LM6162/LM6262/LM6362 High Speed Operational Amplifier Y General Description Y The LM6362 family of high-speed amplifiers exhibits an excellent speed-power product, delivering 300 V/ms and 100 MHz gain-bandwidth product (stable for gains as low as a 2 or b 1) with only 5 mA of supply current. Further power savings and application convenience are possible by taking advantage of the wide dynamic range in operating supply voltage which extends all the way down to a 5V. These amplifiers are built with National’s VIPTM (Vertically Integrated PNP) process which provides fast transistors that are true complements to the already fast NPN devices. This advanced junction-isolated process delivers high speed performance without the need for complex and expensive dielectric isolation. Y Y Y Y Y Low supply current Fast settling time Low differential gain Low differential phase Wide supply range Stable with unlimited capacitive load Well behaved; easy to apply 5 mA 120 ns to 0.1% k 0.1% k 0.1§ 4.75V to 32V Applications Y Y Y Y Video amplifier Wide-bandwidth signal conditioning for image processing (FAX, scanners, laser printers) Hard disk drive preamplifier Error amplifier for high-speed switching regulator Features Y Y High slew rate High gain-bandwidth product 300 V/ms 100 MHz Connection Diagrams 10-Pin Ceramic Flatpak 20-Lead LCC TL/H/11061 – 15 Top View See NS Package Number W10A TL/H/11061 – 2 See NS Package Number N08E, M08A or J08A TL/H/11061–14 Top View See NS Package Number E20A Temperature Range Military b 55§ C s TA s a 125§ C Industrial b 25§ C s TA s a 85§ C Commercial 0§ C s TA s a 70§ C LM6162N LM6262N LM6362N LM6162J/883 5962-9216501PA LM6262M LM6362M NSC Drawing Package 8-Pin Molded DIP N08E 8-Pin Ceramic DIP J08A 8-Pin Molded Surface Mt. M08A LM6162E/883 5962-92165012A 20-Lead LCC E20A LM6162W/883 5962-9216501HA 10-Pin Ceramic Flatpak W10A VIPTM is a trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/H/11061 RRD-B30M115/Printed in U. S. A. LM6162/LM6262/LM6362 High Speed Operational Amplifier September 1995 Absolute Maximum Ratings (Note 1) See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ for other methods of soldering surface mount devices. If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage (V a – Vb) Differential Input Voltage (Note 2) Common-Mode Input Voltage (Note 3) Storage Temperature Range 36V g 8V (V a b0.7V) to (Vb a 0.7V) Output Short Circuit to GND (Note 4) Soldering Information Dual-In-Line Package (N) Soldering (10 seconds) Small Outline Package (M) Vapor Phase (60 seconds) Infrared (15 seconds) b 65§ C s TJ s a 150§ C Max Junction Temperature ESD Tolerance (Note 5) 150§ C g 1100V Operating Ratings Continuous Temperature Range (Note 6) LM6162 260§ C b 55§ C s TJ s a 125§ C b 25§ C s TJ s a 85§ C LM6262 LM6362 Supply Voltage Range 215§ C 220§ C 0§ C s TJ s a 70§ C 4.75V to 32V DC Electrical Characteristics These limits apply for supply voltage e g 15V, VCM e 0V, and RL t 100 kX, unless otherwise specified. Limits in standard typeface are for TA e TJ e 25§ C; limits in boldface type apply over the Operating Temperature Range. Symbol VOS Parameter Typical (Note 7) Conditions Input Offset Voltage DVOS DTemp Input Offset Voltage Average Drift Ibias Input Bias Current IOS Input Offset Current DIOS DTemp Input Offset Current Average Drift RIN Input Resistance CIN Input Capacitance AVOL Large Signal Voltage Gain VCM Input Common-Mode Voltage Range g3 LM6162 Limit (Note 8) LM6262 Limit (Note 8) LM6362 Limit (Note 8) g5 g5 g 13 g8 g8 g 15 7 2.2 g 150 Differential RL e 10 kX 3 6 3 5 4 6 mA max nA max g 350 g 350 g 1500 g 800 g 600 g 1900 0.3 nA/§ C 180 kX 1400 pF 1000 500 1000 700 800 650 a 14.0 a 13.9 a 13.8 a 13.9 a 13.8 a 13.8 a 13.7 V min b 13.2 b 12.9 b 12.7 b 12.9 b 12.7 b 12.9 b 12.8 V max 4.0 3.9 3.8 3.9 3.8 3.8 3.7 V min 1.6 1.8 2.0 1.8 2.0 1.9 2.0 V max 100 83 79 83 79 76 74 dB min 93 83 79 83 79 76 74 dB min a 13.5 a 13.3 a 13.5 a 13.3 a 13.4 13.3 V min b 13.0 b 12.7 b 13.0 b 12.8 b 12.9 b 12.8 V max 6500 Supply e g 15V Supply e a 5V (Note 10) CMRR Common-Mode Rejection Ratio b 10V s VCM s a 10V PSRR Power Supply Rejection Ratio g 10V s VS s g 16V VO Output Voltage Swing Supply e g 15V, RL e 2 kX a 14.2 b 13.4 2 mV max mV/§ C 2.0 VOUT e g 10V, RL e 2 kX (Note 9) Units V/V min V/V DC Electrical Characteristics (Continued) These limits apply for supply voltage e g 15V, VCM e 0V, and RL t 100 kX, unless otherwise specified. Limits in standard typeface are for TA e TJ e 25§ C; limits in boldface type apply over the Operating Temperature Range. Symbol VO IOSC IS LM6162 Limit (Note 8) LM6262 Limit (Note 8) LM6362 Limit (Note 8) Units 4.2 3.5 3.3 3.5 3.3 3.4 3.3 V min 1.3 1.7 2.0 1.7 1.9 1.8 1.9 V max Sourcing 65 30 20 30 25 30 25 mA min Sinking 65 30 20 30 25 30 25 mA min 5.0 6.5 6.8 6.5 6.7 6.8 6.9 mA max Parameter Conditions Output Voltage Swing Supply e a 5V and RL e 2 kX (Note 10) Output Short Circuit Current Typical (Note 7) Supply Current AC Electrical Characteristics These limits apply for supply voltage e g 15V, VCM e 0V, RL t 100 kX, and CL s 5 pF, unless otherwise specified. Limits in standard typeface are for TA e TJ e 25§ C; limits in boldface type apply over the Operating Temperature Range. Symbol Parameter Typical (Note 7) Conditions 100 LM6162 Limit (Note 8) LM6262 Limit (Note 8) LM6362 Limit (Note 8) Units 80 55 80 65 75 65 MHz min 200 180 200 180 200 180 V/ms min GBW Gain-Bandwidth Product f e 20 MHz SR Slew Rate AV e a 2 (Note 11) 200 V/ms PBW Power Bandwidth VOUT e 20 VPP 4.5 MHz ts Settling Time 10V step, to 0.1% AV e b1, RL e 2 kX 100 ns wm Phase Margin AV e a 2 45 deg Differential Gain NTSC, AV e a 2 k 0.1 % Differential Phase NTSC, AV e a 2 k 0.1 deg en Input Noise Voltage f e 10 kHz 10 nV/ SHz in Input Noise Current f e 10 kHz 1.2 pA/ SHz Supply e g 5V 70 300 Supply e g 5V MHz Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions. Note 2: The ESD protection circuitry between the inputs will begin to conduct when the differential input voltage reaches 8V. Note 3: a) In addition, the voltage between the V a pin and either input pin must not exceed 36V. b) When the voltage applied to an input pin is driven more than 0.3V below the negative supply pin voltage, a substrate diode begins to conduct. Current through this pin must then be kept less than 20 mA to limit damage from self-heating. Note 4: Although the output current is internally limited, continuous short-circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150§ C. Note 5: This value is the average voltage that the weakest pin combinations can withstand and still conform to the datasheet limits. The test circuit used consists of the human body model, 100 pF in series with 1500X. Note 6: The typical thermal resistance, junction-to-ambient, of the molded plastic DIP (N package) is 105§ C/W. For the molded plastic SO (M package), use 155§ C/W. All numbers apply for packages soldered directly into a printed circuit board. Note 7: Typical values are for TJ e 25§ C, and represent the most likely parametric norm. Note 8: Limits are guaranteed, by testing or correlation. Note 9: Voltage Gain is the total output swing (20V) divided by the magnitude of the input signal required to produce that swing. Note 10: For single-supply operation, the following conditions apply: V a e 5V, Vb e 0V, VCM e 2.5V, VOUT e 2.5V. Pin 1 and Pin 8 (VOS Adjust pins) are each connected to pin 4 (Vb) to realize maximum output swing. This connection will increase the offset voltage. Note 11: VIN e 10V step. For g 5V supplies, VIN e 1V step. Note 12: A military RETS electrical test specification is available on request. 3 Typical Performance Characteristics RL e 10 kX, TA e 25§ C unless otherwise noted Supply Current vs Supply Voltage Common-Mode Rejection Ratio Power Supply Rejection Ratio Gain-Bandwidth Product vs Supply Voltage Gain-Bandwidth Product vs Load Capacitance Propagation Delay, Rise and Fall Times Slew Rate vs Supply Voltage Slew Rate vs Load Capacitance Overshoot vs Load Capacitance Output Impedance (Open-Loop) Voltage Gain vs Load Resistance Voltage Gain vs Supply Voltage TL/H/11061 – 3 4 Typical Performance Characteristics (Continued) RL e 10 kX, TA e 25§ C unless otherwise noted Differential Phase (Note) Differential Gain (Note) TL/H/11061 – 5 Note: Differential gain and differential phase measured for four series LM6362 op amps configured with gain of a 2 each, in series with a 1:16 attenuator and an LM6321 buffer. Error added by LM6321 is negligible. Test performed using Tektronix Type 520 NTSC test system. TL/H/11061 – 4 Input (1V/div) Output (2V/div) Step Response; Av e a 2 TIME (50 ns/div) Input Noise Voltage Input Noise Current TL/H/11061 – 6 Power Bandwidth TL/H/11061 – 7 5 Typical Performance Characteristics (Continued) RL e 10 kX, TA e 25§ C unless otherwise noted Open-Loop Frequency Response Open-Loop High-Frequency Response TL/H/11061–8 Common-Mode Input Voltage Limits TL/H/11061 – 9 Output Saturation Voltage Bias Current vs Common-Mode Voltage TL/H/11061 – 10 Simplified Schematic TL/H/11061 – 1 6 Application Tips Power supply bypassing is not as critical for LM6362 as it is for other op amps in its speed class. However, bypassing will improve the stability and transient response of the LM6362, and is recommended for every design. 0.01 mF to 0.1 mF ceramic capacitors should be used (from each supply ‘‘rail’’ to ground); if the device is far away from its power supply source, an additional 2.2 mF to 10 mF of tantalum may be required for extra noise reduction. Keep all leads short to reduce stray capacitance and lead inductance, and make sure ground paths are low-impedance, especially where heavier currents will be flowing. Stray capacitance in the circuit layout can cause signal coupling from one pin, input or lead to another, and can cause circuit gain to unintentionally vary with frequency. Breadboarded circuits will work best if they are built using generic PC boards with a good ground plane. If the op amps are used with sockets, as opposed to being soldered into the circuit, the additional input capacitance may degrade circuit frequency response. At low gains ( a 2 or b1), a feedback capacitor Cf from output to inverting input will compensate for the phase lag caused by capacitance at the inverting input. Typically, values from 2 pF to 5 pF work well; however, best results can be obtained by observing the amplifier pulse response and optimizing Cf for the particular layout. The LM6362 has been decompensated for a wider gainbandwidth product than the LM6361. However, the LM6362 still offers stability at gains of 2 (and b1) or greater over the specified ranges of temperature, power supply voltage, and load. Since this decompensation involved reducing the emitter-degeneration resistors in the op amp’s input stage, the DC precision has been increased in the form of lower offset voltage and higher open-loop gain. Other op amps in this family include the LM6361, LM6364, and LM6365. If unity-gain stability is required, the LM6361 should be used. The LM6364 has been decompensated for operation at gains of 5 or more, with corresponding greater gain-bandwidth product (125 MHz, typical) and DC precision. The fully-uncompensated LM6365 offers gain-bandwidth product of 725 MHz, typical, and is stable for gains of 25 or more. All parts in this family, regardless of compensation, have the same high slew rate of 300 V/ms (typ). The LM6362 is unusually tolerant of capacitive loads. Most op amps tend to oscillate when their load capacitance is greater than about 200 pF (in low-gain circuits). However, load capacitance on the LM6362 effectively increases its compensation capacitance, thus slowing the op amp’s response and reducing its bandwidth. The compensation is not ideal, though, and ringing may occur in low-gain circuits with large capacitive loads. Typical Applications Offset Voltage Adjustment Inverting Amplifier, 30 MHz Bandwidth TL/H/11061 – 11 Operation on g 15V supplies results in wider bandwidth, 50 MHz (typ). TL/H/11061 – 12 7 Typical Applications (Continued) Video Cable Driver *Network required when operating on supply voltage over g 5V, for overvoltage protection of LM6321. If g 5V supplies are used, omit network and connect output of LM6362 directly to input of LM6321. TL/H/11061 – 13 8 9 Physical Dimensions inches (millimeters) 20-Lead Small Outline Package (E) Order Number LM6162E/883 NS Package Number E20A Ceramic Dual-In-Line Package (J) Order Number LM6162J/883 NS Package Number J08A 10 Physical Dimensions inches (millimeters) (Continued) Molded Package SO (M) Order Number LM6262M or LM6362M NS Package Number M08A Molded Dual-In-Line Package (N) Order Number LM6162N, LM6262N or LM6362N NS Package Number N08E 11 LM6162/LM6262/LM6362 High Speed Operational Amplifier Physical Dimensions inches (millimeters) (Continued) 10-Pin Ceramic Flatpak Order Number LM6162W/883 NS Package Number W10A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 1111 West Bardin Road Arlington, TX 76017 Tel: 1(800) 272-9959 Fax: 1(800) 737-7018 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 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