Z-Power LED X10490 Technical Data Sheet Specification SPW08F0D SSC Drawn Customer Approval Approval Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet SPW08F0D 1. Description 2. Absolute Maximum Ratings 3. Electro- Optical Characteristics 4. Characteristic Diagram 5. Reliability 6. CIE Chromaticity Diagram 7. Binning Table 8. Outline Dimension 9. Reel Structure 10. Packing 11. Soldering 12. Precaution for use 13. Handling of silicon Resin LEDs Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet SPW08F0D SPW08F0D 1. Description Features It has a substrate made up of a • Industry Standard molded plastic reflector sitting on SMT package top of a bent lead frame (Au Plating). • Low thermal The die is attached within the reflector resistance cavity and the cavity is encapsulated • Lead free product by silicone • RoHS Compliant The high reliability feature is crucial to automotive front, Interior lamp and General Lights Applications • Daytime running lamp (DRL) • Position Lamp • Front Fog Lamp • Automotive interior lamp • Interior lighting • General lighting • Indoor and outdoor Displays • Electronic Signs and Signals Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute Maximum Ratings Parameter Symbol Value Unit Power Dissipation*1 Pd 2.0 W ℃ 100 (min.) 350 (typ.) 500 (max.) Forward Current (Ta = 25 ) IF Operating Temperature Topr -40 ~ +125 Storage Temperature Tstg -40 ~ +125 Junction Temperature Tj 150 Rth-JA 40 K/W Rth-JS 12 K/W Thermal Resistance*2 mA ℃ ℃ ℃ * 1. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. * 2. Mounted on Metal PCB, Area of 950mm 2 per LED. Rth-JC is Junction to case (bottom of metal PCB) temp. 3. Electro-Optical characteristics Parameter Symbol Condition Min Typ Max Unit Forward Voltage VF IF =350mA - 3.5 3.8 V Luminance Flux *1 ΦV IF =350mA 70 - 91 lm - 0.33 - - 0.33 - Color Coordinate (x,y) *2 x y Viewing Angle *3 2θ ½ IF =350mA IF =350mA 120 deg. * 1. The luminous Flux was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Flux Measurement allowance is ± 10% * 2 Measurement Uncertainty of the Color Coordinates is ± 0.01 * 3. 2θ½ is the off- axis where the luminous intensity is 1/ 2 of the peak intensity. Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Relative Luminous Intensity vs Forward Current Forward Current vs. Forward Voltage (Ta=25 OC ) 400 300 200 100 0 2.8 (Ta=25 OC ) 1.5 Relative Luminous Flux (lm/lm) 500 Forward Current IF [mA] Z-Power LED X10490 Technical Data Sheet 4. Characteristic Diagram 1.0 0.5 0.0 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 100 200 (Ta=25 OC ) 0.020 400 500 Spectrum Color Coordinate Shift vs. Forward Current (Ta=25 ℃, I =350mA) F x Axis y Axis 0.015 Color Coordinate Shift (x,y) 300 Forward Current IF [mA] Forward Voltage VF (V) 0.010 0.005 0.000 -0.005 -0.010 -0.015 -0.020 100 200 300 Forward Current IF [mA] 400 400 450 500 550 600 650 700 750 Wavelength [nm] Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Relative Forward Voltage vs. Junction Temperature Relative Luminous Flux (lm/lm) VF (V) (IF=350mA) 1.4 0.3 Δ Relative Luminous Intensity vs. Junction Temperature (IF=350mA) 0.4 Relative Forward Voltage Z-Power LED X10490 Technical Data Sheet 4. Characteristic Diagram 0.2 0.1 0.0 -0.1 1.2 1.0 0.8 0.6 0.4 0.2 -0.2 -60 -40 -20 0 20 40 60 80 100 120 0.0 -60 140 -40 -20 0 20 40 60 100 120 140 Junction Temperature [Tj ] Junction Temperature [Tj ] Radiation Diagram Color Coordinate Shift vs. Junction Temperature (IF=350mA) (Ta=25 0.010 x Axis y Axis 0.005 ℃, I =350mA) F 1.0 0.8 0.000 Intensity Color Coordinate Shift (x,y) 80 -0.005 0.6 0.4 -0.010 0.2 -0.015 x Axis y Axis 0.0 -0.020 -60 -40 -20 0 20 40 60 80 Junction Temperature [Tj ] 100 120 140 -100 -80 -60 -40 -20 0 20 40 60 80 100 Angle [deg.] Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Max. Permissible Forward Current 600 500 Forward Current IF [mA] Z-Power LED X10490 Technical Data Sheet 4. Characteristic Diagram 400 Ta Tc 300 200 100 Ta : Ambient temp. Tc : Case temp. 0 0 20 40 60 80 100 120 140 Temperature [T ] Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Reliability Stress Reference Specification Test Description (as performed by supplier) Duration / Cycle Number of Damage Thermal Shock JESD22 A-104 -40°C/100°C, 20 min dwell, <10 second transfer 1000 Cycle 0/77 Temperature Cycling JESD22 A-104 Tc= -40° 100°C, 30 min dwell, 5 min transfer 1000 Cycle 0/77 Power and Temperature Cycle JESD22 A-105 Tc=-40°C/100°C, If =350 mA, 10 min dwell / 20 min transition (1 hour cycle), 2 min ON / 2 min OFF, 1000 cycles 1000 Cycle 0/77 Low Temperature Operating Life JESD22 A-108C Ta= -40°C, If = 350 mA 1000 hours 0/77 Room Temperature Operating Life - Ta= 25°C, If = 350 mA 1000 hours 0/77 High Temperature Operating Life JESD22 A-108C Ta= 100°C, If = 300 mA 1000 hours 0/77 High Humidity High Temp. Reverse Bias JESD22 A-101 85°C/85% RH, If = 350 mA 1000 hours 0/77 Low Temperature Storage Life JESD22 A-119 Ta= -40°C 1000 hours 0/77 High Temperature Storage Life JESD22 A-103B Ta=100°C 1000 hours 0/77 ESD Characterization AEC-Q101-001, 002, 005 HBM = 2kV - 0/30 Vibration Variable Frequency JESD22 B-103 0.06 inch displacement, 20 to 100 Hz, 50g 100 Hz to 2kHz, - 0/30 Mechanical Shock JESD22 B-104 1500 g's for 0.5 ms, 5 blows, 3 orientations - 0/30 ∼ Criteria for Judging the Damage Criteria for Judgement Item Symbol Condition MIN MAX Forward Voltage VF IF =350mA LSL*2 × 0.8 USL*1 × 1.2 Luminous Flux ΦV IF =350mA LSL*2 × 0.8 USL*1 × 1.2 Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. CIE Chromaticity Diagram ℃ IF = 350mA] [Ta = 25 Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. Binning Table Bin Code Luminous Flux (lm) @ IF = 350mA Color Chromaticity Coordinate @ IF = 350mA Forward Voltage (V) @ IF = 350mA T1 B0 I Luminous Flux (lm) @ IF = 350mA Bin Code Min. Max. S2 60 70 Color Chromaticity Coordinate @ IF = 350mA Bin Code Min. Ref. 9 pages T1 T2 70 80 Max. Forward Voltage (V) @ IF = 350mA Bin Code Min. Max. H 3.0 3.2 I 3.2 3.4 J 3.4 3.6 K 3.6 3.8 80 91 Available ranks Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8.Outline dimension < Package Outline > ( Tolerance: < CirCuit Diagram > ±0.2, Unit: mm ) < Solder Pattern > Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) .1 1.75± 0.1 4± 0.1 ,- 0.25± 0.05 2± 0.05 0 i 5m n (4.75) Φ1. 5.30± 0.1 8.0± 0.1 4.80± 0.1 +0 5.5± 0.05 .5 12.0± 0.2 Φ1 1.30± 0.1 Package Marking 15.4± 1.0 180 13± 0.3 2 60 Z-Power LED X10490 Technical Data Sheet 9. Reel Structure 22 13 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 1,500pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ± 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Packing Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. ℃ Pre-heat 120~150 Pre-heat time 120 sec. Max. ℃ Max. Peak-Temperature 240 Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-free Solder Lead Free Solder 1~5 oC / sec. ℃ Pre-heat 150~200 Pre-heat time 120 sec. Max. ℃ Max. Peak-Temperature 260 Soldering time Condition 10 sec. Max. 1~5 oC / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60± 5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. (13) Silver plating becomes tarnished when being exposed to an environment which contains corrosive gases any product with tarnished leads may lead to poor solderability and deterioration of optical characteristics . Please do not expose the product to corrosive atmosphere during storage Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 13. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 0.00 DECEMBER. 2010. www.Acriche.com 서식번호 : SSC- QP- 7- 07- 24 (Rev.00)