DA6279B.001 24 April 2012 MAS6279B This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice. IC FOR 5.00 – 64.00 MHz VCTCXO Fifth Order Compensation Frequency Stability ± 0.14 ppm Wide Frequency Range Very Low Phase Noise Minimum Operating Temperature –40 °C EEPROM Selectable Output Tri State Output • • • • • • • DESCRIPTION The MAS6279B is an integrated circuit well suited to build high end VCTCXO for telecommunication. The trimming is done through a serial bus and the calibration information is stored in an internal EEPROM. FEATURES To build a VCTCXO only a crystal is required in addition to MAS6279B. The compensation method is fully analog, working continuously without generating any steps or other interference. APPLICATIONS • • • • • • • • • Very small size Minimal current consumption Wide operating temperature range Very low phase noise Minimum operating temperature –40 °C Oscillator frequency output selectable by EEPROM direct or fc/2. Output waveform selectable by EEPROM: clipped sine wave or CMOS. Possibility to use just a compensation part • • • • (VC)TCXO for high end telecommunications systems (VC)TCXO for GPS (VC)TCXO for Stratum (VC)TCXO for Picocell (VC)TCXO for Femtocell 1 (9) DA6279B.001 24 April 2012 BLOCK DIAGRAM VDD DA CLK EEPROM+RO TEST(3:0) INF(7:0) LIN(8:0) SQ(6:0) CUB(6:0) FOUR(6:0) FIFTH(6:0) OFS(4:0) CDACC(5:0) CDACF(5:0) DIV PGM SC (from XOPD testmux) INFO POLYNOMIAL TIN Thermal sensor f(T) = Ax5+Bx4 + Cx3+ Dx2+Ex+F TEST MUX VREF bandgap MOUT NOISE FILTER XO core f | f/ 2 OUT VC VDD CDAC To all blocks VSS XIN Buffers+dividers (SINE/CMOS mode) CDAC XOUT Figure 1. Block diagram of MAS6279B. 2 (9) DA6279B.001 24 April 2012 ABSOLUTE MAXIMUM RATINGS Symbol Min Max Unit VDD – VSS VIN TST ILUT -0.3 VSS -0.3 -55 ±100 3.6 VDD + 0.3 150 V V o C mA Parameter Supply Voltage Input Voltage Storage Temperature Latchup Current Limit Note Note: Operation at maximum conditions will not damage the part but performance can not be guaranteed. Stresses beyond those listed may cause permanent damage to the device. Note: This is a CMOS device and therefore it should be handled carefully to avoid any damage by static voltages (ESD). RECOMMENDED OPERATION CONDITIONS Parameter Symbol Supply Voltage Supply Voltage at EEPROM Programming Operating Temperature Crystal Pulling Sensitivity Crystal Load Capacitance VDD VDD Crystal Rs Rs TOP S CL Conditions Min Typ Max Unit T=+25°C. Note 1. 2.6 3.0 2.8 3.3 3.6 3.6 V V -40 24 25 +85 44 VC = 1.3V 9.2 20 50 Note o C ppm/pF pF Ω Note 1. The recommended condition for EEPROM programming is room temperature. 3 (9) DA6279B.001 24 April 2012 ELECTRICAL CHARACTERISTICS (recommended operation conditions) Parameter Symbol Conditions Min Typ Max Unit Note Crystal Frequency Range fc 10.00 64.00 MHz 1) Output Frequency Range fo 5.00 64.00 MHz 1) Voltage Control Range VC 0 VDD V 2) Voltage Control Sensitivity VCSENS 3 ppm/V 3) Voltage Control Linearity VCLIN ±20 % 4) Frequency vs. Supply Voltage dfo Frequency vs. Load Change dfo Output voltage (10 kΩ || 10 pF) Vout Output voltage (10 kΩ || 15 pF) Vout 1.3 VDD ± 5% 0.8 ±0.1 ppm 5) Vpp 6) Vpp 7) 1.0 0.8vdd 7) Vol 0.2vdd Rise and Fall Time (10 - 15 pF) 3 Duty Cycle IDD Supply Current, CMOS mode Compensated Frequency Stability ppm VDD Voh Supply Current, Sine mode ±0.1 dfo 10 MHz 40 MHz 52.5 MHz 10 MHz 40 MHz 52.5 MHz o o -40 C …+85 C o o -20 C …+70 C o o +10 C …+50 C 40 1.2 2.3 2.5 1.7 3.9 4.9 -0.5 -0.28 -0.14 50 1.3 2.5 2.7 1.8 4.1 6.3 7) ns 60 1.7 3.3 3.7 2.1 5.0 7.0 +0.5 +0.28 +0.14 7) % mA mA ppm Compensation Range Linear a1 -0.4 -0.1 ppm/K Part o Compensation Inflection Point INF 20 28 36 C Compensation Range Cubic -12 3 a3 95 10 /K Part Amplitude Start up Time TSTART 2 ms Tri State Output Buffer OFF State DA 0 V 0.55 ON State VDD-0.6 VDD @ 1Hz -60 @ 10Hz -90 @ 100Hz -113 Phase Noise φn dBc/Hz -136 @ 1kHz -148 @ 10kHz -155 @ 100kHz Note 1: Frequency division by two is selected by EEPROM bit DIV: 0=no division, 1=div by 2 Thus IC output frequency range is 5 MHz – 64 MHz. Note 2: If VC is not needed, it should be left unconnected (floating) Note 3: Depending on a crystal pulling. Note 4: VC=1.3V±0.5V, VDD=2.8V Note 5: RL = 10 kΩ ± 10%, In sine wave output CL = 10 pF ± 10%, In CMOS output CL = 15 pF ± 10% Note 6: Sine mode only Note 7: CMOS mode only Note 8: Typical values Note 9: Not measured in production testing; guaranteed by design. 8) 9) 4 (9) DA6279B.001 24 April 2012 DEVICE OUTLINE CONFIGURATION QFN10 3x3 XOUT VSS OUT 6279 BX YWW VC XIN Top View VDD MOUT CLK DA TIN A = product version X = Varactor type Y = year WW = week 5 (9) DA6279B.001 24 April 2012 PACKAGE (QFN 3X3x0.75 10ld) OUTLINE D D/2 E/2 TOP VIEW A3 A PIN 1 MARK AREA SIDE VIEW A1 SEATING PLANE D2 b D2/2 E2/2 E2 L SHAPE OF PIN #1 IDENTIFICATION IS OPTIONAL BOTTOM VIEW e Symbol Min Nom EXPOSED PAD Max PACKAGE DIMENSIONS A 0.700 0.750 0.800 A1 0.000 0.020 0.050 A3 0.178 --0.228 b 0.200 --0.300 D 2.950 3.000 3.050 D2 (Exposed.pad) 2.500 --2.700 E 2.950 3.000 3.050 E2 (Exposed.pad) 1.650 --1.750 e 0.500 BSC L 0.350 --0.450 Dimensions do not include mold or interlead flash, protrusions or gate burrs. Unit mm mm mm mm mm mm mm mm mm mm 6 (9) DA6279B.001 24 April 2012 SOLDERING INFORMATION ◆ For Lead-Free / Green QFN 3mm x 3mm x 0.75mm Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile According to RSH test IEC 68-2-58/20 260°C 3 Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org 7.62 - 25.4 µm, Matte Tin Lead Finish EMBOSSED TAPE SPECIFICATIONS P2 PO P1 D0 T X E F W B0 R 0.25 typ K0 X A0 User Direction of Feed Orientation on tape Dimension Ao Bo Do E F Ko Po P1 P2 T W Min/Max 3.30 ±0.10 3.30 ±0.10 1.50 +0.1/-0.0 1.75 5.50 ±0.05 1.10 ±0.10 4.0 ±0.10 8.0 ±0.05 2.0 0.3 ±0.05 12.00 ±0.3 All dimensions in millimeters Unit mm mm mm mm mm mm mm mm mm mm mm 7 (9) DA6279B.001 24 April 2012 REEL SPECIFICATIONS W2 A D C Tape Slot for Tape Start N B W1 Carrier Tape Cover Tape End Start Trailer Dimension Components Min A B C D N W 1 (measured at hub) W 2 (measured at hub) Trailer Leader 1.5 12.80 20.2 100 12.4 Leader Max Unit 330 mm mm mm mm mm mm mm mm mm 13.50 14.4 18.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 3000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative 8 (9) DA6279B.001 24 April 2012 ORDERING INFORMATION Product Code Product Package MAS6279B1WAB00 MAS6279B1WAB05 MAS6279B1WA900 MAS6279B1WA905 MAS6279B1Q1306 IC for VCTCXO IC for VCTCXO IC for VCTCXO IC for VCTCXO IC for VCTCXO EWS Tested wafer, thickness 180 µm Tested 180 µm thick dice in waffle pack EWS Tested wafer, thickness 215 µm Tested 215 µm thick dice in waffle pack QFN10, T&R 3000 pcs / reel, Pb free RoHS Contact Micro Analog Systems Oy for other wafer thickness options. ◆ Product code details Product name Design version Package type Delivery format MAS6279 B1 WA9 = 215 µm thick EWS tested wafer or chip Q13 = 10 pin 3 x 3 x 0.75 mm QFN 00 = tested wafer 05 = waffle pack 06 = T&R 3000 pcs LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kutomotie 16 FI-00380 Helsinki, FINLAND Tel. +358 10 835 1100 Telefax +358 10 835 1119 http://www.mas-oy.com NOTICE Micro Analog Systems Oy (MAS) reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. MAS assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and MAS makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. MAS products are not authorized for use in safety-critical applications (such as life support) where a failure of the MAS product would reasonably be expected to cause severe personal injury or death. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of MAS products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by MAS. Further, Buyers must fully indemnify MAS and its representatives against any damages arising out of the use of MAS products in such safety-critical applications. MAS products are neither designed nor intended for use in military/aerospace applications or environments. Buyers acknowledge and agree that any such use of MAS products which MAS has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. MAS products are neither designed nor intended for use in automotive applications or environments. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, MAS will not be responsible for any failure to meet such requirements. 9 (9)