RFM SF2081E

Preliminary
•
•
SF2081E
SAW Filter for Cable System
Complies with Directive 2002/95/EC (RoHS)
Characteristics:
Balanced-to-balanced operation
Terminating source/load impedance : ZS = 200 Ω
1220 MHz
SAW Filter
Pb
Maximum Rating
Rating
Value
Units
Input Power Level
0
dBm
DC Voltage on any Non-ground Terminal
3
V
Operating Temperature Range
-30 to +85
°C
Storage Temperature Range in Tape and Reel
-40 to +85
°C
Suitable for Lead-free Soldering - Maximum Soldering Profile
260°C for 30 s
SM3030-8
Electrical Characteristics
Characteristic
Sym
Notes
Min
Center Frequency
fC
1220
Insertion Loss, 1195 to 1245 MHz
IL
3.0
BW3
3 dB Bandwidth
50
Amplitude Ripple, 1200 to 1240 MHz, -30 to +45 °C
35
44
30
40
Group Delay Ripple
35
Case Style
Max
Units
MHz
4.0
56
2.0
Attenuation Referenced to Minimum Insertion Loss:
F < fC - 48 MHz
F > fC + 48 MHz
dB
MHz
2.2
dB
dB
100
nsP-P
SM3030-8 3.0 x 3.0 mm Nominal Footprint
Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator
Standard Reel Quantity
Port 1
Port 2
Typ
840, YWWS
Reel Size 7 Inch
500 Pieces/Reel
Reel Size 13 Inch
3000 Pieces/Reel
Connection
Balanced Input
Balanced Output
Ground
Terminals
1,2
5,6
All Others
Dot Indicates Pin 1
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1. US and international patents may apply.
2. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
3. Electrostatic Sensitive Device. Observe precautions for handling.
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
Page 1 of 4
SF2081E - 7/21/10
S F 2 0 8 1 E T e s t C ir c u it
4
3
2 0 0 o h m
B a la n c e d
In p u t
2
S F 2 0 8 1 E
5
1
8
6
2 0 0 o h m
B a la n c e d
O u tp u t
7
In d u c to r s a r e 1 5 n H
C a p a c ito r s a r e 3 .0 p F
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
Page 2 of 4
SF2081E - 7/21/10
8-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
J
J
I
J
K
N
I
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
L
M
N
mm
Nom
3.0
3.0
1.27
0.92
0.75
0.60
0.60
1.20
3.19
0.81
0.96
0.81
1.39
0.23
0.38
Min
2.87
2.87
1.14
0.79
0.62
0.47
0.47
1.07
Max
3.13
3.13
1.40
1.05
0.88
0.73
0.73
1.33
Min
0.113
0.113
0.045
0.031
0.024
0.018
0.018
0.042
Inches
Nom
0.118
0.118
0.050
0.036
0.029
0.024
0.024
0.047
0.126
0.032
0.038
0.032
0.055
0.009
0.015
Max
0.123
0.123
0.055
0.041
0.034
0.029
0.029
0.052
Case Materials
Materials
K
O
O
Solder Pad
Plating
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating
2.0 to 3.0 µm Nickel
Body
Al2O3 Ceramic
Pb Free
PCB Footprint Top View
TOP VIEW
BOTTOM VIEW
1
2
8
7
1
6
6
2
5
5
3
7
840
YWWS
A
E
C
B
8
3
H
G
4
4
D
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
F
Page 3 of 4
SF2081E - 7/21/10
Inches
7
13
"B" REF.
100 REF.
Tape and Reel Specifications
“B”
millimeters
178
330
Quantity Per Reel
500
3000
See Detail "A"
13.
0
12.0
Carrier Tape Dimensions
20
.2
2.0
Ao
3.35 mm
Bo
3.35 mm
Ko
1.4 mm
Pitch
8.0 mm
W
12.0 mm
COMPONENT ORIENTATION and DIMENSIONS
2.0
4.0
PIN #1
A
1.50
1.75
0.3 ± 0.05
Bo
B
Ao
12.0
5.5
RO.3
(MAX.)
B
Pitch
A
Ko
R0.5
(MAX.)
1.5
SECTION A-A
SECTION B-B
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
USER DIRECTION OF FEED
Page 4 of 4
SF2081E - 7/21/10