CPC5603

CPC5603
N-Channel Depletion Mode FET
INTEGRATED CIRCUITS DIVISION
Parameter
Drain-to-Source Voltage - VDS
Rating
415
Max On-Resistance - RDS(on)
14
Units
V

Max Power
2.5
W
Features
• 415V Drain-to-Source Voltage
• Depletion Mode Device Offers Low RDS(on)
at Cold Temperatures
• Low On-Resistance: 8 (Typical) @ 25°C
• Low VGS(off) Voltage: -2.0V to -3.6V
• High Input Impedance
• Low Input and Output Leakage
• Small Package Size SOT-223
• PC Card (PCMCIA) Compatible
• PCB Space and Cost Savings
Description
The CPC5603 is an N-channel, depletion mode Field
Effect Transistor (FET) that utilizes IXYS Integrated
Circuits Division’s proprietary third-generation vertical
DMOS process. The third generation process realizes
world class, high voltage MOSFET performance in an
economical silicon gate process. The vertical DMOS
process yields a highly reliable device particularly
in difficult application environments such as
telecommunications, security, and power supplies.
One of the primary applications for the CPC5603 is
as a linear regulator/hook switch for the LITELINK™
family of Data Access Arrangements (DAA) Devices
CPC5620A, CPC5621A, and CPC5622A.
The CPC5603 has a typical on-resistance of 8, a
drain-to-source voltage of 415V and is available in
the SOT-223 package. As with all MOS devices, the
FET structure prevents thermal runaway and
thermal-induced secondary breakdown.
Applications
• Support Component for LITELINK™
Data Access Arrangement (DAA)
• Telecom
• Normally-On Switches
• Ignition Modules
• Converters
• Security
• Power Supplies
Ordering Information
Part #
CPC5603CTR
Description
N-Channel Depletion Mode FET, SOT-223 Pkg.
Tape and Reel (1000/Reel)
Package Pinout
D
1
G
4
2 3
D
S
Pin Number
Name
1
GATE
2
DRAIN
3
SOURCE
4
DRAIN
DS-CPC5603-R08
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1
INTEGRATED CIRCUITS DIVISION
CPC5603
Absolute Maximum Ratings @ 25°C
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Total Package Dissipation
Operational Temperature
Storage Temperature
Symbol
VDS
VGS
P
TA
TA
Ratings
415
±20
2.5
-40 to +85
-40 to +125
Units
V
V
W
oC
oC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Electrical Characteristics @25oC (Unless Otherwise Specified)
Parameter
Gate-to-Source Off Voltage
Drain-to-Source Leakage Current
Drain Current
On Resistance
Gate Leakage Current
Gate Capacitance
Symbol
VGS(off)
Min
-2
130
-
Typ
RDS(on)
IGSS
CISS
Conditions
ID= 2µA, VDS=10V, VDS=100V
VGS= -5V, VDS=250V
VGS= -5V, VDS=415V
VGS= -2.7V, VDS=5V, VDS=50V
VGS= -0.57V, VDS=5V
VGS= -0.35V, IDS=50mA
VGS=10V, VGS=-10V
VDS= VGS=0V
Symbol
RJC
Conditions
-
Min
-
IDS(off)
ID
8
-
Max
-3.6
20
1
5
14
0.1
300
Units
V
nA
A
mA
mA

A
pF
Typ
-
Max
14
Units
ºC/W
Thermal Characteristics
Parameter
Thermal Resistance
2
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R08
INTEGRATED CIRCUITS DIVISION
CPC5603
Performance Data*
Output Characteristics
(TA=25ºC)
0.20
0.15
0.10
300
15
10
150
100
5
0
0
VDS (V)
0.3
ID (A)
Transfer Characteristics
(VDS=10V)
VGS(off) vs. Temperature
(VDS=10V, ID=2PA)
0
250
1
2
3
4
0.0
5
0.1
-2.3
0.2
0.4
0.5
0
0.6
100
-2.6
-2.7
-2.8
50
-2.9
0
-3.0
-1.5
-1.0
CISS
COSS
CRSS
200
150
100
50
0
-20
0
20
40
60
Temperature (ºC)
80
5
10
15
VDS (V)
20
25
30
6
-40
100
-20
0
20
40
60
Temperature (ºC)
80
100
Forward Safe Operating Bias
(VGS=0V, DC Load, TC=25ºC)
1
4.0
Limited by
Device Channel
Saturation
3.5
3.0
0.1
2.5
2.0
1.5
Limited by
Device RDS(on)
0.01
1.0
0.5
0
0
7
Power Dissipation
vs. Ambient Temperature
Power Dissipation (W)
250
8
4
-40
Capacitance vs. Drain-Source Voltage
(VGS=-5V)
9
IDS(A)
-2.0
VGS (V)
10
5
-3.0
-2.5
150
11
On-Resistance (:)
VGS(off) (V)
150
100
On-Resistance vs. Temperature
(VGS=0V, ID=100mA)
12
-2.5
TA=125ºC
TA=25ºC
TA=-40ºC
50
ID (mA)
-2.4
200
ID (mA)
200
50
0.00
Capacitance (pF)
TA=-40ºC
TA=25ºC
TA=125ºC
250
0.05
300
Transconductance vs Drain Current
(VDS=10V)
:
On-Resistance (:)
0.25
ID (A)
20
VGS=-0.5
VGS=-1
VGS=-1.5
VGS=-2
0.30
GFS (m)
0.35
On-Resistance vs. Drain Current
(VGS=0V)
0.001
0
20
40
60 80 100 120
Temperature (ºC)
140
160
1
10
100
1000
VDS (V)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R08
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3
INTEGRATED CIRCUITS DIVISION
CPC5603
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC5603C
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC5603C
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
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R08
INTEGRATED CIRCUITS DIVISION
CPC5603
MECHANICAL DIMENSIONS
CPC5603C
2.90 / 3.10
(0.114 / 0.122)
PCB Land Pattern
0.229 / 0.330
(0.009 / 0.013)
1.90
(0.075)
6.705 / 7.290
(0.264 / 0.287)
3.30 / 3.71
(0.130 / 0.146)
1.499 / 1.981
(0.059 / 0.078)
3.20
(0.126)
6.10
(0.24)
Pin 1
0.610 / 0.787
(0.024 / 0.031)
1.90
(0.075)
0.914 MIN
(0.036 MIN)
2.286
(0.090)
6.30 / 6.71
(0.248 / 0.264)
0.020 / 0.102
(0.0008 / 0.004)
0.864 / 1.067
(0.034 / 0.042)
0.90
(0.035)
1.549 / 1.803
(0.061 / 0.071)
2.286
(0.090)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
4.597
(0.181)
CPC5603CTR Tape & Reel
177.8 Dia
(7.00 Dia)
5.50 ± 0.05
(0.217 ± 0.002)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.1
(0.157 ± 0.004)
W=12.08 ± 0.2
(0.476 ± 0.008)
B0=7.42 ± 0.1
(0.292 ± 0.004)
K0=1.88 ± 0.1
(0.074 ± 0.004)
Embossed
Carrier
1.75 ± 0.1
(0.069 ± 0.004)
A0=6.83 ± 0.1
(0.269 ± 0.004)
P=8.03 ± 0.1
(0.316 ± 0.004)
Embossment
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-CPC5603-R08
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
7/20/2015