RFM SF2177E

Preliminary
SF2177E
•
•
Low-loss UHF SAW Filter
Complies with Directive 2002/95/EC (RoHS)
1472 MHz
SAW Filter
Pb
Characteristics:
Single-ended source impedance :
Balanced load impedance :
ZS = 50 Ω
ZL = 100 Ω
Maximum Rating
Rating
Value
Units
+10
dBm
Input Power Level
DC Voltage on any Non-ground Terminal
3
V
Operating Temperature Range
-40 to +85
°C
Tape and Reel Storage Temperature Range
-40 to +85
°C
Component Storage Temperature Range
-50 to +95
°C
260
°C
Solder Reflow Temperature, 10 seconds/5 cycles maximum
SM3030-8
Electrical Characteristics
Characteristic
Sym
Center Frequency
fC
Notes
Min
1472
Insertion Loss, 1452 to 1492 MHz
IL
3.2
4.5
1.0
2.0
8
40
Amplitude Ripple, 1452 to 1492 MHz
Group Delay Ripple, 1452 to 1492 MHz
Typ
Input Return Loss, 1452 to 1492 MHz
6.5
8.0
Output Return Loss, 1452 to 1492 MHz
8.8
10.5
Max
Units
MHz
dB
nsP-P
dB
Attenuation, 0 dB Reference:
880 to 915 MHz
50
54
1410 MHz
30
35
1530 to 1570 MHz
15
29
1575 MHz
30
38
1710 to 1785 MHz
35
40
1920 to 1980 MHz
35
37.5
2400 to 2500 MHz
26
31.5
Case Style
SM3030-8 3.0 x 3.0 mm Nominal Footprint
Lid Symbolization, Y=year, WW=week, S=shift, dot=pin 1 indicator
Standard Reel Quantity
dB
866, YWWS
Reel Size 7 inch
500 Pieces/Reel
Reel Size 13 inch
3000 Pieces/Reel
Notes:
1. US and international patents may apply.
2. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
3. Electrostatic Sensitive Device. Observe precautions for handling.
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
Page 1 of 5
SF2177E - 8/4/10
Filter Passband Amplitude and Group Delay Plots
Filter Broadband Plot
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
Page 2 of 5
SF2177E - 8/4/10
Filter Input Return Loss
Filter Output Return Loss
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
Page 3 of 5
SF2177E - 8/4/10
8-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
J
J
I
J
K
N
I
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
L
M
N
K
O
O
PCB Footprint Top View
mm
Nom
3.00
3.00
0.92
0.75
0.60
0.60
1.20
3.19
0.81
0.96
0.81
1.39
0.23
0.38
Min
2.87
2.87
0.79
0.62
0.47
0.47
1.07
Max
3.13
3.13
1.10
1.05
0.88
0.73
0.73
1.33
Min
0.113
0.113
0.031
0.024
0.018
0.018
0.042
Inches
Nom
0.118
0.118
0.036
0.029
0.024
0.024
0.047
0.126
0.032
0.038
0.032
0.055
0.009
0.015
Max
0.123
0.123
0.043
0.041
0.034
0.029
0.029
0.052
Case Materials
Materials
5 p F
7
5 0 o h m
In p u t
2
S F 2 1 7 7 E
1 8 n H
5
1 , 3 , 4 , 6 , 8
1 0 0 o h m
B a la n c e d
O u tp u t
Solder Pad
Plating
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating
2.0 to 3.0 µm Nickel
Body
Al2O3 Ceramic
Pb Free
5 p F
TOP VIEW
BOTTOM VIEW
1
E
C
B
8
8
7
7
1
H
A
2
6
6
2
3
5
5
3
G
4
4
D
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
F
Page 4 of 5
SF2177E - 8/4/10
“B”
Nominal Size
Inches
millimeters
7
178
13
330
"B" REF.
100 REF.
Tape and Reel Specifications
Quantity Per Reel
500
3000
See Detail "A"
13.
0
12.0
Carrier Tape Dimensions
20
.2
2.0
Ao
3.35 mm
Bo
3.35 mm
Ko
1.4 mm
Pitch
8.0 mm
W
12.0 mm
COMPONENT ORIENTATION and DIMENSIONS
2.0
4.0
PIN #1
A
1.50
1.75
0.3 ± 0.05
Bo
B
Ao
12.0
5.5
RO.3
(MAX.)
B
Pitch
A
Ko
R0.5
(MAX.)
1.5
SECTION A-A
SECTION B-B
www.RFM.com E-mail: [email protected]
©2010 by RF Monolithics, Inc.
USER DIRECTION OF FEED
Page 5 of 5
SF2177E - 8/4/10