AGILENT ACPF-7002-TR1

Agilent ACPF-7002
High Rejection Tx Filter
for US PCS Band
Data Sheet
General Description
Features
• High rejection from a single filter
With no switches required.
• Passband: 1850-1910 MHz
33 dB min Attenuation,
1930-1990 MHz
2.5 dB Typical Insertion Loss
• Space saving solution
Small footprint:
1.6 x 2.0-mm solution
Low profile package:
0.9 mm high (Typ)
1.0 mm (MAX)
Applications
• US PCS band handsets
• Wireless Data terminals
The ACPF- 7002 is a high
rejection full band transmit
filter designed for US PCS
handsets. Its performance rivals
splitband surface acoustic wave
(SAW) transmit filters. Since a
single filter provides the
rejection, no switches are
required, saving board space
and external components,
eliminating switch loss, and
reducing programming
complexity.
The ACPF- 7002 FBAR transmit
filter utilizes Agilent's Microcap
bonded- wafer chip scale
packaging technology. This
process allows the ultra small
filters to be assembled into a
Molded Chip on Board (MCOB)
module.
In typical cellular phone
architectures, the transmit filter
fits between the driver amplifier
and the Power Amplifier. The
ACPF- 7002 FBAR filter reduces
the noise in the Rx band being
amplified by the transmit chain,
enhancing receiver sensitivity.
High rejection keeps unwanted
signals out of the receive path.
Agilent’s thin- Film Bulk
Acoustic Resonator (FBAR)
technology makes possible highQ filters at a fraction their
usual size.
Electrical Specifications, Zo=50 Ω
+25° C
Symbol
Parameters
-30° to +25° C
25° to +85° C
Units
Min
MHz
Typ
1850
Max
Min
Typ
1910 1850
Max
Min
Typ
1910 1850
Max
f
Passband
1910
IL
Insertion Loss 1850-1855 MHz
dB
2.0
3.5
3.7
3.2
IL
Insertion Loss 1855-1905 MHz
dB
1.5
2.5
2.5
2.5
IL
Insertion Loss 1905-1910 MHz
dB
2.5
3.0
2.7
3.7
D S21
Ripple, 1850-1910 MHz
dB
S21
Min Rejection, 1930-1990 MHz
dB
33
S21
Min Rejection 10 –1800 MHz
dB
S21
Min Rejection 1990 – 3820 MHz
S21
2.5
37
33
33
25
25
25
dB
22
22
22
Min Rejection 3820 − 5730 MHz
dB
15.0
15.0
15.0
S11, S22
In-band return loss
dB
9.0
Pin max
Safe Input Power Level
dBm
20
Parameter
Unit
Value
Operating temperature[1]
°C
-30 to +85
Storage temperature[1]
°C
-30 to +100
11
9.0
11
20
9.0
11
20
Absolute Maximum Ratings[2]
Notes:
1. Temperature is defined at case TC, the temperature of the underside of the filter where it makes contact with the circuit board.
2. Specifications are guaranteed over the given temperature range. Operation in excess of any one of these conditions may result in permanent damage to
the device.
2
Typical Performance (25o C, Zo = 50 Ohms)
0
-10
d B(S (2,1))
0
-1
d B(S (2,1))
-20
-30
-2
-3
-40
-4
-50
1.70
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
Figure 1. Attenuation [dB] vs. Frequency
-5 1.83
1.84
1.85
1.86
1.87
1.88
1.89
1.90
1.91
1.92
1.93
Figure 2. Insertion Loss [dB] vs. Frequency
0
0
-5
d B(S (1,1))
d B(S (2,1))
-10
-20
-30
-10
-15
-20
-40
-25
-50
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.5
-30
1.70
6.0
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
Figure 4. Return Loss [dB] vs. Frequency
S (1,1)
S (2,2)
Figure 3. Attenuation [dB] vs. Frequency (broadband)
5.0
fre q (1.700GHz to 2.100GHz)
Figure 5. Typical S(1,1)
fre q (1.700GHz to 2.100GHz)
Figure 6. Typical S(2,2)
3
PCB Interface & Mounting instructions
Mounting Consideration and board description
Input connection
The ACPF- 7002 FBAR filter has one input (Pin 1),
one output (Pin 3) and two grounds (Pins 2, 4).
TOP
BACK
• Demo board uses 3 mil Getek Microstrip.
The demoboard uses CPWG transmission lines for
high isolation between the two ports. It uses via
holes to connect the CPWG line from the
underside of the board to the filter mounting pads
on top.
Note:
For best performance, try to reproduce this board stack up
closely. If Ground-Signal-Ground (GSG) type board is used,
better return loss can be achieved since it eliminates
connector mismatch.
Output connection
Figure 8. PCB Footprint pad
Demo boards
Demo boards are available.
(See board drawing in Figure 7, 8, 9).
Layer1 (signal)
0.7 mils
Layer 2 (ground)
Getek ML200D ( T=3.9)
Getek
3 mils
0.7 mils
Getek ML200D ( T=4.2)
Getek
Layer 3 (signal)
Getek material ML200D and RG200D
Getek
Figure 7. Board stack up description
4
28 mils
Figure 9. Closer look at the recommended board footprint and soldermask
1.25 MAX
0.35 ± 0.15
8X
1
2
4
3
SIDE VIEW
1.6
0.60 ± 0.15
0.60 ± 0.15
2.0
D
B
Shaded Region Grounded
: Pin 1 Location
A
: Work Week
B,C,D : Lot Number
C
A
Pin 1
Marking
Note:
Dimensions in mm
Figure 10. Detailed Bottom, Side and Top view of Package
Layer 1
Layer 2 (GROUND layer)
0.61
0.70
0.61
0.3
0.30
0.05
OUT
3
4
Via to layer 2
0.05
0.31
0.55
1.5
0.55
0.30
IN
1
2
0.33
Metal voided
To decrease
Capacitance at
Input Port
0.3
0.3
Metal voided
To decrease
Capacitance at
output Port
1.92
This region is Soldermask covering ground
Region (4) & (2) is exposed ground for soldering filter pads
Note:
Dimensions in mm
Figure 11. Suggested PCB layers, viewed from top
5
Solder Compositions
Alloy type
Melting temp. (oC)
Recommended working temperature (oC)
Sn42Bi58
138
160 − 180
Sn43Pb43Bi14
144 − 163
165 − 185
Sn63Pb37
183
200 − 240
Sn60Pb40
186
200 − 240
Sn91/Zn9
199
200 − 240
Sn96.2Ag2.5Cu0.8Sb0.5
216
235 − 255
Sn95.8Ag3.5Cu0.7
217
235 − 255
Sn96.5Ag3.5
221
240 − 260
Sn100
232
260 − 280
Sn95Sb5
235
260 − 280
Sn97Cu3
240
260 − 300
300
Temperature, °C
250
200
150
100
Tested profile shown.
50
0
0
50
100
Figure 12. Recommended solder profile
6
150
200
Time, seconds
250
300
USER DIRECTION
OF UNREELING
NOTES:
1. MEASURED FROM THE CENTRELINE OF THE SPROCKET HOLE TO THE CENTRELINE OF THE POCKET
HOLE AND FROM THE CENTRELINE OF THE SPROCKET HOLE TO THE CENTERLINE OF THE POCKET
2. CUMULATIVE TOLERANCE OF 10 SPROCKET HOLES IS ± 0.20
3. THIS THICKNESS IS APPLICABLE AS MEASURED AT THE EDGE OF THE TAPE.
4. MATERIAL: BLACK POLYSTYRENE
5. ALL DIMENSIONS IN MM.
6. ALLOWABLE CAMBER TO BE 1MM PER 250MM IN LENGTH
7. UNLESS OTHERWISE SPECIFIED TOLERANCE ± 0.10.
8. MEASUREMENT POINT TO BE 0.3 FROM BOTTOM POCKET.
9. SURFACE RESISITIVTY FROM 1.0X105 TO 1.0x1011OHMS/SQ
Figure 13. Tape drawing
Figure 14. Reel drawing
7
Notes:
1. Material Polyester and AcrylicAdhesive Layers.
2. All Dimensions in MM except tape length.
3. Surface Resistivity: 106 to 1012 OHMS/SQ.
Pin 1 Position
User Feed Direction
Empty
Leader : 125 Pocket - 1
Trailer : 125 Pocket - 1
A
B ,C,D
: Pin 1 Location
: WORK WEEK
: LOT NUMB ER
A
B
A
B
C
D
C
D
Top View
Figure 15. Device orientation in the tape
Ordering information
Specify part number followed by option. For example:
ACPF - 7002 - XXX
BLK = Bulk, Min 100pcs per antistatic bag
TR1 = Tape and Reel, 3000pcs per 7” reel
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
Data subject to change.
Copyright 2003 Agilent Technologies, Inc.
January 21, 2004
5989-0380EN
A
C
B
D
End View