SyChip SN3020 IEEE802.15.4/ZigBee Smart Energy Module User Manual and Datasheet Version: 1.1 March 8, 2011 Confidential Information Note: SyChip, Inc. reserves the right to make changes in specifications at anytime and without notice. The information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Sychip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license is generated under any rights of SyChip or its supporters unless specifically agreed. Table of Contents 1 SYSTEM DESCRIPTIONS..................................................................................................................................... 4 1.1 1.2 1.3 1.4 2 MECHANICAL SPECIFICATIONS ..................................................................................................................... 6 2.1 2.2 2.3 2.4 2.5 3 APPLICATIONS ................................................................................................................................................... 4 MODULE SUMMARY .......................................................................................................................................... 4 BLOCK DIAGRAM .............................................................................................................................................. 5 ACRONYMS ........................................................................................................................................................ 5 MODULE DIMENSION ......................................................................................................................................... 6 MODULE TOP AND SIDE VIEW ............................................................................................................................. 6 MODULE BOTTOM VIEW ..................................................................................................................................... 7 DETAILED MECHANICAL DATA (TOP VIEW) ........................................................................................................ 8 MODULE PIN-OUT .............................................................................................................................................. 9 DC ELECTRICAL SPECIFICATIONS .............................................................................................................. 12 3.1 3.2 TYPICAL POWER CONSUMPTION ...................................................................................................................... 12 DIGITAL IO SPECIFICATION ............................................................................................................................. 12 4 RF SPECIFICATIONS.......................................................................................................................................... 13 5 ENVIRONMENTAL SPECIFICATIONS ........................................................................................................... 14 5.1 5.2 6 APPLICATION INFORMATION........................................................................................................................ 15 6.1 6.2 6.3 6.4 6.5 6.5.1 6.5.2 7 REFERENCE CONNECTION FOR UART HOST INTERFACE .................................................................................. 15 REFERENCE CONNECTION FOR THE SPI HOST INTERFACE ................................................................................ 16 RECOMMENDED HOST (CUSTOMER) CIRCUIT BOARD PCB PATTERN ................................................................ 17 HOST PCB LAYOUT RECOMMENDATIONS ........................................................................................................ 17 MODULE LOCATION......................................................................................................................................... 18 Location in x-y plane.................................................................................................................................. 19 Location in z-plane..................................................................................................................................... 19 ASSEMBLY INFORMATION ............................................................................................................................. 20 7.1 8 ABSOLUTE MAXIMUM RATINGS ....................................................................................................................... 14 OPERATION CONDITIONS.................................................................................................................................. 14 LEAD-FREE SOLDERING REFLOW PROFILE ........................................................................................................ 20 PACKAGE INFORMATION ............................................................................................................................... 21 8.1 8.2 TAPE AND REEL SPECIFICATION ....................................................................................................................... 21 MODULE MARKING .......................................................................................................................................... 22 9 ORDERING INFORMATION ............................................................................................................................. 23 10 ROHS DECLARATION........................................................................................................................................ 23 11 REGULATORY INFORMATION....................................................................................................................... 23 11.1 FCC NOTICE (USA) ........................................................................................................................................ 23 11.1.1 FCC Labeling Requirements ................................................................................................................. 24 11.1.2 RF Exposure .......................................................................................................................................... 24 11.2 IC NOTICE (CANADA)...................................................................................................................................... 25 11.3 CE NOTICE (EUROPE) ...................................................................................................................................... 25 12 TECHNICAL SUPPORT CONTACT ................................................................................................................. 26 13 REFERENCES ....................................................................................................................................................... 26 SyChip/Murata Confidential Page 2 of 26 SN3020 User Manual 1.1 List of Figures FIGURE 1 SN3020 MODULE BLOCK DIAGRAM ..................................................................................................................... 5 FIGURE 2 MODULE TOP AND SIDE VIEW .............................................................................................................................. 6 FIGURE 3 MODULE BOTTOM VIEW ...................................................................................................................................... 7 FIGURE 4 DETAILED MECHANICAL DATA (TOP VIEW) .......................................................................................................... 8 FIGURE 5 UART HOST INTERFACE REFERENCE DIAGRAM ................................................................................................. 15 FIGURE 6 SPI HOST INTERFACE REFERENCE DIAGRAM ...................................................................................................... 16 FIGURE 7 RECOMMENDED HOST (CUSTOMER) PCB PATTERN ............................................................................................ 17 FIGURE 8 RECOMMENDED HOST CIRCUIT BOARD DESIGN UNDERNEATH THE MODULE .................................................... 18 FIGURE 9 RECOMMENDED LOCATIONS IN XY-PLANE .......................................................................................................... 19 FIGURE 10 LOCATIONS NOT RECOMMENDED IN XY-PLANE ................................................................................................ 19 FIGURE 11 RECOMMENDED LOCATIONS IN Z-PLANE ........................................................................................................... 19 FIGURE 12 LOCATIONS NOT RECOMMENDED IN XY-PLANE ................................................................................................ 19 FIGURE 13 REFLOW PROFILE PATTERN ............................................................................................................................... 20 FIGURE 14 TAPE DIMENSIONS............................................................................................................................................. 21 SyChip/Murata Confidential Page 3 of 26 SN3020 User Manual 1.1 1 System Descriptions 1.1 Applications SyChip’s SN3020 module is a standard-based wireless transceiver targeting the Smart Energy market with low power consumption, high transmit power (20 dBm typ.) and high receiver sensitivity (-103 dBm). It is based upon the IEEE 802.15.4 wireless network specification. The module can be used to develop applications supporting the ZigBee PRO Smart Energy application profile. The SN3020 module operates in the 2.4 GHz unlicensed ISM frequency band for worldwide deployment. 1.2 Module Summary • Dimensions: 27.20 x 14.75 x 2.90 mm3 • Ember EM357 high-performance, integrated ZigBee/802.15.4 chipset • Supply voltage: 2.4V to 3.4V • Data logging memory: 8 Mbits serial flash • Security: 128-bit AES • Antenna: on-module • Host Interface: SPI, UART • Meter interface: I2C, GPIO • ADC ports: 6 x 14-bit • RoHS compliant • MSL JEDEC level 3 SyChip/Murata Confidential Page 4 of 26 SN3020 User Manual 1.1 1.3 Block Diagram Antenna LPF PA Balun SPDT LNA Switch Connector Balun EM357 (ZigBee IC) SPI I/F UART I/F nRESET JTAG VREG OUT (1.8V) Serial Flash (8Mbit) XTAL (24MHz) GPIO I/F Figure 1 SN3020 Module Block Diagram 1.4 Acronyms ADC Analog to Digital Converter AMR Automatic Meter Reading GPIO General-Purpose Input-Output I2C Intelligent Interface Controller ISM Industrial, Scientific and Medical MAC Medium Access Control MSL Moisture Sensitivity Level PER Packet Error Rate ROHS Restriction of Hazardous Substances SPI Serial Peripheral Interface UART Universal Asynchronous Receiver-Transmitter WPAN Wireless Personal Area Network SyChip/Murata Confidential Page 5 of 26 SN3020 User Manual 1.1 2 Mechanical Specifications 2.1 2.2 Module Dimension Parameter Typical Units Dimension (LxWxH) Dimension tolerances (LxWxH) 27.20 x 14.75 x 2.90 ±0.20 x ±0.20 x ±0.15 mm mm Module top and side view Figure 2 Module Top and Side View SyChip/Murata Confidential Page 6 of 26 SN3020 User Manual 1.1 2.3 Module bottom view Figure 3 Module Bottom View SyChip/Murata Confidential Page 7 of 26 SN3020 User Manual 1.1 2.4 Detailed mechanical data (top view) Pin 20 Pin 32 Pin 13 Pin 1 Figure 4 Detailed Mechanical Data (top view) SyChip/Murata Confidential Page 8 of 26 SN3020 User Manual 1.1 2.5 Module Pin-out Table 1 Module Connector Signal Description Pin # Pin name I/O Description 1 GND - Ground 2 Reserved O Internal serial flash on/off control (active low), for debugging use only 3 PC4/JTMS I/O Programmable I/O control available to the host, or JTAG mode select 4 PB0/IRQA I/O Programmable I/O control available to the host, or an interrupt input 5 Reserved O Internal serial flash nCS, for debugging use only 6 PB6/ADC1/IRQB I/O Programmable I/O control available to the host, or ADC input, or an interrupt input 7 PC1/ADC3 I/O Programmable I/O control available to the host, or an ADC input 8 SWCLK/JTCK I Programmable I/O control available to the host, or an interrupt input, or the JTAG reset input 9 PC0/JRST/IRQD 10 GND 11 PB5/ADC0 12 GND - Ground 13 GND - Ground 14 GND - Ground 15 GND - Ground SyChip/Murata Confidential I/O JTAG/Serial Wire debugging port clock I/O Page 9 of 26 Ground Programmable I/O control available to the host, or an ADC input SN3020 User Manual 1.1 Pin # Pin name I/O 16 Reserved 17 GND - Ground 18 Reserved O Used internally as the LNA on (active low), for debugging use only 19 nRESET I Module reset signal (Internal pull-up) 20 GND - Ground 21 GND - Ground 22 PA3 I/O 23 GND - 24 PC6/OSC32B I/O Programmable I/O control available to the host, or 32.768kHZ crystal 25 PC7/OSC32A I/O Programmable I/O control available to the host, or 32.768kHz crystal 26 SC1SCLK/PB3 I/O SPI port 1 clock, or programmable I/O control available to the host, 27 Reserved O Used internally as the serial flash MOSI, for debugging use only 28 Reserved O Used internally as the serial flash MISO, for debugging use only 29 VBATT PI Module power supply 30 Reserved O Used internally as the serial flash clock, for debugging use only 31 PA4/ADC4 32 GND 33 PA5/ADC5/nBOOTMODE SyChip/Murata Confidential I/O Description I/O - I/O Page 10 of 26 Not connected in SN3020. Programmable I/O control available to the host, Ground Programmable I/O control available to the host, or ADC input Ground Programmable I/O control available to the host, or ADC input, or Boot control, must be left open or pulled high during the reset to enable the normal firmware boot process. SN3020 User Manual 1.1 Pin # Pin name 34 SC1MISO(s)/ SC1MOSI(m)/TXD/PB1/SC1SDA 35 SC1MOSI(s)/ SC1MISO(m)/RXD/PB2/SC1SCL I/O Description I/O SPI port 1 MISO (slave)/ MOSI (master) signal, UART TXD signal, I2C port 1 DATA signal, or programmable I/O control available to the host. I/O SPI port 1 MOSI (slave)/ MISO (master) signal, UART RXD signal, I2C port 1 CLK signal, or programmable I/O control available to the host. 36 PC2/JTDO/SWO I/O Programmable I/O control available to the host, or Serial Wire port OUTPUT signal, or JTAG data out 37 SC1nSSEL/PB4 I/O SPI port 1 slave select, or programmable I/O control available to the host, 38 PC3/JTDI I/O Programmable I/O control available to the host, or JTAG data in 39 GND - Ground 40 GND - Ground 41 GND - Ground 42 GND - Ground 43 GND - Ground 44 GND - Ground SyChip/Murata Confidential Page 11 of 26 SN3020 User Manual 1.1 3 DC Electrical Specifications 3.1 Typical Power Consumption Table 2 Typical Power Consumption Item Values Condition Min Typ Units Max Sleep mode VCC = 3.0V, TAMB = 25°C Internal RC oscillator on Processor, radio, peripherals off 1.2 µA Standby mode VCC = 3.0V, TAMB = 25°C Processor on Radio and peripherals off 12 mA Receive mode VCC = 3.0V, TAMB = 25°C Radio receive chain on 35 mA Transmit mode (+20dBm) VCC = 3.0V, TAMB = 25°C Radio transmit chain on 175 mA Serial controller current For each controller at maximum data rate 0.2 mA General purpose timer current For each timer at maximum clock rate 0.25 mA General purpose ADC current At maximum sample rate, DMA enabled 1.1 mA 3.2 Digital IO Specification VCC = 3.0V, TAMB = 25°C, NORMAL MODE1 unless otherwise stated Table 3 Digital IO Specification Item Condition Values Symbol Min Max Input current for logic 0 IIL -0.5 µA Input current for logic 1 IIH 0.5 µA 0.5 x VCC V Low Schmitt switching threshold 1 Typ Units Schmitt input threshold going from high to low VSWIL 0.42 x VCC NORMAL MODE as defined by Ember for EM357. SyChip/Murata Confidential Page 12 of 26 SN3020 User Manual 1.1 High Schmitt switching threshold Schmitt input threshold going from low to high VSWIH 0.62 x VCC 0.8 x VCC V Output voltage for logic 0 IOL = 4mA (8mA) for standard (high current) pads VOL 0 0.18 x VCC V Output voltage for logic 1 IOH = 4mA (8mA)for standard (high current) pads VOH 0.82 x VCC VCC V Output Source Current Standard current pad IOHS 4 mA Output Sink current Standard current pad IOLS 4 mA Output Source Current High current pad IOHH 8 mA Output Sink current High current pad IOLH 8 mA IOH + IOL 40 mA Total output current 4 RF Specifications VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50Ω terminal load connected to the RF connector Table 4 RF Specifications Parameter Frequency range Min 2400 Receiver sensitivity Maximum input signal level Max Units 2500 MHz -103 dBm -20 dBm Transmitter power at the maximum setting 2 20 dBm Adjacent channel rejection 24 dB Alternate channel rejection 42 dB Carrier frequency error 2 Typ -40 +40 ppm Ember RF output power programmed to -12 by emberSetRadioPower [2] or equivalent under NORMAL mode SyChip/Murata Confidential Page 13 of 26 SN3020 User Manual 1.1 5 Environmental Specifications 5.1 Absolute maximum ratings Table 5 Absolute Maximum Rating Symbol 5.2 Description Min Max Units Top Operating temperature -40 85 °C Tst Storage temperature -40 85 °C Vbatt Power supply -0.3 3.6 V RFin RF input power 10 dBm MSL Moisture Sensitivity Level RoHS Restriction of Hazardous Substances 3 Compliant Operation conditions Table 6 Recommended Operating Conditions Symbol Vbatt Top 3 Parameter Min Typ Max Units Power supply 2.4 3.0 3.43 V Operating temperature -40 85 °C This value is handled by Firmware to meet FCC regulation for modular approval. SyChip/Murata Confidential Page 14 of 26 SN3020 User Manual 1.1 6 Application Information 6.1 Reference connection for UART host interface Figure 5 illustrates the connections between SN3020 module and the host MCU via UART interface. A level shifter may be needed if the host UART interface level does not match with SN3020. Power supply GPIO nRESET RXD TXD TXD RXD Host uC SN3020 Figure 5 UART Host Interface Reference Diagram SyChip/Murata Confidential Page 15 of 26 SN3020 User Manual 1.1 6.2 Reference connection for the SPI host interface Figure 6 illustrates the connections between SN3020 module and the host MCU via SPI interface. Power supply GPIO nRESET SCLK SC1SCLK SCS SC1nSSEL MOSI SC1MOSI MISO SC1MISO Host uC SN3020 Figure 6 SPI Host Interface Reference Diagram SyChip/Murata Confidential Page 16 of 26 SN3020 User Manual 1.1 6.3 Recommended host (customer) circuit board PCB pattern Pin 32 Pin 20 Pin 1 Pin 13 Figure 7 Recommended Host (customer) PCB Pattern 6.4 Host PCB layout recommendations The SN3020 module has an onboard antenna therefore it requires some special host PCB layout underneath the module such that the radio can achieve its best RF performance. Refer to Figure 8 for the requirements. SyChip/Murata Confidential Page 17 of 26 SN3020 User Manual 1.1 Zone1 GND GND GND GND GND Antenna (Layer 1) Zone2 GND Figure 8 Recommended Host Circuit Board Design underneath the Module Notes: 1. Due to the surface mount antenna on the module, the area in ‘Zone1’ on all layers of the customer circuit board should be free of any metal objects. Specifically, there should be no ground plane, traces, or metal shield case. 2. The area in ‘Zone2’ on the top layer of the customer circuit board should have ground only with no signal traces. 6.5 Module Location For optimum EIRP, customer is advised to use the recommended module location on their respective PCB. SyChip/Murata Confidential Page 18 of 26 SN3020 User Manual 1.1 6.5.1 Location in x-y plane Antenna Connector No GND in this area (See Fig.8) Antenna Shield Case Figure 9 Recommended Locations in xy-plane Figure 10 Locations Not Recommended in xy-plane 6.5.2 Location in z-plane Metal Module Antenna Connector Antenna Mother Board Metal Figure 11 Recommended Locations in z-plane Metal Metal Metal Figure 12 Locations Not Recommended in xy-plane SyChip/Murata Confidential Page 19 of 26 SN3020 User Manual 1.1 7 Assembly Information 7.1 Lead-free soldering reflow profile The lead-free solder reflow profile is recommended in the table & graph below. The profile is used to attach the module to its host PCB. The module is designed to withstand 2 reflows. Opposite side reflow is prohibited due to the module weight. Table 7 Reflow Profile Recommendation Ramp up rate Maximum time maintained above 217oC Peak temperature Maximum time within 5oC of peak temperature Ramp down rate 3oC/second max 120 seconds 250oC 20 seconds 6oC/second max Reflow Profile Temperature, C 250 200 150 100 50 0 Time, seconds Figure 13 Reflow Profile Pattern SyChip/Murata Confidential Page 20 of 26 SN3020 User Manual 1.1 8 Package Information 8.1 Tape and reel specification The product will be shipped in tape and reel package. (1) Dimensions of tape (Plastic tape) Figure 14 Tape Dimensions (2) Dimensions of reel TBD SyChip/Murata Confidential Page 21 of 26 SN3020 User Manual 1.1 8.2 Module marking The module will be marked using a label suitable for reflow soldering. Table 8 Module Marking Item A B C D Description Pin 1 ID Model Name MFG barcode in human readable form (includes module type, date code and serial number) Certification Information SyChip/Murata Confidential Page 22 of 26 SN3020 User Manual 1.1 9 Ordering Information Table 9 Ordering Information Product Evaluation kit Module SyChip Model Number SyChip Part Number SN3020EVK 88-00143-85 SN3020 88-00143-00/01* • -01 is for engineering sample quantities in cut tape (Ex. 5~50 pieces) • -00 is for full production reel (950 pcs/reel) 10 RoHS Declaration Given supplier declarations, this product does not contain substances that are banned by Directive 2002/95/EC or contains a maximum concentration of 0.1% by weight in homogeneous materials for • Lead and lead compounds • Mercury and mercury compounds • Chromium (VI) • PBB (polybrominated biphenyl) • PBDE (polybrominated biphenyl ether) And a maximum concentration of 0.01% by weight in homogeneous materials for • Cadmium and cadmium compounds 11 Regulatory Information SN3020 has obtained the certifications described below. 11.1 FCC Notice (USA) This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The FCC requires the user to be notified that any changes or modifications not expressly approved by SyChip, Inc. may void the user’s authority to operate the equipment. While an application of the SN3020 module in a product is not required to obtain a new FCC authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for that end product. SyChip/Murata Confidential Page 23 of 26 SN3020 User Manual 1.1 This device using the integrated antenna has been tested to comply with FCC CFR Part 15. The device meets the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter given the following conditions: • User must set the maximum output power level for the channel ranges listed below as defined by IEEE 802.15.4 [1] using emberSetRadioPower or equivalent under NORMAL mode as specified in [2]: o For channels 11 to 24, the value of -11 o For channel 25, the value of -17 o For channel 26, the value of -27 • Duty cycle of 67% allowed • The application firmware must be written to disable power out if the source voltage is greater than 3.4V* • VBATT must be between 2.4V – 3.4V *The voltage level may be monitored and sampled using emberMeasureVddFast or equivalent just prior to calling emberInit and also within the main loop of EmberZNET stack. If the average of 5 samples exceeds 3450, then invoke halReboot to disable output power and restart the system. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: reorient or relocate the receiving antenna, increase the separation between the equipment and receiver, connect the equipment into an outlet on a circuit different from that to which the receiver is connected, or consult the dealer or an experienced radio/TV technician for help. 11.1.1 FCC Labeling Requirements When integrating the SN3020 into a product the FCC labeling requirements must be met. This includes a clearly visible label on the outside of the finished product specifying the SN3020 FCC identifier (FCC ID:QPU3020) as well as the notice above. The exterior label can use wording such as “Contains Transmitter Module FCC ID:QPU3020” or “Contains FCC ID:QPU3020” although any similar wording that expresses the same meaning may be used. 11.1.2 RF Exposure This module has been certified for remote and base radio applications and is not intended to be operated within 20cm of the body. If the module will be used for portable applications, the device must undergo SAR testing. The following statement must be included as a CAUTION statement in manuals for the products to alert users on FCC RF exposure compliance: SyChip/Murata Confidential Page 24 of 26 SN3020 User Manual 1.1 “WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operations at closer distances than this are not recommended.” 11.2 IC Notice (Canada) The term “IC” before the certification/registration number only signifies that the Industry Canada technical specifications were met. Le terme “IC” devant le numéro de certification /d’enregistrement signifie seulement que les spécifications techniques Industrie Canada ont été respectées. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to The following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence (s). Son utilisation est soumise à Les deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter Toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement du dispositif. This device complies with Health Canada’s Safety Code 6 / IC RSS-210. The installer of this device should ensure that RF radiation is not emitted in excess of the Health Canada’s requirement. Information can be obtained at: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guidelignes_direct-eng.php Cet appareil est conforme avec Santé Canada Code de sécurité 6 / IC RSS-210. Le programme d'installation de cet appareil doit s'assurer que les rayonnements RF n'est pas émis au-delà de l'exigence de Santé Canada. Les informations peuvent être obtenues: http://www.hc-sc.gc.ca/ewhsemt/pubs/radiation/radio_guide-lignes_direct-eng.php The host device should be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: Contains transmitter module IC:4523A-SN3020 where 4523A-SN3020 is the module’s certification number. 11.3 CE Notice (Europe) This device has been tested and certified for use in the European Union. SyChip/Murata Confidential Page 25 of 26 SN3020 User Manual 1.1 If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards. A Declaration of Conformity must be issued and kept on file as described in Annex II of the Radio and Telecommunications Terminal Equipment Directive. The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive. Given that the operating frequency band is not harmonized by a few European countries, the restriction or alert sign must be placed along side the ‘CE’ mark as shown below. As of the date of this document, only France has a restriction. The restriction is that, if the radio is operated outdoors in the 2450-2483.5 MHz band, the power must be limited to 10 mW instead of 100 mW. The OEM must account for this and the product must have the alert mark. It does not require country notifications, however. 12 Technical Support Contact SyChip, Inc 2805 Dallas Parkway, Suite 400 Plano, TX 75093 USA Tel: (972) 202-8900 Fax: (972) 633-0327 Note: SyChip, Inc is an operating unit within Murata Wireless Solutions 13 References [1] IEEE Standard 802.15.4 – 2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [2] Ember, “EmberZNet API Reference: For the EM35x SoC Platform”, 120-3022-000G, October 28 2010 SyChip/Murata Confidential Page 26 of 26 SN3020 User Manual 1.1