MAS MAS6240C

DA6240C.000
1 November, 2010
MAS6240C
Piezo Driver with Multi-Mode Charge Pump
• Both Single Ended and
Differential Output
• Three-Step Volume Adjusting
• Up to 18Vpp Output from 3V
Supply
• One Wire Audio & Shutdown
Control
• High Efficiency
• Solution without Inductors
• Low External Part Count
DESCRIPTION
MAS6240 is a piezo driver device that can drive
outputs up to 18Vpp from 3V supply. An internal threemode charge pump generates boosted supply voltage
for piezo driver. For adjusting the piezo element sound
volume, the charge pump can operate in either of a
1x, 2x or 3x mode. In 1x mode the output voltage is
same to the input voltage, in 2x or 3x mode the input
voltage is boosted up accordingly 2 or 3 times. Charge
pump mode is selected by control pins EN1 and EN2
(see Table 1 on page 2).
the signal is transferred to piezo output VO1. The
same signal is inverted into output VO2 for using
differential output.
MAS6240 is an easy and low-cost solution for piezo
driver, since only 4 small value capacitors are needed
in addition to sound element - the use of inductors can
be avoided. The inductorless design also causes
significantly less disturbance to the surrounding
circuits making it an ideal choice for sensitive designs.
Its charge pump switches at 1MHz, allowing to using
as small as 100nF external capacitors.
In "disabled" mode (DIN has been low for 15ms
typically) all functional blocks are switched off to
achieve the quiescent current less than 1µA.
Control logic is switching the charge pump on at first
rising signal of digital input (DIN) pin. The switch-off
signal will be generated while the signal at DIN has
been at low mostly for 50ms. The piezo driver is
enabled at a second rising edge of a pulse at DIN and
Continuous logic high level at DIN input causes the
charge pump to be turned ON but leaves the audio
amplifier disabled. In that state the charge pump
output can be used to power the external LEDs or any
other external circuit. The output voltage is still
selectable at three steps.
Two QFN packaged device versions are available. C1
version has short circuit protection which limits input
current taken from the supplies. It is suitable for
driving piezo in single ended configuration. C2 version
does not have input current limitation but it provides
maximum output current drive capability and loudest
sound pressure level. It is suited for driving piezo in
both single ended and differential configurations. In
the die form version D1 the input current limitation is
selectable by bonding.
FEATURES
APPLICATIONS
Piezo Driver & Charge Pump
• Thin 0.75 mm QFN 12 package
• Three-Step Volume Adjusting
• Both Single Ended and Differential Output
• Up to 18Vpp Output from 3V Supply
• One Wire Audio & Shutdown Control
• Low External Part Count
• Solution without Inductor
• 1 MHz Switching Frequency
• Multi-Mode Charge Pump (1x/2x/3x)
• Wrist Watches
• Alarm Clocks
• Handheld GPS devices
• PDAs
• Portable Device with Sound Feature
1 (11)
DA6240C.000
1 November, 2010
BLOCK & APPLICATION DIAGRAM
0.1uF
CP1
0.1uF
CN1
CP2
CN2
VIN (3V)
1x/2x/3x Charge Pump
Oscillator
1MHz
0.1uF
EN1
EN2
VOUT
0.1uF
Short Circuit
Protection
Control
Logic
DIN
VO1
PIEZO SOUNDER
900k
Pull Down
Resistor
VO2
MAS6240C1/C2
GND
Figure 1: C1 or C2 Version Charge Pump + Single End Piezo Driver (max 9Vpp)
0.1uF
CP1
0.1uF
CN1
CP2
CN2
VIN (3V)
1x/2x/3x Charge Pump
Oscillator
1MHz
0.1uF
EN1
EN2
VOUT
0.1uF
Control
Logic
Short Circuit
Protection
DIN
VO1
900k
Pull Down
Resistor
PIEZO SOUNDER
VO2
MAS6240C2
GND
Figure 2: C2 Version Charge Pump + Differential Piezo Driver (max 18Vpp)
Table 1 Charge Pump boosting mode selection
DIN
EN1
EN2
Charge Pump
0
1
1
1
1
0
0
1
1
0
1
0
1
OFF
OFF
1x Mode (VIN)
2x Mode (2xVIN)
3x Mode (3xVIN)
Note: Pulsed signal at digital input DIN is taken as “1” if pulse low time is less than 5 ms!
2 (11)
DA6240C.000
1 November, 2010
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
VIN
Charge pump in 1x mode.
Charge pump in 2x or 3x mode.
Supply Voltage
Outputs and Flying
Capacitors Pins Voltages
Voltage Range for Input
Pins
VOUT Short-Circuit
Duration
Storage Temperature
ESD Rating
VOUT,
CP2, VO1,
VO2
CP1, CN2,
DIN,
EN1, EN2,
CN1
tSC
Min
Max
Unit
-0.3
-0.3
-0.3
5.5
4.0
12
-0.3
-0.3
8
VIN + 0.3
Valid for C1 version which has
short circuit limitation.
V
V
V
V
Indefinite
-55
±2
Human Body Model (HBM)
o
+150
C
kV
Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not
operate under these conditions, but it will not be destroyed.
RECOMMENDED OPERATING CONDITIONS
All voltages with respect to ground.
Parameter
Operating Junction
Temperature
Operating Ambient
Temperature
Operating Supply Voltage
Symbol
Conditions
Min
Typ
Max
Unit
+125
°C
TJ
-40
TA
-40
+27
+85
°C
VIN
2.2
3.0
3.3
V
3 (11)
DA6240C.000
1 November, 2010
ELECTRICAL CHARACTERISTICS
TA = -40°C to +85°C, typical values at TA = 27°C, VIN = 3.0 V, C1 = 100 nF, C2 = 100 nF, COUT = 100 nF, CIN = 100 nF, Cpiezo = 15 nF,
digital input DIN=4kHz; unless otherwise specified
Parameter
Output Voltage
Current Consumption
Symbol
VOUT
ICC
Signal Frequency
FAUDIO
Shutdown Current
ISD
Internal Switching
Frequency (Charge Pump)
VOUT Turn-ON Time
(From DIN signal HIGH to
90% VOUT steady state)
FOSC
tON
Shut Down delay
tOFF
Short Circuit Current Limit
ISC
Control Input Threshold
Control Input Current
VIH
VIL
IIH
IIL
IIH
IIL
Conditions
VOUT pin voltage towards ground
at VIN = 3 V
C1 version: load 0…2 mA
C2 version: load 0…5mA
1x Mode
2x Mode
3x Mode
Charge Pump (no load):
1x Mode
2x Mode
3x Mode
Single ended application
(Cpiezo = 15nF; f=4kHz):
1x Mode
2x Mode
3x Mode
Differential application
(Cpiezo = 15 nF; f=4kHz):
1x Mode
2x Mode
3x Mode
Min
Typ
2.8
5.2
7.2
85
800
2100
0.2
IIH
IIL
Note 1: DIN has been low at least 50 ms.
Note 2: EN1 and EN2 pins are at high-Z state while VDIN=0V.
3
6
9
V
150
1500
3000
µA
mA
0.8
3.5
8.2
4
mA
8
kHz
1
µA
1
1.8
MHz
10
130
400
100
300
800
5
6
30
60
15
100
200
300
50
5
10
50
150
0.6
VDIN = 3V, (900kΩ pull down)
VDIN = 0V
VDIN = 3V
VEN1,EN2 = 3V, (900kΩ pull down)
VEN1,EN2 = 0V
VDIN = 0V, Note 2
VEN1,EN2 = 3V
VEN1,EN2 = 0V
Unit
0.3
1.7
4.2
DIN = 0V, Note 1
C1 version
1x Mode
2x Mode
3x Mode
C2 version
1x Mode
2x Mode
3x Mode
Time before device shutdown after
DIN signal goes to LOW
From VIN pin
C1 version
C2 version
EN1, EN2, DIN pins
Max
µs
µs
1.6
ms
mA
3.4
0
0.55
7
1
V
V
µA
µA
3.4
0
7
1
µA
µA
0
0
1
1
µA
µA
4 (11)
DA6240C.000
1 November, 2010
PIN DESCRIPTION
Pin Description
Symbol
Type
Control signal input for setting charge pump mode
Control signal input for setting charge pump mode
Enable signal + Digital signal input
Flying capacitor negative terminal
Supply ground
Digital audio signal output
Digital audio signal output
Flying capacitor negative terminal
Flying capacitor positive terminal
Charge pump output
Flying capacitor positive terminal
Power supply
Control signal for current limitation
C1 current limitation ON: XCURL=floating or GND
C2 current limitation OFF: XCURL=VIN
EN1
EN2
DIN
CN1
GND
VO2
VO1
CN2
CP1
VOUT
CP2
VIN
XCURL
DI
DI
DI
I/O
G
DO
DO
I/O
I/O
AO
I/O
P
DI
X-coordinate
121
121
121
403
574
765
929
929
929
684
570
393
285
Y-coordinate
695
527
360
121
121
201
407
529
682
849
849
929
929
G = Ground, P = Power, D = Digital, A = Analog, I = Input, O = Output.
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
EN1
CP1
EN2
CN2
DIN
VO1
1050 µm
VOUT
CP2
VIN
XCURL
IC OUTLINES
GND
ID: MAS6240D1
CN1
VO2
1130 µm
DIE size = 1130 x 1050 mm; PAD size = 80 x 80 µm
5 (11)
DA6240C.000
1 November, 2010
DETAILED DESCRIPTION
MAS6240 first pulse skipping
10
9
8
voltage [V]
7
6
5
VO1
4
DIN
3
2
1
0
-1
-20
0
20
40
60
time [ms]
Figure 3: Enabling output VO1
The piezo driver is enabled at the second rising edge of the pulse at DIN, thus the signal is transferred to the
piezo output VO1. An output VO2 is enabled at the same time, but it is optional to take it in use. Control logic is
switching the charge pump on at first rising signal of digital input DIN pin. If only one continuous pulse is fed to
the input DIN, the output VO1 is not enabled. This make it possible to control e.g. a white LED or other device
through pin VOUT while charge pump is enabled, without enabling the piezo output VO1.
MAS6240 first pulse skipping & power down delay
10
9
8
voltage [V]
7
6
5
DIN
4
VO2
3
2
1
0
-1
-20
0
20
40
60
time [sec]
Figure 4: Disabling VO2
Figure 4 is drawn in the case of VO2. The switch-off signal will be generated after the signal at DIN has been low
at mostly for 50 ms. In the figure 4 the switch-off delay is about 15 ms. Again when new pulses are fed into DIN,
the charge pump and piezo driver will be enabled.
6 (11)
DA6240C.000
1 November, 2010
DEVICE OUTLINE CONFIGURATION
QFN 3x3 12ld
7
10
1234
GCv 4
YWW
1
Top Marking Information:
1234 = Product Number
Cv = Version Number
G = Lead Free, RoHS Compliant Package
YWW = Year Week
Pin nr.
Pin Name
Pin nr.
Pin Name
Pin nr.
Pin Name
Pin nr.
Pin Name
1
2
3
EN1
EN2
DIN
4
5
6
CN1
GND
VO2
7
8
9
VO1
CN2
CP1
10
11
12
VOUT
CP2
VIN
7 (11)
DA6240C.000
1 November, 2010
PACKAGE (QFN 3X3x0.75 12ld) OUTLINE
D
D/2
E/2
TOP VIEW
A3
A
PIN 1 MARK AREA
SIDE VIEW
A1
SEATING
PLANE
OPTIONAL PIN #1
IDENTIFICATION
PAD
DETAIL A
D2
b
D2/2
L
1
2
Terminal Tip
e
3
Package Center Line X or Y
E2
E2/2
SHAPE OF PIN #1
IDENTIFICATION
IS OPTIONAL
BOTTOM VIEW
EXPOSED PAD
DETAIL A
Symbol
Min
Nom
Max
PACKAGE DIMENSIONS
A
0.700
0.750
0.850
A1
0.000
0.020
0.050
A3
0.178
--0.228
b
0.180
--0.280
D
2.950
3.000
3.050
D2 (Exposed.pad)
1.200
--1.500
E
2.950
3.000
3.050
E2 (Exposed.pad)
1.200
--1.500
e
0.500 BSC
L
0.350
--0.450
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
3000 Components on Each Reel
Reel Material: Conductive, Plastic Antistatic or Static Dissipative
Carrier Tape Material: Conductive
Cover Tape Material: Static Dissipative
8 (11)
DA6240C.000
1 November, 2010
SOLDERING INFORMATION
◆ For Lead-Free / Green QFN 3mm x 3mm x 0.75mm
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
7.62 - 25.4 µm, Matte Tin
Lead Finish
EMBOSSED TAPE SPECIFICATIONS
P2
PO
P1
D0
T
X
E
F
W
B0
R 0.25 typ
K0
X
A0
User Direction of Feed
Orientation on tape
Dimension
Ao
Bo
Do
E
F
Ko
Po
P1
P2
T
W
Min/Max
3.30 ±0.10
3.30 ±0.10
1.50 +0.1/-0.0
1.75
5.50 ±0.05
1.10 ±0.10
4.0
8.0
±0.10
2.0
±0.05
0.3
±0.05
12.00 ±0.3
All dimensions in millimeters
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
9 (11)
DA6240C.000
1 November, 2010
REEL SPECIFICATIONS
W2
A
D
C
Tape Slot for Tape Start
N
B
W1
Carrier Tape
Cover Tape
End
Start
Trailer
Dimension
A
B
C
D
N
W 1 (measured at hub)
W 2 (measured at hub)
Trailer
Leader
Components
Min
1.5
12.80
20.2
100
12.4
160
390,
of which minimum 160 mm of
empty carrier tape sealed with
cover tape
Leader
Max
Unit
330
mm
mm
mm
mm
mm
mm
mm
mm
mm
13.50
14.4
18.4
10 (11)
DA6240C.000
1 November, 2010
ORDERING INFORMATION
Product Code
Product
Package
Comments
MAS6240C1HP06
Piezo Driver with Multi-Mode
Charge Pump with Input
Current Limiting
Piezo Driver with Multi-Mode
Charge Pump without Input
Current Limiting
Piezo Driver with Multi-Mode
Charge Pump, Input Current
Limiting Selectable by Bonding
Piezo Driver with Multi-Mode
Charge Pump, Input Current
Limiting Selectable by Bonding
QFN 3x3x0.75 12ld, Pb Free,
RoHS Compliant
Tape and Reel
3000 pcs / r
QFN 3x3x0.75 12ld, Pb Free,
RoHS Compliant
Tape and Reel
3000 pcs / r
EWS Tested 8” wafers,
thickness 395 µm
Die size 1.13 x 1.05
mm
395 µm thick dies in waffle pack
Die size 1.13 x 1.05
mm
MAS6240C2HP06
MAS6240D1TC00
MAS6240D1TC05
The formation of product code
An example for MAS6240C1HP06:
MAS6240
Product name
C
Design version
1
Product
Version
HP
Package:
HP = QFN 3 x 3 x 0.75
(Pb free, RoHS compliant)
06
Delivery format:
00 = Tested Wafer
05 = Tested Dies
06 = Tape and Reel
08 = In Tube
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kutomotie 16
FI-00380 Helsinki, FINLAND
Tel. +358 10 835 1100
Fax +358 10 835 1119
http://www.mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no
claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or
modification.
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Customers of Micro Analog Systems Oy using or selling these products for use in such
applications do so at their own risk and agree to fully indemnify Micro Analog Systems Oy for any damages resulting from such improper
use or sale.
11 (11)