CPC3701 60V, Depletion-Mode, N-Channel Vertical DMOS FET INTEGRATED CIRCUITS DIVISION V(BR)DSX / V(BR)DGX RDS(on) (max) IDSS (min) Package 60V 1 600mA SOT-89 Features • Depletion Mode Device Offers Low RDS(on) at Cold Temperatures • Low On-Resistance: 1 max. at 25ºC • High Input Impedance • Low VGS(off) Voltage: -0.8 to -2.9V • Small Package Size SOT-89 Ignition Modules Normally-On Switches Solid State Relays Converters Security Power Supplies Ordering Information Part # CPC3701C CPC3701CTR Package Pinout (SOT-89) D G The CPC3701 is an N-channel, depletion mode, field effect transistor (FET) that utilizes IXYS Integrated Circuits Division’s proprietary third-generation vertical DMOS process. The third-generation process realizes world class, high voltage MOSFET performance in an economical silicon gate process. Our vertical DMOS process yields a robust device, with high input impedance, for use in high-power applications. The CPC3701 is a highly reliable FET device that has been used extensively in our Solid State Relays for industrial and security applications. The CPC3701 has a minimum breakdown voltage of 60V, and is available in the SOT-89 package. As with all MOS devices, the FET structure prevents thermal runaway and thermal-induced secondary breakdown. Applications • • • • • • Description Description N-Channel Depletion Mode FET, SOT-89 Pkg. Cut-Tape, Available in Quantities of 200, 300, 400, 500, and 600 N-Channel Depletion Mode FET, SOT-89 Pkg. Tape and Reel (1000/Reel) Circuit Symbol D D S G S Pb DS-CPC3701-R03 e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC3701 Absolute Maximum Ratings @ 25ºC Parameter Drain-to-Source Voltage Gate-to-Source Voltage Pulsed Drain Current Total Package Dissipation 1 Operational Temperature Storage Temperature 1 Ratings 60 ±15 1 1.1 -55 to +125 -55 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP VP A W ºC ºC Mounted on 1"x1" FR4 board. Electrical Characteristics @ 25ºC (Unless Otherwise Noted) Parameter Drain-to-Source Breakdown Voltage Gate-to-Source Off Voltage Change in VGS(off) with Temperature Gate Body Leakage Current Symbol V(BR)DSX Conditions VGS= -5V, ID=100µA Min 60 VGS(off) VDS= 5V, ID=1A dVGS(off) /dT VDS= 5V, ID=1A IGSS Drain-to-Source Leakage Current ID(off) Saturated Drain-to-Source Current IDSS Static Drain-to-Source On-State Resistance Change in RDS(on) with Temperature RDS(on) Max - -0.8 - -2.9 V - - 4.5 mV/ºC VGS=±15V, VDS=0V - - 100 nA VGS= -5V, VDS=60V - - 1 µA VGS= -5V, VDS=40V, TA=125ºC - - 1 mA VGS= 0V, VDS=15V 600 - - - - 1 mA - - 1.1 %/ºC VGS= 0V, ID=300mA dRDS(on) /dT Turn-On Delay Time Typ - Units V td(on) VDS= 25V - 70 tr ID= 300mA - 40 td(off) VGS= 0V to -10V - 50 tf Rgen= 50 - 150 Source-Drain Diode Voltage Drop VSD VGS= -5V, ISD=300mA - 0.6 1.8 V Thermal Resistance (Junction to Ambient) RJA - - 90 - ºC/W Rise Time Turn-Off Delay Time Fall Time - ns Switching Waveform & Test Circuit VDD RL 0V 90% PULSE GENERATOR INPUT -10V 10% Rgen t on t d(on) VDS OUTPUT t off tf t d(off) tr 90% D.U.T. 90% INPUT OUTPUT 0V 2 10% 10% www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC3701 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC3701C MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC3701C 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R03 e3 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC3701 MECHANICAL DIMENSIONS CPC3701C 1.626 / 1.829 (0.064 / 0.072) 1.397 / 1.600 (0.055 / 0.063) R 0.254 (R 0.010) PCB Land Pattern 1.90 (0.075) 3.937 / 4.242 (0.155 / 0.167) 2.286 / 2.591 (0.090 / 0.102) 45º 2.45 (0.096) 1.40 (0.055) Pin 1 0.356 / 0.483 (0.014 / 0.019) 0.432 / 0.559 (0.017 / 0.022) 0.889 / 1.194 (0.035 / 0.047) 5.00 (0.197) 50º 1.90 (0.074) 0.356 / 0.432 (0.014 / 0.017) 0.60 (0.024) TYP 3 4.394 / 4.597 (0.173 / 0.181) 1.422 / 1.575 (0.056 / 0.062) 2.921 / 3.073 (0.115 / 0.121) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) CPC3701CTR Tape & Reel 177.8 Dia (7.00 Dia) 5.50 ± 0.05 (0.217 ± 0.002) Top Cover Tape Thickness 0.102 Max (0.004 Max) 1.75 ± 0.1 (0.069 ± 0.004) W=12.00 ± 0.3 (0.472 ± 0.012) B0=4.60 ± 0.1 (0.181 ± 0.004) K0=1.80 ± 0.1 (0.071 ± 0.004) Embossed Carrier 2.00 ± 0.05 (0.079 ± 0.002) 4.00 ± 0.1 (0.157 ± 0.004) A0=4.80 ± 0.1 (0.189 ± 0.004) P=8.00 ± 0.1 (0.315 ± 0.004) Embossment Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 4 Specification: DS-CPC3701-R03 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/18/2012