IS31AP4833 TREBLE AND BASS CONTROL WITH 3D ENHANCEMENT AUDIO POWER DRIVER August 2012 GENERAL DESCRIPTION FEATURES The IS31AP4833 is a treble and bass control with 3D enhancement audio power driver. The IS31AP4833 provides tone (bass and treble) controls and volume control as well as a stereo audio power amplifier capable of delivering 2.8W into 4Ω with less than 10% THD with a 5V supply. The IS31AP4833 uses flexible I2C control interface for multiple application requirements. It also features 3D sound circuitry which can be externally adjusted via a simple RC network. The IS31AP4833 features a 13 steps tone control (-12dB ~ +12dB, 2dB/step) and a 29 steps volume control (mute, -42dB ~ +12dB, 2dB/step) for the headphone and stereo outputs. The volume and tone are controlled through an I2C compatible interface. The IS31AP4833 can get independent volume control for two channels. IS31AP4833 is available in QFN-36(4mm × 4mm) and TQFP-48(7mm × 7mm) package. It operates from 3.0V to 5.5V over the temperature range of -40°C to +85°C. 3.0V to 5.5V supply Mute control Treble and bass control Independent volume control for two channels Stereo input MUX I2C control interface 3D enhancement Thermal shutdown protection Click-and-pop suppression QFN-36(4mm × 4mm) and TQFP-48(7mm × 7mm) package APPLICATIONS Cell phones, PDA, MP4, PMP Portable and desktop computers Desktops audio system Multimedia monitors TYPICAL APPLICATION CIRCUIT Figure 1 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 Typical Application Circuit 1 IS31AP4833 PIN CONFIGURATION Package Pin Configuration (Top View) 37 INR2 38 NC 39 INR3 40 INR+ 41 INR- 42 GND 43 GND 44 INL- 45 INL+ 46 INL3 47 NC 48 INL2 QFN-36 INL1 1 36 INR1 NC 2 35 NC LOL 3 34 LOR TIL 4 33 TIR OUTL+ 5 32 OUTR+ NC 6 TQFP-48 31 NC VCC 7 30 VCC NC 8 29 NC OUTL- 9 28 OUTR- Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 NC 24 3DP 23 3DN 22 3D_EN 21 HP 20 GND 19 GND 18 RST 17 NC 16 25 SCL BYPASS 15 26 TOR SDA 12 NC 13 27 LIR TOL 11 SDB 14 LIL 10 2 IS31AP4833 PIN DESCRIPTION No. Pin Description QFN-36 TQFP-48 1 1 INL1 Left channel single-ended input1. 2 3 LOL Left channel tone control loop out. 3 4 TIL Left channel tone control in. 4 5 OUTL+ 5, 23 7,30 VCC 6 9 OUTL- 7 10 LIL Left channel tone control loop in. 8 11 TOL Left channel tone control out. 9 12 SDA I2C serial data. 10 14 SDB It will into shutdown mode when pull low. 11 15 BYPASS 12 2,6,8,13,16,24, 29,31,35,38,47 NC No connection. 13 17 RST Reset chip logic and states. Active low. 14,32 18,19,42,43 GND Ground. 15 20 HP 16 21 3D_EN 17 22 3DN Negative channel 3D input. 18 23 3DP Positive channel 3D input. 19 25 SCL I2C serial clock. 20 26 TOR Right channel tone control out. 21 27 LIR Right channel tone control loop in. 22 28 OUTR- Negative output of right channel. 24 32 OUTR+ Positive output of right channel. 25 33 TIR Right channel tone control in. 26 34 LOR Right channel tone control loop out. 27 36 INR1 Right channel single-ended input1. 28 37 INR2 Right channel single-ended input2. 29 39 INR3 Right channel single-ended input3. 30 40 INR+ Right channel positive differential input. 31 41 INR- Right channel negative differential input. 33 44 INL- Left channel negative differential input. 34 45 INL+ Left channel positive differential input. 35 46 INL3 Left channel single-ended input3. 36 48 INL2 Left channel single-ended input2. Thermal Pad Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 Positive output of left channel. Power supply. Negative output of left channel. Bypass capacitor which provides the common mode voltage. Detect HP insert or not. It will into 3D enhance mode when pull high. Connect to GND. 3 IS31AP4833 ORDERING INFORMATION INDUSTRIAL RANGE: -40°C TO +85°C Order Part No. Package QTY IS31AP4833-QFLS2-TR IS31AP4833-TQLS2 QFN-36, Lead-free TQFP-48, Lead-free 2500/Reel 250/Tray Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 4 IS31AP4833 ABSOLUTE MAXIMUM RATINGS Supply voltage, VCC Voltage at any input pin Maximum junction temperature, TJMAX Storage temperature range, TSTG Operating temperature range, TA -0.3V ~ +6.0V -0.3V ~ VCC+0.3V 150°C -65°C ~ +150°C -40°C ~ +85°C Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS TA = 25°C, unless otherwise noted. Typical value are TA = 25°C, VCC = 3.6V. Symbol Parameter Condition VCC Supply voltage ISD Shutdown current ICC Quiescent power supply current VIH_HP HP input high-voltage VIL_HP HP input low-voltage VIH Input high-voltage VIL Input low-voltage Min. Typ. 3.0 VSDB = 0V 1 VSDB = VCC, software shutdown 1 VIN = 0V, IO = 0A, VHP = 0V, no load 6 VIN = 0V, IO = 0A, VHP = 5V, no load 4 VCC = 5.0V 4.1 VCC = 3.0V 2.3 Max. Unit 5.5 V μA mA V VCC = 5.0V 3.4 VCC = 3.0V 1.54 1.4 V V 0.4 V Max. Unit AC CHARACTERISTICS (Note 1) TA = 25°C, VCC = 5.0V, unless otherwise noted. Symbol Po THD+N tWU PSRR VNO Parameter Output power Condition Min. Typ. THD+N = 10%, f = 1kHz, RL = 4Ω, speaker 2.80 THD+N = 1%, f = 1kHz, RL = 4Ω, speaker 2.20 THD+N = 10%, f = 1kHz, RL = 8Ω, speaker 1.75 THD+N = 1%, f = 1kHz, RL = 8Ω, speaker 1.45 THD+N = 10%, f = 1kHz, RL = 32Ω, headphone 0.11 THD+N = 1%, f = 1kHz, RL = 32Ω, headphone 0.091 PO = 1.5W, f = 1kHz, RL = 4Ω, speaker Total harmonic PO = 0.9W, f = 1kHz, RL = 8Ω, speaker distortion plus noise PO = 75mW, f = 1kHz, RL = 32Ω, headphone W 0.069 0.046 % 0.022 Wake-up time from shutdown 130 ms Power supply VCC = 3.0V, f = 217Hz, RL = 8Ωk, speaker rejection ratio -67 dB Noise 60 μV VCC = 3.0V~5.0V, VIN = 0V, RL = 4Ω, speaker Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 5 IS31AP4833 DIGITAL INPUT SWITCHING CHARACTERISTICS (Note 1) Symbol Parameter Condition Min. Typ. Max. Unit 400 kHz fSCL Serial-Clock frequency tBUF Bus free time between a STOP and a START condition 1.3 μs tHD, STA Hold time (repeated) START condition 0.6 μs tSU, STA Repeated START condition setup time 0.6 μs tSU, STO STOP condition setup time 0.6 μs tHD, DAT Data hold time tSU, DAT Data setup time 100 ns tLOW SCL clock low period 1.3 μs tHIGH SCL clock high period 0.7 μs 0.9 μs tR Rise time of both SDA and SCL signals, receiving (Note 2) 20+0.1Cb 300 ns tF Fall time of both SDA and SCL signals, receiving (Note 2) 20+0.1Cb 300 ns Note 1: Guaranteed by design. Note 2: Cb = total capacitance of one bus line in pF. ISINK ≤ 6mA. tR and tF measured between 0.3 × VCC and 0.7 × VCC. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 6 IS31AP4833 TYPICAL PERFORMANCE CHARACTERISTICS 20 20 10 RL = 4Ω f = 1kHz 10 5 THD+N(%) THD+N(%) 5 2 1 0.5 2 1 0.5 VCC = 3.0V PO = 450mW 0.2 0.1 VCC = 3.0V 0.2 VCC = 5.0V PO = 1.5W 0.05 VCC = 5.0V 0.1 0.05 10m RL = 4Ω 0.02 20m 50m 100m 200m 500m 1 2 0.01 3 4 20 50 100 200 THD+N vs. Output Power 5 Figure 3 10 RL = 8Ω f = 1kHz THD+N(%) THD+N(%) 1 0.2 THD+N vs. Frequency RL = 8Ω 1 0.5 VCC = 3.0V PO = 270mW 0.2 0.1 0.1 0.05 0.05 VCC = 5.0V 0.02 20m 50m 100m 200m 500m 1 VCC = 5.0V PO = 900mW 0.02 0.01 2 20 50 100 200 Figure 4 THD+N vs. Output Power Figure 5 RL = 32Ω f = 1kHz 10 2k 5k 10k 20k THD+N vs. Frequency RL = 32Ω 5 2 THD+N(%) 2 THD+N(%) 1k 20 20 1 0.5 VCC = 3.0V 0.2 1 0.5 VCC = 3.0V PO = 25mW 0.2 0.1 0.1 0.05 0.05 VCC = 5.0V PO = 75mW 0.02 0.02 0.01 1m 500 Frequency(Hz) Output Power(W) 5 10k 20k 2 VCC = 3.0V 0.5 10 5k 5 2 0.01 10m 2k 20 20 10 1k Frequency(Hz) Output Power(W) Figure 2 500 VCC = 5.0V 2m 5m 10m 20m 50m 100m 200m 0.01 20 50 100 THD+N vs. Output Power Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 500 1k 2k 5k 10k 20k Frequency(Hz) Output Power(W) Figure 6 200 Figure 7 THD+N vs. Frequency 7 IS31AP4833 +0 200u RL = 8Ω -20 100u VCC = 3.0V -40 70u PSRR(dB) Output Voltage(V) VCC = 3.0V, 5.0V RL = 4Ω 50u 30u -60 -80 VCC = 5.0V 20u -100 10u 20 50 100 200 500 1k 2k 5k 10k -120 20 20k 50 100 500 1k 2k 5k 10k 20k Frequency(Hz) Frequency(Hz) Figure 8 200 Noise vs. Frequency Figure 9 PSRR vs. Frequency 2.5 3.5 RL = 4Ω f = 1kHz 3 RL = 8Ω f = 1kHz THD+N = 10% THD+N = 10% Output Power(W) Output Power(W) 2 2.5 2 1.5 THD+N = 1% 1.5 1 THD+N = 1% 1 0.5 0.5 0 3 3.5 4 4.5 5 5.5 0 3 3.5 4.5 5 5.5 Power Supply(V) Power Supply(V) Figure 10 4 Output Power vs. Power Supply Figure 11 Output Power vs. Power Supply +20 VCC = 5.0V RL = 8Ω Output Level(dB) +15 +10 +5 +0 -5 -10 -15 20 50 100 200 500 1k 2k 5k 10k 20k Frequency(Hz) Figure 12 Bass and Treble Response vs. Frequency Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 8 IS31AP4833 FUNCTIONAL BLOCK DIAGRAM Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 9 IS31AP4833 DETAILED DESCRIPTION I2C INTERFACE The IS31AP4833 uses a serial bus, which conforms to the I2C protocol, to control the chip’s functions with two wires: SCL and SDA. The IS31AP4833’s slave address is “1000 0000”. It only supports write operations. The SCL line is uni-directional. The SDA line is bi-directional (open-collector) with a pull-up resistor (typically 4.7kΩ). The maximum clock frequency specified by the I2C standard is 400kHz. In this discussion, the master is the microcontroller and the slave is the IS31AP4833. After the last bit of the chip address is sent, the master checks for the IS31AP4833’s acknowledge. The master releases the SDA line high (through a pull-up resistor). Then the master sends an SCL pulse. If the IS31AP4833 has received the address correctly, then it holds the SDA line low during the SCL pulse. If the SDA line is not low, then the master should send a “STOP” signal (discussed later) and abort the transfer. Following acknowledge of IS31AP4833, the register address byte is sent, most significant bit first. IS31AP4833 must generate another acknowledge indicating that the register address has been received. The timing diagram for the I2C is shown in Figure 13. The SDA is latched in on the stable high level of the SCL. When there is no interface activity, the SDA line should be held high. The “START” signal is generated by lowering the SDA signal while the SCL signal is high. The start signal will alert all devices attached to the I2C bus to check the incoming address against their own chip address. Then 8-bit of data byte are sent next, most significant bit first. Each data bit should be valid while the SCL level is stable high. After the data byte is sent, the IS31AP4833 must generate another acknowledge to indicate that the data was received. The “STOP” signal ends the transfer. To signal “STOP”, the SDA signal goes high while the SCL signal is high. The 8-bit chip address is sent next, most significant bit first. Each address bit must be stable while the SCL level is high. Figure 13 Figure 14 Figure 15 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 Interface timing Bit transfer Writing to IS31AP4833 10 IS31AP4833 REGISTER DESCRIPTION Table 1 Byte Function Address Bit D7:D5 Data Bit D4 000 D3 D2 D1 - Table Default IGS Audio input gain control 2 0000 0110 001 - BGS Bass control 3 0010 0110 010 - TGS Treble control 4 0100 0110 011 LVS Left channel gain control 5 0111 0000 100 RVS Right channel gain control 6 1001 0000 Audio input MUX control 7 1010 0000 Operating mode control 8 1110 0000 101 111 Table 2 ME - IMS 3DE SE Audio Input Gain Control Byte Address Bit Bit Data Bit D4:D3 D2:D0 Name 000 - IGS Default 000 00 110 Configure the input gain. Input Gain Select -15dB -12dB -9dB -6dB -3dB +0dB +3dB +6dB SSD Table 3 D7:D5 IGS 000 001 010 011 100 101 110 111 Function D0 Bass Control Byte Bit Address Bit Data Bit D7:D5 D4 D3:D0 Name 001 - BGS Default 001 0 0110 Configure the bass gain. Input Resistor 85kΩ 80kΩ 74kΩ 67kΩ 59kΩ 50kΩ 41kΩ 33kΩ Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 BGS 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 Bass Gain Select -12dB -10dB -8dB -6dB -4dB -2dB 0dB +2dB +4dB +6dB +8dB +10dB +12dB 11 IS31AP4833 Table 4 Treble Control Byte Table 6 Address Bit Bit Data Bit Right Channel Gain Control Byte Bit Address Bit Data Bit D7:D5 D4:D0 D7:D5 D4 D3:D0 Name 010 - TGS Name 100 RVS Default 010 0 0110 Default 100 10000 Configure the treble gain. Configure the right channel gain (see Table 9). Treble Gain Select -12dB -10dB -8dB -6dB -4dB -2dB 0dB +2dB +4dB +6dB +8dB +10dB +12dB TGS 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 Table 5 Address Bit Data Bit D7:D5 D4:D0 Name 011 LVS Default 011 10000 Configure the left channel gain (see Table 9). LVS 00000 00001 00010 00011 …… 10000 …… 10110 10111 …… 111xx -12dB +0dB +2dB +12dB Table 7 Left Volume Select Mute -42dB -40dB -38dB Audio Input MUX Control Byte Address Bit Bit Left Channel Gain Control Byte Bit Right Volume Select Mute -42dB -40dB -38dB RVS 00000 00001 00010 00011 …… 10000 …… 10110 10111 …… 111xx Data Bit D7:D5 D4:D2 D1:D0 Name 101 - IMS Default 101 000 00 Single-ended or differential input selected. IMS 00 01 10 11 Input MUX Select Single-ended Input 1 Single-ended Input 2 Single-ended Input 3 Differential Input -12dB +0dB +2dB +12dB Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 12 IS31AP4833 Table 8 Bit Table 9 Operating Mode Control Byte Address Bit Data Bit D7:D5 D4 D3 D2 D1 D0 Name 111 ME - 3DE SE SSD Default 111 0 0 0 0 0 Configure the operating mode for IS31AP4833. Left/Right Channel Gain Control Data Gain Data Gain 00000 Mute 01111 -14 00001 -42 10000 -12 00010 -40 10001 -10 00011 -38 10010 -8 SSD 0 1 Shutdown Enable Operating Mode Shutdown Mode 00100 -36 10011 -6 00101 -34 10100 -4 00110 -32 10101 -2 SE 0 1 Speaker Enable Speaker Enable Speaker Disable 00111 -30 10110 +0 01000 -28 10111 +2 01001 -26 11000 +4 3DE 0 1 3D Enable 3D Off 3D On 01010 -24 11001 +6 01011 -22 11010 +8 01100 -20 11011 +10 ME 0 1 Mute Enable Mute Disable Mute Enable 01101 -18 111xx +12 01110 -16 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 13 IS31AP4833 APPLICATION INFORMATION 3D ENHANCEMENT The IS31AP4833 has a 3D audio enhancement effect that helps improve the apparent stereo channel separation when, because of cabinet or equipment limitations, the left and right speakers are closer to each other than optimal. Decreasing the resistor size will make the 3D effect more pronounced and decreasing the capacitor size will raise the cutoff frequency for the effect. A 68nF capacitor is used to reduce the effect at frequencies below 1kHz. Increasing the value of the capacitor will decrease the low cutoff frequency at which the stereo enhanced effect starts to occur as shown below f 3D 1 2R3 D C 3 D (1) For example, according to the Figure 1, R3D = 2.7kΩ, C3D = 68nF So, f 3D 1 867 Hz 2 2.7 k 68 nF The 3D enhancement effect enabled by setting the 3DE bit of the control byte “111x xxxx”. When setting the 3DE bit to “1”, 3D enhancement enabled. When setting the 3DE bit to “0”, 3D enhancement disabled. Pulling the 3D_EN pin to high will enable the 3D enhancement either. Set the 3DE bit to “1” or pull the 3D_EN pin to high will enable the 3D enhancement. Shutdown the 3D enhancement should set the 3DE bit to “0” and pull the 3D_EN pin to low. TONE CONTROL RESPONSE Bass and treble tone controls are included in the IS31AP4833. The tone controls use two external capacitors for each stereo channel (C1L,C2L,C1R,C2R). Each has a corner frequency determined by the value of C1, C2 and internal resistors in the feedback loop of the internal tone amplifier. With C = C1 = C2, the treble turn-over frequency is nominally 1 f TT 2 56 k C (2) and the bass turn-over frequency is nominally f BT 1 2 113 .3k C (3) So, f f BT TT 1 1.3kHz 2 56 k 2.2 nF 1 639 Hz 2 113 .3k 2.2 nF The bass and treble gain can be adjusted independently by the control byte “010x xxxx” and “001x xxxx” (Table 3, 4). GAIN SELECTION The left/right channel gain can be adjusted by the LVS bit of the control byte “011x xxxx” and the RVS bit of the control byte “100x xxxx” (Table 5, 6). In the speaker mode the output gain is equaled to audio input gain(IGS)+left/right channel gain(LVS/RVS)+6dB. In the headphone mode the output gain is equaled to audio input gain(IGS)+left/right channel gain(LVS/RVS). INPUT CAPACITORS (CIN) The input capacitors (CIN) and internal resistor (RIN) form a high-pass filter with the corner frequency, fC, determined in Equation (4). 1 f c 2R C IN IN (4) The value of RIN is following the audio input gain (see Table 2). For example, in figure 1, CIN = 220nF, the audio input gain is set to -3dB, so the RIN = 59kΩ, then, 1 f 12 Hz c 2 59 k 220 nF The capacitors should have a tolerance of 10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below. MUTE FUNCTION By setting the LVS/RVS bit to “00000” the left/right channel output will be mute independently (see Table 5, 6). The ME bit of the control byte “111x xxxx” sets the mute function for left and right channels. When the ME bit is set to “1”, the left and right channels are both mute (see Table 8). When the ME bit is set to “0”, the left and right channels will resume the volume before. For example, according to the Figure 1, C1 = C2 = 2.2nF Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 14 IS31AP4833 INPUT SIGNAL SELECTION SHUTDOWN MODE IS31AP4833 can choose single-ended or differential signal for the input source. Single-ended input 1, single-ended input 2, single-ended input 3 and differential input signal can be chosen by the IMS bit of control byte “101x xxxx”(see Table 7). Shutdown mode can either be used as a means of reducing power consumption. During shutdown mode all registers retain their data. HEADPHONE MODE IS31AP4833 can also be used to drive headphone. The IC will shut off the positive output if headphone plug-in has been detected. Then the speaker will stop working and switch to the headphone mode. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 SOFTWARE SHUTDOWN By setting SSD bit of the control byte “111x xxxx” to “1”, the IS31AP4833 will operate in software shutdown mode, wherein they consume only 1μA (Typ.) current. HARDWARE SHUTDOWN The chip enters hardware shutdown mode when the SDB pin is pulled low, wherein they consume only 1μA (Typ.) current. 15 IS31AP4833 CLASSIFICATION REFLOW PROFILES Profile Feature Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 150°C 200°C 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. Liquidous temperature (TL) Time at liquidous (tL) 217°C 60-150 seconds Peak package body temperature (Tp)* Max 260°C Time (tp)** within 5°C of the specified classification temperature (Tc) Max 30 seconds Average ramp-down rate (Tp to Tsmax) 6°C/second max. Time 25°C to peak temperature 8 minutes max. Figure 16 Classification Profile Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 16 IS31AP4833 PACKAGING INFORMATION QFN-36 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 17 IS31AP4833 TQFP-48 Note: All dimensions in millimeters unless otherwise stated. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/22/2012 18