SPBT2532C2.AT2 Bluetooth® V2.1 + EDR module class 2 embedding SPP and AT commands Datasheet − production data Features ■ Bluetooth® radio – Fully embedded Bluetooth v2.1 + EDR with profiles – Class 2 module – Complete RF ready module ■ ST micro Cortex-M3 microprocessor up to 72 MHz ■ Memory – 256 kb Flash memory – 48 kb RAM memory ■ Data rate – 1.5 Mbps maximum data rate ■ Serial interface – UART up to 2.0 Mbps ■ General I/O – 4 general purpose I/Os ■ User interface – AT2 command set (abSerial) – Firmware upgrade over UART ■ CE and Bluetooth qualified ■ EPL (end product listing) fulfilled ■ Single voltage supply: 3.3 V typical ■ Micro-sized form factor: 10.5 x 13.5 x 2.5 mm ■ Operating temperature range: -40 °C to 85 °C July 2012 This is information on a product in full production. Doc ID 023461 Rev 1 1/27 www.st.com 27 Contents SPBT2532C2.AT2 Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Software architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 4.1 Lower layer stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Upper layer stack: Amp'ed UP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.3 AT command set: abSerial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.4 Bluetooth firmware implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.1 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.3 High speed CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . 11 5.4 Standard CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . . . 11 5.5 I/O operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.6 Selected RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.7 Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.8 Pin placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.9 Layout drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6 Hardware block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7 Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8 2/27 7.1 Module reflow installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.2 GPIO interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.3 UART interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 8.1 Antenna choice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 8.2 Antenna coupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Doc ID 023461 Rev 1 SPBT2532C2.AT2 Contents 8.3 Example of trace calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 8.4 Reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 8.4.1 External reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 8.4.2 Internal reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 9 Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 10 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Doc ID 023461 Rev 1 3/27 List of tables SPBT2532C2.AT2 List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. 4/27 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 High speed CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Standard CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 I/O operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Selected RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Doc ID 023461 Rev 1 SPBT2532C2.AT2 List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. FW architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Ground plane diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Layout drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 SPBT2532C2.AT2 module block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Connection to host device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Typical RS232 circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Example of antenna integration on the STEVAL-SPBT2ATV3. . . . . . . . . . . . . . . . . . . . . . 20 Antenna printed on PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SMD antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SMA connector for external antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Parameters for trace matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 External reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Internal reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Doc ID 023461 Rev 1 5/27 Description 1 SPBT2532C2.AT2 Description The SPBT2532C2.AT2 is an easy to use Bluetooth module, compliant with Bluetooth v2.1 + EDR. The module is the smallest form factor available which provides a complete RF platform. The SPBT2532C2.AT2 enables electronic devices with wireless connectivity, not requiring any RF experience or expertise for integration into the final product. The SPBT2532C2.AT2 module, being a certified solution, optimizes the time to market of the final application. The module is designed for maximum performance in the minimum possible size including fast speed UART and 4 general purpose I/O lines, several serial interface options, and up to 1.5 Mbps data throughput. The SPBT2532C2.AT2 is a surface mount PCB module that provides fully embedded, ready-to-use Bluetooth wireless technology. The reprogrammable Flash memory contains embedded firmware for serial cable replacement using the Bluetooth SPP profile. Embedded Bluetooth AT2 command firmware is a friendly interface, which realizes a simple control for cable replacement, enabling communication with most Bluetooth enabled devices, provided that the devices support the SPP profile. The SPBT2532C2.AT2, supporting iAP profile, provides communication with Android™, smartphones, and Apple® iOS Bluetooth enabled devices. An Apple authentication IC is required to exchange data with an Apple device or access an Apple device application. The AT2 FW includes the Bluetooth SPP profile capable of recognizing the Apple authentication chip. Customers using the Apple authentication IC must register as developers to become an Apple certified MFI member. License fees may apply, for additional information visit: http://developer.apple.com/programs/which-program/index.html. Certified MFI developers developing electronic accessories that connect to the iPod®, iPhone®, and iPad® gain access to technical documentation, hardware components, technical support and certification logos. Customized firmware for peripheral device interaction, power optimization, security, and other proprietary features may be supported and can be ordered pre-loaded and configured. 6/27 Doc ID 023461 Rev 1 SPBT2532C2.AT2 2 RoHS compliance RoHS compliance ST modules are RoHS compliant and comply with ECOPACK® norms. 3 Applications ■ Serial cable replacement ■ M2M industrial control ■ Service diagnostic ■ Data acquisition equipment ■ Machine control ■ Sensor monitoring ■ Security system ■ Mobile health. Doc ID 023461 Rev 1 7/27 Software architecture SPBT2532C2.AT2 4 Software architecture 4.1 Lower layer stack 4.2 4.3 ● Bluetooth v2.1 + EDR ● Device power modes: active, sleep and deep sleep ● Wake-on Bluetooth feature optimized power consumption of host CPU ● Authentication and encryption ● Encryption key length from 8 bits to 128 bits ● Persistent Flash memory for BD address and user parameter storage ● All ACL (asynchronous connection less) packet types ● Point-to-point supported ● Master/slave switch supported during connection and post connection ● Dedicated inquiry access code for improved inquiry scan performance ● Dynamic packet selection channel quality driven data rate to optimize link performance ● Dynamic power control ● 802.11b co-existence AFH. Upper layer stack: Amp'ed UP ● SPP, IAP, SDAP and GAP protocols ● RFComm, SDP, and L2CAP supported ● Multipoint with simultaneous slaves. AT command set: abSerial The complete command list including the iAP commands is reported in the UM1547 user manual. 8/27 Doc ID 023461 Rev 1 SPBT2532C2.AT2 4.4 Software architecture Bluetooth firmware implementation Figure 1. FW architecture abSerial AT Command Set and/or custom application Application layer API iAP Upper layer stack + BT profiles:Amp’edUP HCI over UART Lower layer BT stack Bluetooth controller AM14808v1 Doc ID 023461 Rev 1 9/27 Hardware specifications 5 SPBT2532C2.AT2 Hardware specifications General conditions (VIN = 3.3 V and 25 °C). 5.1 Recommended operating conditions Table 1. Recommended operating conditions Rating Min. Typ. Max. Unit Operating temperature range(1) -40 - 85 °C Supply voltage VIN 2.8 3.3 3.6 V Signal pin voltage - 3.0 - V RF frequency 2400 - 2483.5 MHz 1. @ CPU 8MHz, @ CPU 32MHZ - 16 MHz max. operating temperature is 55 °C. 5.2 Absolute maximum ratings Table 2. 10/27 Absolute maximum ratings Rating Min. Typ. Max. Unit Storage temperature range -55 - +105 °C Supply voltage, VIN -0.3 + 5.0 V I/O pin voltage, VIO -0.3 + 5.5 V RF input power - -5 dBm Input voltage on non-5 V tolerant pin 0.3 +4.0 V Doc ID 023461 Rev 1 SPBT2532C2.AT2 5.3 Hardware specifications High speed CPU mode current consumption ● High speed CPU mode – CPU 32 MHz, maximum operating temperature 55 °C – UART supports up to 921 Kbps – Data throughput up to 1.5 Mbps – Shallow sleep enabled. Table 3. 5.4 High speed CPU mode current consumption Modes (typical power consumption) Avg. Unit ACL data 115 K baud UART at max. throughput (master) 41 mA ACL data 115 K baud UART at max. throughput (slave) 41 mA Connection, no data traffic, master 28.9 mA Connection, no data traffic, slave 34.5 mA Standby, without deep sleep 28 mA Standby, with deep sleep 3.1 mA Bluetooth power down / CPU standby 25 µA Mode (typical power consumption) Avg. Unit ACL data 115 K baud UART at max. throughput (master) 25.8 mA ACL data 115 K baud UART at max. throughput (slave) 25.8 mA Connection, no data traffic, master 11.9 mA Connection, no data traffic, slave 16.9 mA Standby, without deep sleep 11.2 mA Standby, with deep sleep 2.6 mA Bluetooth power down / CPU standby 25 µA Standard CPU mode current consumption ● Standard CPU mode – CPU 8 MHz, maximum operating temperature 85 °C – UART supports up to 115 Kbps – Data throughput up to 200 Kbps – Shallow sleep enabled. Table 4. Standard CPU mode current consumption Doc ID 023461 Rev 1 11/27 Hardware specifications 5.5 I/O operating characteristics Table 5. 5.6 SPBT2532C2.AT2 I/O operating characteristics Symbol Parameter Min. Max. Unit Conditions VIL Low-level input voltage - 0.9 V VIN, 3.0 V VIH High-level input voltage 2.1 - V VIN, 3.0 V VOL Low-level output voltage - 0.4 V VIN, 3.0 V VOH High-level output voltage 2.2 - V VIN, 3.0 V IOL Low-level output current - 4.0 mA VOL = 0.4 V IOH High-level output current - 4.0 mA VOH = 2.2 V RPU Pull-up resistor 80 120 kΩ Resistor turned on RPD Pull-down resistor 80 120 kΩ Resistor turned on Selected RF characteristics Table 6. Selected RF characteristics Parameter Conditions Antenna load Typ. Unit 50 ohm Radio receiver Sensitivity level BER < .001 with DH5 -85 dBm Maximum usable level BER < .001 with DH1 +8 dBm Input VSWR 2.5:1 Radio transmitter Maximum output power 12/27 50 Ω load +2 dBm Initial carrier frequency tolerance ± 30 kHz 20 dB bandwidth for modulated carrier 935 kHz Doc ID 023461 Rev 1 SPBT2532C2.AT2 Hardware specifications 5.7 Pin assignment Table 7. Pin assignment Name Type Pin# Description ALT function(1) (2) 5V tolerant Initial state UART interface RXD I 13 Receive data ADC 3 Y TXD O 14 Transmit data ADC 2 Y RTS O 12 Request to send (active low) ADC 0 I2C clock/aux UART Rx Y CTS I 11 Clear to send (active low) ADC 1 I2C data/aux UART Tx Y I 9 Boot 0 Vin 8 Vin GND 5,7 GND I 10 Reset input (active low for 5 ms) RF I/O 6 50 Ω Rx/Tx antenna port Boot loader Boot 0 Power and ground Reset RESETN Antenna ANT GPIO - general purpose input/output GPIO [1] I/O 1 General purpose input/output SPI MISO Y Input pull-down GPIO [2] I/O 2 General purpose input/output SPI MOSI/I2S_SD Y Floating GPIO [3] I/O 3 General purpose input/output SPI SCLK/ I2S_CK Y Input pull-down GPIO [4] I/O 4 General purpose input/output SPI SS/I2S_WS Y Input pull-down 1. ADC pin functions are not 5 V tolerant when used as ALT pin function. Otherwise the I/O pins are all 5 V tolerant. 2. Please note that the usage of ALT function is dependant upon the firmware that is loaded into the module, and is beyond the scope of this document. The AT command interface uses the main UART by default. Doc ID 023461 Rev 1 13/27 Hardware specifications 5.8 14/27 SPBT2532C2.AT2 Pin placement Figure 2. Pin placement Figure 3. Ground plane diagram Doc ID 023461 Rev 1 SPBT2532C2.AT2 5.9 Hardware specifications Layout drawing Figure 4. Layout drawing 1 GPI0 01 TXD 14 2 GPI0 02 RXD 13 3 GPI0 03 RTS 12 4 GPI0 04 CTS 11 RESET 10 5 GND 6 ANT BOOT 9 7 GND VIN 8 pad size: 0.76x1.07 10.5x13.5x2.5 mm (height tolerance +/- 0.1 mm) All dimensions are in millimeters. Drawing is not in scale. Doc ID 023461 Rev 1 AM14832v1 15/27 Hardware block diagram 6 SPBT2532C2.AT2 Hardware block diagram Figure 5. SPBT2532C2.AT2 module block diagram Battery or Supply ARM Cortex MCU STM32 Regulator 256K Flash BP Filter Host Controller Interface STLC2500DB UART GPIO 48K RAM UART I2S/ PCM Clock LPO AM14807v1 16/27 Doc ID 023461 Rev 1 SPBT2532C2.AT2 7 Hardware design Hardware design The SPBT2532C2.AT2 module with AT2 command embedded FW supports UAR and GPIO hardware interfaces. Note that the usage of these interfaces is dependent upon the firmware that is loaded into the module, and is beyond the scope of this document. The AT2 command interface uses the main UART by default. Note: 7.1 1 All unused pins should be left floating; do not ground. 2 All GND pins must be well grounded. 3 The area around the module should be free of any ground planes, power planes, trace routings, or metal, for 6 mm from the antenna in all directions. 4 Traces should not be routed underneath the module. Module reflow installation The SPB2532C2.AT2 is a surface mount Bluetooth module supplied on a 14-pin, 6-layer PCB. The final assembly recommended reflow profiles are indicated here below. The soldering phase must be executed with care: in order to avoid undesired melting phenomenon, particular attention must be paid to the setup of the peak temperature. The following are some suggestions for the temperature profile based on IPC/JEDEC JSTD-020C, July 2004 recommendations. Table 8. Soldering Profile feature Average ramp-up rate (TSMAX to TP) PB-free assembly 3 °C/sec max. Preheat: – Temperature min. (TS min.) – Temperature max. (TS max.) – Time (ts min. to ts max.)(ts) 150 °C 200 °C 60-100 sec Time maintained above: – Temperature TL – Temperature TL 217 °C 60-70 sec Peak temperature (TP) 240 + 0 °C Time within 5 °C of actual peak temperature (TP) 10-20 sec Ramp-down rate 6 °C/sec Time from 25 °C to peak temperature Doc ID 023461 Rev 1 8 minutes max. 17/27 Hardware design SPBT2532C2.AT2 Figure 6. Soldering profile !-V 7.2 GPIO interface All GPIOs are capable of sinking and sourcing 4 mA of I/O current. GPIO [1] is internally pulled down with 100 kΩ (nominal) resistors. 7.3 UART interface The UART is compatible with the 16550 industry standard. Four signals are provided with the UART interface. The TXD and RXD pins are used for data while the CTS and RTS pins are used for flow control. Figure 7. Connection to host device "LUETOOTH -ODULE (OST !-V 18/27 Doc ID 023461 Rev 1 SPBT2532C2.AT2 Figure 8. Hardware design Typical RS232 circuit !-V Doc ID 023461 Rev 1 19/27 Application information 8 SPBT2532C2.AT2 Application information Here below there are some suggestions to better implement the module in the final application. ● Avoid that traces with switching signals are routed on the motherboard below the module. The best condition would be to have a ground plane underneath the module ● Connect the supply voltage ground of the module with the other grounds present on the motherboard in a star ground configuration. Keep the RF ground separate from the module supply voltage ground; the two grounds are already connected inside the module in one point, a possible implementation can be seen in Figure 9. Figure 9. 8.1 Example of antenna integration on the STEVAL-SPBT2ATV3 Antenna choice The RF output pin must be connected to an antenna which may be: ● Antenna directly printed on the PCB (Figure 10) ● Integrated SMD antenna, including but not limited to the following examples (Figure 11): – Johanson Technology 2450T18A100S – Antenova 30-30-A5839-01 – Murata ANCV12G44SAA127 – Pulse W3008 – Yageo CAN4311153002451K. The external antenna connected by means of an SMA connector (Figure 12). 20/27 Doc ID 023461 Rev 1 SPBT2532C2.AT2 Application information Figure 10. Antenna printed on PCB Note: This is an antenna design indication. Since antenna dimension depends on PCB material, thickness, ε r constant and design, among other parameters, to dimension it correctly, please refer to antenna calculator literature. Figure 11. SMD antenna Figure 12. SMA connector for external antenna Doc ID 023461 Rev 1 21/27 Application information 8.2 SPBT2532C2.AT2 Antenna coupling Despite the type of antenna chosen, the connection between the RF out pin and the antenna must be realized to get the maximum power transfer. As a general rule, the characteristic impedance (Z0) of the connection must be fixed at the value of 50 Ω. The connection trace must be matched to respect such a condition. 50 Ω¸ matching depends on various factors and elements that must be taken into consideration: 8.3 ● Type of material, i.e. FR4 or others ● The electrical characteristics of the material, among them the electric constant, ε r, at 2.4 GHz ● PCB and traces mechanical dimensions: – PCB thickness – Reference ground thickness – Trace width – Trace thickness. Example of trace calculation Example of strip line calculation: ● To get a strip line of 50 Ω, using a 1 mm thick FR4 board, with an ε r = 4.3 at 2.4 GHz, with Cu thickness of 41 µm, the strip line width must be 1.9 mm (micro strip type calculation). Tools for calculating the characteristic impedance, based on the physical and mechanical characteristics of the PCB, can be easily found online. Figure 13. Parameters for trace matching 22/27 Doc ID 023461 Rev 1 SPBT2532C2.AT2 8.4 Application information Reset circuit Two types of system reset circuits are detailed below. 8.4.1 External reset circuit Figure 14. External reset circuit 2%3%4 !-V Note: RPU ranges from 30 kΩ to 50 kΩ internally. 8.4.2 Internal reset circuit Figure 15. Internal reset circuit 2%3%4 !-V Note: 1 RPU ranges from 30 kΩ to 50 kΩ internally. 2 RRST should be from 1 kΩ to 10 kΩ. Doc ID 023461 Rev 1 23/27 Regulatory compliance 9 SPBT2532C2.AT2 Regulatory compliance ● ● BQB – BQB qualified design, QD ID: B016360 – Product type: End Product – TGP version: Core 2.1/2.1 + EDR TCRL-2009-1 – Core spec version: 2.1/2.1 + EDR – Product descriptions: Bluetooth module CE – CE Expert opinion: 307-ARAJ00079 – Measurements have been performed in accordance with (report available on request): – EN 300 328 V 1.7.1 (2006-10) (a) – EN 301 489-17 V 2.1.1 (2009) (b) – EN60950-1:2006 +A11:2009+A1:2010 (c) CE certified: a. EN 300 328 V 1.7.1 (2006-10): “electromagnetic compatibility and radio spectrum matters (ERM); wideband transmission systems; data transmission equipment operating in the 2.4 GHZ ISM band and using wideband modulation techniques; harmonized EN covering essential requirements under article 3.2 of the R&TTE directive”. b. EN 301 489-17 V 2.1.1 (2009): “electromagnetic compatibility and radio spectrum matters (ERM); electromagnetic compatibility (EMC) standard for radio equipment and services; part 17: specific condition for 2.4 GHz wideband transmission systems and 5 GHz high performance RLAN equipment”. c. EN60950-1:2006 +A11:2009+A1:2010: “Information technology equipment - safety”. 24/27 Doc ID 023461 Rev 1 SPBT2532C2.AT2 10 Ordering information Ordering information Table 9. Ordering information Order code Description SPBT2532C2.AT2 Class 2 OEM Bluetooth antenna module Doc ID 023461 Rev 1 25/27 Revision history 11 SPBT2532C2.AT2 Revision history Table 10. 26/27 Document revision history Date Revision 18-Jul-2012 1 Changes First release. Doc ID 023461 Rev 1 SPBT2532C2.AT2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 023461 Rev 1 27/27