LGER433.92M(TO-39) SAW resonator 1. SCOPE This specification shall cover the characteristics of 1-port SAW resonator with used for remote-control security. 2. ELECTRICAL SPECIFICATION DC Voltage VDC AC Voltage Vpp Operation temperature Storage temperature RF Power Dissipation 10V 10V50Hz/60Hz -20℃ to +85℃ -45℃ to +85℃ 0dBm Electronic Characteristics Item Center Frequency Insertion Loss Unites Minimum Typical Maximum MHz 433.845 433.920 433.995 1.5 2.5 dB Quality Factor Unload Q 12,800 50Ω Loaded Q 2,000 Temperature Turnover Temperature Stability ℃ 20 35 Turnover Frequency KHz fo±1.3 Freq.temp.Coefficient ppm/℃2 0.032 ppm/yr <±10 Frequency Aging DC. Insulation Resistance MΩ 1.0 Ω 18 μH 86 RLC Model Motional Capacitance CM pF 1.5 Pin 1 to Pin 2 Staic Capacitance Co pF Motional Resistance RM RF Equivalent Motional Inductance LM Transducer Static Capacitance Cp pF 50 1.7 2.0 26 2.3 1.9 3. TEST CIRCUIT http://www.luguang.cn mail:[email protected] LGER433.92M(TO-39) SAW resonator 4．EQUIVALENT LC MODEL The following equivalent LC model is Valid near resonance 5. DIMENSION 6. ENVIRONMENTAL CHARACTERISTICS 6-1 High temperature exposure Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1. 6-2 Low temperature exposure Subject the device to -20℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1. 6-3 Temperature cycling Subject the device to a low temperature of -40℃for 30 minutes. Following http://www.luguang.cn mail:[email protected] LGER433.92M(TO-39) SAW resonator by a high temperature of +80℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the measurement. It shall meet the specifications in table 1. 6-4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for 10±1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in table 1. 6-5 Solderability Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in table 1. 6-6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in table 1. 6-7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1. 6-8 Lead fatigue 5-8-1 Pulling test Weight along with the direction of lead without an shock 1kg. The device shall satisfy all the initial Characteristics. 5-8-2 Bending test Lead shall be subject to withstand against 90℃ bending with 450g weight in the direction of thickness. This operation shall be done toward both direction. The device shall show no evidence of damage and shall satisfy all the initial electrical characteristics. 7. REMARK 7.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 7.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 7.3 Soldering Only leads of component may be soldered. Please avoid soldering another part of component. http://www.luguang.cn mail:[email protected] LGER433.92M(TO-39) SAW resonator 8.Typical Application Circuit http://www.luguang.cn mail:[email protected]