HI-SINCERITY Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 1/5 MICROELECTRONICS CORP. HSBR20100CT Series to HSBR20150CT Series Schottky Barrier Rectifiers (Reverse Voltage 100V to150V, Forward Current 20A) TO-220AB Features • Low Forward Voltage Drop • High Current Capability • High Reliability • High Surge Current Capability • High ESD capability; Mechanical Data TO-220FP • Cases: TO-220 molded plastic body • Epoxy: UL 94V-0 rate flame retardant • Lead: Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed • High temperature soldering guaranteed: 250°C/10seconds/.375”(9.5mm) lead lengths at 5lbs.(2.3kg) tension • Weight: 2.05gram Maximum Ratings & Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load. Derate current by 20%. Ratings Symbol HSBR HSBR HSBR HSBR 20100CTE 20100CTF 20150CTE 20150CTF Unit Repetitive Peak Reverse Voltage VRRM 100 150 V Surge Peak Reverse Voltage VRSM 70 105 V VDC 100 150 V Average Forward Rectified Current (TA=75 C) IFAV 20 20 A Peak Forward Surge Current, 50Hz Half o Sine-wave (TA=25 C) IFSM 250 250 A Repetitive Peak Forward C (f>15Hz) IFRM 10 10 A VF 0.85 0.90 V 0.2 0.2 mA 20 20 mA DC Blocking Voltage o Instantaneous Forward [email protected] o Leakage Current (TJ=25 C, VR=VRRM) o IR Leakage Current (TJ=100 C, VR=VRRM) Typical thermal resistance Operating Junction Temperature Range Storage Temperature Range HSBR20100CT Series ~HSBR20150CT Series RθJC 2.4 3.5 2.4 3.5 °C/W TJ -65 to +150 °C TSTG -65 to +150 °C HSMC Product Specification HI-SINCERITY Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 2/5 MICROELECTRONICS CORP. Characteristics Curve Typical Instantaneous Forward Characteristics Maximum Non-repet itive Peak Forward Surge Current 280 100 Peak Forward IF,Forward Current 100V 150V 1 0.1 Surge Current( 240 10 T j=T jmax.8.3ms single half sine-wave(JEDEC Method) 200 160 ` 120 80 0.01 40 Ta=25℃ 0 0.001 0 0.2 0.4 0.6 VF,Forward Voltage(V) 0.8 1 1 10 100 Number of Cy cles at 50Hz Typical Reverse Characteristics Typical Reverse Characteristics 10 1 100V Tj=125℃ Tj=100℃ 0.1 Tj=75℃ 0.01 Tj=25℃ 0.001 10 150V Instantaneous Reverse Curren Instantaneous Reverse Curren Tj=150℃ Tj=150℃ 1 Tj=125℃ 0.1 Tj=100℃ 0.01 Tj=75℃ Tj=25℃ 0.001 0.0001 0.0001 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage(V) 120 0 50 100 150 Percent of Rated Peak Reverse Voltage(V) 200 Forward Current Derat ing Curve 20 Current(A) Average Forward Recti 25 15 10 Resist ive or Induct ive Load 0.375"(9.5mm)lead lengt h 5 0 0 25 50 75 100 125 150 175 Lead Temp erature(℃ ) HSBR20100CT Series ~HSBR20150CT Series HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 3/5 TO-220AB Dimension Marking: A F B E C D H M I K 3 G N 2 O P J L Pin Style: 1.Anode 2.Cathode 3.Anode Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 1 Tab Note: Green label is used for pb-free packing DIM A B C D E F G H I J K L M N O P Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48 Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87 *: Typical, Unit: mm 3-Lead TO-220AB Plastic Package HSMC Package Code: E Marking: A F B E C D H M I G N 2 1 Tab O P L K 3 J Note: Green label is used for pb-free packing Pin Style: 1.Anode 2.Cathode 3.Anode Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I J K L M N O P Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48 Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87 *: Typical, Unit: mm 3-Lead TO-220AB Plastic Package HSMC Package Code: E HSBR20100CT Series ~HSBR20150CT Series HSMC Product Specification HI-SINCERITY Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 4/5 MICROELECTRONICS CORP. TO-220FP Dimension Marking: A B α4 α1 E O C α2 D α3 G α5 I H J 3 N 2 F K 3-Lead TO-220FP1 Plastic Package HSMC Package Code: F M L Inches Min. Max. 0.2480 0.2520 0.3386 0.3425 0.1673 0.1870 0.1043 0.1083 0.0230 0.0242 0.3980 0.4039 0.1083 0.1122 0.3386 0.3425 *0.1496 *0.0236 DIM A B C D E F G H I J Millimeters Min. Max. 6.30 6.40 8.60 8.70 4.25 4.75 2.65 2.75 0.58 0.61 10.11 10.26 2.75 2.85 8.60 8.70 *3.80 *0.60 Style: 1.Anode 2.Cathode 3.Anode DIM K L M N O α1 α2 α3 α4 α5 Inches Min. Max. *0.1004 0.5118 0.5906 0.5886 0.5925 *0.0669 0.1098 0.1114 -2° *5° *15° *5° *5° Millimeters Min. Max. *2.55 13.00 15.00 14.95 15.05 *1.70 2.79 2.83 *2° *5° *15° *5° *5° Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712 HSBR20100CT Series ~HSBR20150CT Series HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. HSBR20100CT Series ~HSBR20150CT Series Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 5/5 HSMC Product Specification