Z-Power LED X10490 Technical Data Sheet RoHS Specification SAW09H0A Rev. 00 March. 2013 1 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet SAW09H0A SAW09H0A Features Description • Super high flux output and high luminance • Designed for high voltage operation • SMT solderable • Lead free product • RoHS compliant The MJT series of LEDs are designed for AC & DC(Highi Voltage) operation and high flux output applications. MJT’s thermal management performance exceeds other power LED solutions by incorporating state-of-the-art SMD design and use of specialized thermal emission material. MJT is an ideal light source for general purpose illumination applications Applications • • • • LED bulb Spot light Architectural lighting Street light * The appearance and specifications of the product can be changed for improvement without notice. Rev. 00 March. 2013 2 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Full code of SAW09H0A 1. Part Number Form : X1X2X3X4X5X6X7X8 – X9X10X11X12X13 X1 Company S SSC X2 Package series A Acrich X3 W Color White X4 0 X5 Series number 9 X6 Voltage H X7 PCB type 0 Emitter X8 Revision No. A Rev0 X9X10 Luminous flux - - X11X12 Color bin - - X13 Voltage - - LF MJT4040 Color bin V3 140.0 ~ 154.0 W1 154.0 ~ 165.0 W2 165.0 ~ 177.0 W3 177.0 ~ 200.0 B0~B5 C0~C5 D0~D5 Voltage A 60~63 B 63~65 C 65~68 2. Sticker Diagram on Reel & Aluminum Vinyl Bag X9 X10 X11 X12 X13 X1 X2 X3 X4 X5 X6 X7 X8 Rev. 00 March. 2013 3 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Outline dimensions Anode Cathode Notes : [1] All dimensions are in millimeters. (tolerance is ±0.20mm ) [2] Scale : none [3] The appearance and specifications of the product may be changed for improvement without notice [4] Electrical ly neutral thermal path Rev. 00 March. 2013 4 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Characteristics of SAW09H0A 1. Cool white 1-1 Electro-Optical characteristics at IF= 20mA, Ta=25ºC Value Parameter Symbol Unit Min Typ Max ФV [2] 140 165 - lm Correlated Color Temperature [3] CCT 4,200 - 6,000 K CRI Ra 69 - - - Forward Voltage VF 60 64 68 V Thermal resistance Rth 6 ºC/W View Angle 2Θ 1/2 120 deg. Luminous Flux [1] 1-2 Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current IF 40 mA Power Dissipation PD 2.72 W Junction Temperature Tj 125 ºC Operating Temperature Topr -30 ~ +85 ºC Storage Temperature Tstg -40 ~ +110 ºC ESD Sensitivity - - - * Notes : [1] Acrich series maintains a tolerance of 10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrating sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT 5% tester tolerance Rev. 00 March. 2013 5 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Color Spectrum, TA=25℃, IF=20mA 1.0 Cool White Relative Spectral Power Distribution 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 350 400 450 500 550 600 650 700 750 800 Wavelength(nm) Radiant pattern, TA=25℃, IF=20mA 1.0 0.9 Relative Luminous Flux 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angle [deg.] Rev. 00 March. 2013 6 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Forward Current Characteristics Forward Voltage vs. Forward Current , Ta=25℃ 0.040 0.035 Forward Current [A] 0.030 0.025 0.020 0.015 0.010 0.005 0.000 0 10 20 30 40 50 60 70 80 0.035 0.040 Forward Voltage [V] Forward Current vs. Relative Luminous Flux, Ta=25℃ 2.0 1.8 Relative Luminous Flux 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.000 0.005 0.010 0.015 0.020 0.025 0.030 Forward Current (A) Rev. 00 March. 2013 7 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Forward Current Characteristics Forward Current vs. CIE X, Y Shift , Ta=25℃ 0.365 0.360 Y 0.355 10mA 20mA 0.350 30mA 0.345 40mA 0.340 0.335 0.330 0.335 0.340 0.345 0.350 0.355 X Rev. 00 March. 2013 8 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Junction Temperature Characteristics Relative Light Output vs. Junction Temperature at IF=20mA 1.0 Relative Luminous Intensity 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 25 50 75 100 125 150 o Junction Temperature [ C] Forward Voltage Shift vs. Junction Temperature at IF=20mA 0 -1 Forward Voltage Shift [V] -2 -3 -4 -5 -6 -7 -8 -9 -10 25 50 75 100 125 150 o Junction Temperature [ C] Rev. 00 March. 2013 9 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Junction Temperature Characteristics Junction Temp. vs. CIE X, Y Shift, IF=20mA 0.001 CIE X CIE Y 0.000 CIE X,Y Shift -0.001 -0.002 -0.003 -0.004 -0.005 25 50 75 100 125 150 o Junction Temperature [ C] Rev. 00 March. 2013 10 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Maximum Forward Current vs. Ambient Temperature Tjmax = 125℃, at 40mA 0.045 0.040 Max. Current [A] 0.035 0.030 0.025 RjaT = 35℃/W RjaT = 25℃/W RjaT = 15℃/W 0.020 0.015 0.010 0.005 0.000 0 25 50 75 100 125 o Ambient Temperature [ C] Rev. 00 March. 2013 11 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Color & Binning Binning structure graphical representation < IF=20mA, Ta=25℃ > 0.40 4500K 4700K 0.38 D1 5000K 0.36 B1 6000K 0.34 B0 B3 B2 B5 D3 D2 C0 5600K D0 C1 5300K Y 4200K D5 C3 D4 C2 C5 C4 B4 0.32 0.30 0.32 0.34 0.36 0.38 X Rev. 00 March. 2013 12 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Color & Binning ● COLOR RANK < IF=20mA, Ta=25℃ > B0 B1 B2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3292 0.3539 0.3376 0.3616 0.3293 0.3461 B3 B4 B5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3293 0.3461 0.3217 0.3316 0.3293 0.3384 0.3293 0.3384 0.3222 0.3243 0.3294 0.3306 0.3369 0.3451 0.3294 0.3306 0.3366 0.3369 0.3373 0.3534 0.3293 0.3384 0.3369 0.3451 C0 C1 C2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3376 0.3616 0.3463 0.3687 0.3373 0.3534 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3456 0.3601 0.3539 0.3669 0.3448 0.3514 0.3463 0.3687 0.3552 0.376 0.3456 0.3601 C3 C4 C5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3456 0.3601 0.3369 0.3451 0.3448 0.3514 0.3448 0.3514 0.3366 0.3369 0.344 0.3428 0.3526 0.3578 0.344 0.3428 0.3514 0.3487 0.3539 0.3669 0.3448 0.3514 0.3526 0.3578 Rev. 00 March. 2013 13 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Color & Binning ● COLOR RANK < IF=20mA, Ta=25℃ > D0 D1 D2 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3548 0.3736 0.3641 0.3804 0.3536 0.3646 0.3536 0.3646 0.3625 0.3711 0.3523 0.3555 0.3625 0.3711 0.3714 0.3775 0.3608 0.3616 0.3641 0.3804 0.3736 0.3874 0.3625 0.3711 D3 D4 D5 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3625 0.3711 0.3523 0.3555 0.3608 0.3616 0.3608 0.3616 0.3511 0.3465 0.359 0.3521 0.3692 0.3677 0.359 0.3521 0.367 0.3578 0.3714 0.3775 0.3608 0.3616 0.3692 0.3677 Rev. 00 March. 2013 14 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Bin code description 1. Luminous Flux Bins - Luminous flux bin structure for pure white, warm white · Example BIN CODE : W2C0A Luminous Flux bin Bin Code Luminous Flux [lm] V3 140.0 ~ 154.0 W1 154.0 ~ 165.0 W2 165.0 ~ 177.0 W3 177.0 ~ 200.0 Tolerance : 10% of Luminous flux value 2. Pure White CIE Pure white product tested and binned by x,y coordinates and CCT · Example BIN CODE : W2C0A Color bin 3. Voltage Bins · Example BIN CODE : W2C0A Voltage bin Bin Code Voltage [V] A 60~63 B 63~65 C 65~68 Rev. 00 March. 2013 15 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Emitter Carrier & Reel Packaging Notes : [1] Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm [2] Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape [3] Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 00 March. 2013 16 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX RoHS PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. b a Rev. 00 March. 2013 17 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Soldering IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. * Caution 1. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. Rev. 00 March. 2013 18 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Precaution for use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14)Attaching LEDs, do not use adhesives that outgas organic vapor. (15)The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. Rev. 00 March. 2013 19 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet (16) Please note Acrich runs on high voltage so use caution when near the leads or if a dome is inadvertently removed while circuit is active. (17) Please do not touch any of the circuit board, components or terminals with bare hands or metal while circuit is electrically active. (18) Please do not add or change wires while Acrich circuit is active. Rev. 00 March. 2013 20 www.seoulsemicon.com Z-Power LED X10490 Technical Data Sheet Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. Rev. 00 (7) Avoid leaving fingerprints on silicone resin parts. March. 2013 21 www.seoulsemicon.com