA 0 0 0 1 0 1.6 1.6 19.4 19.4 mA 0 0 0 1 1 2.4 2.4 29.0 29.0 mA 0 0 1 0 0 3.2 3.2 38.7 38.7 mA 0 0 1 0 1 4.0 4.0 48.4 48.4 mA 0 0 1 1 0 4.8 4.8 58.1 58.1 mA 0 0 1 1 1 5.6 5.6 67.7 67.7 mA 0 1 0 0 0 6.5 6.5 77.4 77.4 mA 0 1 0 0 1 7.3 7.3 87.1 87.1 mA 0 1 0 1 0 8.1 8.1 96.8 96.8 mA 0 1 0 1 1 8.9 8.9 106 106 mA 0 1 1 0 0 9.7 9.7 116 116 mA 0 1 1 0 1 10.5 10.5 126 126 mA 0 1 1 1 0 11.3 11.3 135 135 mA 0 1 1 1 1 12.1 12.1 145 145 mA 1 0 0 0 0 12.9 12.9 155 155 mA 1 0 0 0 1 13.7 13.7 165 165 mA 1 0 0 1 0 14.5 14.5 174 174 mA 1 0 0 1 1 15.3 15.3 184 184 mA 1 0 1 0 0 16.1 16.1 194 194 mA 1 0 1 0 1 16.9 16.9 203 203 mA 1 0 1 1 0 17.7 17.7 213 213 mA 1 0 1 1 1 18.5 18.5 223 223 mA 1 1 0 0 0 19.4 19.4 232 232 mA 1 1 0 0 1 20.2 20.2 242 242 mA 1 1 0 1 0 21.0 21.0 252 252 mA 1 1 0 1 1 21.8 21.8 261 261 mA 1 1 1 0 0 22.6 22.6 271 271 mA 1 1 1 0 1 23.4 23.4 281 281 mA 1 1 1 1 0 24.2 24.2 290 290 mA 1 1 1 1 1 25.0 25.0 300 300 mA Note. The values of the table 2 “LED drive current settings” are not guaranteed. The actual current values will spread around the values in the table. Especially the variation in 0.8mA setting is wide, and some of actual current may become 0mA. We recommend the usage that the minimum LED driving current value is set at 1.6mA at the brightness adjustment. Table 3. LDO output voltage settings (not guaranteed values) D5 D4 D3 D2 D1 Data 3 Data 4 Data 5 Data 6 LSB 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 LDOUT1 LDOUT2 Unit 0 1.5 1.5 V 1 1.8 1.8 V 1 0 2.5 2.5 V 1 1 2.6 2.6 V 1 0 0 2.8 2.8 V 1 0 1 3.0 3.0 V 0 1 1 0 3.1 3.1 V 0 1 1 1 3.3 3.3 V SEIKO NPC CORPORATION —16 SM8150A 13. TYPICAL APPLICATION CIRCUITS 1µF 1µF 3.6V C1P C1M C2P C2M VIN1 2.2µF VOUT 4.7µF PGND1 VIN2 DIN1 2.2µF PGND2 DIN2 VIN3 DIN3 2.2µF DIN4 DIN5 DIN6 SM8150A Logic supply VEN DIN7 0.1µF 2 I C LDOUT1 SCL LDO1 output 2.2µF SDA LDOUT2 LDO2 output 2.2µF Strobe SBN ON/OFF 100kΩ FB 8pF 200kΩ LX VREF 0.1µF 2.2µH GND1 GND2 2.2µF DCOUT (1.8V) Note. A 2.2µF bypass capacitor should be connected between the VOUT and GND pins. A 4.7µF or greater capacitor value may cause an unstable output voltage condition. Any unused LED drive pins (DIN1 to DIN7) should be connected to GND. If the LDOUT1/2 or LX pins are not used, they should be left open circuit, and not connected to GND or power supply. SEIKO NPC CORPORATION —17 SM8150A 13-1. DIN1 to 3, DIN5, DIN7 (Strobe), and LDO1 1µF 1µF VIN "ON" 3.6V C1P C1M C2P C2M VIN1 VEN "ON" VOUT 4.7µF 1ms 2.2µF PGND1 VIN2 I 2 C address transfer 00010010 DIN1 2.2µF PGND2 DIN2 VIN3 DIN3 2.2µF Data transfer 00011111 DIN1 to 4 set to 25mA Data transfer 00111010 DIN5 to 6 set to 21mA Data transfer 01000000 Torch set to 0mA Data transfer 01110000 Strobe set to 155mA Data transfer 10000111 LDO1 set to 3.3V Data transfer 11111010 DIN1 to 6, LDO1: Enable Data transfer 111**1** DIN7: Enable (Waiting for SBN = Low) DIN4 DIN5 DIN6 2.8V VEN 10kΩ 10kΩ SM8150A DIN7 10kΩ 0.1µF SCL I2 C SDA H: Strobe OFF (Torch) LDOUT1 LDO1 output 2.2µF LDOUT2 LDOUT2: Leave open circuit. Do not connect to ground. SBN L: Strobe ON SBN = Low, 200ms 200ms Strobe ON FB VREF LX 0.1µF GND1 LX: Leave open circuit. Do not connect to ground or power supply. Data transfer 111**0** GND2 VEN "OFF" DIN7: Disable LEDs OFF, LDO1 output stopped Standby mode ■ Unused pins • DIN4 and DIN6: Connect to GND. • FB: Connect to GND. • LDOUT2: Leave open circuit, do not connect to GND. • LX: Leave open circuit, do not connect to GND or power supply. ■ Logic-level signal input pins Connect pull-up resistors to SCL, SDA, and SBN for pull-up to the VEN supply level. The resistances should be of the order of 1k to 10kΩ. The optimal resistance will vary with the actual mounting conditions. SEIKO NPC CORPORATION —18 SM8150A 13-2. DIN1 to 2, DIN5 to 6, DIN7 (Torch), and DC/DC Converter 1µF 1µF VIN "ON" 3.6V C1P C1M C2P C2M VEN "ON" VOUT VIN1 1ms 2.2µF 4.7µF I 2 C address transfer 00010010 PGND1 VIN2 DIN1 PGND2 DIN2 2.2µF VIN3 DIN3 2.2µF Data transfer 00011111 DIN1 to 4 set to 25mA Data transfer 00110011 DIN5 to 6 set to 15.3mA Data transfer 01000101 Torch set to 48.4mA Data transfer 01100000 Strobe set to 0mA Data transfer 11111000 DIN1 to 6: Enable Data transfer 11010000 DC/DC converter: Enable Data transfer 111**1** DIN7: Enable (Torch lighting) Data transfer 111**0** DIN7: Disable (Torch OFF) DIN4 DIN5 DIN6 2.8V VEN 10kΩ 10kΩ SM8150A DIN7 10kΩ 0.1µF SCL 2 LDOUT1 LDOUT1: Leave open circuit. Do not connect to ground. LDOUT2 LDOUT2: Leave open circuit. Do not connect to ground. I C SDA SBN 100kΩ FB 8pF VREF VEN "OFF" 2.2µH 0.1µF GND1 200kΩ LX GND2 2.2µF DCOUT (1.8V) LEDs OFF, DC/DC converter stopped Standby mode ■ Unused pins • DIN3 and DIN4: Connect to GND. • LDOUT1 and LDOUT2: Leave open circuit, do not connect to GND. ■ Logic-level signal input pins Connect pull-up resistors to SCL, SDA, and SBN for pull-up to the VEN supply level. The resistances should be of the order of 1k to 10kΩ. The optimal resistance will vary with the actual mounting conditions. SEIKO NPC CORPORATION —19 SM8150A 14. USAGE NOTES 14-1. External Capacitor Type The external capacitors connected to the SM8150A should be multi-layer ceramic capacitors, with low temperature coefficient X5R or X7R class (EIA standard) multi-layer ceramic capacitors recommended. Use of high temperature coefficient Z5U or Y5V class multi-layer ceramic capacitors may cause an unstable output voltage condition and should be avoided. Capacitor temperature coefficient 3-letter codes (EIA standard) Lower category temperature Upper category temperature Maximum deviation in capacitance from +25°C (0V DC) value X = −55°C 5 = +85°C F = ± 7.5% Y = −30°C 6 = +105°C P = ± 10% Z = +10°C 7 = +125°C R = ± 15% 8 = +150°C S = ± 22% T = +22%/−33% U = +22%/−56% V = +22%/−82% Selection : X5R characteristics 14-2. VIN Supply Input Capacitor In some cases, the printed board component layout may affect the stability of the output voltages. In such cases, the VIN power supply capacitor should be increased or an additional capacitor connected. 14-3. Mounting The package rear surface is metallic, and can be connected to the printed circuit board pattern as a heatsink. The connected pattern should be tied to GND level. Furthermore, use of a thermal via structure on the PCB or other technology should be used to provide sufficient heat dissipation. Use a printed circuit board with 4 or more layers. The PCB wiring ratio*1 should exceed 200%, where the wiring ratio is the sum total of printed wiring pattern surface area relative to the circuit board surface area. *1. Determining the wiring pattern ratio Example: 4-layer board with the same wiring pattern on 4 layers (left), where the wiring pattern surface area on each layer is represented by S1, and the non-wired surface area is represented by S2. The wiring pattern is connected directly to the IC, and each layer’s wiring pattern is connected to the IC by through holes. The circuit board surface area seen from above is S1 + S2. First, calculate the board surface area, here represented by S1 + S2. Next, calculate the wiring pattern surface area on each layer connected to the IC, represented here by S1. Calculate the total wiring pattern surface area for all 4 layers, in this example 4 × S1. Finally, calculate the wiring ratio percentage using the following equation: (Wiring ratio) = (Total wiring pattern surface area connected to the IC) / (PCB surface area) × 100. In this example, 4 × S1/(S1 + S2) × 100 [%], or a wiring ratio of 200% when S1 = S2. S1 S2 SEIKO NPC CORPORATION —20 SM8150A 15. PACKAGE DIMENSION (Unit: mm) Top view Bottom view 4.0 ± 0.07 2.8 2.8 0.3 ± 0.07 0.4 4.0 ± 0.07 A 6 = 2.4 ± 0.05 0.8 B 0.7 ± 0.05 0.2 S φ 0.05 M S A B 0.05 S 0.4 0.15 ± 0.03 S 0.07 ± 0.03 C 0.3 0.18 ± 0.05 0.02 S A B 16. FOOTPRINT PATTERN 4.6 ± 0.1 3.2 ± 0.1 4.6 ± 0.1 3.2 ± 0.1 2.6 0.4 × 6 = 2.4 0.3 0.21 ± 0.05 0.4 × 6 = 2.4 0.7 ± 0.1 0.3 2.6 SEIKO NPC CORPORATION —21 SM8150A Please pay your attention to the following points at time of using the products shown in this document. The products shown in this document (hereinafter “Products”) are not intended to be used for the apparatus that exerts harmful influence on human lives due to the defects, failure or malfunction of the Products. Customers are requested to obtain prior written agreement for such use from SEIKO NPC CORPORATION (hereinafter “NPC”). Customers shall be solely responsible for, and indemnify and hold NPC free and harmless from, any and all claims, damages, losses, expenses or lawsuits, due to such use without such agreement. NPC reserves the right to change the specifications of the Products in order to improve the characteristic or reliability thereof. NPC makes no claim or warranty that the contents described in this document dose not infringe any intellectual property right or other similar right owned by third parties. Therefore, NPC shall not be responsible for such problems, even if the use is in accordance with the descriptions provided in this document. Any descriptions including applications, circuits, and the parameters of the Products in this document are for reference to use the Products, and shall not be guaranteed free from defect, inapplicability to the design for the mass-production products without further testing or modification. Customers are requested not to export or re-export, directly or indirectly, the Products to any country or any entity not in compliance with or in violation of the national export administration laws, treaties, orders and regulations. Customers are requested appropriately take steps to obtain required permissions or approvals from appropriate government agencies. SEIKO NPC CORPORATION 15-6, Nihombashi-kabutocho, Chuo-ku, Tokyo 103-0026, Japan Telephone: +81-3-6667-6601 Facsimile: +81-3-6667-6611 http://www.npc.co.jp/ Email: [email protected] NC0506DE 2007.06 SEIKO NPC CORPORATION —22