CPC2317N

CPC2317N
60V Dual Single-Pole SOIC OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to operate
Rating
60
120
16
1
One Normally-Open Pole & One Normally-Closed Pole
Units
VP
mArms / mADC

mA
Features
•
•
•
•
•
•
•
Description
The CPC2317N is a miniature device with one
independent normally-open (1-Form-A) solid state
relay and one independent normally-closed
(1-Form-B) solid state relay in an 8-pin SOIC package.
It employs optically coupled MOSFET technology to
provide 1500Vrms of input to output isolation.
The optically coupled outputs, which use IXYS
Integrated Circuits Division's patented OptoMOS
architecture, are controlled by a highly efficient
infrared LED.
1500Vrms Input/Output Isolation
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Immune to radiated EM fields
Wave Solderable
Small 8-Pin SOIC Package
Tape & Reel Version Available
This device uses IXYS Integrated Circuits Division’s
state of the art, double-molded vertical construction
packaging to produce one of the world’s smallest
relays. It is ideal for replacing larger, less-reliable reed
and electromechanical relays.
Applications
• Security
• Passive Infrared Detectors (PIR)
• Data Signaling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
Approvals
• UL Recognized Component: File E76270
• CSA Approval Pending
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
Ordering Information
Part #
CPC2317N
CPC2317NTR
Description
8-Pin SOIC (50/tube)
8-Pin SOIC (2000/reel)
Pin Configuration
1
Switching Characteristics of
Normally-Open
(Form-A) Devices
8
+ Control
Load
2
7
– Control
Form-B - Normally Closed
Load
3
6
+ Control
Load
Form-A
Form-B
IF
IF
ILOAD
90%
Form-A - Normally Open
4
– Control
DS-CPC2317N-R04
Switching Characteristics of
Normally-Closed
(Form-B) Devices
5
ILOAD
ton
Load
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90%
10%
10%
toff
toff
ton
1
INTEGRATED CIRCUITS DIVISION
CPC2317N
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Total Power Dissipation 1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
Soldering Temperature (10 Seconds)
1
Ratings
60
5
50
1
600
1500
-40 to +85
-40 to +125
260
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Units
VP
V
mA
A
mW
Vrms
°C
°C
°C
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Derate linearly 5mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Normally Open (Form-A) Continuous 1
Normally Closed (Form-B) Continuous 1
Peak
On-Resistance 2
Switching Speeds
Turn-On
Turn-Off
Off-State Leakage Current
Output Capacitance
Normally Open (Form-A)
Normally Closed (Form-B)
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
3
2
Conditions
Symbol
Min
Typ
Max
Units
IL
-
-
120
mArms / mADC
ILPK
RON
-
-
±350
16
mAP

IF=5mA, VL=10V
ton
toff
VL=60VP
ILEAK
-
-
3
3
1
-
5
-
-
10
-
IF=1mA
IF=0mA
t =10ms
IL=120mA
IF=0mA, VL=50V, f=1MHz
IF=5mA, VL=50V, f=1MHz
COUT
ms
µA
pF
IL=100mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.1
0.9
-
0.40
0.35
1.2
-
1
1.4
10
mA
mA
V
µA
VIO=0V, f=1MHz
CIO
-
1
-
pF
Load current derates linearly from 120mA @ 25oC to 60mA @ 85oC, and must be derated for both poles operating simultaneously.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended.
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INTEGRATED CIRCUITS DIVISION
CPC2317N
Common Performance Data @ 25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
25
Device Count (N)
Device Count (N)
30
25
20
15
10
5
1.17
15
10
5
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
0.35
0.40
0.45
0.50
0.55
Load Current (mA)
LED Current (mA)
100
2.0
1.5
1.0
-40
-20
0
20
40
60
Temperature (ºC)
Load Current (A)
85
83
81
79
77
0
90
92
110
100
90
80
20
40
60
Temperature (ºC)
80
80
100
60
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
87
-20
88
70
89
-40
86
120
Typical Blocking Voltage
vs. Temperature
(Form-A IF=0mA, Form-B IF=2mA)
91
Blocking Voltage (VP)
80
84
Maximum Load Current
vs. Temperature
(Form-A IF=2mA, Form-B IF=0mA)
130
0
20
40
60
Temperature (ºC)
82
Blocking Voltage (VP)
0.5
0
80
0.60
2.5
IF=5mA
IF=2mA
IF=1mA
-20
10
Typical IF for Switch Operation
vs. Temperature
(IL=80mA)
3.0
IF=50mA
IF=20mA
IF=10mA
1.2
1.0
-40
15
LED Current (mA)
1.3
1.1
20
0
0.30
1.6
1.4
25
5
Typical LED Forward Voltage Drop
vs. Temperature
1.5
Typical Blocking Voltage Distribution
(N=50)
(Form-A IF=0mA, Form-B IF=2mA)
30
20
0
0
LED Forward Voltage Drop (V)
35
Device Count (N)
35
Typical IF for Switch Operation
(N=50, IL=100mA)
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R04
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3
INTEGRATED CIRCUITS DIVISION
CPC2317N
Form-A Performance Data @ 25ºC (Unless Otherwise Noted)*
25
20
20
15
10
5
0
15
10
5
25
20
15
10
5
0
Turn-Off Time (ms)
7.0
7.1
7.2
On-Resistance (:)
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
Typical Load Current vs. Load Voltage
(IF=5mA)
1.2
1.3
1.4
1.5
1.6
0.26
0.7
0.28
0.30
0.32
0.34
0.36
150
Load Current (mA)
Turn-Off Time (ms)
0.5
0.4
0.3
0.2
0
45
50
3.0
IF=2mA
2.5
2.0
IF=5mA
1.5
1.0
-40
-20
0
20
40
60
Temperature (ºC)
0.016
80
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-150
-1.5
Typical Turn-Off Time vs. Temperature
(IL=50mA)
Typical On-Resistance vs. Temperature
(IL=Max Rated @ Temperature)
10
15
20
25
30
35
40
45
50
14
-1.0
1.0
1.5
IF=2mA
IF=5mA
12
IF=5mA
10
Steady State
8
Instantaneous
IF=5mA
6
4
IF=2mA
-40
-20
0
20
40
60
Temperature (ºC)
Typical Leakage vs. Temperature
(Measured Across Pins 5&6)
(IF=0mA, VL=60V)
14
Output Capacitance (pF)
Leakage (PA)
0
-50
-0.5
0
0.5
Load Voltage (V)
5
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-40
50
LED Forward Current (mA)
0
Typical Turn-On Time vs. Temperature
(IL=50mA)
100
On-Resistance (:)
10 15 20 25 30 35 40
LED Forward Current (mA)
7.4
7.3
-100
0.1
5
6.9
6.8
0.38
0.6
Turn-Off Time (ms)
Turn-On Time (ms)
30
Turn-On Time (ms)
1.1
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
0
Turn-On Time (ms)
35
0
1.0
3.5
Typical On-Resistance Distribution
(N=50, IL=100mA)
Typical Turn-Off Time
(N=50, IL=100mA, IF=5mA)
Device Count (N)
25
Device Count (N)
Device Count (N)
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
80
100
2
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz)
12
10
8
6
4
-20
0
20
40
60
Temperature (ºC)
80
100
0
10
20
30
40
Load Voltage (V)
50
60
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R04
INTEGRATED CIRCUITS DIVISION
CPC2317N
Form-B Performance Data @ 25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
(N=50, IF=2mA, IL=150mA)
25
15
10
5
0.28
0.30
0.32 0.34 0.36 0.38
Turn-On Time (ms)
10
5
25
20
15
10
5
0
0.30
0.40
0.4
0.3
0.2
0.1
0
5
10
15
20
25
30
35
40
0.34 0.36 0.38 0.40
Turn-Off Time (ms)
5.0
0.42
45
50
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
5.1
5.2
5.3
5.4
5.5
5.6
On-Resistance (:)
Typical Load Current vs. Load Voltage
150
Load Current (mA)
Turn-Off Time (ms)
0.5
0
0.32
Typical Turn-Off Time
vs. LED Forward Current
(IL=50mA)
0.6
100
50
0
-50
-100
0
5
10
15
20
25
30
35
40
45
50
-150
-1
-0.75 -0.5 -0.25
0
0.25
0.5
0.75
1
LED Forward Current (mA)
Load Voltage (V)
Typical Turn-On Time vs. Temperature
(IF=2mA, IL=50mA)
Typical Turn-Off Time vs. Temperature
(IF=2mA, IL=50mA)
Typical On-Resistance vs. Temperature
(IF=0mA, IL=150mA)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40
Turn-Off Time (ms)
LED Forward Current (mA)
-20
0
20
40
60
80
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
7
0
20
40
Typical Leakage vs. Temperature
Measured Across Pins 7&8
(IF=2mA, VL=60V)
40
Output Capacitance (pF)
0.35
Leakage (µA)
5
4
3
60
80
100
-40
-20
Temperature (ºC)
Temperature (ºC)
0.40
6
2
-20
-40
100
8
On-Resistance (:)
Turn-On Time (ms)
15
Typical Turn-On Time
vs. LED Forward Current
(IL=50mA)
0.7
Typical On-Resistance Distribution
(N=50, IL=150mA)
30
20
0
0
Turn-On Time (ms)
35
Device Count (N)
20
Device Count (N)
Device Count (N)
25
Typical Turn-Off Time
(N=50, IF=2mA, IL=150mA)
0.30
0.25
0.20
0.15
0.10
0.05
0
20
40
60
80
100
Temperature (ºC)
Output Capacitance vs. Load Voltage
(IF=0.5mA)
35
30
25
20
15
10
5
0
-40
-20
0
20
40
60
80
100
0
Temperature (ºC)
10
20
30
40
Load Voltage (V)
50
60
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R04
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5
INTEGRATED CIRCUITS DIVISION
CPC2317N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC2317N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
Maximum Reflow Cycles
CPC2317N
260ºC for 30 seconds
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after soldering processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
6
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INTEGRATED CIRCUITS DIVISION
CPC2317N
MECHANICAL DIMENSIONS
CPC2317N
1.016 ± 0.025
(0.040 ± 0.001)
9.347 ± 0.203
(0.368 ± 0.008)
Pin 1
2.184 MAX
(0.086 MAX)
PCB Land Pattern
5.60
(0.22)
1.30
(0.051)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.051
(0.150 ± 0.002)
2.540 TYP
(0.100 TYP)
0.203 ± 0.025
(0.008 ± 0.001)
0.432 ± 0.127
(0.017 ± 0.005)
2.54
(0.100)
0.55
(0.022)
Pin to Package Standoff
MIN 0.0254 (0.001)
(MAX 0.102 (0.004)
0.838 ± 0.102
(0.033 ± 0.004)
Dimensions
mm
(inches)
0.381 ± 0.051
(0.015 ± 0.002)
CPC2317NTR Tape & Reel
1.75 ± 0.10
330.2 DIA.
(13.00 DIA.)
4.00 ± 0.10
8.00 ± 0.10
2.00 ± 0.10
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
1.20
7.50 ± 0.10
Ø1.50
+0.1, -0
6.50 9.65 ± 0.10
16.00 ± 0.30
Embossed Carrier
3.50
6.55 ± 0.10
Ø1.50 MIN
Embossment
2.35 ± 0.10
NOTES:
1. All dimensions in millimeters
2. 10 sprocket hole pitch cumulative tolerance ± 0.20.
3. Carrier camber is within 1mm in 250mm.
2.85 ± 0.10
4. Tape material : Black Conductive Polystyrene Alloy.
5. All dimensions meet EIA-481-C requirements.
6. Thickness : 0.30 ± 0.05mm.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-CPC2317N-R04
©Copyright 2014, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
11/19/2014