IXYS LBA710S

LBA710
Dual Single-Pole OptoMOS® Relay
Normally Open & Normally Closed
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Rating
60
1
0.6
2
Units
V
Arms / ADC

mA
Features
•
•
•
•
•
•
•
•
•
•
•
Low On-Resistance (0.6)
Low Control Current (2mA)
3750Vrms Input/Output Isolation
100% Solid State
Low Drive Power Requirements (TTL/CMOS
Compatible)
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Surface Mount Versions
Small 8-Pin Package
Tape & Reel available
Description
LBA710 is a 60V, 1A, 0.6 dual Solid State Relay
integrating independent single-pole normally open
(1-Form-A) and single-pole normally closed
(1-Form-B) relays into a single package. It features
a superior combination of low on-resistance and 1A
load current handling capability.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
LBA710
LBA710S
LBA710STR
Description
8-Pin DIP (50/Tube)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1000/Reel)
Applications
• Telecommunications
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (gas, oil, electric and water)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Pin Configuration
+ Control
– Control
+ Control
– Control
1
8
2
7
3
6
4
5
Normally Closed
Form-B
Normally Open
Form-A
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
toff
Switching Characteristics
of Normally Closed Devices
Form-B
IF
ILOAD
90%
10%
toff
Pb
DS-LBA710-R02
ton
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1
INTEGRATED CIRCUITS DIVISION
LBA710
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
ESD Rating, Human Body Model
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Ratings
60
5
50
1
Units
VP
V
mA
A
150
800
3750
8
-40 to +85
-40 to +125
mW
mW
Vrms
kV
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameter
Conditions
Output Characteristics: Form-A (Normally Open)
Load Current
IF=2mA
Continuous
Peak
IF=2mA, t < 10ms
On-Resistance
IF=2mA, IL=1A
Switching Speeds
Turn-On
IF=5mA, VL=10V
Turn-Off
Off-State Leakage Current
IF=0mA, VL=60V
Output Capacitance
IF=0mA, VL=50V, f=1MHz
Output Characteristics: Form-B (Normally Closed)
Load Current
IF=0mA
Continuous
Peak
IF=0mA, t < 10ms
On-Resistance
IF=0mA, IL=1A
Switching Speeds
Turn-On
IF=5mA, VL=10V
Turn-Off
Off-State Leakage Current
IF=2mA, VL=60V
Output Capacitance
IF=2mA, VL=50V, f=1MHz
Input Characteristics: Form-A and Form-B
Input Control Current to Activate
IL=1A
Input Control Current to Deactivate
Input Voltage Drop
IF=5mA
Reverse Input Current
VR=5V
Common Characteristics: Form-A and Form-B
Capacitance, Input to Output
-
Symbol
Min
Typ
Max
Units
IL
-
-
1
Arms / ADC
ILPK
RON
-
0.21
±5
0.6
AP

ton
toff
ILEAK
COUT
-
0.7
0.09
44
5
5
1
-
A
pF
ms
IL
-
-
1
Arms / ADC
ILPK
RON
-
0.39
±5
0.6
AP

ton
toff
ILEAK
COUT
-
0.63
1.5
125
5
5
1
-
A
pF
IF
IF
VF
IR
0.1
0.9
-
1.2
-
2
1.4
10
mA
mA
V
A
CI/O
-
3
-
pF
ms
*NOTE: If both poles operate simultaneously, then load current must be derated so as not to exceed the package total power dissipation value.
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R02
INTEGRATED CIRCUITS DIVISION
LBA710
Form-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-A
Typical LED Current to Operate
(N=50, IL=1A)
25
15
10
5
20
15
10
5
0
0
0.65
0.69
0.73 0.77 0.81 0.85
LED Current (mA)
Form-A
Typical LED Forward Voltage Drop
(N=50)
15
10
5
0
15
10
5
0.95
-20
1200
80
Turn-Off Time (Ps)
800
600
400
Form-A
Typical IF for Switch Operation
vs. Temperature
(IL=500mA)
Turn-On Time (Ps)
0.85
0.80
0.75
68.5
Form-A
Typical Turn-Off
vs. LED Forward Current
(IL=100mA, TA=25ºC)
77.6
77.5
77.4
77.3
77.1
10
20
30
40
LED Forward Current (mA)
50
0
Form-A
Typical Turn-On Time
vs. Temperature
(IL=100mA)
2500
0.90
66.5 67.0 67.5 68.0
Blocking Voltage (VP)
77.2
0
100
66.0
77.7
0
20
40
60
Temperature (ºC)
5
77.8
200
0
10
65.5
1000
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
15
0
2000
50
Form-A
Typical Turn-Off Time
vs. Temperature
(IL=100mA)
85
1500
1000
10
20
30
40
LED Forward Current (mA)
90
IF=2mA
Turn-Off Time (Ps)
1.1
1.0
-40
LED Current (mA)
20
Form-A
Typical Turn-On
vs. LED Forward Current
(IL=100mA, TA=25ºC)
1.2
0.102
20
Form-A
Typical LED Forward Voltage Drop
vs. Temperature
1.3
0.082 0.087 0.092 0.097
Turn-Off Time (ms)
Form-A
Typical Blocking Voltage Distribution
(N=50)
0.206 0.207 0.208 0.209 0.210 0.211 0.212
On-Resistance (:)
1.4
5
0.077
0
1.5
10
0.81
1.220 1.225 1.230 1.235 1.240 1.245 1.250
LED Forward Voltage (V)
Turn-On Time (Ps)
LED Forward Voltage (V)
1.6
0.65 0.69 0.73 0.77
Turn-On Time (ms)
Device Count (N)
Device Count (N)
Device Count (N)
20
0.61
Form-A
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=1A)
25
25
15
0
0.57
0.89
30
Form-A
Typical Turn-Off Time
(N=50, IF=5mA)
20
Device Count (N)
Device Count (N)
Device Count (N)
20
Form-A
Typical Turn-On Time
(N=50, IF=5mA)
IF=5mA
500
80
IF=2mA
75
70
IF=5mA
65
60
55
0.70
-40
0
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
50
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R02
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3
INTEGRATED CIRCUITS DIVISION
LBA710
Form-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-A
Typical On-Resistance
vs. Temperature
(IF=2mA, IL=500mA)
0.26
0.3
0.20
0.18
0.16
-0.1
0
20
40
60
Temperature (ºC)
80
100
Form-A
Typical Blocking Voltage
vs. Temperature
20
68
67
66
65
64
63
-20
0
20
40
60
Temperature (ºC)
80
0.8
0.7
0.6
0.4
-0.5
0.0
Voltage (V)
0.5
1.0
-40
Form-A
Typical Leakage vs. Temperature
Measured Across Pins 5&6
(VL=60V)
10
5
-20
0
20
40
60
Temperature (ºC)
80
100
Form-A
Output Capacitance
vs. Load Voltage
(IF=0mA, f=1MHz)
120
15
0
-40
100
0.9
0.5
-0.3
-1.0
Leakage Current (nA)
Blocking Voltage (VP)
0.0
Output Capacitence (pF)
-20
69
62
-40
0.1
-0.2
0.14
70
1.0
Load Current (A)
0.22
Form-A
Maximum Load Current
vs. Temperature
(IF=2mA)
1.1
0.2
Current (A)
On-Resistance (:)
0.24
0.12
-40
Typical Load Current
vs. Load Voltage
(IF=2mA)
100
80
60
40
20
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0.1
1
10
Load Voltage (V)
100
Form-A
Energy Rating Curve
6
Load Current (A)
5
4
3
2
1
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R02
INTEGRATED CIRCUITS DIVISION
LBA710
Form-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-B
Typical LED Current to Operate
(N=50, IL=1A)
25
15
10
5
0
20
15
10
5
0.21
0.22 0.23 0.24 0.25
LED Current (mA)
10
5
0
0.26
0.54
Form-B
Typical LED Forward Voltage Drop
(N=50)
30
0.57
0.60 0.63 0.66 0.69
Turn-On Time (ms)
1.2
0.72
Form-B
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=1A)
20
25
20
15
10
Device Count (N)
Device Count (N)
25
Device Count (N)
15
0
0.20
15
10
5
Form-B
Typical LED Forward Voltage Drop
vs. Temperature
Form-B
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
1.3
1.1
1.0
-40
0
20
40
60
Temperature (ºC)
80
5
Form-B
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
0.20
0.16
-20
0
20
40
60
Temperature (ºC)
80
100
73
75
77
79
Blocking Voltage (VP)
81
Form-B
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
8
6
5
4
3
2
1
0
10
20
30
40
LED Forward Current (mA)
50
10
20
30
40
LED Forward Current (mA)
50
Form-B
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=100mA)
2.6
2.4
0.8
0.7
0.6
0.5
0.4
-40
0
Form-B
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=100mA)
0.9
0.24
71
7
0
100
0.28
0.12
-40
0.640
0.638
0.636
0.634
0.632
0.630
0.628
0.626
0.624
0.622
0.620
Turn-On Time (ms)
LED Current (mA)
0.32
-20
Form-B
Typical Blocking Voltage Distribution
(N=50, IF=2mA)
69
Turn-Off Time (ms)
1.2
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
1.9
10
Turn-Off Time (ms)
1.4
1.8
0
0.381 0.384 0.387 0.390 0.393 0.396 0.399
On-Resistance (:)
1.5
1.4 1.5 1.6 1.7
Turn-Off Time (ms)
15
0
1.220 1.225 1.230 1.235 1.240 1.245 1.250
LED Forward Voltage (V)
Turn-On Time (ms)
LED Forward Voltage (V)
1.6
1.3
20
5
0
Form-B
Typical Turn-Off Time
(N=50, IF=5mA)
20
Device Count (N)
20
Device Count (N)
Device Count (N)
25
Form-B
Typical Turn-On Time
(N=50, IF=5mA)
2.2
2.0
1.8
1.6
1.4
-20
0
20
40
60
Temperature (ºC)
80
100
1.2
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R02
www.ixysic.com
5
INTEGRATED CIRCUITS DIVISION
LBA710
Form-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-B
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=500mA)
1.0
0.9
0.8
0.7
0.6
0.5
0
20
40
60
Temperature (ºC)
80
-1.0
-0.4 -0.3 -0.2
100
Form-B
Typical Blocking Voltage
vs. Temperature
(IF=2mA)
0.10
Leakage Current (PA)
79
78
77
76
75
74
-20
0
20
40
60
Temperature (ºC)
80
100
0.4
-0.1 0.0 0.1
Voltage (V)
0.2
0.3
Form-B
Typical Leakage vs. Temperature
Measured Across Pins 7&8
(IF=2mA, VL=60V)
0.06
0.04
0.02
-20
0
20
40
60
Temperature (ºC)
80
100
Form-B
Output Capacitance
vs. Load Voltage
(IF=2mA, f=1MHz)
450
0.08
0.00
-40
-40
0.4
Output Capacitance (pF)
-20
80
Blocking Voltage (VP)
0.0
-0.5
0.32
73
-40
Load Current (A)
0.36
81
1.1
0.5
0.40
0.28
-40
Form-B
Maximum Load Current
vs. Temperature
(IF=0mA)
1.0
0.44
Current (A)
On-Resistance (:)
0.48
Form-B
Typical Load Current
vs. Load Voltage
(IF=0mA)
400
350
300
250
200
150
100
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0.1
1
10
Load Voltage (V)
100
Form-B
Energy Rating Curve
6
Load Current (A)
5
4
3
2
1
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
6
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R02
INTEGRATED CIRCUITS DIVISION
LBA710
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
LBA710 / LBA710S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
LBA710 / LBA710S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R02
e3
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7
INTEGRATED CIRCUITS DIVISION
LBA710
Mechanical Dimensions
LBA710
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
3.302 ± 0.051
(0.130 ± 0.002)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.127
(0.300 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LBA710S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
0.635 ± 0.127
(0.025 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
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R02
INTEGRATED CIRCUITS DIVISION
LBA710
LBA710STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
K0 =4.90
(0.193)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
9
Specification: DS-LBA710-R02
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012