SAW09H0A - Seoul Semiconductor

Z-Power LED
X10490
Technical
Data
Sheet
RoHS
Specification
SAW09H0A
Rev. 02
1
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
SAW09H0A
SAW09H0A
Features
Description
• Super high flux output
and high luminance
• Designed for high
voltage operation
• SMT solderable
• Lead free product
• RoHS compliant
The MJT series of LEDs are designed for AC & DC(High
Voltage) operation and high flux output applications.
MJT’s thermal management performance exceeds other
power LED solutions by incorporating state-of-the-art SMD
design and use of specialized thermal emission material. MJT
is an ideal light source for general purpose illumination
applications
Applications
•
•
•
•
LED bulb
Spot light
Architectural lighting
Street light
* The appearance and specifications of the product can be changed
for improvement without notice.
Rev. 02
2
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Full code of SAW09H0A
1. Part Number Form : X1X2X3X4X5X6X7X8 – X9X10X11X12X13
X1
Company
S
SSC
X2
Package series
A
Acrich
X3
W
Color
X4
White
0
X5
Series number
9
X6
Voltage
H
X7
PCB type
0
Emitter
X8
Revision No.
A
Rev0
X9X10
Luminous flux
-
-
X11X12
Color bin
-
-
X13
Voltage
-
-
LF
MJT4040
Color bin
V3
140.0 ~ 154.0
W1
154.0 ~ 165.0
W2
165.0 ~ 177.0
W3
177.0 ~ 200.0
B0~B5
C0~C5
D0~D5
Voltage
A
60~63
B
63~65
C
65~68
2. Sticker Diagram on Reel & Aluminum Vinyl Bag
X9 X10 X11 X12 X13
X1 X2 X3 X4 X5 X6 X7 X8
Rev. 02
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August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Outline dimensions
Anode
Cathode
Notes :
[1]
[2]
[3]
[4]
All dimensions are in millimeters. (tolerance is ±0.20mm )
Scale : none
The appearance and specifications of the product may be changed for improvement without notice
Electrically neutral thermal path
Rev. 02
4
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Characteristics of SAW09H0A
1. Cool white
1-1 Electro-Optical characteristics at IF= 20mA, Ta=25ºC
Parameter
Symbol
Value
Unit
Min
Typ
Max
ФV [2]
140
165
-
lm
CCT
4,200
-
6,000
K
CRI
Ra
69
-
-
-
Forward Voltage
VF
60
64
68
V
Thermal resistance
Rth
6
ºC/W
View Angle
2Θ 1/2
120
deg.
Luminous Flux
[1]
Correlated Color Temperature
[3]
1-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
40
mA
Power Dissipation
PD
2.72
W
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-30 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +110
ºC
ESD Sensitivity
-
-
-
* Notes :
[1] Acrich series maintains a tolerance of 10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tester tolerance
Rev. 02
5
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Color Spectrum, TA=25℃, IF=20mA
1.0
Cool White
Relative Spectral Power Distribution
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
350
400
450
500
550
600
650
700
750
800
Wavelength(nm)
Radiant pattern, TA=25℃, IF=20mA
1.0
0.9
Relative Luminous Flux
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
Angle [deg.]
6
Rev. 02
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Forward Current Characteristics
Forward Voltage vs. Forward Current , Ta=25℃
0.040
0.035
Forward Current [A]
0.030
0.025
0.020
0.015
0.010
0.005
0.000
0
10
20
30
40
50
60
70
80
0.035
0.040
Forward Voltage [V]
Forward Current vs. Relative Luminous Flux, Ta=25℃
2.0
1.8
Relative Luminous Flux
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.000
0.005
0.010
0.015
0.020
0.025
0.030
Forward Current (A)
Rev. 02
7
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Forward Current Characteristics
Forward Current vs. CIE X, Y Shift , Ta=25℃
0.365
0.360
Y
0.355
10mA
20mA
0.350
30mA
0.345
40mA
0.340
0.335
0.330
0.335
0.340
0.345
0.350
0.355
X
Rev. 02
8
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Junction Temperature Characteristics
Relative Light Output vs. Junction Temperature at IF=20mA
1.0
Relative Luminous Intensity
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
25
50
75
100
125
150
o
Junction Temperature [ C]
Forward Voltage Shift vs. Junction Temperature at IF=20mA
0
-1
Forward Voltage Shift [V]
-2
-3
-4
-5
-6
-7
-8
-9
-10
25
50
75
100
125
150
o
Junction Temperature [ C]
Rev. 02
9
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Junction Temperature Characteristics
Junction Temp. vs. CIE X, Y Shift, IF=20mA
0.001
CIE X
CIE Y
0.000
CIE X,Y Shift
-0.001
-0.002
-0.003
-0.004
-0.005
25
50
75
100
125
150
o
Junction Temperature [ C]
Rev. 02
10
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Maximum Forward Current vs. Ambient Temperature
Tjmax = 125℃, at 40mA
0.045
0.040
Max. Current [A]
0.035
0.030
0.025
RjaT = 35℃/W
RjaT = 25℃/W
RjaT = 15℃/W
0.020
0.015
0.010
0.005
0.000
0
25
50
75
100
125
o
Ambient Temperature [ C]
Rev. 02
11
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Color & Binning
Binning structure graphical representation
< IF=20mA, Ta=25℃ >
0.40
4500K
4700K
0.38
D1
5000K
0.36
B1
6000K
0.34
B0
B3
B2
B5
D3
D2
C0
5600K
D0
C1
5300K
Y
4200K
D5
C3
D4
C2
C5
C4
B4
0.32
0.30
0.32
0.34
0.36
0.38
X
Rev. 02
12
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Color & Binning
● COLOR RANK
< IF=20mA, Ta=25℃ >
B0
B1
B2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3207
0.3462
0.3292
0.3539
0.3212
0.3389
0.3212
0.3389
0.3293
0.3461
0.3217
0.3316
0.3293
0.3461
0.3373
0.3534
0.3293
0.3384
0.3292
0.3539
0.3376
0.3616
0.3293
0.3461
B3
B4
B5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3293
0.3461
0.3217
0.3316
0.3293
0.3384
0.3293
0.3384
0.3222
0.3243
0.3294
0.3306
0.3369
0.3451
0.3294
0.3306
0.3366
0.3369
0.3373
0.3534
0.3293
0.3384
0.3369
0.3451
C0
C1
C2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3376
0.3616
0.3463
0.3687
0.3373
0.3534
0.3373
0.3534
0.3456
0.3601
0.3369
0.3451
0.3456
0.3601
0.3539
0.3669
0.3448
0.3514
0.3463
0.3687
0.3552
0.376
0.3456
0.3601
C3
C4
C5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3456
0.3601
0.3369
0.3451
0.3448
0.3514
0.3448
0.3514
0.3366
0.3369
0.344
0.3428
0.3526
0.3578
0.344
0.3428
0.3514
0.3487
0.3539
0.3669
0.3448
0.3514
0.3526
0.3578
Rev. 02
13
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Color & Binning
● COLOR RANK
< IF=20mA, Ta=25℃ >
D0
D1
D2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3548
0.3736
0.3641
0.3804
0.3536
0.3646
0.3536
0.3646
0.3625
0.3711
0.3523
0.3555
0.3625
0.3711
0.3714
0.3775
0.3608
0.3616
0.3641
0.3804
0.3736
0.3874
0.3625
0.3711
D3
D4
D5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3625
0.3711
0.3523
0.3555
0.3608
0.3616
0.3608
0.3616
0.3511
0.3465
0.359
0.3521
0.3692
0.3677
0.359
0.3521
0.367
0.3578
0.3714
0.3775
0.3608
0.3616
0.3692
0.3677
Rev. 02
14
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Bin code description
1. Luminous Flux Bins
- Luminous flux bin structure for pure white, warm white
· Example
BIN CODE : W2C0A
Luminous Flux bin
Bin Code
Luminous Flux [lm]
V3
140.0 ~ 154.0
W1
154.0 ~ 165.0
W2
165.0 ~ 177.0
W3
177.0 ~ 200.0
Tolerance : 10% of Luminous flux value
2. Pure White CIE
Pure white product tested and binned by x,y coordinates and CCT
· Example
BIN CODE : W2C0A
Color bin
3. Voltage Bins
· Example
BIN CODE : W2C0A
Voltage bin
Bin Code
Voltage [V]
A
60~63
B
63~65
C
65~68
Rev. 02
15
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Emitter Carrier & Reel Packaging
Notes :
[1] Quantity : 700 pcs/Reel
[2] Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
[3] Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from
the carrier tape at the angle of 10º to the carrier tape
Rev. 02
[4] Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package August. 2013
16
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Z-Power LED
X10490
Technical
Data
Sheet
Packing
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
RoHS
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
b
a
Rev. 02
17
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Soldering
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
* Caution
1. Reflow soldering is recommended not to be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be
damaged.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
Rev. 02
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August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Precaution for use
(1) Storage
To avoid the moisture penetration, we recommend store in a dry box
with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum
humidity of RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens
may affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the
desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products
are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and
etc. When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring
the package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months
or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should
be used for storage.
(11) The appearance and specifications of the product may be modified for improvement
without notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of
fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and
photonic energy. The result can be a significant loss of light output from the fixture.
Knowledge of the properties of the materials selected to be used in the construction of fixtures
can help prevent these issues.
(14)Attaching LEDs, do not use adhesives that outgas organic vapor.
(15)The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
Rev. 02
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Z-Power LED
X10490
Technical
Data
Sheet
(16) Please note Acrich runs on high voltage so use caution when near the leads
or if a dome is inadvertently removed while circuit is active.
(17) Please do not touch any of the circuit board, components or terminals with
bare hands or metal while circuit is electrically active.
(18) Please do not add or change wires while Acrich circuit is active.
Rev. 02
20
August. 2013
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Z-Power LED
X10490
Technical
Data
Sheet
Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
21
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not
handle this product with acid or sulfur material in sealed space.
Rev. 02
(7) Avoid leaving fingerprints on silicone resin parts.
August. 2013
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