August 2002 Revision 2.2 Geode™ CS1301/CS1311 Multimedia Companion: Media Coprocessor General Description The National Semiconductor® Geode™ CS1301 and CS1311 multimedia companions act as coprocessors to decode multimedia in National’s Geode single chip processor-based systems (i.e., SC1200/SC1201, SC2200, and SC3200, hereafter referred to as SCx200). They provide a multimedia experience for an Information Appliance (IA) user that cannot typically be achieved on a PC. coprocessor’s task of decoding media and thereby causing stuttering of sound or interruptions in the video. Lower power consumption can also be achieved using the SCx200/CS1301 or SCx200/CS1311 solution. The CS1301/CS1311 has an architecture specifically designed for decoding media. The architecture is such that while decoding media, power is not consumed by portions of the system that are not used to decode media. Since the SCx200 is not decoding the media locally, it is able to go into a lower power state. When the CS1301/CS1311 is not decoding media, it uses almost no power. By implementing a dedicated coprocessor to perform multimedia tasks, a high quality video viewing experience can be achieved. This high quality is achieved by having a coprocessor architecture that is ideally suited for decoding digital media. In addition, since the decoding is not occurring on the SCx200, system events cannot interrupt the Additionally, since the architecture is designed for decoding media, fewer CS1301/CS1311 cycles are required. Internal Block Diagram 32-Bit Data (up to 664 MB/sec) SDRAM Main Memory Interface CCIR-656 Digital Video YUV 4:2:2 up to 81 MHz (40 Mpix/sec) Video In Video Out CCIR-656 Digital Video Stereo Digital Audio 8/16-bit data I2S DC, up to 22 MHz AI_SCK Audio In Audio Out 2/4/6/8 Ch. Digital Audio 16/32-Bit Data I2S DC, up to 22 MHz AO_SCK VLD Coprocessor S/PDIF Out Huffman Decoder Slice-At-A-Time MPEG-1 & 2 ACCESS.bus Interface Timers VLIW CPU 32K I$ IEC958 up to 40 Mbit/sec ACCESS.bus Interface to EEPROM Image Coprocessor 16K D$ Down and Up Scaling YUV --> RGB (50 Mpix/sec) PCI Interface External Bus PCI V2.1 (32 bits, 33 MHz) National Semiconductor and Virtual System Architecture are registered trademarks of National Semiconductor Corporation. Geode, MacPHYTER, WebPAD, and VSA are trademarks of National Semiconductor Corporation. For a complete listing of National Semiconductor trademarks, please visit www.national.com/trademarks. © 2002 National Semiconductor Corporation 1 www.national.com Geode™ CS1301/CS1311 Multimedia Companion: Media Data Processor Preliminary Geode™ CS1301/CS1311 Features General Features VLD Coprocessor ■ Physical ■ Parses MPEG-1 and MPEG-2 elementary bit streams generating run-level pairs and filling macroblock headers ■ Process 0.25-micron CMOS ■ Packaged in a 292-terminal TEPBGA (Thermally Enhanced Plastic Ball Grid Array) Timers ■ Power supply: ■ Four 32-bit wide timers — CS1301: 2.5V Core; 3.3V I/O (5V tolerant) — CS1311: 2.2V Core; 3.3V I/O (5V tolerant) Input/Output Support ■ Consumption 1300 mA; 3.5W ■ PCI Interface: — — — — ■ Power-down 300 mA ■ Case Temperature 0° to 85°C Central Processing Unit PCI 2.1 compliant Speed 33 MHz Bus width 32 bits Voltage drive and receive at 3.3V ■ Audio In (AI): — Two I2S compliant channels — Sample size 8 or 16-bit samples per channel ■ Clock speed: — CS1301: 180 MHz — CS1311: 166 MHz ■ Audio Out (AO): — Eight I2S compliant channels — Sample size 16 or 32-bit samples per channel ■ Instruction length variable (2 to 23 bytes) ■ Instruction set arithmetic and logical operations, ■ Video In (VI): load/store operations, special multimedia and DSP operations, IEEE compliant floating point operations — Supported signals CCIR-601/656: – 8-bit video (up to 40 Mpix/sec) — Image sizes all sizes, subject to sample rate — Provides programmable on-the-fly 2X horizontal resolution subsampling ■ Functional units 27, pipelined Caches ■ Data 16 KB, instructions 32 KB ■ Video Out (VO): — Image sizes flexible, including CCIR-601; max. 4K x 4K pixels (subject to 80 MB/sec data rate) — Outputs CCIR-601/656 8-bit video, PAL or NTSC — Clock rates programmable (4-80 MHz), typical 27 MB/sec (13.5 Mpix/sec for NTSC, PAL; 40 Mpix/sec in YUV 4:2:2 mode) — Features full 129-level alpha blending, GenLock mode, frame synchronization chroma key, programmable YUV color clipping Memory System ■ Speed 166 MHz SDRAM ■ CPU/Memory programmable; 1:1, 5:4, 4:3, 3:2, and 2:1 speed ratios ■ Memory size 512 KB to 64 MB (up to four banks) ■ Recommended configurations: — 16 MB: Two 4M x 16 or two 2M x 32 — 32 MB: Four 2M x 32 or four 4M x 16 ■ S/PDIF Out: — Number of channels up to 6 — Sample size 16 or 24 bits per channel — IEC-958, output up to 40 Mbits/sec ■ Width 32-bit bus ■ Max. bandwidth 664 MB/sec (at 166 MHz) ■ ACCESS.bus Interface: — Supported modes single master only — Addressing 7-bit — Rates up to 400 Kbps Image Coprocessor ■ Scaling programmable scale factor (0.2X to 10X) using 5-tap filters: — Horizontal or vertical scaling and filtering of individual Y, U or V — Horizontal scaling and filtering with color conversion and overlay — HYUV to RGB, RGB overlay and alpha blending, bit mask blanking www.national.com 2 Revision 2.2 System Architecture The CS1301/CS1311 multimedia companion acts as a coprocessor to decode multimedia in National’s Geode SC1200/SC1201, SC2200, and SC3200 (SCx200 unless otherwise specified). Figure 1-1 provides a typical system block diagram. 1.1 IMPORTANT DESIGN NOTE The CS1301/CS1311 was designed to be a general purpose media data processor. As such, the CS1301/CS1311 is capable of far more than the current National CS1301/CS1311 solution. The solution that National is providing is only one possible implementation of the CS1301/CS1311 and only this implementation is fully supported by National Semiconductor. In order to maintain software compatibility with National’s provided software, any deviation of the CS1301/CS1311 section of the schematic is strongly discouraged. Media decoding is one of the most demanding system applications. If media is decoded on the main processor, a much higher performance processor is required to achieve even comparable levels of media decoding quality. Such a system would be significantly over-designed for other tasks, such as browsing the Internet. Using a low-cost processor that is ideally suited for all tasks, and adding the coprocessor for the high performance media decoding requirement, results in a cost-effective solution. For those wishing to deviate from the schematic, or wishing to take advantage of other features of the CS1301/CS1311, documentation is available on the Philips Semiconductors SDE CD-ROM to support design variations. However, additional support to implement these variations must be obtained from one of the TriMedia Alliance Partners who support the CS1301/CS1311, its software, and the peripheral functions. Another advantage of an processor/coprocessor solution is that an OEM (Original Equipment Manufacturer) can provide a scalable solution. A single board can be designed that supports the coprocessor. If it is desired to support a low-end product that does not support the high quality media decoding capabilities, the coprocessor and its supporting components can be excluded from the system, which results in additional savings in an already cost-effective design. For a list of TriMedia Alliance Partners, visit: http://www.trimedia.com/TAPP/ Flash or M-Systems’ DiskOnChip IDE CompactFlash Data AMP LM4880 Control SDRAM Sub-ISA Codec LM4549 USB 1, 2, 3 GeodeTM SCx200 CCIR 656 VIP WM8725 DAC SDRAM XpressROM BIOS IRDA PCI Bus GeodeTM CS1301/ CS1311 Display: TV, CRT, or TFT EEPROM Figure 1-1. System Block Diagram Revision 2.2 3 www.national.com Geode™ CS1301/CS1311 1.0 Geode™ CS1301/CS1311 System Architecture (Continued) 1.2 SOFTWARE The CS1301/CS1311 software and reference schematic is provided for a system that decodes media quickly with no original software development needed. As part of the CS1301/CS1311 purchase (see Section A.1 "Ordering Information" on page 24 for purchase details), National will license for the use of the operating system drivers and media decoder codecs in object form, which include: MPEG-2 Decoding • Communications manager driver. • Audio stream - MPEG-2 audio: — Layers 1 and 2 (ISO 13818-3) at 32 KHz, 44.1 KHz or 48 KHz sample rate — AC3 audio at 32 KHz, 44.1 KHz or 48 KHz sample rate • Program stream (ISO 13818-1): DVD style MPEG-2 program stream • Video stream (ISO 13818-2) - Main level at main profile: — Full screen NTSC (720x480) at 29.97 fps — Full screen PAL (720x576) at 25 fps • Video filter: Takes the video from the VIP (Video Input Port) of the Geode SCx200 and plays it back through the operating system media player. • Various multimedia codecs. MPEG-1, MPEG-2 Layer 3 Audio Decoding (MP3) 1.2.1 Software Support National provides a reference schematic and the associated software for a processor/coprocessor solution using the Geode SCx200 and the CS1301/CS1311. This implementation is currently supplied as a multimedia decoder for CE player under Microsoft Windows CE.net or Linux. Future support for Microsoft Windows XP is planned. Since this is a software-based DSP (Digital Signal Processor) coprocessor rather than strictly a silicon-based coprocessor, the software can be upgraded to support evolving media standards without a redesign of the hardware. • Up to 384 Kbps • Up to 48 KHz sample rate • Fixed bit rate decoding MPEG-4 Decoding • Video stream - “Simple profile”: — CIF resolution at 30 fps, up to 384 Kbps • Audio stream - “High quality profile”: — MPEG-4 AAC low complexity and MPEG-4 CELP 1.2.2 Software Features Support The CS1301/CS1311 multimedia solution supports the following software components: WMT (Windows Media Technology) Decoding • Video stream - Windows Media Video v8, also supports v7 decode: — CIF resolution at 30 fps, up to 1 Mbps General Support • Reverse 3:2 pull down • Audio stream - Windows Media Audio v8, also supports v7 decode: — Up to 128 Kbps and 48 KHz sample rate • Progressive display output • Capture Video Input Windows Media Player Integration An implementation has been developed to seamlessly integrate Windows Media Player with WindowsCE.net or Linux. National has taken advantage of the native playback features supported by Microsoft DirectShow and has extended that functionality to the CS1301/CS1311. WindowsCE.net ships with an ActiveX control that wraps the filter graph manager and provides a very high level API (Application Programming Interface). It also supports a browser plug-in. An application writer can use the ActiveX control interface to playback MPEG-1/MPEG-2 media types. The user can also open the MPEG-1/MPEG-2/WMT files in Windows Media Player by double clicking on the file or by launching WMP, then opening the selected media. MPEG-1 Decoding • System stream (ISO 11172-1): — Up to 1.5 Mbps • Video stream (ISO 11172-2): — CIF (up to 360x288) resolution — 29.97 fps (NTSC) — 25 fps (PAL) — Up to 1.12 Mbps • Audio stream (ISO 11172-3): MPEG-1 layers 1 and 2: — Up to 384 Kbps, 32 KHz, 44.1 KHz or 48 KHz sample rate New codecs are continually being developed and added (see National’s IA Developer’s web site for a list of supported codecs). www.national.com 4 Revision 2.2 1.2.3 Software Architecture Overview Figure 1-2 demonstrates the interaction between the various software layers. Note: The shaded boxes indicate components provided by Microsoft Corporation. Windows Media Player ActiveX Control Filter Graph Manager File Source Video Renderer DirectShow Filter TMComm TMMan32/HostComm/LibLoad/TMCRT Geode™ SCx200 TMMan Driver Geode Part TMMan Driver TM Part Geode™ CS1301/CS1311 DAC TMMan32/HostComm/LibLoad/TMCRT To SCx200 Video Input Port CommTM ExolTMpeg Application TSSA* Video Decoder TRead VTransCrystal Video Renderer Demux Audio Decoder Audio Renderer * TriMedia Streaming Software Architecture Figure 1-2. Software Architecture Diagram Revision 2.2 5 www.national.com Geode™ CS1301/CS1311 System Architecture (Continued) Geode™ CS1301/CS1311 System Architecture (Continued) 1.2.4 Software Component Pricing and Licensing National delivers and supports a complete software solution when paired up with the WindowsCE.net or Linux operating system. The delivered software is a compilation of software created by National Semiconductor, Philips Semiconductors and Microsoft. Customers may need separate pricing and support agreements for Windows Media Technology (Microsoft), BIOS, Operating System, and middleware. National’s pricing excludes fundamental patents: MPEG-1, -2, -4 (MPEG-LA) and MP3 (Thomson Multimedia/Fraunhofer ILS). The following tables list the associated software, their respective owners and the licensing requirements for each. 188.8.131.52 Codec Software The codec software includes video and audio decoders and operates on the CS1301/CS1311 (see Table 1-1). This software performs the task of decoding the encoded media content, which are the workhorses of the solution. 184.108.40.206 Host Filter Software The DirectShow filter is the core piece of software that integrates the CS1301/CS1311 media companion with Microsoft DirectShow (see Table 1-2). Table 1-1. Codec Software Components TM MP3 Decoder IP Owner(s) Available as Source/Binary Philips Semiconductors Binary Licensee is responsible for licensing of all fundamental patents. National Semiconductor Microsoft Binary Microsoft WMT license required. TM MP3 Basic Application Licensing Requirements TM MPEG-1 Video Decoder TM MPEG-1 Audio Decoder TM MPEG-2 Video Decoder TM MPEG-2 Audio Decoder TM AC-3 Audio Decoder TM MPEG-2 Program Stream Demux TM MPEG-2 Basic Application TM MPEG-4 Video Decoder TM MPEG-4 AAC Audio Decoder TM MPEG-4 CELP Audio Decoder TM MPEG-1 File Parser and Demultiplexer TM MPEG-4 Basic Application TM WMT v8 Video Decoder TM WMT v8 Audio Decoder Table 1-2. Host Filter Software Components DirectShow Filter www.national.com IP Owner Available as Source/Binary National Semiconductor Binary 6 Licensing Requirements Not licensed as source code. Revision 2.2 220.127.116.11 Communications Driver Software The communications driver software includes most of the components that perform the communication and control tasks between the Geode SCx200 and the CS1301/CS1311 (see Table 1-3). ponents that enable the execution of the codec software on the CS1301/CS1311 (see Table 1-4). 18.104.22.168 System Software To expand system functionality beyond media decoding, Geode software components are included. These are standard components to be used in a non-media enabled application to support the required functions of an Information Appliance. In some cases, these drivers have been optimized to work with the CS1301/CS1311 (see Table 1-5). 22.214.171.124 Software Development Kit The Software Development Kit (SDK) includes the core software components that run on the TM32A core of the CS1301/CS1311. These are the supporting software com- Table 1-3. Communications Driver Software Components Host TMMan Driver TM TMMan Library IP Owner(s) National Semiconductor Philips Semiconductors Available as Source/Binary Open Source Licensing Requirements Per Philips Semiconductors public source license provisions. TMComm Library HostComm Library TMCRT Library TMMan 32 LibLoad TriMedia Technologies, Inc. Binary NA Table 1-4. SDK Software Components COMMTM Video Renderer IP Owner(s) Available as Source/Binary Licensing Requirements National Semiconductor Philips Semiconductors Binary NA VxWorks Binary OS run-time licenses. Audio Renderer TRead VTrans Crystal PSOS Table 1-5. System Software Components Graphics Driver (Linux, WinCE.net) IP Owner(s) National Semiconductor Available as Source/Binary Licensing Requirements Source National source code license. Audio Driver (Linux, WinCE.net) WinCE.net Power Management OAL Touchscreen Driver (Linux, WinCE.net) National’s DP83815 MacPHYTER™ Network Driver (Linux, WinCE.net) Revision 2.2 7 www.national.com Geode™ CS1301/CS1311 System Architecture (Continued) Geode™ CS1301/CS1311 2.0 Signal Definitions This section defines the signals and describes the external interface of the CS1301/CS1311 media companion. Figure 2-1 shows the signals organized by their functional groups. Table 2-1 shows the types of I/O circuits used by the CS1301/CS1311 series. Note that the # symbol in a signal name indicates that the active or asserted state occurs when the signal is at a low voltage level. Otherwise, the signal is asserted when at a high voltage level. The remaining subsections of this chapter describe: • Section 2.1 "Ball Assignments": Provides a ball assignment diagram and tables listing the signals sorted according to ball number and alphabetically by signal name. Table 2-1. Ball Type Descriptions Modes • Section 2.2 "Signal Descriptions": Detailed descriptions of each signal according to functional group. • Section 2.3 "Reference Voltages": Discussion on ball reference voltages. 2.1 BALL ASSIGNMENTS The CS1301/CS1311 has a total of 169 functional pins, excluding VDDQ, VSSQ, VREF_PCI, VREF_PERIPH, and digital power/ground. For pins with 5.0V input capability, the VREF_PCI or VREF_PERIPH determines 3.3V or 5.0V input tolerance. Unused pins can remain floating/unconnected; all pins that drive a clock should drive a series resistor. System Interface Memory Interface PCI Bus Interface ACCESS.bus Interface I Input only, except during boundary scan. O Output only, except during boundary scan. OD Open Drain output, active pull low, no active drive high, requires external pull-up. I/O Input or Output. I/OD TRI_CLKIN TRI_USERIRQ TRI_TIMER_CLK TRI_RESET# VREF_PCI VREF_PERIPH MM_CLK [ 1:0] MM_A [13:00] MM_DQ [ 31: 00] MM_CKE[1:0] MM_CS[ 3:0] # MM_RAS# MM_CAS# MM_WE# MM_DQM[ 3:0] Description Input with Open Drain output, active pull low, no active drive high, requires external pull-up. VI_CLK VI_DVALID VI_DATA[09:00] VO_CLK VO_IO[2:1] VO_DATA[07:00] Geode™ CS1301/CS1311 AI_OSCLK AI_SCK AI_SD AI_WS AO_OSCLK AO_SCK AO_SD[4:1] AO_WS PCI_CLK PCI_AD [31: 00] PCI_C/BE[3:0]# PCI_PAR PCI_FRAME# PCI_IRDY# PCI_TRDY# PCI_STOP# PCI_IDSEL PCI_DEVSEL# PCI_REQ# PCI_GNT# PCI_PERR# PCI_SERR# PCI_INTA# PCI_INTB# PCI_INTC# PCI_INTD# SPDO JTAG_TDI JTAG_TDO JTAG_TCK JTAG_TMS BOOT_CLK TESTMODE SCANCPU VDDQ VSSQ (Total of 24) VDD (Total of 40) VCC (Total of 55) VSS (Total of 8) NC IIC-SDA IIC-SCL Video In Interface Video Out* Interface Audio In* Interface Audio Out Interface S/PDIF Interface JTAG Interface Test and Measurement Interface Power, Ground and No Connections *Video In and Audio In are supported by third party software solutions, not by the National Semiconductor solution. Figure 2-1. Functional Block Diagram www.national.com 8 Revision 2.2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 A PAD23 PIDSEL PAD24 PAD27 PAD28 PAD31 PCIID# PCIIB# NC NC NC SPDO AOSD2 AOSC AOWS AISCK VILD VIDT8 VIDT5 VIDT4 A B PAD20 PAD19 PCBE3# PAD26 PGT# PAD30 PRQ# PCIIC# NC NC NC AOSD4 OSD1 AOOCK AIOCK AIWS VIDT9 VIDT7 VIDT3 VIDT2 B C PAD18 PAD21 PAD22 PAD25 VSS PAD29 VCC VDD PCIIA# VCC VCC AOSD3 VDD VCC AISD VSS VIDT6 VRPER VIDT1 VICK C D PAD16 PCBE#2 PAD17 VSS VSS VCC VCC VDD VDD VCC VCC VDD VDD VCC VCC VSS NC SCNCPU D E PIRD# PFM# NC JTTMS E JTTDO JTTCK JTTDI F F VSS VSS Geode™ PDVSL# VRPC PTRD# VCC G PPR# PSTP# VCC VCC H PPAR VDD VDD VSS VSS VSS VSS VSS J PAD14 PAD15 PCBE1# VDD VSS VSS VSS VSS K PAD12 PAD13 VCC VCC VSS VSS VSS L PAD11 PAD10 VCC VCC VSS VSS M PAD9 PAD8 PCBE0# VDD VSS N PAD7 PAD6 VDD VDD VSS P PAD5 PAD4 VCC VCC R PAD3 PAD2 PAD1 VCC T PAD0 PCICK VSS VSS VSS VIDT0 VSS VSS VCC VCC VCC TRRST# TRUSIQ G VSS VDD VDD TRTRCK VOIO2 H VSS VSS VDD VOIO1 VOCLK VODT7 J VSS VSS VSS VCC VCC VODT6 VDDQ K VSS VSS VSS VSS VCC VCC VSSQ TRCKIN L VSS VSS VSS VSS VSS VDD VSS VSS VSS VSS VSS VDD VDD VODT1 VODT2 N VCC VCC TEST VODT0 P VCC MDQM1 ICSDA ICSCL R VSS MDQ7 MDQM0 BTCK T VSS MDQ4 MCS3# MCS1# U MDQ9 MDQ1 MDQ5 MDQ6 V W MDQ26 MDQ27 MDQ30 MDQ23 MDQ21 MDQ18 MDQ16 MMA8 MMA5 MMCK1 MMA2 MMA0 MMA12 MRS# MWE# MDQ13 MDQ11 MDQ8 MDQ2 MDQ3 W Y MDQ28 MDQ29 MDQ31 MDQ22 MDQ20 MDQ17 MMA9 MMA7 MMA4 MMCK0 MMA3 MMA1 MMA11 MMA13 MCS# MDQ14 MDQ12 MDQ10 MCE0 MDQ0 Y PSR# CS1301/CS1311 Multimedia Companion U MCE1 MCS0# MCS2# VSS V MDQM2 MDQ24 MDQ25 MDQM3 VSS 1 Note: 2 3 4 VSS 5 VCC VCC VDD VDD VCC VCC VDD VDD VCC VCC VSS MDQ19 VCC VDD MMA6 VCC VCC MMA10 VDD VCC MDQ15 VSS 6 7 8 9 VODT3 VODT4 VODT5 M 10 11 12 13 14 15 16 17 18 19 20 Signal names have been abbreviated in this figure due to space constraints. = GND Connection = CS1301 2.5V Core Power Connection; CS1311 2.2V Core Power Connection = 3.3V I/O Power Connection Figure 2-2. 292-TEPBGA Ball Assignment Diagram Revision 2.2 9 www.national.com Geode™ CS1301/CS1311 Signal Definitions (Continued) Geode™ CS1301/CS1311 Signal Definitions (Continued) Table 2-2. Ball Assignment Sorted by Ball Number Ball No. Signal Name Ball No. Signal Name Type Ball No. Signal Name Type A1 PCI_AD23 I/O C13 VDD PWR G19 TRI_RESET# I A2 PCI_IDSEL I C14 VCC PWR G20 TRI_USERIRQ A3 PCI_AD24 I/O C15 AI_SD I H1 PCI_PAR A4 PCI_AD27 I/O C16 VSS GND H2 PCI_SERR# A5 PCI_AD28 I/O H3 VDD PWR A6 PCI_AD31 I/O PWR H4 VDD PWR A7 PCI_INTD# I/OD A8 PCI_INTB# I/O/OD A9 NC --- A10 NC --- A11 NC --- A12 SPDO Type O VI_DATA6 C18 VREF_PERIPH I VI_DATA1 I H8 VSS GND C20 VI_CLK I/O H9 VSS GND D1 PCI_AD16 I/O H10 VSS GND D2 PCI_C/BE#2 I/O H11 VSS GND D3 PCI_AD17 I/O H12 VSS GND D4 VSS GND H13 VSS GND D5 VSS GND D6 VCC PWR D7 VCC PWR AO_SD2 A14 AO_SCK I/O A15 AO_WS I/O A16 AI_SCK I/O A17 VI_DVALID I D8 VDD PWR A18 VI_DATA8 I D9 VDD A19 VI_DATA5 I D10 VCC A20 VI_DATA4 I D11 B1 PCI_AD20 I/O B2 PCI_AD19 I/O B3 PCI_C/BE3# I/O B4 PCI_AD26 I/O B5 PCI_GNT# I B6 PCI_AD30 I/O B8 PCI_REQ# PCI_INTC# OD C19 A13 B7 O C17 I I/O H17 VDD PWR H18 VDD PWR H19 TRI_TIMER_CLK H20 VO_IO2 I/O PWR J1 PCI_AD14 I/O PWR J2 PCI_AD15 I/O VCC PWR J3 PCI_C/BE1# I/O D12 VDD PWR J4 VDD PWR D13 VDD PWR J8 VSS GND D14 VCC PWR J9 VSS GND VSS GND I D15 VCC PWR J10 D16 VSS GND J11 VSS GND D17 VSS GND J12 VSS GND I/OD D18 VI_DATA0 I J13 VSS GND NC --- J17 VDD PWR O B9 NC --- D19 B10 NC --- D20 SCANCPU I J18 VO_IO1 I/O PCI_IRDY# I/O J19 VO_CLK I/O PCI_FRAME# B11 NC --- E1 B12 AO_SD4 O E2 I/O J20 VO_DATA7 O K1 PCI_AD12 I/O O E3 VSS GND AO_OSCLK O E4 VSS GND K2 PCI_AD13 AI_OSCLK O E17 VSS GND K3 VCC PWR B16 AI_WS I/O E18 VSS GND K4 VCC PWR B17 VI_DATA9 I E19 --- K8 VSS GND B18 VI_DATA7 I E20 JTAG_TMS B19 VI_DATA3 I F1 PCI_DEVSEL# B20 VI_DATA2 I F2 C1 PCI_AD18 I/O C2 PCI_AD21 I/O B13 AO_SD1 B14 B15 C3 PCI_AD22 I/O C4 PCI_AD25 C5 VSS C6 PCI_AD29 C7 VCC PWR C8 VDD PWR C9 PCI_INTA# I/O GND I/O I/OD NC I K9 VSS GND I/O K10 VSS GND VREF_PCI PWR K11 VSS GND F3 PCI_TRDY# I/O K12 VSS GND F4 VCC PWR K13 VSS GND F17 VCC PWR K17 VCC PWR F18 JTAG_TDO I/O K18 JTAG_TCK I VCC PWR F19 F20 JTAG_TDI I K19 VO_DATA6 K20 VDDQ L1 PCI_AD11 L2 PCI_AD10 L3 VCC PWR L4 VCC PWR L8 VSS GND G1 PCI_PERR# I/O G2 PCI_STOP# I/O G3 VCC PWR C10 VCC PWR G4 VCC PWR C11 VCC PWR G17 VCC PWR VCC PWR C12 AO_SD3 www.national.com O I/O G18 10 O PWR I/O I/O Revision 2.2 Table 2-2. Ball Assignment Sorted by Ball Number (Continued) Ball No. Signal Name Type Ball No. Signal Name Type Ball No. Signal Name L9 VSS GND R17 VCC PWR V18 MM_DQ01 I/O L10 VSS GND R18 MM_DQM1 O V19 MM_DQ05 I/O GND R19 IIC_SDA I/OD V20 MM_DQ06 I/O GND R20 IIC_SCL I/OD W1 MM_DQ26 I/O T1 PCI_AD00 I/O W2 MM_DQ27 I/O T2 PCI_CLK I W3 MM_DQ30 I/O T3 VSS GND W4 MM_DQ23 I/O GND W5 MM_DQ21 I/O W6 MM_DQ18 I/O W7 MM_DQ16 I/O W8 MM_A08 O W9 MM_A05 O W10 MM_CLK1 O W11 MM_A02 O W12 MM_A00 O W13 MM_A12 O W14 MM_RAS# O W15 MM_WE# O L11 L12 L13 L17 VSS VSS VSS GND VCC PWR L18 VCC PWR L19 VSSQ GND L20 TRI_CLKIN I M1 PCI_AD09 I/O M2 PCI_AD08 I/O M3 PCI_C/BE0# I/O M4 VDD PWR M8 VSS GND M9 VSS GND M10 VSS T4 GND M11 VSS GND M12 VSS GND M13 VSS GND M17 VDD PWR M18 VO_DATA3 O M19 VO_DATA4 O M20 VO_DATA5 O N1 PCI_AD07 I/O N2 PCI_AD06 I/O N3 VDD PWR N4 VDD N8 T17 T18 T19 T20 U1 VSS VSS GND MM_DQ07 MM_DQM0 BOOT_CLK MM_CKE1 I/O O I O U2 MM_CS0# O U3 MM_CS2# O U4 U5 VSS GND VSS GND Type U6 VCC PWR W16 MM_DQ13 I/O U7 VCC PWR W17 MM_DQ11 I/O U8 VDD PWR W18 MM_DQ08 I/O U9 VDD PWR W19 MM_DQ02 I/O U10 VCC PWR W20 MM_DQ03 I/O PWR Y1 MM_DQ28 I/O PWR Y2 MM_DQ29 I/O Y3 MM_DQ31 I/O Y4 MM_DQ22 I/O Y5 MM_DQ20 I/O Y6 MM_DQ17 I/O Y7 MM_A09 O U11 U12 VDD VDD PWR U14 VCC PWR PWR U15 VCC PWR VSS GND U16 VSS GND N9 VSS GND U17 VSS GND Y8 MM_A07 O N10 VSS GND U18 MM_DQ04 I/O Y9 MM_A04 O U19 MM_CS3# O Y10 MM_CLK0 O U20 MM_CS1# O Y11 MM_A03 O V1 MM_DQM2 O Y12 MM_A01 O V2 MM_DQ24 I/O Y13 MM_A11 O V3 MM_DQ25 I/O Y14 MM_A13 O O Y15 MM_CAS# O GND Y16 MM_DQ14 I/O N11 VSS GND U13 VCC N12 VSS GND N13 VSS GND N17 VDD PWR N18 VDD PWR V4 MM_DQM3 N19 VO_DATA1 O V5 VSS N20 VO_DATA2 O V6 MM_DQ19 I/O Y17 MM_DQ12 I/O P1 PCI_AD05 I/O V7 VCC PWR Y18 MM_DQ10 I/O P2 PCI_AD04 I/O V8 PWR Y19 MM_CKE0 O P3 VCC PWR VDD O Y20 MM_DQ00 I/O P4 VCC PWR P17 VCC PWR P18 VCC PWR P19 TESTMODE I P20 VO_DATA0 O R1 PCI_AD03 I/O R2 PCI_AD02 I/O R3 PCI_AD01 R4 VCC Revision 2.2 V9 MM_A06 V10 VCC PWR V11 VCC PWR V12 MM_A10 V13 VDD PWR V14 VCC PWR V15 MM_DQ15 V16 VSS V17 MM_DQ09 I/O PWR O I/O GND 11 I/O www.national.com Geode™ CS1301/CS1311 Signal Definitions (Continued) Geode™ CS1301/CS1311 Signal Definitions (Continued) Table 2-3. Ball Assignment Sorted Alphabetically by Signal Name Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. AI_OSCLK B15 MM_DQ11 W17 PCI_AD22 C3 AI_SCK A16 MM_DQ12 Y17 PCI_AD23 A1 VDD (2.5V Core Power Supply, Total of 24) AI_SD C15 MM_DQ13 W16 PCI_AD24 A3 AI_WS B16 MM_DQ14 Y16 PCI_AD25 C4 AO_OSCLK B14 MM_DQ15 V15 PCI_AD26 B4 AO_SCK A14 MM_DQ16 W7 PCI_AD27 A4 C8, C13, D8, D9, D12, D13, H3, H4, H17, H18, J4, J17, M4, M17, N3, N4, N17, N18, U8, U9, U12, U13, V8, V13 AO_SD1 B13 MM_DQ17 Y6 PCI_AD28 A5 AO_SD2 A13 MM_DQ18 W6 PCI_AD29 C6 AO_SD3 C12 MM_DQ19 V6 PCI_AD30 B6 AO_SD4 B12 MM_DQ20 Y5 PCI_AD31 A6 AO_WS A15 MM_DQ21 W5 PCI_C/BE0# M3 BOOT_CLK T20 MM_DQ22 Y4 PCI_C/BE1# J3 IIC_SCL R20 MM_DQ23 W4 PCI_C/BE2# D2 IIC_SDA R19 MM_DQ24 V2 PCI_C/BE3# B3 JTAG_TCK F19 MM_DQ25 V3 PCI_CLK T2 JTAG_TDI F20 MM_DQ26 W1 PCI_DEVSEL# F1 JTAG_TDO F18 MM_DQ27 W2 PCI_FRAME# E2 JTAG_TMS E20 MM_DQ28 Y1 PCI_GNT# B5 MM_A00 W12 MM_DQ29 Y2 PCI_IDSEL A2 MM_A01 Y12 MM_DQ30 W3 PCI_INTA# C9 MM_A02 W11 MM_DQ31 Y3 PCI_INTB# A8 MM_A03 Y11 MM_DQM0 T19 PCI_INTC# B8 MM_A04 Y9 MM_DQM1 R18 PCI_INTD# A7 MM_A05 W9 MM_DQM2 V1 PCI_IRDY# E1 MM_A06 V9 MM_DQM3 V4 PCI_PAR H1 MM_A07 Y8 MM_RAS# W14 PCI_PERR# G1 MM_A08 W8 MM_WE# W15 PCI_REQ# B7 MM_A09 Y7 NC (Total of 8) PCI_SERR# H2 MM_A10 V12 PCI_STOP# G2 MM_A11 Y13 A9, A10, A11, B9, B10, B11, E19, D19 PCI_TRDY# F3 MM_A12 W13 PCI_AD00 T1 SCANCPU D20 MM_A13 Y14 PCI_AD01 R3 SPDO A12 MM_CAS# Y15 PCI_AD02 R2 TESTMODE P19 MM_CKE0 Y19 PCI_AD03 R1 TRI_CLKIN L20 MM_CKE1 U1 PCI_AD04 P2 TRI_RESET# G19 MM_CLK0 Y10 PCI_AD05 P1 TRI_TIMER_CLK H19 MM_CLK1 W10 PCI_AD06 N2 TRI_USERIRQ G20 MM_CS0# U2 PCI_AD07 N1 MM_CS1# U20 PCI_AD08 M2 VCC (3.3V I/O Power Supply, Total of 40) MM_CS2# U3 PCI_AD09 M1 MM_CS3# U19 PCI_AD10 L2 MM_DQ00 Y20 PCI_AD11 L1 MM_DQ01 V18 PCI_AD12 K1 MM_DQ02 W19 PCI_AD13 K2 MM_DQ03 W20 PCI_AD14 J1 MM_DQ04 U18 PCI_AD15 J2 MM_DQ05 V19 PCI_AD16 D1 MM_DQ06 V20 PCI_AD17 D3 MM_DQ07 T18 PCI_AD18 C1 C7, C10, C11, C14, D6, D7, D10, D11, D14, D15, F4, F17, G3, G4, G17, G18, K3, K4, K17, K18, L3, L4, L17, L18, P3, P4, P17, P18, R4, R17, U6, U7, U10, U11, U14, U15, V7, V10, V11, V14 MM_DQ08 W18 PCI_AD19 B2 MM_DQ09 V17 PCI_AD20 B1 MM_DQ10 Y18 PCI_AD21 C2 www.national.com 12 VDDQ K20 VI_CLK C20 VI_DATA0 D18 VI_DATA1 C19 VI_DATA2 B20 VI_DATA3 B19 VI_DATA4 A20 VI_DATA5 A19 VI_DATA6 C17 VI_DATA7 B18 VI_DATA8 A18 VI_DATA9 B17 VI_DVALID A17 VO_CLK J19 VO_DATA0 P20 VO_DATA1 N19 VO_DATA2 N20 VO_DATA3 M18 VO_DATA4 M19 VO_DATA5 M20 VO_DATA6 K19 VO_DATA7 J20 VO_IO1 J18 VO_IO2 H20 VREF_PCI F2 VREF_PERIPH C18 VSS (Ground Connection, Total of 55) C5, C16, D4, D5, D16, D17, E3, E4, E17, E18, H8, H9, H10, H11, H12, H13, J8, J9, J10, J11, J12, J13, K8, K9, K10, K11, K12, K13, L8, L9, L10, L11, L12, L13, M8, M9, M10, M11, M12, M13, N8, N9, N10, N11, N12, N13, T3, T4, T17, U4, U5, U16, U17, V5, V16, VSSQ L19 Revision 2.2 2.2 2.2.1 SIGNAL DESCRIPTIONS System Interface Signals Signal Name Ball No. Type TRI_CLKIN L20 I Description Main Input Clock. The SDRAM clock outputs (MM_CLK0 and MM_CLK1) can be set to 2x or 3x this frequency. The on-chip DSPCPU clock (DSPCPU_CLK) can be set to 1x, 5/4, 4/3, 3/2 or 2x the SDRAM clock frequency. The maximum recommended ppm level is ±100 ppm or lower to improve jitter on generated clocks. The duty cycle should not exceed 30/70% asymmetry. The operating limits of the internal PLLs are: • 27 MHz < Output of the SDRAM PLL < 200 MHz • 33 MHz < Output of the CPU PLL < 266 MHz These are not the speed grades of the chips, just the PLL limits. TRI_USERIRQ G20 I General Purpose Level/Edge Interrupt Input. Vectored interrupt source number 4. TRI_TIMER_CLK H19 I External General Purpose Clock Source for Timers. Maximum 40 MHz. TRI_RESET# G19 I CS1301/CS1311 RESET Input. This pin can be tied to the PCI_RST# signal in the PCI bus systems. Upon releasing RESET, CS1301/CS1311 initiates its boot protocol. F2 PWR PCI Voltage Reference. Determines the mode of operation of the PCI pins. VREF_PCI must be connected to VSS (0V) for use in 3.3V PCI signaling environment, as is the case for a Geode SCx200 system. VREF_PCI The supply to this pin should be AC bypassed and provide 40 mA of DC sink or source capability. VREF_PERIPH C18 PWR Peripheral Voltage Reference. Determines the mode of operation of the I/O pins listed in Section 2.3 "Reference Voltages" on page 22. VREF_PERIPH must be connected to 5.0V if the designated I/O pins listed in Section 2.3 should be 5.0V input voltage capable. VREF_PERIPH must be connected to VSS (0V) if the designated I/O pins listed in Section 2.3 are 3.3V only inputs. The supply to this pin should be AC bypassed and provide 40 mA of DC sink or source capability. Revision 2.2 13 www.national.com Geode™ CS1301/CS1311 Signal Definitions (Continued) Geode™ CS1301/CS1311 Signal Definitions (Continued) 2.2.2 Memory Interface Signals Signal Name Ball No. Type MM_CLK0 Y10 O MM_CLK1 W10 Description SDRAM Output Clock (at 2x or 3x TRI_CLKIN frequency). Two identical outputs are provided to reliably drive several small memory configurations without external glue. A series terminating resistor close to CS1301/CS1311 is required to reduce ringing. For driving a 50Ω trace, a resistor of 27 to 33Ω is recommended. The use of higher impedance traces in the SDRAM signals is not recommended. MM_A[13:00] Address Bus. Used for row and column addresses. See Table 2-3 on page 12 O See Table 2-3 on page 12 I/O 32-Bit Data I/O Bus. The Main Memory Interface module also supports a 16-bit I/O interface. MM_CKE0 Y19 O MM_CKE1 U1 Clock Enable Output to SDRAMs. Two identical outputs are provided in order to reliably drive several small memory configurations without external glue. MM_CS0# U2 O MM_CS1# U20 Chip Select for DRAM rank n; active low. The chip select pins may be used as address pins to support the 256-Mbit SDRAM device organized in x16. MM_CS2# U3 MM_CS3# U19 MM_RAS# W14 O Row Address Strobe; active low. MM_CAS# Y15 O Column Address Strobe; active low. MM_WE# W15 O Write Enable; active low. MM_DQM0 T19 O MM_DQM1 R18 Data Mask Enable. These are byte-enable signals for the 32-bit MM_DQ bus. MM_DQM2 V1 MM_DQM3 V4 MM_DQ[31:00] www.national.com WARNING: Do not connect MM_A[13:11] directly to SDRAM A[13:11] pins. Refer to Chapter 12 SDRAM Memory System of the Philips Semiconductor PNX1300 Series Media Processors Data Book for accurate connection diagrams. 14 Revision 2.2 2.2.3 PCI Interface Signals Ball No. Type T2 I See Table 2-3 on page 12 I/O Multiplexed Address and Data. PCI_C/BE0# M3 I/O PCI_C/BE1# J3 Multiplexed Bus Commands and Byte-Enables. High for command, low for byte-enable. PCI_C/BE2# D2 Signal Name PCI_CLK PCI_AD[31:00] Description PCI Clock. All PCI input signals are sampled with respect to the rising edge of this clock. All PCI outputs are generated based on this clock. This clock is required for normal operation of the PCI module. PCI_C/BE3# B3 PCI_PAR H1 I/O Parity. Even parity across AD and C/BE# lines. PCI_FRAME# E2 I/O Frame Sustained TRI-STATE. Frame is driven by a master to indicate the beginning and duration of an access. PCI_IRDY# E1 I/O Initiator Ready Sustained TRI-STATE. Initiator Ready indicates that the bus master is ready to complete the current data phase. PCI_TRDY# F3 I/O Target Ready Sustained TRI-STATE. Target Ready indicates that the bus target is ready to complete the current data phase. PCI_STOP# G2 I/O Stop Sustained TRI-STATE. Indicates that the target is requesting that the master stop the current transaction. PCI_IDSEL A2 I PCI_DEVSEL# F1 I/O Device Select Sustained TRI-STATE. Indicates whether any device on the bus has been selected. PCI_REQ# B7 O Request. Driven by the CS1301/CS1311 as a PCI bus master to request use of the PCI bus. PCI_GNT# B5 I Grant. Indicates to the CS1301/CS1311 that access to the PCI bus has been granted. PCI_PERR# G1 I/O Parity Error Sustained TRI-STATE. Parity error generated/received by CS1301/CS1311. PCI_SERR# H2 OD System Error. This signal is asserted when operating as a target and detecting an address parity error. PCI_INTA# C9 I/OD PCI_INTB# A8 I/O/OD PCI Interrupts A, B, C, and D. Can operate as an input (power-up default) or output, as determined by direction control bits in PCI MMIO register INT_CTL. PCI_INTC# B8 I/OD PCI_INTD# A7 I/OD ID Select. Used as chip select during configuration read/write cycles. As an input, PCI_INT# can be used to receive PCI interrupt requests (normal PCI use is active low, level-sensitive mode, but the VIC can be set to treat these as a positive edge triggered mode). As an input, PCI_INT# can also be used as a general interrupt request if not needed for PCI. As an output, the value of a PCI_INT# can be programmed through PCI MMIO registers to generate interrupts for other PCI masters. Note: Revision 2.2 Current buffer design allows drive/receive from either 3.3V or 5.0V PCI bus. 15 www.national.com Geode™ CS1301/CS1311 Signal Definitions (Continued) Geode™ CS1301/CS1311 Signal Definitions (Continued) 2.2.4 Video In Interface Signals Signal Name Ball No Type VI_CLK C20 I/O Description Clock. This signal can be configured as either an input or an output: If configured as an input (power-up default): A positive transition on this incoming video clock pin samples VI_DATA[09:00] if VI_DVALID is high. If VI_DVALID is low, VI_DATA[09:00] is ignored. Clock and data rates of up to 81 MHz are supported. The CS1301/CS1311 supports an additional mode where VI_DATA[09:08] in message passing mode are not affected by the VI_DVALID signal. If configured as an output: VI_CLK performs as a programmable output clock to drive an external video A/D converter. It can be programmed to emit integral dividers of DSPCPU_CLK. If used as an output, a board level 27 to 33Ω series resistor is recommended to reduce ringing. A17 I Data Valid. VI_DVALID indicates that valid data is present on VI_DATA[09:00]. If high, VI_DATA will be accepted on the next VI_CLK positive edge. If low, VI_DATA[09:00] will not be sampled. However, the CS1301/CS1311 supports an additional mode where VI_DATA[9:8] in message passing mode are not affected by the VI_DVALID signal. VI_DATA[07:00] B18, C17, A19, A20, B19, B20, C19, D18 I Data Bus Lines [7:0]. CCIR-656 style YUV 4:2:2 data from a digital camera or general purpose high speed data input pins. Sampled on VI_CLK if VI_DVALID is high. VI_DATA[09:08] B17, A18 VI_DVALID Note: Data Bus Lines [9:8]. Extension high speed data input bits to allow use of 10-bit video A/D converters in raw10 modes. VI_DATA serves as START and VI_DATA as END message input in message passing mode. Sampled on positive transitions of VI_CLK if VI_DVALID is high. The CS1301/CS1311 supports an additional mode where VI_DATA[09:08] in message passing mode are not affected by the VI_DVALID signal. Video In and Audio In are supported by third party software solutions, not by the National solution. www.national.com 16 Revision 2.2 2.2.5 Video Out Interface Signals Signal Name Ball No. Type VO_CLK J19 I/O Description Clock. The VO module emits VO_DATA[07:00] on a positive edge of VO_CLK. VO_CLK can be configured as an input (reset default) or output. If configured as an input: VO_CLK is received from external display clock master circuitry. If configured as an output: The CS1301/CS1311 emits a programmable clock frequency. The emitted frequency can be set between approximately 4 and 81 MHz with a sub-Hertz resolution. The clock generated is frequency accurate and has low jitter properties due to a combination of an on-chip DDS (Direct Digital Synthesizer) and VCO/PLL. If used as an output, a board level 27 to 33Ω series resistor is recommended to reduce ringing. VO_IO1 J18 I/O Input/Output 1. This pin can function as HS (Horizontal Sync) output or as STMSG (Start Message) output. If set as HS output: VO_IO1 outputs the HS output signal. In message passing mode, VO_IO1 acts as the STMSG output signal. VO_IO2 H20 I/O Input/Output 2. This pin can function as FS (Frame Sync) input, FS output or as ENDMSG (End Message) output. If set as FS input, it can be set to respond to positive or negative edge transitions. If the VO module operates in external sync mode and the selected transition occurs, the VO module sends two fields of video data. Note: this works only once after a reset. In message passing mode, this pin acts as ENDMSG output signal. VO_DATA[07:00] Revision 2.2 K20, K12, M20, M19, M18, N20, N19, P20 O Data Bus. CCIR-656 style YUV 4:2:2 digital output data, or general purpose high-speed data output channel. Output changes on positive edge of VO_CLK. 17 www.national.com Geode™ CS1301/CS1311 Signal Definitions (Continued) Geode™ CS1301/CS1311 Signal Definitions (Continued) 2.2.6 Audio In Interface Signals Signal Name Ball No. Type AI_OSCLK B15 O Over-Sampling Clock. This output can be programmed to emit any frequency up to 40 MHz with a sub-Hertz resolution. It is intended for use as the 256fs or 384fs over-sampling clock by external A/D subsystem. A board level 27 to 33Ω series resistor is recommended to reduce ringing. AI_SCK A16 I/O Serial Clock. When the AI module is programmed as a serial-interface timing slave (power-up default), AI_SCK is an input. AI_SCK receives the serial bit clock from the external A/D subsystem. This clock is treated as fully asynchronous to the CS1301/CS1311 main clock. Description When the AI module is programmed as the serial-interface timing master, AI_SCK is an output. AI_SCK drives the serial clock for the external A/D subsystem. The frequency is a programmable integral divisor of the AI_OSCLK frequency. AI_SCK is limited to 22 MHz. The sample rate of valid samples embedded within the serial stream is variable. If used as an output, a board level 27 to 33Ω series resistor is recommended to reduce ringing. AI_SD C15 I Serial Data. Serial data from external A/D subsystem. Data on this pin is sampled on positive or negative edges of AI_SCK as determined by the CLOCK_EDGE bit in the AI_SERIAL register. AI_WS B16 I/O Word-Select. AI_WS is the word-select or frame-synchronization signal from/to the external A/D subsystem. When the AI module is programmed as the serial-interface timing slave (power-up default), AI_WS acts as an input. AI_WS is sampled on the same edge as selected for AI_SD. When the AI module is programmed as the serial-interface timing master, AI_WS acts as an output. It is asserted on the opposite edge of the AI_SD sampling edge. Note: The AI module always acts as receiver, but can be master or slave for A/D timing. Video In and Audio In are supported by third party software solutions, not by the National solution. www.national.com 18 Revision 2.2 2.2.7 Audio Out Interface Signals Signal Name Ball No. Type AO_OSCLK B14 O Over-Sampling Clock. This output can be programmed to emit any frequency up to 40 MHz, with a sub-Hertz resolution. It is intended for use as the 256 or 384 fs over-sampling clock by the external D/A conversion subsystem. A board-level 27 to 33Ω series resistor is recommended to reduce ringing. AO_SCK A14 I/O Serial Clock. When the Audio Out (AO) module is programmed to act as the serial interface timing slave (power-up default), AO_SCK acts as an input. It receives the Serial Clock from the external audio D/A subsystem. The clock is treated as fully asynchronous to the CS1301/CS1311 main clock. Description When the AO module is programmed to act as the serial interface timing master, AO_SCK acts as an output. It drives the serial clock for the external audio D/A subsystem. The clock frequency is a programmable integral divisor of the AO_OSCLK frequency. AO_SCK is limited to 22 MHz. The sample rate of valid samples embedded within the serial stream is variable. If used as an output, a board-level 27 to 33Ω series resistor is recommended to reduce ringing. AO_SD1 B13 AO_SD2 A13 AO_SD3 C12 AO_SD4 B12 AO_WS A15 O Serial Data Buses. Serial data to external stereo audio D/A subsystem. The timing of transitions on this output is determined by the CLOCK_EDGE bit in the AO_SERIAL register, and can be on positive or negative AO_SCK edges. I/O Word-Select or Frame synchronization. Signal from/to the external D/A subsystem. Each audio channel receives 1 sample for every WS period. When the AO module is programmed as the serial interface timing slave (power-up default), AO_WS acts as an input. AO_WS is sampled on the opposite AO_SCK edge from which AO_SDx are asserted. When the AO module is programmed as serial interface timing master, AO_WS acts as an output. AO_WS is asserted on the same AO_SCK edge as AO_SDx. Note: 2.2.8 The AO module always acts as sender, but can be master or slave for D/A timing. S/PDIF Interface Signals Signal Name Ball No. Type SPDO A12 O Revision 2.2 Description S/PDIF Data Out. Self-clocking serial data stream as per IEC958, with 1937 extensions. Note that the low impedance output buffer requires a 27 to 33Ω series terminator close to CS1301/CS1311 in order to match the board trace impedance. This series terminator must be part of the voltage divider needed to create the coaxial output through the AC isolation transformer. 19 www.national.com Geode™ CS1301/CS1311 Signal Definitions (Continued) Geode™ CS1301/CS1311 Signal Definitions (Continued) 2.2.9 ACCESS.bus Interface Signals Signal Name Ball No. Type Description IIC_SDA R19 I/OD ACCESS.bus Serial Data. IIC_SCL R20 I/OD ACCESS.bus Serial Clock. Description 2.2.10 JTAG Interface Signals Signal Name Ball No. Type JTAG_TDI F20 I JTAG_TDO F18 I/O JTAG_TCK F19 I JTAG Test Clock Input. JTAG_TMS E20 I JTAG Test Mode Select Input. JTAG Test Data Input. JTAG Test Data Output. This pin can either drive active low, high or float. 2.2.11 Test and Measurement Interface Signals Signal Name Ball No. Type BOOT_CLK T20 I Boot Clock. Used for testing purposes. Must be connected to TRI_CLKIN for normal operation. TESTMODE P19 I Test Mode. Used for testing purposes. Must be connected to VSS for normal operation. SCANCPU D20 I Scan CPU. Used for testing purposes. Must be connected to VSS for normal operation. www.national.com Description 20 Revision 2.2 2.2.12 Power, Ground, and No Connections Signal Name Ball No. Type Description VDDQ K20 PWR Quiet VDD for the PLL Subsystem. Should be supplied from VDD through a low-Q series inductor. It should be bypassed for AC to VSSQ, using a dual capacitor bypass (high and low frequency AC bypass). VSSQ L19 GND Quiet VSS for the PLL Subsystem. Should be AC bypassed to VDDQ, otherwise left DC floating. It is connected on-chip to VSS. No external coil or other connection to board ground is needed; such a connection would create a ground loop. VDD See Table 2-3 on page 12 PWR 2.5V CS1301 Core Power Connection (Total of 24). VCC See Table 2-3 on page 12 PWR 3.3V I/O Power Connection (Total of 24). VSS See Table 2-3 on page 12 GND Ground Connection (Total of 50). NC A9, A10, A11, B9, B10, B11, E19, D19 --- Revision 2.2 2.2V CS1311 Core Power Connection (Total of 24). No Connection. For normal operation, leave unconnected. 21 www.national.com Geode™ CS1301/CS1311 Signal Definitions (Continued) Geode™ CS1301/CS1311 Signal Definitions (Continued) 2.3 REFERENCE VOLTAGES Outputs always drive to a level determined by the 3.3V I/O voltage, with the exception of Open Drain mode outputs. VREF_PCI Determined Mode VREF_PERIPH and VREF_PCI determine input voltage clamping, not input signal thresholds or output levels. VREF_PERIPH Determined Mode SDRAM Interface (3.3V Mode) Inputs (3.3V Mode) Output Only Pins PCI_AD00 PCI_AD27 TRI_USERIRQ MM_CLK0 MM_DQM2 TRI_CLKIN VO_DATA0 PCI_AD01 PCI_AD28 TRI_TIMER_CLK MM_CLK1 MM_DQM3 BOOT_CLK VO_DATA1 PCI_AD02 PCI_AD29 JTAG_TDI MM_A00 MM_DQ13 TESTMODE VO_DATA2 PCI_AD03 PCI_AD30 JTAG_TDO MM_A01 MM_DQ14 SCANCPU VO_DATA3 PCI_AD04 PCI_AD31 JTAG_TCK MM_A02 MM_DQ15 VO_DATA4 PCI_AD05 PCI_CLK JTAG_TMS MM_A03 MM_DQ16 VO_DATA5 PCI_AD06 PCI_C/BE#0 VI_CKL MM_A04 MM_DQ17 VO_DATA6 PCI_AD07 PCI_C/BE#1 VI_DVALID MM_A05 MM_DQ18 VO_DATA7 PCI_AD08 PCI_C/BE#2 VI_DATA0 MM_A06 MM_DQ19 AO_OSCLK PCI_AD09 PCI_C/BE#3 VI_DATA1 MM_A07 MM_DQ20 AO_SCK PCI_AD10 PCI_PAR VI_DATA2 MM_A08 MM_DQ21 AO_SD1 PCI_AD11 PCI_FRAME# VI_DATA3 MM_A09 MM_DQ22 AO_SD2 PCI_AD12 PCI_IRDY# VI_DATA4 MM_A10 MM_DQ23 AO_SD3 PCI_AD13 PCI_TRDY# VI_DATA5 MM_A11 MM_DQ24 AO_SD4 PCI_AD14 PCI_STOP# VI_DATA6 MM_A12 MM_DQ25 SPDO PCI_AD15 PCI_IDSEL VI_DATA7 MM_A13 MM_DQ26 PCI_AD16 PCI_DEVSEL# VI_DATA8 MM_DQ00 MM_DQ27 PCI_AD17 PCI_REQ# VI_DATA9 MM_DQ01 MM_DQ28 PCI_AD18 PCI_GNT# IIC_SDA MM_DQ02 MM_DQ29 PCI_AD19 PCI_PERR# IIC_SCL MM_DQ03 MM_DQ30 PCI_AD20 PCI_SERR# VO_IO1 MM_DQ04 MM_DQ31 PCI_AD21 PCI_INTA# VO_IO2 MM_DQ05 MM_CKE0 PCI_AD22 PCI_INTB# VO_CLK MM_DQ06 MM_CKE1 PCI_AD23 PCI_INTC# AI_SCK MM_DQ07 MM_CS0# PCI_AD24 PCI_INTD# AI_SD MM_DQ08 MM_CS1# PCI_AD25 TRI_RESET# AI_WS MM_DQ09 MM_CS2# AO_SCK MM_DQ10 MM_CS3# PCI_AD26 AO_WS MM_DQ11 MM_RAS# MM_DQ12 MM_CAS# MM_DQM0 MM_WE# MM_DQM1 www.national.com 22 Revision 2.2 Geode™ CS1301/CS1311 3.0 Package Specifications NOTES: UNLESS OTHERWISE SPECIFIED. 1) SOLDER BALL COMPOSITION: SN 63%, PB 37%. 2) DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N. 3) THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION. 4) REFERENCE JEDEC REGISTRATION MS-034, VARIATION BAL-1. Figure 3-1. 292-Terminal TEPBGA (Body Size: 27x27x2.33 mm; Pitch: 1.27 mm) Revision 2.2 23 www.national.com Geode™ CS1301/CS1311 Appendix A Support Documentation A.1 ORDERING INFORMATION Part Marking Core Frequency (MHz) Core Voltage (V) Temperature (Degree C) Package CS1301 CS1301 180 2.5 0 - 85 TEPBGA CS1311 CS1311 166 2.2 0 - 85 TEPBGA Order Number (NSID) Note: Due to licensing agreements, the CS1301/CS1311 can only be purchased by those customers using a Geode processor-based design. A.2 CUSTOMER SUPPORT National is the primary contact for all technical support issues. For certain software modules listed, National does not have access to source code. For these software modules, National will work directly with intellectual property owners of these software modules to provide customer support. A.3 PRODUCT BRIEF REVISION HISTORY This section is a report of the revision/creation process of the product brief for the Geode CS1301/CS1311. Any revisions (i.e., additions, deletions, parameter corrections, etc.) are recorded in the table below. Note: This product brief must be used in conjunction with the Philips Semiconductor PNX1300 Series Media Processors Data Book for a complete understanding of the CS1301/CS1311 (posted on National’s IA Developer’s web site). Table A-1. Revision History Revision # (PDF Date) 1.0 (November 2001) Revisions / Comments First draft of product brief. (Confidential) 2.0 (April 2002) Updated to include a list of supported software and software block diagram. (Confidential) 2.1 (July 2002) Updated to include Signal Definitions and Package Specifications sections. (No longer confidential, to be posted on National external web site in the product folders.) 2.2 (August 2002) Replaced “Product Brief” with “Preliminary”. Updated package specifications to use National supplied drawing and changed HBGA to TEPBGA. (These changes were made to meet Corporate standard requirements, revision 2.1 was never posted on National external web site.) www.national.com 24 Revision 2.2 Geode™ CS1301/CS1311 Multimedia Companion: Media Data Processor LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Email: [email protected] 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: [email protected] Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 87 90 National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: [email protected] National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 Email: [email protected] www.national.com National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.