SEOUL STW8Q14BE

Z-Power LED
X10490
Technical
Data
Sheet
RoHS
Specification
SSC-STW8Q14BE
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
STW8Q14BE
Description
This surface-mount
LED comes in standard
package dimension.
It has a substrate made up
of a molded plastic reflector
sitting on top of a lead frame.
The die is attached within the reflector cavity and the
cavity is encapsulated by silicone.
STW8Q14BE
Features
• Lead Frame type
LED PKG
size: 5.6*3.0
thickness 0.9mm
• White colored SMT
package
• Pb-free Reflow
Soldering Application
• RoHS compliant
The package design coupled with careful selection of
component materials allow these products to perform
with high reliability.
Applications
• Interior lighting
• General lighting
• Indoor and out door
displays
• Architectural /
Decorative lighting
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
[ Contents ]
1.
Outline dimensions of STW8Q14BE
2.
Characteristics of STW8Q14BE
3.
Characteristic diagrams
4.
Color & Binning
5.
Bin Code Description
6.
Labeling
7.
Packing
8.
Recommended solder pad
9.
Soldering
10. Precaution for use
11. Handling of Silicone Resin LEDs
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
1. Outline dimensions of STW8Q14BE
Package Marking
Circuit Diagram
N.C
A
C
N.C
Cathode
Anode
1
2
ESD Protection
Device
TOP VIEW
Slug
BOTTOM VIEW
SIDE VIEW
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] Undefined tolerance is ±0.1mm
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
Material Structure
Parts No.
Name
Description
Materials
①
LEAD FRAME
Metal
Copper Alloy (Silver Plated)
②
Chip Source
Blue LED
GaN on Sapphire
③
Wire
Metal
Gold Wire
④
Encapsulation
Silicone
+Phosphor
⑤
Body
Thermo Plastic
Heat-resistant Polymer
⑥
Zener Diode
Si
-
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
2. Characteristics of STW8Q14BE
1) Electro-Optical characteristics at 100mA
(Ta=25℃, RH30%)
Value
Parameter
Symbol
Unit
Min
Typ
Max
VF
2.9
3.2
3.5
V
VR
-
0.9
1.2
V
Luminous Intensity*
(3,700~7,000 K)
Iv
-
11.7
(35)
-
cd
(lm)
Luminous Intensity*[1]
(2,600~3,700 K)
Iv
-
11.0
(33)
-
cd
(lm)
Correlated Color
Temperature
CCT
2,600
-
7,000
K
2Θ1/2
-
120
-
-
Ra
80
-
90
-
RthJS
-
18
-
ºC/W
Forward Voltage
Reverse Voltage
[1]
Viewing Angle
[2]
Color Rendering Index*
Thermal resistance
[3]
*Notes :
All measurements were made under the standardized environment of SSC.
[1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be
aligned with the mechanical axis of the LED package.
[2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[3] Thermal resistance: RthJS (Junction / solder)
* Tolerance : VF :±0.1V, IV :±7%, Ra :±2, x,y :±0.01
2) Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
160
mA
Power Dissipation*[1]
Pd
560
mW
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
±5,000V HBM
V
ESD (HBM)
*Notes :
LED’s properties might be different from suggested values like above and below tables if operation
condition will be exceeded our parameter range.
[1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the
SSCproduct.
SSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
1) Spectrum data
(IF=100mA, Ta=25℃, RH30%)
2600~3700K
3700~4700K
4700~7000K
1.0
Relative Emission Intensity
Z-Power LED
X10490
Technical
Data
Sheet
3. Characteristic diagrams
0.5
0.0
300
400
500
600
700
800
Wavelength [nm]
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Forward Current(mA)
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Forward Voltage [V]
3) Forward Current vs. Relative Luminous Intensity, Ta=25℃
1.6
1.4
Relative Luminous Intensity
Z-Power LED
X10490
Technical
Data
Sheet
2) Forward Voltage vs. Forward Current, Ta=25℃
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
20
40
60
80
100
120
140
160
Forward Current IF [mA]
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
(2600~3200K)
0.368
0.366
20mA
60mA
y
Z-Power LED
X10490
Technical
Data
Sheet
4) Chromaticity Coordinate vs. Forward Current, Ta=25℃
100mA
0.364
150mA
200mA
0.362
0.360
0.336
0.337
0.338
0.339
0.340
0.341
x
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
1 .0
0 .8
Relative Light Output
Z-Power LED
X10490
Technical
Data
Sheet
5) Relative Light Output vs. Junction Temperature, IF=100mA
0 .6
0 .4
0 .2
0 .0
30
45
60
75
90
1 05
1 20
O
Ju n c tio n tem pe ra tu re T j( C )
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
(2600~3200K)
0.335
0.330
25
0.325
45
y
Z-Power LED
X10490
Technical
Data
Sheet
6) Chromaticity Coordinate vs. Junction Temperature
65
0.320
85
105
0.315
0.310
0.315
0.320
0.325
0.330
x
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Relative Forward Voltage
1.0
0.8
0.6
0.4
0.2
0.0
30
45
60
75
90
105
120
O
Ju n ctio n te m p e ra tu re T j( C )
8) Ambient Temperature vs. Maximum Forward Current
20 0
18 0
16 0
Forward Current IF[mA]
Z-Power LED
X10490
Technical
Data
Sheet
7) Forward Voltage Shift vs. Junction Temperature
14 0
o
R th J-A = 1 0 0 C /W
12 0
10 0
80
60
40
20
0
-40
-2 0
0
20
40
60
80
O
A m b ie n t te m p e ra tu re Ta ( C )
100
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
9) Viewing angle, Ta=25℃
0
-30
-60
-90
30
60
90
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
4. Color & Binning
0.46
2600K
0.44
2900K
2700K
3000K
3200K
0.42
3500K
3700K
G0
F1
4000K
0.40
E1
4500K
CIE Y
4700K
0.38
5000K
D0
5300K
5600K
0.36
6000K
0.34
0.32
6500K
A1
7000K A0 A3
A2 A5
D3
C1
C0
B1 C2
B0
B3 C4
B2
B5
D2
C3
E2
F3
F2
E0
D1
G2
F0
4200K
H3
H2
G3
H4
H1
H0
G1
H5
G5
G4
F5
E3
F4
E5
E4
D5
D4
C5
B4
A4
0.30
0.28
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
CIE X
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
4. Color & Binning
● COLOR RANK
<IF=100mA, Ta=25℃>
6500~7000K
A0
A2
A4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3028
0.3304
0.3041
0.324
0.3055
0.3177
0.3041
0.324
0.3055
0.3177
0.3068
0.3113
0.3126
0.3324
0.3136
0.3256
0.3146
0.3187
0.3115
0.3393
0.3126
0.3324
0.3136
0.3256
6000~6500K
A1
A3
A5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3115
0.3393
0.3126
0.3324
0.3136
0.3256
0.3126
0.3324
0.3136
0.3256
0.3146
0.3187
0.321
0.3408
0.3216
0.3334
0.3221
0.3261
0.3205
0.3481
0.321
0.3408
0.3216
0.3334
5600~6000K
B0
B2
B4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3207
0.3462
0.3212
0.3389
0.3217
0.3316
0.3212
0.3389
0.3217
0.3316
0.3222
0.3243
0.3293
0.3461
0.3293
0.3384
0.3294
0.3306
0.3292
0.3539
0.3293
0.3461
0.3293
0.3384
5300~5600K
B1
B3
B5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3292
0.3539
0.3293
0.3461
0.3293
0.3384
0.3293
0.3461
0.3293
0.3384
0.3294
0.3306
0.3373
0.3534
0.3369
0.3451
0.3366
0.3369
0.3376
0.3616
0.3373
0.3534
0.3369
0.3451
SSCSSC-STW8Q14BE
August 2012
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
4. Color & Binning
● COLOR RANK
<IF=100mA, Ta=25℃>
5000~5300K
C0
C2
C4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3376
0.3616
0.3373
0.3534
0.3369
0.3451
0.3373
0.3534
0.3369
0.3451
0.3366
0.3369
0.3456
0.3601
0.3448
0.3514
0.344
0.3428
0.3463
0.3687
0.3456
0.3601
0.3448
0.3514
4700~5000K
C1
C3
C5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3463
0.3687
0.3456
0.3601
0.3448
0.3514
0.3456
0.3601
0.3448
0.3514
0.344
0.3428
0.3539
0.3669
0.3526
0.3578
0.3514
0.3487
0.3552
0.376
0.3539
0.3669
0.3526
0.3578
4500~4700K
D0
D2
D4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3548
0.3736
0.3536
0.3646
0.3523
0.3555
0.3536
0.3646
0.3523
0.3555
0.3511
0.3465
0.3625
0.3711
0.3608
0.3616
0.359
0.3521
0.3641
0.3804
0.3625
0.3711
0.3608
0.3616
4200~4500K
D1
D3
D5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3641
0.3804
0.3625
0.3711
0.3608
0.3616
0.3625
0.3711
0.3608
0.3616
0.359
0.3521
0.3714
0.3775
0.3692
0.3677
0.367
0.3578
0.3736
0.3874
0.3714
0.3775
0.3692
0.3677
SSCSSC-STW8Q14BE
August 2012
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
4. Color & Binning
● COLOR RANK
<IF=100mA, Ta=25℃>
4000~4200K
E0
E2
E4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3736
0.3874
0.3714
0.3775
0.3692
0.3677
0.3714
0.3775
0.3692
0.3677
0.367
0.3578
0.3842
0.3855
0.3813
0.3751
0.3783
0.3646
0.3869
0.3958
0.3842
0.3855
0.3813
0.3751
3700~4000K
E1
E3
E5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3869
0.3958
0.3842
0.3855
0.3813
0.3751
0.3842
0.3855
0.3813
0.3751
0.3783
0.3646
0.397
0.3935
0.3934
0.3825
0.3898
0.3716
0.4006
0.4044
0.397
0.3935
0.3934
0.3825
3500~3700K
F0
F2
F4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3996
0.4015
0.396
0.3907
0.3925
0.3798
0.396
0.3907
0.3925
0.3798
0.3889
0.369
0.4104
0.3978
0.4062
0.3865
0.4017
0.3751
0.4146
0.4089
0.4104
0.3978
0.4062
0.3865
3200~3500K
F1
F3
F5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4146
0.4089
0.4104
0.3978
0.4062
0.3865
0.4104
0.3978
0.4062
0.3865
0.4017
0.3751
0.4248
0.4048
0.4198
0.3931
0.4147
0.3814
0.4299
0.4165
0.4248
0.4048
0.4198
0.3931
SSCSSC-STW8Q14BE
August 2012
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
4. Color & Binning
● COLOR RANK
<IF=100mA, Ta=25℃>
3000~3200K
G0
G2
G4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4299
0.4165
0.4248
0.4048
0.4198
0.3931
0.4248
0.4048
0.4198
0.3931
0.4147
0.3814
0.4374
0.4093
0.4317
0.3973
0.4259
0.3853
0.443
0.4212
0.4374
0.4093
0.4317
0.3973
2900~3000K
G1
G3
G5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.443
0.4212
0.4374
0.4093
0.4317
0.3973
0.4374
0.4093
0.4317
0.3973
0.4259
0.3853
0.4499
0.4138
0.4436
0.4015
0.4373
0.3893
0.4562
0.426
0.4499
0.4138
0.4436
0.4015
2700~2900K
H0
H2
H4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4562
0.426
0.4499
0.4138
0.4436
0.4015
0.4499
0.4138
0.4436
0.4015
0.4373
0.3893
0.462
0.4166
0.4551
0.4042
0.4483
0.3919
0.4687
0.4289
0.462
0.4166
0.4551
0.4042
2600~2700K
H1
H3
H5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4687
0.4289
0.462
0.4166
0.4551
0.4042
0.462
0.4166
0.4551
0.4042
0.4483
0.3919
0.474
0.4194
0.4666
0.4069
0.4593
0.3944
0.481
0.4319
0.474
0.4194
0.4666
0.4069
SSCSSC-STW8Q14BE
August 2012
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
5. Bin Code Description
Bin Code
Luminous Intensity [mcd]
Color Rank
Forward Voltage [V]
U7
G3
Z3
2,600K ~ 7,000K
Luminous Intensity [mcd]
*[1]
@ IF = 100mA
Flux
*[2]
[lm]
RANK
Min.
Max.
Typ.
S5
9500
10000
30
T0
10000
10500
31
T5
10500
11000
32.5
U0
11000
11700
33.5
U7
11700
12500
35.6
V5
12500
13500
38.3
Color Rank
@ IF = 100mA
Forward Voltage [V]
@ IF =100mA
A~H
RANK
Min.
Max.
Z1
3.0
3.1
Z2
3.1
3.2
Z3
3.2
3.3
A1
3.3
3.4
A2
3.4
3.5
Available ranks
Not yet available ranks
CCT
CIE
IV Rank
6000~7000K
A
S5
T0
T5
U0
U7
V5
5300~6000K
B
S5
T0
T5
U0
U7
V5
4700~5300K
C
S5
T0
T5
U0
U7
V5
4200~4700K
D
S5
T0
T5
U0
U7
V5
3700~4200K
E
S5
T0
T5
U0
U7
V5
3200~3700K
F
S5
T0
T5
U0
U7
V5
2900~3200K
G
S5
T0
T5
U0
U7
V5
2600~2900K
H
S5
T0
T5
U0
U7
V5
*Notes :
All measurements were made under the standardized environment of SSC.
[1] The LEDs are sorted based on luminous intensity measurements.
[2] The typical lumen values are included for reference only.
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
6. Labeling
Full code form :
X1X2-X3X4-X5-X6X7-X8X9
-
X1 : Company
X2 : Kind of LED
X3X4 : CRI Group
X5 : Package series
X6X7 : Characteristic code
X8 : Version
X9 : Old Version
Rank
#1#2#3
- #1 : Luminous Intensity : IV [cd]
- #2 : Color coordinates : x, y
- #3 : Forward Voltage : VF [V]
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
7. Packing
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
TYPE
SIZE (mm)
ⓐ
ⓑ
ⓒ
7inch 245
220
102
245
220
142
1 SIDE
ⓒ
①
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
ⓑ
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
ⓐ
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
15.4±1.0
180
13±0.3
2
60
Z-Power LED
X10490
Technical
Data
Sheet
7. Packing
22
13
( Tolerance: ±0.2, Unit: mm )
1)Quantity : 3500pcs/Reel
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10˚ to the carrier tape.
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package.
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
8. Recommended solder pad
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] Undefined tolerance is ±0.1mm
This drawing without tolerances are for reference only.
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
9. Soldering
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
* Caution
1. Reflow soldering is recommended not to be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be
damaged.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
24
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
10. Precaution for use
(1) Storage
To avoid the moisture penetration, we recommend store in a dry box
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum
humidity of RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens
may affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the
desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products
are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and
etc. When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring
the package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months
or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should
be used for storage.
(11) The appearance and specifications of the product may be modified for improvement
without notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of
fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and
photonic energy. The result can be a significant loss of light output from the fixture.
Knowledge of the properties of the materials selected to be used in the construction of fixtures
can help prevent these issues.
SSCSSC-STW8Q14BE
(14)Attaching LEDs, do not use adhesives that outgas organic vapor.
August 2012
(15)The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
www.seoulsemicon.com
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
서식번호 : SSC-QP-7-07-12 (Rev.01)
Z-Power LED
X10490
Technical
Data
Sheet
11. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form of
the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions
must be considered during the handling of such devices. Compared to standard encapsulants,
silicone is generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution
must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured
that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.
product with acid or sulfur material in sealed space.
SSCSSC-STW8Q14BE
August 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-12 (Rev.01)