Board 3s SKYPER 32 R Absolute Maximum Ratings Symbol SKYPER® Values Unit Vs Supply voltage primary 16 V IoutPEAK Output peak current 15 A IoutAVmax Output average current 50 mA fmax max. switching frequency 50 kHz VCE Collector emitter voltage sense across the IGBT 1700 V 4000 V 1500 V 1500 V Visol IO VisolPD Adaptor board Visol12 Board 3s SKYPER 32 R Conditions Isolation test voltage input - output (AC, rms, 2s) Partial discharge extinction voltage, rms, QPD ! 10pC Isolation test voltage output 1 - output 2 (AC, rms, 2s) RGon min RGoff min Minimum rating for external RGoff 1.5 " 1.5 " Preliminary Data Top Operating temperature -25 ... 85 °C Features Tstg Storage temperature -25 ... 85 °C • Two output channels • Failure management Characteristics Symbol Conditions min. typ. max. Unit Vs Supply voltage primary side 14.4 15 15.6 V Typical Applications* • Adaptor board for SKYPER 32 IGBT drivers in bridge circuits for industrial applications • DC bus up to 1200V Footnotes All characteristics listed in the data sheet are guilty for the use with SKYPER 32 Please consider the derating of the ambient temperature Please refer to the datasheet of SKYPER 32 for further information Vj input signal voltage on / off VIT+ Input treshold voltage HIGH VIT- Input threshold voltage (LOW) VG(on) Turn on gate voltage output 15 / 0 V 12.3 4.6 V V 15 V VG(off) Turn off gate voltage output -7 V td(on)IO Input-output turn-on propagation time 1.1 µs td(off)IO Input-output turn-off propagation time 1.1 µs Derating This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. Adaptor board © by SEMIKRON Rev. 1 – 21.04.2010 1 Board 3s SKYPER® 32 R - Technical Explanations Adaptor Board 3s SKYPER® 32 R Technical Explanations Revision 01 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------This Technical Explanation is valid for the following parts: part number L6100151 type Board 3s SKYPER® 32 R date code (YYWW) ≥ 1004 Related documents: title Technical Explanations SKYPER® 32 R Prepared by: Johannes Krapp ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ Content Application and Handling Instructions .................................................................................................................... 3 Further application support ..................................................................................................................................... 3 General Description ................................................................................................................................................ 3 Dimensions ............................................................................................................................................................. 4 Component Placement Layout ............................................................................................................................... 5 PIN Array ................................................................................................................................................................ 6 Setting Dynamic Short Circuit Protection ............................................................................................................... 7 Collector Series Resistance.................................................................................................................................... 7 Adaptation Gate Resistors...................................................................................................................................... 7 Adaptation Decoupling Gate Resistors................................................................................................................... 8 Boost Capacitors .................................................................................................................................................... 8 Temperature Signal ................................................................................................................................................ 8 Mounting Notes....................................................................................................................................................... 9 Schematics ........................................................................................................................................................... 10 Parts List ............................................................................................................................................................... 12 2 2010-04-21 – Rev01 © by SEMIKRON Board 3s SKYPER® 32 R - Technical Explanations Please note: All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating parameters should be validated by user’s technical experts for each application. Application and Handling Instructions Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules. Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCDsnubber networks between main terminals for PLUS and MINUS of the power module. When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector voltage. It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device. The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below -0,3V may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided. The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the driver leads should be twisted. Further application support Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON Application Manual Power Modules available at http://www.semikron.com. General Description ® ® The Board 3s SKYPER 32 R is an adaptor board for the IGBT module SEMiX 3s (spring contact version). The board can ® be customized allowing adaptation and optimization to the used SEMiX Module. The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-off speed by variation of RGon and RGoff. Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP (see ® Technical Explanations SKYPER 32 R). Please note: This technical explanation is based on the Technical Explanations for SKYPER® 32 R. Please read the Technical Explanations SKYPER® 32 R before using the Adaptor Board. Board 3s SKYPER® 32 R 3 2010-04-21 – Rev01 © by SEMIKRON Board 3s SKYPER® 32 R - Technical Explanations Dimensions Dimensions in mm 64 Ø3 9 10 Ø3 57 64 9 10 3 1 2 Ø Ø 3 9 10 Ø 3,2 Ø3 1 2 X10 Ø 3,5 Ø 3,2 Ø3 56 1 2 13 14 2 1 X20 Ø 3,5 54,86 38,55 32 2 3, Ø 3 Ø 22 7 8 3 47,64 20,46 Ø 1,3 2,54 97,5 100,5 4 2010-04-21 – Rev01 © by SEMIKRON Board 3s SKYPER® 32 R - Technical Explanations Component Placement Layout Adaptor Board 5 2010-04-21 – Rev01 © by SEMIKRON Board 3s SKYPER® 32 R - Technical Explanations PIN Array Connector X20 (ODU FLAKAFIX 511.068.803.014) Product information of suitable female connectors and distributor contact information is available at e.g. http://www.harting.com (part number 09 18 514 6 813). PIN Signal Function Specification X20:01 reserved X20:02 IF_HB_BOT Switching signal input (BOTTOM switch) Digital 15 V; 10 kOhm impedance; LOW = BOT switch off; HIGH = BOT switch on X20:03 IF_nERROR_OUT ERROR output LOW = NO ERROR; open collector output; max. 30V / 15mA (external pull up resistor necessary) X20:04 IF_HB_TOP Switching signal input (TOP switch) Digital 15 V; 10 kOhm impedance; LOW = TOP switch off; HIGH = TOP switch on X20:05 reserved X20:06 reserved X20:07 reserved X20:08 IF_PWR_15P Drive power supply Stabilised +15V ±4% X20:09 IF_PWR_15P Drive power supply Stabilised +15V ±4% X20:10 IF_PWR_GND GND for power supply and GND for digital signals X20:11 IF_PWR_GND GND for power supply and GND for digital signals X20:12 reserved X20:13 reserved X20:14 reserved Please note: The feature PRIM_ERROR_IN of the driver core is not availble at the interface X20. 6 2010-04-21 – Rev01 © by SEMIKRON Board 3s SKYPER® 32 R - Technical Explanations Setting Dynamic Short Circuit Protection RCE & CCE Designation Pattern Name R160 1206 C150 1206 R260 1206 C250 1206 Setting RCE Factory setting: not equipped CCE Factory setting: not equipped RCE Factory setting: not equipped CCE Factory setting: not equipped TOP TOP BOT BOT Collector Series Resistance RVCE * Designation Pattern Name R150 MiniMELF R250 MiniMELF Setting RVCE * Factory setting: not equipped RVCE * Factory setting: not equipped TOP BOT * 1200V IGBT operation: 0Ω 1700V IGBT operation: 1kΩ / 0,4W Adaptation Gate Resistors RGon & RGoff Designation R151, R152, R153 (parallel connected) R155, R156, R157 (parallel connected) R251, R252, R253 (parallel connected) R255, R256, R257 (parallel connected) 7 Pattern Name MiniMELF MiniMELF MiniMELF MiniMELF Setting RGon Factory setting: not equipped RGoff Factory setting: not equipped RGon Factory setting: not equipped RGoff Factory setting: not equipped 2010-04-21 – Rev01 TOP TOP BOT BOT © by SEMIKRON Board 3s SKYPER® 32 R - Technical Explanations Adaptation Decoupling Gate Resistors ® For details to the decoupling gate resistors and recommended values, see Modules Explanations and Data Sheets SEMiX . RG1, RG2, RG3 Designation Pattern Name R101 MELF R102 MELF R103 MELF R201 MELF R202 MELF R203 MELF Setting RG1 Factory setting: not equipped RG2 Factory setting: not equipped RG3 Factory setting: not equipped RG1 Factory setting: not equipped RG2 Factory setting: not equipped RG3 Factory setting: not equipped TOP TOP TOP BOT BOT BOT Boost Capacitors Cboost15P & Cboost8N Designation Pattern Name C151 1210 C152 1210 C251 1210 C252 1210 Setting Cboost8N Factory setting: 4,7µF/16V * Cboost15P Factory setting: 2,2µF/25V * Cboost8N Factory setting: 4,7µF/16V * Cboost15P Factory setting: 2,2µF/25V * TOP TOP BOT BOT * output charge pulse: 5µC Temperature Signal ® The temperature sensor inside the SEMiX module is directly connected to contacting points T1 and T2. For details to the ® temperature sensor, see Modules Explanations SEMiX . Safety Warnings: The contacting points T1 and T2 are not electrical isolated. Due to high voltage that may be present at the contacting points T1 and T2, some care must be taken in order to avoid accident. There is no cover or potential isolation that protect the high voltage sections / wires from accidental human contact. 8 2010-04-21 – Rev01 © by SEMIKRON Board 3s SKYPER® 32 R - Technical Explanations Mounting Notes ® ® The electrical connections between adaptor board and SEMiX are realised via spring contacts integrated in SEMiX power modules and via landing pads on the bottom side of the adaptor board. Adaptor Board & Driver Core Mounting 1. Soldering of components (e.g. RGon, RGoff, etc.) on adapter board. 2. Adaptor Board has to be fixed to the SEMiX® module (see "Mounting Instruction and Application Notes for SEMiX® IGBT modules" on SEMiX® product overview page at http://www.semikron.com). 3. Insert driver core into the box connector on adaptor board. The connection between driver core and adaptor board should be mechanical reinforced by using support posts. The posts have to be spaced between driver core and adaptor board. SKYPER™ 32 Support post Product information of suitable support posts and distributor contact information is available at e.g. http://www.richco-inc.com (e.g. part number DLMSPM-8-01, LCBST-8-01). Evaluation Board 9 2010-04-21 – Rev01 © by SEMIKRON Board 3s SKYPER® 32 R - Technical Explanations Schematics Schematic I Adaptor Board 10 2010-04-21 – Rev01 © by SEMIKRON Board 3s SKYPER® 32 R - Technical Explanations Schematic II Adaptor Board 11 2010-04-21 – Rev01 © by SEMIKRON Board 3s SKYPER® 32 R - Technical Explanations Parts List Parts List Adaptor Board Count Ref. Designator Value Pattern Name Description 2 C151, C251 4,7µF 1210 (SMD) Capacitor X7R 2 C152, C252 2,2µF 1210 (SMD) Capacitor X7R 4 C20, C21, C22, C23 1nF 0805 (SMD) Capacitor X7R 1 C27 220uF/35V SMD Longlife-Elko 1 R10 0,00Ohm MiniMelf (SMD) 3 R11, R161, R261 10,0KOhm MiniMelf (SMD) 1% 6 R111, R112, R113, R211, R212, R213 0,51Ohm Melf (SMD) 2% 6 V111, V112, V113, V211, V212, V213 10BQ100N DO214AA (SMD) Diode Schottky 2 V150, V250 BY203/20S 1 V20 SMBJ15A DO215AA (SMD) Suppressor Diode 3 X10, X100, X200 RM2,54 10p. SMD Box Connector 1 X20 14p. SMD Connector High Voltage Diode TP: Test Point Box Connector: SUYIN 254100FA010G200ZU DISCLAIMER SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function or design. Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed with respect to the accuracy or use of such information. SEMIKRON does not assume any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. This document supersedes and replaces all information previously supplied and may be superseded by updates without further notice. SEMIKRON products are not authorized for use in life support appliances and systems without the express written approval by SEMIKRON. www.SEMIKRON.com 12 2010-04-21 – Rev01 © by SEMIKRON