DA6240C.005 22 December, 2015 MAS6240C Piezo Driver with Multi-Mode Charge Pump Both Single Ended and Differential Output Three-Step Volume Adjusting Up to 18Vpp Output from 3V Supply One Wire Audio & Shutdown Control High Efficiency Solution without Inductors Low External Part Count DESCRIPTION MAS6240 is a piezo driver device that can drive outputs up to 18Vpp from 3V supply. An internal threemode charge pump generates boosted supply voltage for piezo driver. For adjusting the piezo element sound volume, the charge pump can operate in either of a 1x, 2x or 3x mode. In 1x mode the output voltage is same to the input voltage, in 2x or 3x mode the input voltage is boosted up accordingly 2 or 3 times. Charge pump mode is selected by control pins EN1 and EN2 (see Table 2 on page 3). MAS6240 is an easy and low-cost solution for piezo driver, since only 4 small value capacitors are needed in addition to sound element - the use of inductors can be avoided. The inductorless design also causes significantly less disturbance to the surrounding circuits making it an ideal choice for sensitive designs. Its charge pump switches at 1MHz, allowing to using as small as 100nF external capacitors. Control logic is switching the charge pump on at first rising signal of digital input (DIN) pin. The piezo driver is enabled at a second rising edge of a pulse at DIN and the signal is transferred to piezo output VO1. The same signal is inverted into output VO2 for using differential output. The charge pump and piezo driver disable signal will be generated while the signal at DIN FEATURES Piezo Driver & Charge Pump Thin QFN 2x2 and 3x3 12ld packages Three-Step Volume Adjusting Both Single Ended and Differential Output Up to 18Vpp Output from 3V Supply One Wire Audio & Shutdown Control Low External Part Count Inductorless low EMI solution 1 MHz Switching Frequency Multi-Mode Charge Pump (1x/2x/3x) has been at low mostly for 50ms. When disabled the piezo driver outputs VO1 and VO2 are pulled actively to GND. Continuous logic high level at DIN input causes the charge pump to be turned ON but leaves the piezo driver disabled. In that state the VOUT charge pump output of the MAS6240C2 version can be used to power the external LED or any other external circuit up to 5mA load. The output voltage is still selectable at three steps. In "disabled" mode (DIN has been low for 15ms typically) all functional blocks are switched off to achieve the quiescent current less than 1μA. Two QFN packaged device versions are available. C1 version has short circuit protection which limits input current taken from the supplies. It is suitable for driving piezo in single ended configuration. C2 version does not have input current limitation but it provides maximum output current drive capability and loudest sound pressure level. It is suited for driving piezo in both single ended and differential configurations. In the die form version D1 the input current limitation is selectable by bonding. APPLICATIONS Wrist Watches Alarm Clocks Handheld GPS devices PDAs Portable Device with Sound Feature 1 (13) DA6240C.005 22 December, 2015 BLOCK & APPLICATION DIAGRAM CFLY1=0.1uF CP1 CFLY2=0.1uF CN1 CP2 CN2 VIN (3V) Oscillator 1MHz CIN=0.1uF EN1 1x/2x/3x Charge Pump COUT=0.1uF Short Circuit Protection Control Logic EN2 VOUT DIN 1kΩ…2kΩ Output Protection (optional) VO1 900k Pull Down Resistor PIEZO SOUNDER VO2 MAS6240C1/C2 GND Figure 1. C1 or C2 Version Charge Pump + Single End Piezo Driver (max 9Vpp) CFLY1=0.1uF CP1 FLY2=0.1uF CN1 CP2 CN2 VIN (3V) Oscillator 1MHz CIN=0.1uF EN1 EN2 1x/2x/3x Charge Pump VOUT COUT=0.1uF Control Logic Short Circuit Protection DIN VO1 900k Pull Down Resistor VO2 1kΩ…2kΩ Output Protection (optional) PIEZO SOUNDER MAS6240C2 GND Figure 2. C2 Version Charge Pump + Differential Piezo Driver (max 18Vpp) The application figures 1 and 2 include optional 1kΩ…2kΩ output protection resistor which offers an extra protection for the over voltage that the piezo element could generate in a mechanical shock. The input (CIN), fly (CFLY1, CFLY2) and output (COUT) capacitor value selections affect output ripple and inrush current drawn from input during startup. See table 1 for selecting capacitor values at different applications. The capacitors must be ceramic type with low ESR and meeting following minimum voltage ratings: min 6.3V for CIN and CFLY1-CFLY2 and min 16V for COUT. Table 1. Capacitor value selections at different applications CIN CFLY1-2 COUT Application 100nF 10µF 10µF 100nF 100nF 100nF 100nF 100nF 1µF Minimum size layout but increased inrush current Battery cell operated device with low startup inrush current Low output ripple application with medium inrush current 2 (13) DA6240C.005 22 December, 2015 The voltage ripple at VOUT output is approximately proportional to ratio of piezo load capacitance and charge pump output capacitor (COUT). Thus the output ripple can be reduced by choosing COUT which is much larger relative to piezo capacitance value. However the COUT should not be chosen too large since it lengthens output voltage rise time and increases inrush current drawn from input. For low inrush current the CIN should be made much larger than the COUT. Table 2 presents charge pump boosting modes selected by control pins EN1 and EN2. Table 2. Charge Pump boosting mode selection DIN EN1 EN2 Charge Pump 0 1 1 1 1 0 0 1 1 0 1 0 1 OFF OFF 1x Mode (VIN) 2x Mode (2xVIN) 3x Mode (3xVIN) Note: In above table pulsed signal at digital input DIN is taken as “1” if pulse low time is less than 5 ms! ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions VIN Charge pump in 1x mode. Charge pump in 2x or 3x mode. Supply Voltage Outputs and Flying Capacitors Pins Voltages Voltage Range for Input Pins VOUT Short-Circuit Duration Storage Temperature ESD Rating VOUT, CP2, VO1, VO2 CP1, CN2, DIN, EN1, EN2, CN1 tSC Min Max Unit -0.3 -0.3 -0.3 5.5 4.0 12 -0.3 -0.3 8 VIN + 0.3 Valid for C1 version which has short circuit limitation. V V V V Indefinite -55 ±2 Human Body Model (HBM) +150 oC kV Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not operate under these conditions, but it will not be destroyed. RECOMMENDED OPERATING CONDITIONS All voltages with respect to ground. Parameter Operating Junction Temperature Operating Ambient Temperature Operating Supply Voltage Symbol Conditions Min Typ Max Unit +125 °C TJ -40 TA -40 +27 +85 °C VIN 2.2 3.0 3.3 V 3 (13) DA6240C.005 22 December, 2015 ELECTRICAL CHARACTERISTICS TA = -40°C to +85°C, typical values at TA = 27°C, VIN = 3.0 V, C1 = 100 nF, C2 = 100 nF, COUT = 100 nF, CIN = 100 nF, Cpiezo = 15 nF, digital input DIN=4kHz; unless otherwise specified Parameter Output Voltage Symbol VOUT Shutdown Current ISD Current Consumption ICC Conditions VOUT pin voltage towards ground at VIN = 3 V C1 version: load 15nF C2 version: load 0…5mA 1x Mode 2x Mode 3x Mode Note 1 DIN = 0V, Note 2 Min Typ 2.8 5.2 7.2 Charge Pump (no load): 1x Mode 2x Mode 3x Mode Single ended application (Cpiezo = 15nF; f=4kHz): 1x Mode 2x Mode 3x Mode Differential application (Cpiezo = 15 nF; f=4kHz): 1x Mode 2x Mode 3x Mode, Note 3 85 800 2100 Max Unit 3 6 9 V 1 µA 150 1500 3250 µA 0.26 1.5 3.6 mA mA 8 kHz MHz Signal Frequency FAUDIO 0.2 0.8 3.5 7.6 4 Internal Switching Frequency (Charge Pump) VOUT Turn-ON Time (From DIN signal HIGH to 90% VOUT steady state) FOSC 0.6 1 1.8 10 130 400 100 300 800 5 6 30 60 15 100 200 300 50 5 10 50 150 tON Shut Down delay tOFF Short Circuit Current ISC Control Input Threshold Control Input Current VIH VIL IIH IIL C1 version 1x Mode 2x Mode 3x Mode C2 version 1x Mode 2x Mode 3x Mode Time before device shutdown after DIN signal goes to LOW From VIN pin C1 version with current limitation C2 version EN1, EN2, DIN pins µs µs 1.6 0.55 7 1 ms mA V V µA µA 3.4 VDIN = 3V, (900k pull down) 0 VDIN = 0V VDIN = 3V IIH 3.4 7 µA VEN1,EN2 = 3V, (900k pull down) IIL 0 1 µA VEN1,EN2 = 0V VDIN = 0V, Note 4 IIH 0 1 µA VEN1,EN2 = 3V IIL 0 1 µA VEN1,EN2 = 0V Note 1: C1 version is limited for capacitive load only. C2 version can be also used to drive dc-load from VOUT. Note 2: DIN has been low at least 50 ms. Note 3: For differential 3x mode it is recommended to use C2 version due to limited current drive capability of C1 version. Note 4: EN1 and EN2 pins are at high-Z state while VDIN=0V. 4 (13) DA6240C.005 22 December, 2015 DETAILED DESCRIPTION MAS6240 first pulse skipping 10 9 8 voltage [V] 7 6 5 VO1 4 DIN 3 2 1 0 -1 -20 0 20 40 60 time [ms] Figure 3. Enabling output VO1 The piezo driver is enabled at the second rising edge of the signal at DIN, thus the signal is transferred to the piezo output VO1. An inverted output VO2 is enabled at the same time, but it is optional to take it in use. Control logic is switching the charge pump on at first rising signal of digital input DIN pin. If only one rising edge is fed to the input DIN, the piezo driver remains disabled. This makes it possible to control e.g. a white LED or other device through pin VOUT while charge pump is enabled, without enabling the piezo driver. The VO1 and VO2 outputs are at GND when the piezo driver is disabled. MAS6240 first pulse skipping & power down delay 10 9 8 voltage [V] 7 6 5 DIN 4 VO2 3 2 1 0 -1 -20 0 20 40 60 time [sec] Figure 4. Disabling VO2 Figure 4 is drawn in the case of VO2. The charge pump and piezo driver disable signal will be generated after the signal at DIN has been low at mostly for 50 ms. In the figure 4 the switch-off delay is about 15 ms. Again when new pulses are fed into DIN, the charge pump and piezo driver will be enabled. 5 (13) DA6240C.005 22 December, 2015 DEVICE OUTLINE CONFIGURATION QFN 2x2 12ld QFN 3x3 12ld 7 7 240 10 CvY 10 4 1 1234 GCv 4 YWW 1 Top Marking Information: 240 & 1234 = Product Number Cv = Version Number G = Lead Free, RoHS Compliant Package Y = Year WW = Week QFN-12 2x2x0.5, QFN-12 3x3x0.75 PIN DESCRIPTION Pin Name Pin Type Function EN1 EN2 DIN CN1 GND VO2 VO1 CN2 CP1 VOUT CP2 VIN EXP_PAD 1 2 3 4 5 6 7 8 9 10 11 12 - DI DI DI AI/O G DO DO AI/O AI/O AO AI/O P P Charge pump mode selection input 1 Charge pump mode selection input 2 Enable signal + Digital signal input Flying capacitor 1 negative terminal Supply ground Digital audio signal output 2 Digital audio signal output 1 Flying capacitor 2 negative terminal Flying capacitor 1 positive terminal Charge pump output Flying capacitor 2 positive terminal Power supply Exposed pad connected to GND Note 1 G = Ground, P = Power, D = Digital, A = Analog, I = Input, O = Output Note1: On PCB the exposed can be either connected to GND or left floating. 6 (13) DA6240C.005 22 December, 2015 PACKAGE (QFN 2X2x0.5 12ld) OUTLINE Symbol Min Nom Max Unit PACKAGE DIMENSIONS A 0.45 0.5 0.55 mm A1 --0.02 0.05 mm b 0.20 0.25 0.30 mm b2 0.15 0.20 0.25 mm c 0.18 0.20 0.25 mm D 2.90 3.00 3.10 mm D2 (Exposed.pad) 1.55 1.65 1.75 mm e 0.50 BSC mm Ne 1.00 BSC mm Nd 1.00 BSC mm E 2.90 3.00 3.10 mm E2 (Exposed.pad) 1.55 1.65 1.75 mm L 0.35 0.40 0.45 mm h 0.20 0.25 0.30 mm Dimensions do not include mold or interlead flash, protrusions or gate burrs. 7 (13) DA6240C.005 22 December, 2015 QFN 2X2x0.5 12ld PCB LAND PATTERN Notes I/O lands should be 0.2mm longer than QFN pads and extend the same 0.2mm outside package outline exposed pad land size should be the same as QFN exposed pad size solder resist opening should be 120 m…150 m larger than the land size resulting in 60 m…75 m clearance between copper land and solder resist 8 (13) DA6240C.005 22 December, 2015 PACKAGE (QFN 3X3x0.75 12ld) OUTLINE Symbol Min Nom Max PACKAGE DIMENSIONS A 0.70 0.75 0.80 A1 --0.02 0.05 b 0.20 0.25 0.30 b2 0.15 0.20 0.25 c 0.18 0.20 0.25 D 2.90 3.00 3.10 D2 (Exposed.pad) 1.55 1.65 1.75 e 0.50 BSC Ne 1.00 BSC Nd 1.00 BSC E 2.90 3.00 3.10 E2 (Exposed.pad) 1.55 1.65 1.75 L 0.35 0.40 0.45 h 0.20 0.25 0.30 Dimensions do not include mold or interlead flash, protrusions or gate burrs. Unit mm mm mm mm mm mm mm mm mm mm mm mm mm mm 9 (13) DA6240C.005 22 December, 2015 QFN 3X3x0.75 12ld PCB LAND PATTERN Notes I/O lands should be 0.2mm longer than QFN pads and extend the same 0.2mm outside package outline exposed pad land size should be the same as QFN exposed pad size solder resist opening should be 120 m…150 m larger than the land size resulting in 60 m…75 m clearance between copper land and solder resist 10 (13) DA6240C.005 22 December, 2015 SOLDERING INFORMATION For Lead-Free / Green QFN 2mm x 2mm x 0.5mm and 3mm x 3mm x 0.75mm Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Lead Finish According to RSH test IEC 68-2-58/20 260 C 3 Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org 7.62 - 25.4 µm, Matte Tin QFN 2X2x0.5 EMBOSSED TAPE SPECIFICATIONS User Direction of Feed Orientation on tape Dimension Min/Max Unit A0 B0 D D1 E F K0 P P0 10P0 P2 t W 2.13 ±0.05 2.13 ±0.05 1.50 ±0.1 1.00 +0.25/-0.00 1.75 ±0.10 3.50 ±0.05 0.88 ±0.05 4.00 ±0.10 4.00 ±0.10 40.00 ±0.20 2.00 ±0.05 0.254 ±0.02 8.00 +0.3/-0.1 5 MAX mm mm mm mm mm mm mm mm mm mm mm mm mm ° Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative 11 (13) DA6240C.005 22 December, 2015 QFN 3X3x0.75 EMBOSSED TAPE SPECIFICATIONS P2 PO P1 D0 T X E F W B0 R 0.25 typ K0 X A0 User Direction of Feed Orientation on tape Dimension Min/Max Unit Ao Bo Do E F Ko Po P1 P2 T W 3.30 ±0.10 3.30 ±0.10 1.50 +0.1/-0.0 1.75 5.50 ±0.05 1.10 ±0.10 4.0 8.0 ±0.10 2.0 ±0.05 0.3 ±0.05 12.00 ±0.3 mm mm mm mm mm mm mm mm mm mm mm Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative 12 (13) DA6240C.005 22 December, 2015 ORDERING INFORMATION Product Code Product Package Comments MAS6240C1HP06 Piezo Driver with Input Current Limiting Piezo Driver with Input Current Limiting Piezo Driver without Input Current Limiting Piezo Driver without Input Current Limiting Piezo Driver without Input Current Limiting Piezo Driver, Input Current Limiting Selectable by Bonding Piezo Driver, Input Current Limiting Selectable by Bonding QFN 3x3x0.75 12ld, Pb Free, RoHS Compliant, MSL=1 QFN 3x3x0.75 12ld, Pb Free, RoHS Compliant, MSL=1 QFN 2x2x0.5 12ld, Pb Free, RoHS Compliant, MSL=1 QFN 3x3x0.75 12ld, Pb Free, RoHS Compliant, MSL=1 QFN 3x3x0.75 12ld, Pb Free, RoHS Compliant, MSL=1 EWS Tested 8” wafers, thickness 395 μm Ø13” Tape and Reel 5000 pcs / r Tape 500 pcs MAS6240C1HP09 MAS6240C2Q2106 MAS6240C2HP06 MAS6240C2HP09 MAS6240D1TC00 MAS6240D1TC05 Ø7” Tape and Reel 3000 pcs / r Ø13” Tape and Reel 5000 pcs / r Tape 500 pcs 395 μm thick dies in waffle pack The formation of product code An example for MAS6240C1HP06: MAS6240 C 1 Product name Design version Product Version HP Package: HP = QFN 3 x 3 x 0.75 Q21 = QFN 2 x 2 x 0.5 (Pb free, RoHS compliant) 06 Delivery format: 00 = Tested Wafer 05 = Tested Dies 06 = Tape and Reel 09 = Tape LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kutomotie 16 FI-00380 Helsinki, FINLAND Tel. +358 10 835 1100 Fax +358 10 835 1119 http://www.mas-oy.com NOTICE Micro Analog Systems Oy (MAS) reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. MAS assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and MAS makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. MAS products are not authorized for use in safety-critical applications (such as life support) where a failure of the MAS product would reasonably be expected to cause severe personal injury or death. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safetyrelated requirements concerning their products and any use of MAS products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by MAS. Further, Buyers must fully indemnify MAS and its representatives against any damages arising out of the use of MAS products in such safety-critical applications. MAS products are neither designed nor intended for use in military/aerospace applications or environments. Buyers acknowledge and agree that any such use of MAS products which MAS has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. MAS products are neither designed nor intended for use in automotive applications or environments. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, MAS will not be responsible for any failure to meet such requirements. 13 (13)