RT9166B 600mA, Ultra-Fast Transient Response Linear Regulator General Description Features The RT9166B is a CMOS linear regulator optimized for ultra-fast transient response. The device is capable of supplying up to 600mA of output current and is optimized for CD/DVD-ROM, CD/RW or wireless communication applications. The RT9166B regulator is stable with output capacitor as low as 3.3μF. The other features include high output accuracy, current limiting protection, and high ripple rejection ratio. The RT9166B regulator is available in a 3-lead SOT-89 package. z z z z z z z z z z Ordering Information RT9166B - μA) Low Quiescent Current (Typically 220μ Guaranteed 600mA Output Current Wide Operating Voltage Ranges : 2.8V to 5.5V Ultra-Fast Transient Response Tight Load and Line Regulation Current Limiting Protection Thermal Shutdown Protection Only Low-ESR Ceramic Capacitor Required for Stability Custom Voltage Available RoHS Compliant and Halogen Free Applications Package Type X : SOT-89 z Lead Plating System G : Green (Halogen Free and Pb Free) z Output Voltage 12 : 1.2V z z z Note : CD/DVD-ROM, CD/RW Wireless LAN Card/Keyboard/Mouse Battery-Powered Equipment XDSL Router PCMCIA Card Richtek products are : ` RoHS compliant and compatible with the current require- ` Suitable for use in SnPb or Pb-free soldering processes. Pin Configurations ments of IPC/JEDEC J-STD-020. (TOP VIEW) Marking Information 1 For marking information, contact our sales representative directly or through a Richtek distributor located in your area. 2 GND VOUT (TAB) 3 VIN SOT-89 Typical Application Circuit RT9166B VIN VIN CIN 1µF DS9166B-01 April 2011 VOUT GND VOUT COUT 3.3µF www.richtek.com 1 RT9166B Functional Pin Description Pin No. Pin Name Pin Function 1 GND Common Ground. 2 VOUT Regulator Output. 3 VIN Supply Input. Function Block Diagram VIN VOUT Thermal Shutdown Error Amplifier - + Current Limiting Sensor 1.2V Reference GND www.richtek.com 2 DS9166B-01 April 2011 RT9166B Absolute Maximum Ratings (Note 1) Supply Input Voltage ---------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C SOT-89 --------------------------------------------------------------------------------------------------------------------z Package Thermal Resistance (Note 2) SOT-89, θJA ---------------------------------------------------------------------------------------------------------------SOT-89, θJC --------------------------------------------------------------------------------------------------------------z Junction Temperature --------------------------------------------------------------------------------------------------z Lead Temperature (Soldering, 10 sec.) ----------------------------------------------------------------------------z Storage Temperature Range ------------------------------------------------------------------------------------------z ESD Susceptibility (Note 3) HBM (Human Body Mode) --------------------------------------------------------------------------------------------MM (Machine Mode) ---------------------------------------------------------------------------------------------------z 6.5V z Recommended Operating Conditions z z z 0.847W 118°C/W 58°C/W 150°C 260°C −65°C to 150°C 2kV 200V (Note 4) Supply Input Voltage ---------------------------------------------------------------------------------------------------- 2.8V to 5.5V Junction Temperature Range ------------------------------------------------------------------------------------------ −40°C to 125°C Ambient Temperature Range ------------------------------------------------------------------------------------------ −40°C to 85°C Electrical Characteristics (VIN = 2.8V whichever is greater; CIN = 1μF, COUT = 3.3μF, TA = 25°C, unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit Output Voltage Accuracy ΔVOUT IOUT = 1mA -1 -- 3 % Current Limit ILIM RLOAD = 1Ω 600 -- -- mA Quiescent Current (Note 5) IQ IOUT = 0mA -- 220 300 μA Line Regulation ΔVLINE VIN = 2.8V to 5.5V, IOUT = 1mA -- 0.2 -- %V ΔVLOAD 1mA < IOUT < 600mA -- 30 55 mV PSRR f = 1kHz, COUT = 1μF -- −55 -- dB -- 170 -- °C -- 40 -- °C Load Regulation (Note 6) Power Supply Rejection Rate Thermal Shutdown Temperature Thermal Shutdown Hysteresis DS9166B-01 April 2011 TSD ΔTSD ISW = 0.2A www.richtek.com 3 RT9166B Note 1. Stresses listed as the above “ Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective four-layer thermal conductivity test board of JEDEC 51-7 thermal measurement standard. The measurement case position of θJC is on the expose pad of the package. Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN − IOUT under no load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus the ground pin current. Note 6. Regulation is measured at constant junction temperature by using a 20ms current pulse. Devices are tested for load regulation in the load range from 1mA to 600mA respectively. www.richtek.com 4 DS9166B-01 April 2011 RT9166B Typical Operating Characteristics Output Voltage vs. Temperature 1.25 1.24 1.24 1.23 1.23 Output Voltage (V) Output Voltage (V) Output Voltage vs. Input Voltage 1.25 1.22 1.21 1.20 1.19 1.18 1.17 1.22 1.21 1.20 1.19 1.18 1.17 1.16 1.16 IOUT = 0A 1.15 2.8 3.1 3.4 3.7 4.0 4.3 4.6 4.9 5.2 VIN = 3.3V, IOUT = 0A 1.15 5.5 -50 -25 0 Quiescent Current vs. Input Voltage 75 100 125 Quiescent Current vs. Temperature 230 230 220 220 Quiescent Current (μA) Quiescent Current (μA) 50 Temperature (°C) Input Voltage (V) 210 200 190 180 170 210 200 190 180 170 160 160 VOUT = 1.2V, IOUT = 0A VIN = 3.3V, VOUT = 1.2V, IOUT = 0A 150 150 2.8 3.1 3.4 3.7 4.0 4.3 4.6 4.9 5.2 -50 5.5 -25 0 25 50 75 100 125 Temperature (°C) Input Voltage (V) Current Limit vs. Temperature Current Limit vs. Input Voltage 1.00 1.00 0.95 0.95 0.90 0.90 Current Limit (A) Current limit (A) 25 0.85 0.80 0.75 0.85 0.80 0.75 0.70 0.70 0.65 0.65 VOUT = 1.2V 0.60 2.8 3.1 3.4 3.7 4.0 4.3 4.6 Input Voltage (V) DS9166B-01 April 2011 4.9 5.2 5.5 VIN = 3.3V, VOUT = 1.2V 0.60 -50 -25 0 25 50 75 100 125 Temperature (°C) www.richtek.com 5 RT9166B Power Off from VIN Power On from VIN VIN (2V/Div) VIN (2V/Div) VOUT (0.5V/Div) VOUT (0.5V/Div) I IN (0.5A/Div) IOUT (0.5A/Div) I IN (0.5A/Div) IOUT (0.5A/Div) VIN = 3.3V, VOUT = 1.2V, IOUT = 600mA VIN = 3.3V, VOUT = 1.2V, IOUT = 600mA Time (2.5ms/Div) Time (2.5ms/Div) Load Transient Response Load Transient Response VOUT (20mV/Div) VOUT (20mV/Div) IOUT (500mA/Div) IOUT (500mA/Div) VIN = 3.3V, VOUT = 1.2V, IOUT = 0A to 600mA VIN = 3.3V, VOUT = 1.2V, IOUT = 0A to 300mA Time (250μs/Div) Time (250μs/Div) Line Transient Response 0.00 PSRR VIN = 3V + 0.1VAC, VOUT = 1.2V -10.00 PSRR (dB) -20.00 VIN (1V/Div) VOUT (5mV/Div) IOUT = 0A IOUT = 300mA -30.00 -40.00 -50.00 -60.00 VIN = 3V to 4V, VOUT = 1.2V, IOUT = 300mA -70.00 -80.00 Time (50μs/Div) 0.01 10 CIN = 1μF/X7R, COUT = 3.3μF 0.1 100 1 1000 10 10000 100 100000 1000 1000000 Frequency (kHz) www.richtek.com 6 DS9166B-01 April 2011 RT9166B Application Information Like any linear regulator, the RT9166B requires input and output decoupling capacitors. These capacitors must be correctly selected for good performance Please note that linear regulators have high internal loop gains which require care in guarding against oscillation caused by insufficient decoupling capacitance. Input Capacitor An input capacitance of 1μF is required between the device input pin and ground directly (the capacitance may be increased without limit). The input capacitor must be located less than 1cm from the device to assure input stability A lower ESR capacitor allows the use of less capacitance, while higher ESR type (like aluminum electrolytic) requires more capacitance. Capacitor types (aluminum, ceramic and tantalum) can be mixed in parallel, but the total equivalent input capacitance/ ESR must be defined as above for stable operation. There are no requirements for the ESR on the input capacitor, but tolerance and temperature coefficient must be considered when selecting the capacitor to ensure 1μF capacitance over the entire operating temperature range. Output Capacitor The RT9166B is designed specifically to work with very small ceramic output capacitors. The recommended minimum capacitance (temperature characteristics X7R or X5R) is 3.3μF with 10mΩ to 50mΩ range ceramic capacitor between LDO output and GND for transient stability. Higher capacitance helps to improve the transient response. The output capacitor's ESR is critical because it forms a zero to provide phase lead which is required for loop stability. Input-Output (Dropout) Voltage A regulator's minimum input-to-output differential voltage (dropout voltage) determines the lowest usable supply voltage. In battery-powered systems, this determines the useful end-of-life battery voltage. Because the device uses a PMOS, its dropout voltage is a function of drain-to- DS9166B-01 April 2011 source on-resistance, RDS(ON), multiplied by the load current : VDROPOUT = VIN − VOUT = RDS(ON) x IOUT Current Limit The RT9166B monitors and controls the PMOS gate voltage, with a minimum limit of the output current at 600mA. The output can be shorted to ground for an indefinite period of time without damaging the part. Short-Circuit Protection The device is short-circuit protected in the event of a peak over-current condition, such that the short-circuit control loop rapidly drives the output PMOS pass element off. Once the power pass element shuts down, the control loop will rapidly cycle the output on and off until the average power dissipation causes the thermal shutdown circuit to respond by cycling to a lower frequency. Please refer to the section on thermal information for power dissipation calculations. Thermal Considerations For continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula : PD(MAX) = (TJ(MAX) − TA ) / θJA Where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction to ambient thermal resistance. For recommended operating condition specifications of RT9166B, the maximum junction temperature is 125°C and TA is the ambient temperature. The junction to ambient thermal resistance, θJA, is layout dependent. For SOT-89 packages, the thermal resistance, θJA, is 118°C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at TA = 25°C can be calculated by the following formula : www.richtek.com 7 RT9166B PD(MAX) = (125°C − 25°C) / (60°C/W) = 0.847W for SOT-89 package The maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance, θJA. For RT9166B packages, the derating curve in Figure 1 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. Maximum Power Dissipation (W)1 1.00 Four-Layer PCB 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 0 25 50 75 100 125 Ambient Temperature (°C) Figure 1. Derating Curve for RT9166B Package www.richtek.com 8 DS9166B-01 April 2011 RT9166B Outline Dimension D D1 A B C C1 e e H A b b1 b Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 1.397 1.600 0.055 0.063 b 0.356 0.483 0.014 0.019 B 2.388 2.591 0.094 0.102 b1 0.406 0.533 0.016 0.021 C 3.937 4.242 0.155 0.167 C1 0.787 1.194 0.031 0.047 D 4.394 4.597 0.173 0.181 D1 1.397 1.753 0.055 0.069 e 1.448 1.549 0.057 0.061 H 0.356 0.432 0.014 0.017 3-Lead SOT-89 Surface Mount Package Richtek Technology Corporation Richtek Technology Corporation Headquarter Taipei Office (Marketing) 5F, No. 20, Taiyuen Street, Chupei City 5F, No. 95, Minchiuan Road, Hsintien City Hsinchu, Taiwan, R.O.C. Taipei County, Taiwan, R.O.C. Tel: (8863)5526789 Fax: (8863)5526611 Tel: (8862)86672399 Fax: (8862)86672377 Email: [email protected] Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek. DS9166B-01 April 2011 www.richtek.com 9