DA9280.003 13 July 2006 MAS9280 IC FOR 18.00 – 40.00 MHz VCTCXO This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice. Min. Supply Voltage 2.4 V Max. Frequency 40 MHz True Sine Wave Output Frequency Stability +/- 1.5 ppm Suitable Also for Low Pull Crystals Very Low Phase Noise • • • • • • DESCRIPTION The MAS9280 is an integrated circuit well suited to build VCTCXO for mobile communication. Temperature calibration is achieved in three calibration temperatures only. The trimming is done through a serial bus and the calibration information is stored in an internal PROM. This means no rework for trimming is needed. To build a VCTCXO additionally only a crystal is required. The compensation method is fully analog, working continuously without generating any steps or other interference. Divider function allows the usage of double frequency crystal. FEATURES • • • • • • APPLICATIONS Very small size Minimum Vdd 2.4V No voltage reference capacitor needed Phase noise <-110 dBc/Hz at 100 Hz and <-130 dBc/Hz at 1kHz @ 32 MHz crystal Programmable VC-sensitivity Oscillator frequency output fo /2 versions available • • VCTCXO for mobile phones VCTCXO for other telecommunications systems BLOCK DIAGRAM DA CLK PV CUB 4 INF 4 SENS 4 LIN 8 CDAC1 8 MAS9280 f(T) TE1 Σ f(T) T Vref TMux TE2 VC VDD CDAC2 VSS 2 OUT X2 X1 1 (8) DA9280.003 13 July 2006 PIN DESCRIPTION Pin Description Symbol MAS9280A1/ A3 /B1/B3 x-coordinate MAS9280A1/ A3 /B1/B3 y-coordinate MAS9280A2 /B2 x-coordinate MAS9280A2 /B2 y-coordinate Power Supply Voltage Programming Input Serial Bus Clock Input VDD PV CLK 268 604 1047 1320 1320 1320 268 604 1420 1320 1320 1320 Serial Bus Data Input Temperature Output Crystal/Varactor Oscillator Input Voltage Control Input Crystal Oscillator Output Buffer Output Power Supply Ground Test Multiplexer Output DA TE1 X2 VC X1 OUT VSS TE2 1420 1848 1048 268 796 2020 1701 2058 1320 1320 164 164 164 164 164 1320 1047 1848 1048 268 796 2020 1701 2058 1320 1320 164 164 164 164 164 1320 Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. Note: Test Multiplexer Output is for testing only and must not be connected in module. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Min Max Unit Supply Voltage Input Voltage Power Dissipation Storage Temperature VDD - VSS VIN PMAX TST -0.3 VSS -0.3 6.0 VDD + 0.3 20 150 V V mW o C -55 Note 1) Note 1: Not valid for programming pin PV RECOMMENDED OPERATION CONDITIONS Parameter Supply Voltage Supply Current Operating Temperature Load Capacitance Load Capacitance Crystal Pulling Sensitivity Crystal Rs Symbol VDD ICC TOP CL CL S CRS Conditions Min Typ Max Unit 2.4 2.6 5.0 1.8 +85 V mA o C pF pF ppm/pF Ω Vdd = 2.8 Volt -40 8 10 18 30 50 Note 1 2 3 Note 1: MAS9280A1, MAS9280A2 and MAS9280A3 with CDAC1 = 160 …200 Note 2: MAS9280B1, MAS9280B2 and MAS9280B3 with CDAC1 = 160 …200 Note 3: At 30 MHz to 40 MHz maximum Rs 30 ohm. 2 (8) DA9280.003 13 July 2006 ELECTRICAL CHARACTERISTICS Parameter Symbol Min Frequency Range fo Voltage Control Range VC Typ Max Unit Note 18.00 40.00 MHz 1) 0 VDD V Voltage Control Sensitivity (VCR = 0) VCSENS 10 ppm/V Voltage Control Sensitivity (VCR = 1) VCSENS 5 ppm/V 2) Frequency vs. Supply Voltage dfo ±0.2 ppm 3) Frequency vs. Load Change dfo ±0.2 ppm 4) Output Voltage (10kΩ // 10 pF) Vout 0.6 Harmonic Distortion Compensation Range ± 2.5 ppm TC Compensation Range ± 2.0 ppm 1.0 Vpp -25 dBc -40 TC -30 85 o C 85 o C o C Compensation Range ± 1.5 ppm TC -25 75 Compensation Range Linear Part a1 -0.7 0.0 Compensation Inflection Point INF 25 31 Compensation Range Cubic Part a3 Compensation CDAC1 (8 Bit) CX1 C10 C10 + 10.6 pF 5) Compensation CDAC2 (2 Bit) CX2 C20 C20 + 3 pF 6) Start up Time ppm/K o TSTART C ppm2/K3 95 2 ms Note 1: MAS9280B1, MAS9280B2 and MAS9280B3 maximum frequency are 36MHz Note 2: default Note 3: VDD +/- 5% Note 4: R=10 kohm +/- 10%, C=10 pF +/- 10% Note 5: typ C10 = 9.7pF Note 6: typ C20 = 15.2pF IC OUTLINES VDD PV CLK DA TE1 TE2 1484um VDD PV DA CLK TE1 TE2 1484um MAS9280A1/A3 /B2/B3 VC X1 X2 Die map reference VSS MAS9280A2 /B2 VC OUT X1 X2 VSS OUT Die map reference 2194um 2194um Note 1: MAS9280A and MAS9280B pads are round with 80 µm diameter at opening. Note 2: Pins CLK and DA can either be connected to VSS or left floating, pin PV can either be connected to VDD or left floating and pin TE1 must be left floating in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip. 3 (8) DA9280.003 13 July 2006 SAMPLES IN SBDIL 20 PACKAGE 1 20 OUT 2 19 3 18 VSS TE2 4 DA 6 MAS9280A1 YYWW XXXXX.X TE1 5 17 16 X2 Top marking: YYWW = Year, Week XXXXX.X = Lot number 15 14 X1 CLK 7 13 PV 8 VDD 9 12 VC 10 11 DEVICE OUTLINE CONFIGURATION MSOP10 OUT DA VSS CLK X2 PV VDD 9280 AX YWW TE2 Top View X1 VC A = product version X = pad layout and fo version Y = year WW= week 4 (8) DA9280.003 13 July 2006 PACKAGE (MSOP-10) OUTLINE e S See Detail A c B c1 b1 (b) E1 E1 B Section B - B E E 5-15 Degrees L1 Detail A A2A F AA A1 Land Pattern Recommendation Gauge Plane 0 - 8 Degrees L2 D Seating Plane N L G Symbol Min Nom Max Unit A A1 A2 b b1 c c1 D E E1 e F G L (Terminal length for soldering) L1 L2 M N S -0.00 0.75 0.15 0.15 0.08 0.08 --0.85 ---- 1.10 0.15 0.95 0.30 0.25 0.23 0.18 mm mm mm mm mm mm mm mm mm mm mm mm mm mm 0.40 3.00 BSC 4.90 BSC 3.00 BSC 0.50 BSC 4.8 0.50 0.60 0.80 0.95 REF 0.25 BSC 0.41 1.02 0.50 M mm mm mm Mm Dimensions do not include mold or interlead flash, protrusions or gate burrs. Reference Standard : JEDEC MO-187 BA. 5 (8) DA9280.003 13 July 2006 SOLDERING INFORMATION Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile According to RSH test IEC 68-2-58/20 2*220°C 240°C 2 Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% Seating Plane Co-planarity Lead Finish EMBOSSED TAPE SPECIFICATIONS P1 T DO PO P2 E W F BO A AO KO D1 Section A-A User Direction of Feed Pin 1 Designator Dimension Min/Max Unit Ao Bo Do D1 E F Ko Po P1 P2 T W 5.00 ±0.10 3.20 ±0.10 1.50 +0.1/-0.0 1.50 min 1.75 5.50 ±0.05 1.45 ±0.10 4.0 8.0 ±0.10 2.0 ±0.05 0.3 ±0.05 12.00 +0.30/-0.10 mm mm mm mm mm mm mm mm mm mm mm mm 6 (8) DA9280.003 13 July 2006 REEL SPECIFICATIONS W2 A D C Tape Slot for Tape Start N B W1 5000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative Carrier Tape Cover Tape End Start Trailer Dimension A B C D N W 1 (measured at hub) W 2 (measured at hub) Trailer Leader Weight Leader Components Min 1.5 12.80 20.2 50 12.4 Max Unit 330 mm mm mm mm mm mm mm mm mm 13.50 14.4 18.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 1500 g 7 (8) DA9280.003 13 July 2006 ORDERING INFORMATION Product Code MAS9280A1TG00 MAS9280A1SM06 MAS9280A2TG00 MAS9280A3TG00 MAS9280A3SM06 MAS9280B1TG00 MAS9280B1SM06 MAS9280B2TG00 MAS9280B3TG00 MAS9280B3SM06 Product IC FOR VCTCXO IC FOR VCTCXO IC FOR VCTCXO, CLK and DA pins swapped round IC FOR VCTCXO, frequency output fo /2 IC FOR VCTCXO, frequency output fo /2 IC FOR VCTCXO IC FOR VCTCXO IC FOR VCTCXO, CLK and DA pins swapped round IC FOR VCTCXO, frequency output fo /2 IC FOR VCTCXO, frequency output fo /2 Comments For 8pF Crystal load For 8pF Crystal load For 8pF Crystal load Package EWS Tested wafers 215 µm For 8pF Crystal load EWS Tested wafers 215 µm For 8pF Crystal load MSOP-10, T&R/5000 pcs/r. For 10pF Crystal load For 10pF Crystal load For 10pF Crystal load EWS Tested wafers 215 µm For 10pF Crystal load EWS Tested wafers 215 µm For 10pF Crystal load MSOP-10, T&R/5000 pcs/r. MSOP-10, T&R/5000 pcs/r. EWS Tested wafers 215 µm MSOP-10, T&R/5000 pcs/r. EWS Tested wafers 215 µm Please contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 8 (8)