a module solution provider WG7310-00 WLAN/BT/FM Module TI WL1271 IEEE 802.11b/g/n, BT 2.1+EDR & FM solution Product Specification Revision 0.3 Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Doc No: WG7310-00-SPC-R03 Index 1. OVERVIEW...............................................................................................................2 1.1. GENERAL FEATURES..............................................................................................2 2. FUNCTIONAL FEATURES........................................................................................3 2.1. MODULE BLOCK DIAGRAM .................................................................................3 2.2. BLOCK FUNCTIONAL FEATURE ..............................................................................3 2.2.1. WLAN Features .......................................................................................3 2.2.2. Bluetooth Features ................................................................................4 2.2.3. FM Radio (RX/TX) Features ..................................................................5 3. MODULE SPECIFICATION.....................................................................................6 3.1. ABSOLUTE MAXIMUM RATINGS.............................................................................6 3.2. RECOMMENDED OPERATING CONDITIONS ..........................................................6 3.3. RF CHARACTERISTIC ............................................................................................6 3.3.1. WLAN RF ...................................................................................................6 3.3.2. Bluetooth RF ............................................................................................7 3.3.3. FM Radio Electrical Characteristics..................................................8 4. PACKAGE INFORMATION ...................................................................................9 4.1. SIGNAL LAYOUT (TOP VIEW) ................................................................................9 4.2. PIN DESCRIPTION ...............................................................................................10 4.3. ORDERING INFORMATION ..................................................................................13 4.4. PACKAGE MARKING..........................................................................................13 5. MECHANICAL CHARACTERISTICS ...................................................................14 6. SMT AND BAKING RECOMMENDATION ........................................................15 6.1. BAKING RECOMMENDATION ..............................................................................15 6.2. SMT RECOMMENDATION ...................................................................................15 7. HISTORY CHANGE ...............................................................................................16 Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 1 Doc No: WG7310-00-SPC-R03 1. OVERVIEW WG7310, a WiFi , Bluetooth and FM SiP (system in package) module, is the most demanded design for all handset and portable devices with TI WL1271 IEEE 802.11b/g/n and BT v2.1 EDR solutions to provide the best WiFi and BT coexistence interoperability and power saving technologies from TI. 1.1. General Features WLAN, Bluetooth and FM radio on a SIP module LGA96 pin package Dimension 10mm(L) x 10mm(W) x 1.4mm(H) Based on TI WL1271 65-nm CMOS technology packaged in WSP for module Seamless integration with TI OMAP application processor and GSM-GPRS-UMTS chipset Internal support for WLAN and Bluetooth Co-existence (bandwidth sharing, antenna sharing) Direct connection to battery using external switching mode power supply supporting 5.5V to 2.3V operation VIO in the 1.8V domain Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 2 Doc No: WG7310-00-SPC-R03 2. FUNCTIONAL FEATURES 2.1. Module Block Diagram VBAT DC2DC WL1271 WL1271 FE WLAN VIO PA(b/g/n) 38.4M X’tal SW Slow CLK BPF BT Host I/F Host Signaling TX FM Debug I/F Matching RX Matching WG7310 2.2. Block Functional Feature 2.2.1. WLAN Features WLAN MAC Baseband Processor and RF transceiver which is IEEE802.11b/g/n PICS compliant Optimized for ultra low current consumption in all operating modes including extremely low power modes IEEE Std 802.11d, e, h, I, k, r, s PICS compliant Supports Cisco Client eXtensions (CCX) standard Support Secure Digital Input/Output (SDIO), Serial Peripheral Interface (SPI) Host Interfaces Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 3 Doc No: WG7310-00-SPC-R03 Medium-Access Controller (MAC) Embedded ARM Central Processing Unit (CPU) 292kByte (Used for Program code, data and packet data) Embedded Random-Access Memory (RAM) Hardware-Based Encryption/Decryption Using 64-, 128-, and 256-Bit WEP, TKIP or AES Keys Supports Wi-Fi Protected Access (WPA and WPA2.0) and IEEE Std 802.11i [Includes Hardware-Accelerated Advanced-Encryption Standard (AES)] Designed to Work with IEEE Std 802.1x for Virtual Private Network (VPN) Solutions Baseband Processor All IEEE Std 802.11b Data Rates, all IEEE Std 802.11b/g and 802.11n Data Rates up to 72.2Mbps 2.4 GHz Radio Digital Radio Processor (DRP) implementation Internal LNA Supports: IEEE Std 802.11b, 802.11g, 802.11b/g and 802.11n 2.2.2. Bluetooth Features Bluetooth 1.1, 1.2, 2.0+EDR and 2.1+EDR specification compliant – up to HCI level BT Enhanced Data Rate (2 and 3 Mbps) Support for Bluetooth 2005 core release Enhanced host Interfaces (UART, btSPI) Very low power consumption On-chip Embedded radio Embedded ARM Microprocessor System Temperature detection and compensation mechanism ensure minimal variation in the RF performance over the entire temperature range A2DP support Wide-Band Speech support Full support for the Ultra Low Power (ULP) Bluetooth standard (previously known as Wibree) Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 4 Doc No: WG7310-00-SPC-R03 2.2.3. FM Radio (RX/TX) Features On-Chip FM Receive On-Chip 0dBm output FM Transmitter Operation through BT host interface (UART/btSPI) or separate I²C interface for control and RDS data transfer Up to 48k Samples/sec audio sampling for stereo headsets Frequency resolution: 50-kHz step tuner Compatibility with Europe/US (87.5-108MHz) and Japan (76-90 MHz) FM Bands Full digital implementation Digital MPX signal, thus eliminating need for noise blanking circuits Integrated RDS/RDBS features Soft Mute Stereo/Mono blend based on signal condition for RX Selectable 50/75-us de-emphasis filter I²S format for stereo/mono digital audio data Analog stereo audio inputs/outputs Software selectable level for soft mute and stereo/mono blend level for RX Fast independent up/down tuning function Supports a dedicated enable pin for the FM IP Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 5 Doc No: WG7310-00-SPC-R03 3. MODULE SPECIFICATION 3.1. Absolute Maximum Ratings Over operating free-air temperature range Characteristics Value Unit VBAT -0.5 to 5.5 V VIO -0.5 to 2.1 V Input Voltage to Analog Pins -0.5 to 2.1 V Input Voltage to all Other Pins -0.5 to VIO + 0.5V V Operating Ambient Temperature Range -20 to 70 °C Storage Temperature Range -45 to 85 °C Supply Voltage Range 3.2. Recommended Operating Conditions The WG7310 requires three two supplies: VBAT and VIO. Voltage Power Supply Min. Typ. Max. VBAT 2.7V 3.3V 4.8V VIO 1.62V 1.8V 1.92V 3.3. RF Characteristic 3.3.1. WLAN RF WLAN Transmitter Characteristics Condition EVM Min Typ Output Power 54M OFDM 4.83% 13.5 48M OFDM 4.70% 13.5 36M OFDM 4.80% 13.5 24M OFDM 4.82% 13.5 18M OFDM 4.79% 13.5 Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Max Unit dBm Page 6 Doc No: WG7310-00-SPC-R03 12M OFDM 4.70% 13.5 9M OFDM 4.81% 13.5 6M OFDM 4.85% 13.5 11M CCK 4.83% 17 5.5M CCK 4.82% 17 2M DSSS 4.73% 17 1M DSSS 4.80% 17 WLAN Receive Characteristics Condition Min Typ Sensitivity 54M OFDM -73 48M OFDM -75 36M OFDM -80 24M OFDM -83 18M OFDM -86 12M OFDM -88 9M OFDM -89 6M OFDM -90 11M CCK -88 5.5M CCK -90 2M DSSS -91 1M DSSS -94 Max Unit dBm 3.3.2. Bluetooth RF BT Transmitter, GFSK, Class 2 & Class 1.5 Characteristics RF output powera Min Typ Max CLASS1P5 = VBAT 8 9.5 --- CLASS1P5 = 1.8V 5 7 --- Power variation over BT band -1 Gain control range Power control step 1 30 2 5 Unit dBm dB dB 8 dB BT Receiver Characteristics, In-Band Signals Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 7 Doc No: WG7310-00-SPC-R03 Characteristics Sensitivity Max. useable input power Min Typ GFSK, BER = 0.1% -88 -90 Pi/4-DQPSK, BER = 0.01% -88 -90 8DPSK, BER = 0.01% -82 -84 GFSK, BER = 0.1% -5 Pi/4-DQPSK, BER = 0.1% -10 8DPSK, BER = 0.1% -10 Max Unit dBm dBm 3.3.3. FM Radio Electrical Characteristics Characteristics Condition Min Typ FM function enabled and Audio output during auto-search impedance FM function disabled and when muted Audio input impedance Selectable RF Rx input With external matching impedance circuitry – Default = 50 Ω RF input return loss With external matching circuitry Receiver current FM Rx at sensitivity level, BT in consumption deep sleep Transmitter current consumption FM TX on, BT FM off current Unit 50 Ω 50 KΩ 30 KΩ 50 500 -10 Ω dB 12 15 mA 13 16 mA 1 2 uA Digital audio in deep sleep Max Analog audio Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 8 Doc No: WG7310-00-SPC-R03 4. Package Information 4.1. Signal Layout (Top View) Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 9 Doc No: WG7310-00-SPC-R03 4.2. Pin Description No. Index Name Type Description 1 A1 GND GND GROUND 2 A2 VBAT_FEM O FEM POWER SUPPLY 3 B1 BT_FUNC2: BT_WU/ DC2DC O BT WU (default) or BT DC2DC 4 B2 GND 5 C1 BT_FUNC6: BT_SDA O BT SDA (internal use only) 6 C2 BT_FUNC4: BT_TX_DBG O BT UARTD (reserved for debug) 7 D1 BT_FUNC5: HOST_WU O HOST WU 8 D2 GND GND GROUND 9 E1 GND GND GROUND 10 E2 DRPWPABC 11 F1 BT_RF_ANT 12 F2 GND GND GROUND 13 G1 GND GND GROUND 14 G2 DRPWPDET I 15 H1 WL_TX_SW O 16 H2 GND 17 J1 WL_BTH_SW O WLPA_IF (internal use only) 18 J2 WL_RX_SW O WLPA_IF (internal use only) 19 K1 GND 20 K2 VCC_DCOW O WL DCO SUPPLY 21 L1 NC_C3/VCC_TXAW O WL PPA A SUPPLY 22 L2 GND 23 L3 FM_EN 24 K3 VCC_RXW 25 L4 GND 26 K4 BT_EN 27 L5 WB_RF_ANT 28 K5 GND GND GROUND 29 L6 GND GND GROUND 30 K6 WL_RS232_RX/ I2S_M_SCL GND GROUND O I/O WL PA BIAS (internal use only) BT RF ANT (internal use only) WL POWER DET IN (internal use only) WLPA_IF (internal use only) GND GROUND GND GROUND GND GROUND I O FM RST WL LNA SUPPLY GND GROUND I I/O I BT RST WL/BT RF ANT RS232_RX (default) or I2C_M_SCL (reserved for debug) 31 L7 SDIO_D1 I/O SDIO IF Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 10 Doc No: WG7310-00-SPC-R03 32 K7 WL_RS232_TX/ I2S_M_SDA O RS232_TX (default) or I2C_M_SDA (reserved for debug) 33 L8 SDIO_D2 I/O SDIO IF 34 K8 SPI_CSX/ SDIO_D3 I/O SDIO IF 35 L9 SPI_DIN/ SDIO_CMD I/O SDIO IF 36 K9 SPI_DOUT/ SDIO_D0 I/O SDIO IF 37 L10 SPI_CLK/ SDIO_CLK I SDIO IF 38 K10 FM_I2S_FSYNC 39 L11 WL_EN 40 K11 FM_SDA I/O FM I2C IF 41 J11 FM_SCL I/O FM I2C IF 42 J10 FM_IRQ O FM I2C IF 43 H11 FM_I2S_CLK I/O FM I2S IF 44 H10 FM_I2S_DI I FM I2S IF 45 G11 FM_I2S_DO O FM I2S IF 46 G10 GND GND GROUND 47 F11 GND GND GROUND 48 F10 SLOWCLK 49 E11 FM_TX_ANT 50 E10 GND GND GROUND 51 D11 GND GND GROUND 52 D10 FMAUDROUT O 53 C11 FM_RX_ANT I 54 C10 GND GND GROUND 55 B11 GND GND GROUND 56 B10 FMAUDLOUT 57 A11 FMAUDRIN 58 A10 GND 59 A9 FMAUDLIN 60 B9 GND GND GROUND 61 A8 GND GND GROUND 62 B8 XTALP O FREF INPUT (internal use only) 63 A7 XTALM O FREF INPUT (internal use only) 64 B7 GND GND GROUND 65 A6 GND GND GROUND I/O I FM I2S IF WL RST I SLEEP CLK O FM TX ANT O I FM AUD OUT FM RX ANT FM AUD OUT FM AUD IN GND GROUND I FM AUD IN Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 11 Doc No: WG7310-00-SPC-R03 66 B6 BT_FUNC1: O DC2DC/ btSPI_CLK BT DC2DC mode (default) or btSPI_CLK 67 A5 DC_REQ O DC_REQ to INTERNAL DC2DC 68 B5 TPS_DC2DC I MODE SELECTION PIN OF DC2DC 69 A4 VIO I 1.62~1.92V POWER SUPPLY, 1.8V TYP 70 B4 1V8 O 71 A3 VBAT I 2.3~4.8V POWER SUPPLY, 3.3V TYP 72 B3 VDD_LDO_IN_CLASS1P5 I BT CLASS2/CLASS1.5 POWER SUPPLY 73 D4 PCM_AUD_CLK/ 1.8V DC2DC POWER SUPPLY I/O PCM I/F (default ) or FM I2S CLK I/O PCM I/F (default ) or FM I2S DI FM_I2S_CLK 74 E4 PCM_AUD_IN/ FM_I2S_DI 75 F4 GND 76 G4 WL_PAEN_B 77 H4 GND 78 H5 VCC_ANAW O WLANA INPUT SUPPLY 79 H6 VCC_TXBW O WL PPA BG SUPPLY 80 H7 WL_UART_DBG O WL_UART_DBG (reserved for debug) 81 H8 CLK_REQ_OUT O CLK_REQ positive polarity 82 G8 WLAN_IRQ O WLAN interrupt request 83 F8 HCI_RX/ btSPI_DIN 84 E8 HCI_TX/ btSPI_DOUT 85 D8 BT_FUNC7: BT_SCL I/O BT_SCL (internal use only) 86 D7 HCI_RTS/ btSPI_IRQ I/O BT UART I/F (default) or btSPI IRQ 87 D6 HCI_CTS/ btSPI_CS I/O BT UART I/F (default) or btSPI CS 88 D5 PCM_AUD_FSYNC/ I/O PCM I/F (default) or FM I2S FSYNC GND GROUND O WLPA_IF (internal use only) GND GROUND I O BT UART I/F (default) or btSPI DIN BT UART I/F (default) or btSPI DOUT FM_I2S_FSYNC 89 E5 PCM_AUD_OUT/ O PCM I/F (default) or FM_I2S_DO FM_I2S_DO 90 F5 GND GND GROUND 91 G5 GND GND GROUND 92 G6 GND GND GROUND 93 G7 GND GND GROUND 94 F7 GND GND GROUND 95 E7 GND GND GROUND 96 E6 GND GND GROUND Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 12 Doc No: WG7310-00-SPC-R03 4.3. Ordering Information Part number: WG7310-00 4.4. Package Marking Date Code: YYWWSSF YY = Digit of the year, ex: 2008=08 WW = Week (01~53) SS = Serial number from 01 ~99 match to manufacture’s lot number F = 1 for Taiwan Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 13 Doc No: WG7310-00-SPC-R03 5. MECHANICAL CHARACTERISTICS WG7310 Bottom View Side View WG7310 Bottom View ‧ ‧ ‧ ‧ Pin array = 11x11 Pin number = 96 pins Bump pitch = 0.85mm Bump diameter = 0.5mm Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 14 Doc No: WG7310-00-SPC-R03 6. SMT and Baking Recommendation 6.1. Baking Recommendation Baking condition： Follow MSL Level 4 to do baking process. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or b) Stored at <10% RH. - Devices require bake, before mounting, if Humidity Indicator Card reads >10% If baking is required, Devices may be baked for 8 hrs at 125 °C. - 6.2. SMT Recommendation Recommended Reflow profile： Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 15 Doc No: WG7310-00-SPC-R03 No. Item Temperature (°C) Time (sec) 1 Pre-heat D1: 140 ~ D2: 200 T1: 80 ~ 120 2 Soldering D2: = 220 T2: 60 +/- 10 3 Peak-Temp. D3: 250 °C max Note: (1) Reflow soldering is recommended two times maximum. (2) Add Nitrogen while Reflow process： SMT solder ability will be better. 7. History Change Revision Date Description D 0.1 2009/02/05 Draft 0.1 R 0.1 2009/06/16 Release 0.1 R 0.2 2009/06/23 Modify Storage/Operating Temperature Range, WLAN/ BT output power & Marking, Pin out description R 0.3 2009/07/21 Update P13 Marking, P14 Mechanical & P15 Baking Reflow Recommended Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 16